CN101052291A - Prefabricated plate type heat radiation element - Google Patents
Prefabricated plate type heat radiation element Download PDFInfo
- Publication number
- CN101052291A CN101052291A CN 200710098014 CN200710098014A CN101052291A CN 101052291 A CN101052291 A CN 101052291A CN 200710098014 CN200710098014 CN 200710098014 CN 200710098014 A CN200710098014 A CN 200710098014A CN 101052291 A CN101052291 A CN 101052291A
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- CN
- China
- Prior art keywords
- plate body
- heat dissipation
- dissipation element
- element according
- body heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The technical scheme of the invention is to use an insulation material with high insulation and heat radiation function- namely a diamond material- to replace the traditional epoxy resin to make encapsulation for all kind of electronic component.
Description
Technical field
The present invention relates to a kind of plate body heat dissipation element that is shaped in advance, this plate body can be applicable on the various electric elements package application such as chip, Light-Emitting Diode.
Background technology
Along with improving constantly of chip or various electric elements power, heat discharge also increases relatively and forms serious problem, actual at present application mode of dispelling the heat, radiator and fan dual mode are arranged, for example radiator by with tight contact the on chip or various electric elements surface, make the heat of chip or various electric elements be transmitted to radiator, discharge by fan again.Between right radiator and chip or the various electric elements, still there is the encapsulation high molecule plastic of high thermal resistance,, fails to solve heat extraction and stop up the problem that is piled up in the encapsulation macromolecular material therefore obviously with present correlation technique.
Summary of the invention
Purpose of the present invention, be to overcome above-mentioned deficiency, a kind of preformed plate body heat dissipation element that contains the diamond composition is provided, this heat dissipation element can be used for chip, Light-Emitting Diode, LCD screen backlight plate module or various electric elements insulation-encapsulated to be used, to solve packaging insulating layer heat conduction problem.
Technical scheme of the present invention is as follows.
A kind of plate body heat dissipation element encapsulating structure that is shaped in advance, its technological means promptly is to use the radiating insulating material that contains diamond to replace traditional materials such as epoxy resin, carry out the encapsulation of chip or various electric elements, see through the diamond thermal conductivity up to having high insulation characterisitic structure again for 2000.W/Km.Make this heat conductive insulating encapsulating material direct contact heat source, radiator of external outside again.So form the encapsulating structure that a radiating efficiency is high and insulate.Described heat conduction plate body encapsulating structure is the material that contains diamond dust, is mixed to fill forming by diamond fine particle and macromolecule bond.First kind of way is: mixed forming by diamond fine particle (11) composition that is higher than 75% weight ratio and macromolecule bond (12), this plate body can use extrusion molding, pressing mold, wire mark to be shaped or irritate the plate body of contour forming as appropriate size.Second kind of way by: formed by the diamond film that chemical vapour deposition technique (CVD) is formed on the sheet metal, again through cutting into the plate body of appropriate size.
The using method of this heat conduction plate body, be directly the heat conduction plate body to be placed between package position, encapsulate by the macromolecule driving fit more on every side, make direct contact chip of heat conduction plate body or various electric elements heating part, the outside simultaneously radiator that also directly contacts the outside, so form the encapsulating structure that a radiating efficiency is high and insulate, reached best radiating effect.
Description of drawings
Fig. 1 is the structural representation of high radiating insulating plate body material.
The shape schematic diagram of Fig. 2 heat conductive insulating encapsulation plate body material.
The structural representation of Fig. 3 heat conduction encapsulation plate body between heating and heat radiation.
Among the figure: 1, high radiating insulating plate body, 11, diamond grains, 12, the macromolecule bond, 2, the encapsulation macromolecular material, 3, heater element, 4, outside radiator, 5, circuit substrate, 6, lead-in wire.
Embodiment
The execution mode that the present invention used is to use a kind of heat conduction plate body (1) encapsulating structure material that contains diamond dust.Formed by diamond fine particle (11) composition that is higher than 75% weight ratio and macromolecule bond (12) mixing, this plate body can use extrusion molding, pressing mold, wire mark to be shaped or irritate the plate body of contour forming as appropriate size.
Again heat conduction plate body (1) is placed the centre of package position, in mould, inject macromolecule (2) shaping encapsulation such as epoxy resin on every side again, make heat conduction plate body (1) directly contact chip or various electric elements heating part (3), the outside also directly contacts outside radiator (4) simultaneously, so forms the encapsulating structure of radiating efficiency height and insulation.
Claims (6)
1, a kind of plate body heat dissipation element that is shaped in advance, it is characterized in that: this element is to comprise the tabular object that the diamond composition is shaped in advance, this radiating insulating sheet can be placed and the heat extraction of contact element heating part; Also can be around with macromolecule driving fit encapsulation, radiating insulating sheet outside contacts radiator again, to form the encapsulating structure of a heat radiation and insulation.
2, plate body heat dissipation element according to claim 1 is characterized in that: this plate-like structure is the complex that moulding in advance contains diamond powder, and its composition is formed by diamond dust that is higher than 75% weight ratio and the mixing of macromolecule bond.
3, the plate body heat dissipation element according to claim 1 is characterized in that: this plate body potted element, can use extrusion molding, pressing mold, wire mark to be shaped or irritate the plate body of contour forming as appropriate size.
4, the plate body heat dissipation element according to claim 1 is characterized in that: this plate body potted element shape can be square, rectangle, rondelle, star-like or other erose plate bodys.
5, the plate body heat dissipation element according to claim 1 is characterized in that: this plate body potted element, with encapsulation macromolecular material faying face, can make the difform face of slightly making a list according to actual demand, to strengthen adhesion.
6, the plate body heat dissipation element according to claim 1 is characterized in that: this plate-like structure, can carry out common encapsulation with epoxy resin or other macromolecular materials again and make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710098014 CN101052291A (en) | 2007-04-25 | 2007-04-25 | Prefabricated plate type heat radiation element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200710098014 CN101052291A (en) | 2007-04-25 | 2007-04-25 | Prefabricated plate type heat radiation element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101052291A true CN101052291A (en) | 2007-10-10 |
Family
ID=38783425
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710098014 Pending CN101052291A (en) | 2007-04-25 | 2007-04-25 | Prefabricated plate type heat radiation element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101052291A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024036525A1 (en) * | 2022-08-17 | 2024-02-22 | 华为技术有限公司 | Thermally conductive structure, electronic device, and terminal |
-
2007
- 2007-04-25 CN CN 200710098014 patent/CN101052291A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024036525A1 (en) * | 2022-08-17 | 2024-02-22 | 华为技术有限公司 | Thermally conductive structure, electronic device, and terminal |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |