CN101048035A - Adjustable resistance in multi-layer substrate and forming method thereof - Google Patents
Adjustable resistance in multi-layer substrate and forming method thereof Download PDFInfo
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- CN101048035A CN101048035A CN 200610067011 CN200610067011A CN101048035A CN 101048035 A CN101048035 A CN 101048035A CN 200610067011 CN200610067011 CN 200610067011 CN 200610067011 A CN200610067011 A CN 200610067011A CN 101048035 A CN101048035 A CN 101048035A
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- resistance
- adjustable resistance
- base plate
- multilager base
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Abstract
The invention discloses a kind of adjustable resistance in the multi-layer substrate and its manufacturing method, which includes a planar adjustable resistor-blocks and numbers of connecting cables connected with the resistor-blocks, in which, the connecting cables are led out from the endpoint of the planar resistor-blocks to from a resistor network, then it forms multiple open circuit through selective breaking of substrate boring technology, which obtains the adjustable resistor values.
Description
Technical field
The present invention relates to adjustable resistance in a kind of multilager base plate and forming method thereof, particularly relate to a kind of each interconnective connecting line and open a way, can reach the adjustable resistance that accurately to adjust resistance value with the connecting line that forms multiple combination by machine drilling process choice destruction resistor network.
Background technology
As everyone knows, resistive element has been widely used in the circuit such as current limliting, voltage stabilizing and termination impedance control.Yet general small-sized resistive element major part is by surface adhering technology (Surface MountedTechnique, SMT) etc. complicated technology is finished welding, though the miniaturization day by day of this resistive element, but still need be arranged at the surface of multilager base plate and improved the entity circuit area and the height.In order resistive element to be buried inside in Mulitilayer circuit board, the research and development unit of existing many materials finished and successfully was applied in the exploitation of cloth of coating-type resistance material in the various electronic circuits in recent years, yet the resistance of cloth of coating-type is because of the error of material prescription and wire mark, the fine setting that the resistive element that feasible coating is finished need be done resistance value through high-accuracy laser facility or abrasive blasting machine, and this method only limits to the fine setting work of the cloth of coating-type resistance on surface.
(Thick Film Resistor presents a nonequilibrium condition to general commercial thick-film resistor when TFR) printing ink is coated on the substrate, can't obtain a fixing resistance value, and its resistance value and predicted value present variation value approximately ± 20%.For accurately reaching designed resistance value, the finishing process after thick-film resistor burns till is a procedure of processing necessary in the element manufacture process, and its method for trimming has abrasive blasting dressing method and laser reconditioning method.The abrasive blasting dressing method is that abrasive material is penetrated with the nozzle of a pressure-air through a slot, and by the geometry that resistive layer is repaired in the grinding of abrasive material and thick film resistive layer, the course of processing that does not heat is its advantage; But very easily cause the resistance border to expose and dust pollution with the abrasive blasting dressing method, and can't do high-precision finishing.The laser reconditioning rule gasifies by the high hot material with resistive layer that laser produced and produces 2 to 2.5mil breach, its advantage is that high material removes rate, but the computer controlled automation operation, accurate and high speed, clean processing technology, and can on high-density circuit board, process etc.; But because the slight crack that thermal shock caused then is its shortcoming.
Prior art is taken off the fine setting technology of surface coated formula resistance, as United States Patent (USP) the 4th, 443, No. 782 " Method for Regulating the Value of a Thick Film Resistor and aCorresponding Resistor ", it uses the resistance value that the interior various grooving structures (slot) of region of resistive material are adjusted surperficial cloth of coating-type resistance, though there is no, this patent emphasizes to produce in which way this grooving structure, but with present industrial technology, it is comparatively common to utilize the laser reconditioning method to adjust the mode of resistance value.
Figure 1 shows that the schematic diagram of existing surface coated formula resistance, wherein the computing formula of resistance R is R=ρ * L/A, thus formula as can be known the resistance of resistance R count ρ with the resistance of resistance material and the resistance length L is directly proportional, and be inversely proportional to the sectional area A of resistance, if the resistance material ρ of hypothesis surface coated formula resistance R and sectional area A thereof are under the fixing situation, then the resistance material length L that electric current is flowed through is only depended in the variation of two resistance between electrode of surface coated formula resistance R.
Existing surface coated formula resistance is in the process of making, and the destabilizing factor that often produces burr or bake process because of the crawling of resistance material around the even or resistance material produces the variation on the resistance, makes the resistance value after the making produce great error; And have the technology of adjusting surperficial cloth of coating-type resistance value now and can't be applicable to internal layer resistance, so await proposing the interior adjustable resistance of a kind of multilager base plate to overcome the problems referred to above.
Summary of the invention
Technical problem to be solved by this invention is to propose the interior adjustable resistance of a kind of multilager base plate, this adjustable resistance forms a resistor network, form the connecting line open circuit of multiple combination by each interconnective connecting line of substrate bore process selective destruction, make this adjustable electric resistance change, can reach the adjustable resistance that accurately to adjust resistance value.
Another object of the present invention is to propose a kind of method that forms the adjustable resistance in the multilager base plate, form the resistor network that comprises a planar resistor block and a plurality of connecting lines that are connected with each end points of planar resistor block earlier, open a way with the connecting line that forms multiple combination by each interconnective connecting line of substrate bore process selective destruction again, make the resistance value of this adjustable resistance change, can reach the adjustable resistance that accurately to adjust resistance value.
For achieving the above object, the invention provides the adjustable resistance in a kind of multilager base plate, this adjustable resistance is arranged at arbitrary layer of a multilager base plate, and this adjustable resistance comprises: a planar resistor material block, and this planar resistor block is provided with a plurality of end points; And a plurality of connecting lines that are connected with this planar resistor material block, and each connecting line is drawn to form a resistor network by each end points of planar resistor block; Wherein form the connecting line open circuit of multiple combination, make this adjustable electric resistance change, with the resistance of accurate this adjustable resistance of adjustment by each interconnective connecting line of substrate bore process selective destruction.
For achieving the above object, the present invention proposes adjustable resistance in a kind of multilager base plate and forming method thereof, this adjustable resistance comprises a planar resistor block and a plurality of connecting line that is connected with the planar resistor block, wherein each connecting line is drawn to form a resistor network by each end points of planar resistor block, form the connecting line open circuit of multiple combination by each interconnective connecting line of substrate bore process selective destruction, make this adjustable electric resistance change, can reach the adjustable resistance that accurately to adjust resistance value.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 is the schematic diagram of existing surface coated formula resistance;
Fig. 2 is the adjustable resistance preferred embodiment schematic diagram in the multilager base plate of the present invention;
Fig. 3 is the adjustable resistance preferred embodiment equivalent circuit diagram in the multilager base plate of the present invention;
Fig. 4 is the adjustable resistance change list in the multilager base plate of preferred embodiment of the present invention;
Fig. 5 is the adjustable resistance change curve in the multilager base plate of preferred embodiment of the present invention;
Fig. 6 is another preferred embodiment schematic diagram of adjustable resistance in the multilager base plate of the present invention;
Fig. 7 is the another preferred embodiment schematic diagram of adjustable resistance in the multilager base plate of the present invention.
1,2,3,4,5,6,7,8,9,10,11,12,13,14: bore position
A, B, C, D, E, F, G, H, I, J, K, L, M, N: bore position
L1, L2, L3, L4, L5, L6: connecting line
LA, LB, LC, LD, LE, LF: connecting line
L7, L8, L9, L10, L11, L12, L13, L14: connecting line
LG, LH, LI, LJ, LK, LL, LM, LN: connecting line
R: adjustable resistance
R0: main resistor
Rs, RL, RC: interior resistance
Embodiment
Figure 2 shows that the adjustable resistance preferred embodiment schematic diagram in the multilager base plate of the present invention, it is arranged at arbitrary layer of multilager base plate, this adjustable resistance R is a planar resistor block, this planar resistor block is provided with a plurality of end points, and the position of these a plurality of end points belongs to arbitrarily, for convenience of explanation, a plurality of end points set in this preferred embodiment are considered as comprising a main resistor R0 and a plurality of interior resistance R S that is connected with main resistor R0 with this adjustable resistance R, and wherein each end points all is provided with a connecting line (being L1-L6 and LA-LF) and draws and be connected to each other to form a resistor network, and on each connecting line and be reserved with bore position 1-6 and A-F, in the time will adjusting the resistance value of adjustable resistance R, can selected connecting line be broken to open-circuit condition by the substrate bore process, make each connecting line in this resistor network form the open circuit of multiple combination, adjust the equivalent resistance of adjustable resistance R whereby.
Figure 3 shows that the adjustable resistance preferred embodiment equivalent circuit diagram in the multilager base plate of the present invention, this adjustable resistance R is promptly for being seen into the equivalent resistance of gained by electrode among Fig. 21, wherein if main resistor R0 is 5000 ohm, resistance R S is 100 ohm in each, then by destroying the combination that 12 bore position 1-6 shown in Fig. 2 or Fig. 3 and A-F go up different connecting lines, can produce the adjustable electric resistance more than at least 30 kinds after as calculated.
Fig. 4 is the interior adjustable resistance change list of multilager base plate of the preferred embodiment of the present invention that draws as calculated, for instance, bore position changes 5 at bore position 1,2,3,4,5 hole, this moment, connecting line L1 was open circuit because bore position 1 is formed by boring, so the connecting line L6 that is positioned at bore position 6 and is connected with connecting line L1 in fact also is open circuit, the connecting line LF path flow that the electric current of main resistor R0 will be selected the resistance minimum so flow through is to connecting line L2, so adjustable resistance R will connecting for resistance R S in the main resistor R0 and.And for example bore position changes 15 at bore position B, C, F, 1,2,3,6 hole, be open circuit because bore position 6 and F are formed by boring this moment, so the electric current of the main resistor R0 that flows through just has connecting line L5, L4 with continuing to flow through after the resistance R S in two, LE, paths such as LD are flowing to connecting line LA, and connecting line L5, L4, LE, paths such as LD will form the parallel connection of three interior resistance R S, so adjustable resistance R will be for after the connecting of resistance R S in main resistor R0 and two, and three the formed parallel resistances of interior resistance R S of connecting again.
In addition, the present invention also proposes a kind of method that forms the adjustable resistance in the multilager base plate, this method is the resistor network that comprises a planar resistor block and a plurality of connecting lines that are connected with each end points of planar resistor block earlier in arbitrary layer of formation of multilager base plate, open a way with the connecting line that forms multiple combination by each connecting line of substrate bore process selective destruction again, make this adjustable electric resistance change, to reach the adjustable resistance that accurately to adjust resistance value.And the multilager base plate among the present invention can be tellite, ceramic substrate or ic substrate.
Figure 5 shows that the interior adjustable resistance change curve of multilager base plate of preferred embodiment of the present invention, and Fig. 5 is that the bore position among Fig. 4 changes the corresponding relation figure with adjustable resistance R, can learn the adjustable resistance in the multilager base plate that uses Fig. 2 by Fig. 5, can produce the adjustable electric resistance more than at least 30 kinds, and this adjustable electric resistance is the highest can heighten 20% with main resistor R0, and therefore adjustable resistance and the method thereof in the multilager base plate of the present invention can be accurate to the adjustable electric resistance of main resistor below 1% at least.This result obviously reaches close adjustable resistance characteristic compared to the surface coated formula resistance of general use abrasive blasting dressing method and the fine setting of laser reconditioning method.
Figure 6 shows that another preferred embodiment schematic diagram of adjustable resistance in the multilager base plate of the present invention, it is arranged at arbitrary layer of multilager base plate, this adjustable resistance R is a planar resistor block, this planar resistor block is provided with a plurality of end points, and the position of these a plurality of end points belongs to arbitrarily, for convenience of explanation, a plurality of end points set in this preferred embodiment are considered as comprising resistance R L in a main resistor R0 and a plurality of L type that is connected with main resistor R0 with this adjustable resistance R, and wherein each end points is located at the minor face of resistance R L in each L type and each end points and all is provided with a connecting line (being L7-L10 and LG-LJ) and draws and be connected to each other to form a resistor network, and on each connecting line and be reserved with bore position 7-10 and G-J, in the time will adjusting the resistance value of adjustable resistance R, can selected connecting line be broken to open-circuit condition by the substrate bore process, make each connecting line in this resistor network form the open circuit of multiple combination, adjust the equivalent resistance of adjustable resistance R whereby.
Figure 7 shows that the another preferred embodiment schematic diagram of adjustable resistance in the multilager base plate of the present invention, it is arranged at arbitrary layer of multilager base plate, this adjustable resistance R is a planar resistor block, this planar resistor block is provided with a plurality of end points, and the position of these a plurality of end points belongs to arbitrarily, for convenience of explanation, a plurality of end points set in this preferred embodiment are considered as comprising resistance R C in a main resistor R0 and a plurality of be connected with main resistor R0 ring-like with this adjustable resistance R, and wherein each end points all is provided with a connecting line (being L11-L14 and LK-LN) Xiang Huanxin and draws and be connected to each other to form a resistor network, and on each connecting line and be reserved with bore position 11-14 and K-N, in the time will adjusting the resistance value of adjustable resistance R, can selected connecting line be broken to open-circuit condition by the substrate bore process, make each connecting line in this resistor network form the open circuit of multiple combination, adjust the equivalent resistance of adjustable resistance R whereby.
Comprehensively above-mentioned, the present invention proposes adjustable resistance in a kind of multilager base plate and forming method thereof, this adjustable resistance comprises a planar resistor block and a plurality of connecting line that is connected with the planar resistor block, wherein each connecting line is drawn to form a resistor network by each end points of planar resistor block, form the connecting line open circuit of multiple combination by each interconnective connecting line of substrate bore process selective destruction, make this adjustable electric resistance change, can reach the adjustable resistance that accurately to adjust resistance value.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (6)
1. the adjustable resistance in the multilager base plate, this adjustable resistance is arranged at arbitrary layer of a multilager base plate, it is characterized in that this adjustable resistance comprises:
One planar resistor material block, this planar resistor block is provided with a plurality of end points; And
A plurality of connecting lines that are connected with this planar resistor material block, and each connecting line is drawn to form a resistor network by each end points of planar resistor block;
Wherein, the connecting line that forms multiple combination by each interconnective connecting line of substrate bore process selective destruction is opened a way, with the resistance of accurate this adjustable resistance of adjustment.
2. the adjustable resistance in the multilager base plate according to claim 1 is characterized in that, is located at these a plurality of endpoint locations of this planar resistor block and can adjusts arbitrarily.
3. the adjustable resistance in the multilager base plate according to claim 1 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
4. method that forms the adjustable resistance in the multilager base plate is characterized in that this method comprises:
The adjustable resistance network that comprises a planar resistor material block and a plurality of connecting lines that are connected with this each end points of planar resistor material block in arbitrary layer of formation of multilager base plate; And
The connecting line that forms multiple combination by each interconnective connecting line of substrate bore process selective destruction is opened a way, with the resistance of this adjustable resistance network of accurate adjustment.
5. according to the method for the adjustable resistance in the described formation multilager base plate of claim 4, it is characterized in that, be located at these a plurality of endpoint locations of this planar resistor block and can adjust arbitrarily.
6. according to the method for the adjustable resistance in the described formation multilager base plate of claim 4, it is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610067011 CN101048035A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistance in multi-layer substrate and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610067011 CN101048035A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistance in multi-layer substrate and forming method thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102535515A Division CN102438400A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistor in multi-layer base plate and forming method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN101048035A true CN101048035A (en) | 2007-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200610067011 Pending CN101048035A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistance in multi-layer substrate and forming method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633427A (en) * | 2012-12-28 | 2014-03-12 | 中国科学院电子学研究所 | Broadband antenna based on planar resistor technology |
-
2006
- 2006-03-31 CN CN 200610067011 patent/CN101048035A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103633427A (en) * | 2012-12-28 | 2014-03-12 | 中国科学院电子学研究所 | Broadband antenna based on planar resistor technology |
| CN103633427B (en) * | 2012-12-28 | 2015-02-04 | 中国科学院电子学研究所 | Broadband antenna based on planar resistor technology |
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Open date: 20071003 |