CN102438400A - Adjustable resistor in multi-layer base plate and forming method thereof - Google Patents
Adjustable resistor in multi-layer base plate and forming method thereof Download PDFInfo
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- CN102438400A CN102438400A CN2011102535515A CN201110253551A CN102438400A CN 102438400 A CN102438400 A CN 102438400A CN 2011102535515 A CN2011102535515 A CN 2011102535515A CN 201110253551 A CN201110253551 A CN 201110253551A CN 102438400 A CN102438400 A CN 102438400A
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Abstract
The invention discloses an adjustable resistor in a multi-layer base plate and a forming method thereof. The adjustable resistor comprises a planar resistor block and a plurality of connection lines connected with the planar resistor block, wherein the respective connection lines are led out from respective end points of the planar resistor block to form a resistor network; and the respective connection lines which are connected with each other are selectively destroyed through a base plate drilling process, thus forming a multi-combination connection line open circuit to enable the resistance of the adjustable resistor to be variable. Thus, the resistance of the adjustable resistor can be accurately adjusted.
Description
The application is for dividing an application, and the application number of its female case application is 200610067011.7, and the applying date is on March 31st, 2006, and denomination of invention is " adjustable resistance in the multilager base plate and forming method thereof ".
Technical field
The present invention relates to adjustable resistance in a kind of multilager base plate and forming method thereof; Particularly relate to a kind of each interconnective connecting line and open a way, can reach the adjustable resistance that accurately to adjust resistance value with the connecting line that forms multiple combination through machine drilling process choice property destruction resistor network.
Background technology
As everyone knows, resistive element has been widely used in the circuit such as current limliting, voltage stabilizing and termination impedance control.Yet general small-sized resistive element major part is through surface adhering technology (Surface Mounted Technique; SMT) etc. complicated technology is accomplished welding; Though the miniaturization day by day of this resistive element, but still need be arranged at the surface of multilager base plate and improved the entity circuit area and the height.In order resistive element to be buried the inside in Mulitilayer circuit board; The research and development unit of existing many materials accomplished the exploitation of cloth of coating-type resistance material and successfully be applied in the various electronic circuits in recent years; Yet the resistance of cloth of coating-type is because of the error of material prescription and wire mark; The resistive element that makes coating accomplish need pass through the fine setting that high-accuracy laser facility or abrasive blasting machine are done resistance value, and this method only limits to the fine setting work of the cloth of coating-type resistance on surface.
(Thick Film Resistor presents a nonequilibrium condition to general commercial thick-film resistor when TFR) printing ink is coated on the substrate, can't obtain a fixing resistance value, and its resistance value and predicted value present variation value approximately ± 20%.For accurately reaching the resistance value that is designed, the finishing process after thick-film resistor burns till is a procedure of processing necessary in the element manufacture process, and its method for trimming has abrasive blasting dressing method and laser reconditioning method.The abrasive blasting dressing method is that abrasive material is penetrated with the nozzle of a pressure-air through a slot, and through the geometry that resistive layer is repaired in the grinding of abrasive material and thick film resistive layer, the course of processing that does not heat is its advantage; But very easily cause the resistance border to expose and dust pollution with the abrasive blasting dressing method, and can't do high-precision finishing.The laser reconditioning rule gasifies through the high hot material with resistive layer that laser produced and produces 2 to 2.5mil breach; Its advantage is that high material removes rate, but the computer controlled automation operation, accurate and high speed; Clean processing technology, and can on high-density circuit board, process etc.; But because the slight crack that thermal shock caused then is its shortcoming.
Prior art is taken off the fine setting technology of surface coated formula resistance; Like United States Patent (USP) the 4th; 443; No. 782 " Method for Regulating the Value of a Thick Film Resistor and a Corresponding Resistor ", it uses the resistance value that the interior various grooving structures (slot) of region of resistive material are adjusted surperficial cloth of coating-type resistance, stresses to produce in which way this grooving structure though this patent has; But with present industrial technology, it is comparatively common to utilize the laser reconditioning method to adjust the mode of resistance value.
Sketch map for existing surface coated formula resistance shown in Figure 1; Wherein the computing formula of resistance R is R=ρ * L/A; Formula can know that the resistance of resistance R is counted ρ with the resistance of resistance material and the resistance length L is directly proportional thus; And be inversely proportional to the sectional area A of resistance, if the resistance material ρ of hypothesis surface coated formula resistance R and sectional area A thereof be under the fixing situation, then two resistance between electrode of surface coated formula resistance R change and only depend on the resistance material length L that electric current is flowed through.
Existing surface coated formula resistance is in the process of making, and the destabilizing factor that often produces burr or bake process because of the crawling of resistance material around the even or resistance material produces the variation on the resistance, makes the resistance value after the making produce great error; And have the technology of the surperficial cloth of coating-type resistance value of adjustment now and can't be applicable to internal layer resistance, so await proposing the interior adjustable resistance of a kind of multilager base plate to overcome the problems referred to above.
Summary of the invention
Technical problem to be solved by this invention is to propose the adjustable resistance in a kind of multilager base plate; This adjustable resistance forms a resistor network; Form the connecting line open circuit of multiple combination through each interconnective connecting line of substrate bore process selective destruction; Make this adjustable electric resistance change, can reach the adjustable resistance that accurately to adjust resistance value.
Another object of the present invention is to propose a kind of method that forms the adjustable resistance in the multilager base plate; Form the resistor network that comprises a planar resistor block and a plurality of connecting lines that are connected with each end points of planar resistor block earlier; Open a way with the connecting line that forms multiple combination through each interconnective connecting line of substrate bore process selective destruction again; Make the resistance value of this adjustable resistance change, can reach the adjustable resistance that accurately to adjust resistance value.
For realizing above-mentioned purpose, the present invention provides the adjustable resistance in a kind of multilager base plate, and this adjustable resistance is arranged at arbitrary layer of a multilager base plate, and this adjustable resistance comprises: a planar resistor material block, and this planar resistor block is provided with a plurality of end points; And a plurality of connecting lines that are connected with this planar resistor material block, and each connecting line is drawn to form a resistor network by each end points of planar resistor block; Wherein form the connecting line open circuit of multiple combination, make this adjustable electric resistance change, with the resistance of accurate this adjustable resistance of adjustment through each interconnective connecting line of substrate bore process selective destruction.
For realizing above-mentioned purpose; The present invention proposes adjustable resistance in a kind of multilager base plate and forming method thereof; This adjustable resistance comprises a planar resistor block and a plurality of connecting line that is connected with the planar resistor block; Wherein each connecting line is drawn to form a resistor network by each end points of planar resistor block; The connecting line that forms multiple combination through each interconnective connecting line of substrate bore process selective destruction is opened a way, and makes this adjustable electric resistance change, can reach the adjustable resistance that can accurately adjust resistance value.
Describe the present invention below in conjunction with accompanying drawing and specific embodiment, but not as to qualification of the present invention.
Description of drawings
Fig. 1 is the sketch map of existing surface coated formula resistance;
Fig. 2 is the adjustable resistance preferred embodiment sketch map in the multilager base plate of the present invention;
Fig. 3 is the adjustable resistance preferred embodiment equivalent circuit diagram in the multilager base plate of the present invention;
Fig. 4 is the adjustable resistance change list in the multilager base plate of preferred embodiment of the present invention;
Fig. 5 is the adjustable resistance change curve in the multilager base plate of preferred embodiment of the present invention;
Fig. 6 is another preferred embodiment sketch map of adjustable resistance in the multilager base plate of the present invention;
Fig. 7 is the another preferred embodiment sketch map of adjustable resistance in the multilager base plate of the present invention.
1,2,3,4,5,6,7,8,9,10,11,12,13,14: bore position
A, B, C, D, E, F, G, H, I, J, K, L, M, N: bore position
L1, L2, L3, L4, L5, L6: connecting line
LA, LB, LC, LD, LE, LF: connecting line
L7, L8, L9, L10, L11, L12, L13, L14: connecting line
LG, LH, LI, LJ, LK, LL, LM, LN: connecting line
R: adjustable resistance
R0: main resistor
Rs, RL, RC: interior resistance
Embodiment
Shown in Figure 2 is the interior adjustable resistance preferred embodiment sketch map of multilager base plate of the present invention; It is arranged at arbitrary layer of multilager base plate; This adjustable resistance R is a planar resistor block, and this planar resistor block is provided with a plurality of end points, and the position of these a plurality of end points belongs to arbitrarily; For convenience of explanation; A plurality of end points set in this preferred embodiment are regarded as comprising a main resistor R0 and a plurality of interior resistance R S that is connected with main resistor R0 with this adjustable resistance R, and wherein each end points all is provided with a connecting line (being L1-L6 and LA-LF) and draws and connect mutually forming a resistor network, and on each connecting line and be reserved with bore position 1-6 and A-F; In the time will adjusting the resistance value of adjustable resistance R; Can selected connecting line be broken to open-circuit condition through the substrate bore process, make each connecting line in this resistor network form the open circuit of multiple combination, adjust the equivalent resistance of adjustable resistance R whereby.
Shown in Figure 3 is the interior adjustable resistance preferred embodiment equivalent circuit diagram of multilager base plate of the present invention; This adjustable resistance R is promptly for being seen into the equivalent resistance of gained by electrode among Fig. 21; Wherein if main resistor R0 is 5000 ohm; Resistance R S is 100 ohm in each, then through destroying the combination that 12 bore position 1-6 shown in Fig. 2 or Fig. 3 and A-F go up different connecting lines, after calculating, can produce the adjustable electric resistance more than at least 30 kinds.
Fig. 4 is the adjustable resistance change list in the multilager base plate of the preferred embodiment of the present invention that calculates, and for instance, bore position changes 5 at bore position 1; 2; 3,4,5 hole; This moment, connecting line L1 was owing to bore position 1 is become open circuit by boring; So the connecting line L6 that is positioned at bore position 6 and is connected with connecting line L1 in fact also is open circuit, so the electric current of the main resistor R0 that flows through will select the minimum connecting line LF path flow of resistance to connecting line L2, so adjustable resistance R will connecting for resistance R S in the main resistor R0 and.And for example bore position changes 15 in bore position B, C, F, 1; 2,3,6 hole, and become open circuit owing to bore position 6 and F by boring this moment; The electric current of main resistor R0 just has connecting line L5 with continuing to flow through in two after the resistance R S so flow through, L4, and LE, paths such as LD are to flow to connecting line LA; And connecting line L5, L4, LE; Paths such as LD will form the parallel connection of three interior resistance R S, so adjustable resistance R will be for after the connecting of resistance R S in main resistor R0 and two, and three the formed parallel resistances of interior resistance R S of connecting again.
In addition; The present invention also proposes a kind of method that forms the adjustable resistance in the multilager base plate; This method is the resistor network that comprises a planar resistor block and a plurality of connecting lines that are connected with each end points of planar resistor block earlier in arbitrary layer of formation of multilager base plate; Open a way with the connecting line that forms multiple combination through each connecting line of substrate bore process selective destruction again, make this adjustable electric resistance change, to reach the adjustable resistance that accurately to adjust resistance value.And the multilager base plate among the present invention can be tellite, ceramic substrate or ic substrate.
Shown in Figure 5 is the interior adjustable resistance change curve of multilager base plate of preferred embodiment of the present invention; And Fig. 5 is that the bore position among Fig. 4 changes the corresponding relation figure with adjustable resistance R; Can learn the adjustable resistance in the multilager base plate that uses Fig. 2 by Fig. 5; Can produce the adjustable electric resistance more than at least 30 kinds; And this adjustable electric resistance is the highest can heighten 20% with main resistor R0, and therefore adjustable resistance and the method thereof in the multilager base plate of the present invention can be accurate to the adjustable electric resistance of main resistor below 1% at least.This result obviously reaches close adjustable resistance characteristic compared to the surface coated formula resistance of general use abrasive blasting dressing method and the fine setting of laser reconditioning method.
Shown in Figure 6 is interior another preferred embodiment sketch map of adjustable resistance of multilager base plate of the present invention; It is arranged at arbitrary layer of multilager base plate; This adjustable resistance R is a planar resistor block, and this planar resistor block is provided with a plurality of end points, and the position of these a plurality of end points belongs to arbitrarily; For convenience of explanation; Set a plurality of end points are regarded as comprising resistance R L in a main resistor R0 and a plurality of L type that is connected with main resistor R0 with this adjustable resistance R in this preferred embodiment, and wherein each end points minor face and each end points of being located at resistance R L in each L type all is provided with a connecting line (being L7-L10 and LG-LJ) and draws and connect mutually forming a resistor network, and on each connecting line and be reserved with bore position 7-10 and G-J; In the time will adjusting the resistance value of adjustable resistance R; Can selected connecting line be broken to open-circuit condition through the substrate bore process, make each connecting line in this resistor network form the open circuit of multiple combination, adjust the equivalent resistance of adjustable resistance R whereby.
Shown in Figure 7 is the interior another preferred embodiment sketch map of adjustable resistance of multilager base plate of the present invention; It is arranged at arbitrary layer of multilager base plate; This adjustable resistance R is a planar resistor block, and this planar resistor block is provided with a plurality of end points, and the position of these a plurality of end points belongs to arbitrarily; For convenience of explanation; Set a plurality of end points are regarded as comprising resistance R C in a main resistor R0 and a plurality of be connected with main resistor R0 ring-like with this adjustable resistance R in this preferred embodiment, and wherein each end points all is provided with a connecting line (being L11-L14 and LK-LN) Xiang Huanxin and draws and connect mutually forming a resistor network, and on each connecting line and be reserved with bore position 11-14 and K-N; In the time will adjusting the resistance value of adjustable resistance R; Can selected connecting line be broken to open-circuit condition through the substrate bore process, make each connecting line in this resistor network form the open circuit of multiple combination, adjust the equivalent resistance of adjustable resistance R whereby.
Comprehensively above-mentioned; The present invention proposes adjustable resistance in a kind of multilager base plate and forming method thereof; This adjustable resistance comprises a planar resistor block and a plurality of connecting line that is connected with the planar resistor block; Wherein each connecting line is drawn to form a resistor network by each end points of planar resistor block; The connecting line that forms multiple combination through each interconnective connecting line of substrate bore process selective destruction is opened a way, and makes this adjustable electric resistance change, can reach the adjustable resistance that can accurately adjust resistance value.
Certainly; The present invention also can have other various embodiments; Under the situation that does not deviate from spirit of the present invention and essence thereof; Those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (21)
1. the adjustable resistance in the multilager base plate, this adjustable resistance is arranged at arbitrary layer of a multilager base plate, it is characterized in that this adjustable resistance comprises:
First electrode;
Second electrode, described second electrode and said first electrode have a predeterminable range accordingly;
The planar resistor block; This planar resistor block is provided with a plurality of end points; Set a plurality of end points are regarded as comprising main resistor and a plurality of interior resistance that is connected with main resistor with this adjustable resistance; And each end points is positioned on the resistance, and wherein said planar resistor block is electrically connected said first electrode and said second electrode respectively;
A plurality of interior resistance are in-line and are connected with main resistor; Each end points all is provided with a connecting line; Be connected respectively to the end points of said planar resistor block from said second electrode; The both sides of resistance are staggered relatively in in-line draws and connection mutually, to form a resistor network jointly with main resistor, interior resistance; And
Wherein, Be reserved with bore position on each connecting line; Form the connecting line open circuit of series connection and/or parallel connection combination through each interconnective connecting line of substrate bore process selective destruction; And connected with main resistor in all interior resistance series connection and/or parallel connection back, with the resistance of accurate this adjustable resistance of adjustment.
2. the adjustable resistance in the multilager base plate according to claim 1; It is characterized in that; Wherein each connecting line comprises that first and second portion correspond to each other; Said first comprises that a plurality of connecting lines are connected respectively to each end points, and said second portion comprises that a plurality of connecting lines are connected respectively to each end points, said first and said second portion be interlock said planar resistor block form said in resistance.
3. the adjustable resistance in the multilager base plate according to claim 1 is characterized in that being positioned at ohmically these a plurality of endpoint locations can adjust arbitrarily.
4. the adjustable resistance in the multilager base plate according to claim 1 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
5. the adjustable resistance in the multilager base plate, this adjustable resistance is arranged at arbitrary layer of a multilager base plate, it is characterized in that this adjustable resistance comprises:
First electrode;
Second electrode, described second electrode and said first electrode have a predeterminable range accordingly;
The planar resistor block; This planar resistor block is provided with a plurality of end points; Set a plurality of end points are regarded as comprising main resistor and a plurality of interior resistance that is connected with main resistor with this adjustable resistance; And each end points is positioned on the resistance, and wherein said planar resistor block is electrically connected said first electrode and said second electrode respectively;
Resistance is L-shaped in a plurality of is connected with main resistor; Each end points all is provided with a connecting line; Be connected respectively to the end points of said planar resistor block from said second electrode, the both sides of resistance are staggered relatively in L shaped draws and connects mutually, with main resistor, the common resistor network that forms of interior resistance;
Wherein, Be reserved with bore position on each connecting line; Form the connecting line open circuit of series connection and/or parallel connection combination through each interconnective connecting line of substrate bore process selective destruction; And connected with main resistor in all interior resistance series connection and/or parallel connection back, with the resistance of accurate this adjustable resistance of adjustment.
6. the adjustable resistance in the multilager base plate according to claim 5; It is characterized in that; Wherein each connecting line comprises that first and second portion correspond to each other; Said first comprises that a plurality of connecting lines are connected respectively to each end points, and said second portion comprises that a plurality of connecting lines are connected respectively to each end points, said first and said second portion be interlock said planar resistor block form said in resistance.
7. the adjustable resistance in the multilager base plate according to claim 5 is characterized in that being positioned at ohmically these a plurality of endpoint locations can adjust arbitrarily.
8. the adjustable resistance in the multilager base plate according to claim 5 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
9. the adjustable resistance in the multilager base plate, this adjustable resistance is arranged at arbitrary layer of a multilager base plate, it is characterized in that this adjustable resistance comprises:
First electrode;
Second electrode, described second electrode and said first electrode have a predeterminable range accordingly;
The planar resistor block; This planar resistor block is provided with a plurality of end points; Set a plurality of end points are regarded as comprising main resistor and a plurality of interior resistance that is connected with main resistor with this adjustable resistance; And each end points is positioned on the resistance, and wherein said planar resistor block is electrically connected said first electrode and said second electrode respectively;
A plurality of interior resistance are ring-like interior resistance and are connected with main resistor, and each end points all is provided with a connecting line, and Xiang Huanxin draws and connects mutually, to form a resistor network jointly with main resistor, interior resistance; And
Wherein, Be reserved with bore position on each connecting line; Form the connecting line open circuit of series connection and/or parallel connection combination through each interconnective connecting line of substrate bore process selective destruction; And connected with main resistor in all interior resistance series connection and/or parallel connection back, with the resistance of accurate this adjustable resistance of adjustment.
10. the adjustable resistance in the multilager base plate according to claim 9; It is characterized in that; Wherein each connecting line comprises that first and second portion correspond to each other; Said first comprises that a plurality of connecting lines are connected respectively to each end points, and said second portion comprises that a plurality of connecting lines are connected respectively to each end points, said first and said second portion be interlock said planar resistor block form said in resistance.
11. the adjustable resistance in the multilager base plate according to claim 9 is characterized in that being positioned at ohmically these a plurality of endpoint locations can adjust arbitrarily.
12. the adjustable resistance in the multilager base plate according to claim 9 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
13. a method that forms the adjustable resistance in the multilager base plate is characterized in that this method comprises:
Arbitrary layer of formation at multilager base plate comprises a planar resistor block; This planar resistor block is provided with a plurality of end points; Set a plurality of end points are regarded as comprising a main resistor and a plurality of interior resistance that is connected with main resistor with this adjustable resistance; And each end points is positioned on the resistance, and said planar resistor block arrangement is between first electrode and second electrode, and wherein said planar resistor block is electrically connected said first electrode and said second electrode respectively;
A plurality of interior resistance are in-line and are connected with main resistor; Each end points all is provided with staggered relatively the drawing and connection mutually in both sides of connecting line resistance in in-line; To form a resistor network jointly with main resistor, interior resistance; Wherein each connecting line comprises that first and second portion correspond to each other; Said first comprises that a plurality of connecting lines are connected respectively to each end points, and said second portion comprises that a plurality of connecting lines are connected respectively to each end points, said first and said second portion be interlock said planar resistor block form said in resistance;
Be reserved with bore position on each connecting line; Form the connecting line open circuit of series connection and/or parallel connection combination through each interconnective connecting line of substrate bore process selective destruction; And connected with main resistor in all interior resistance series connection and/or parallel connection back, with the resistance of this adjustable resistance network of accurate adjustment.
14. the method according to the adjustable resistance in the said formation multilager base plate of claim 13 is characterized in that these a plurality of endpoint locations can be adjusted arbitrarily.
15. the method according to the adjustable resistance in the said formation multilager base plate of claim 13 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
16. a method that forms the adjustable resistance in the multilager base plate is characterized in that this method comprises:
Arbitrary layer of formation at multilager base plate comprises a planar resistor block; This planar resistor block is provided with a plurality of end points; Set a plurality of end points are regarded as comprising a main resistor and a plurality of interior resistance that is connected with main resistor with this adjustable resistance; And each end points is positioned on the resistance, and said planar resistor block arrangement is between first electrode and second electrode, and wherein said planar resistor block is electrically connected said first electrode and said second electrode respectively;
Resistance is L-shaped in a plurality of when being connected with main resistor; Each end points all is provided with staggered relatively the drawing and connection mutually in both sides of connecting line resistance in L shaped; To form a resistor network jointly with main resistor, interior resistance; Wherein each connecting line comprises that first and second portion correspond to each other; Said first comprises that a plurality of connecting lines are connected respectively to each end points, and said second portion comprises that a plurality of connecting lines are connected respectively to each end points, said first and said second portion be interlock said planar resistor block form said in resistance;
Be reserved with bore position on each connecting line; Form the connecting line open circuit of series connection and/or parallel connection combination through each interconnective connecting line of substrate bore process selective destruction; And connected with main resistor in all interior resistance series connection and/or parallel connection back, with the resistance of this adjustable resistance network of accurate adjustment.
17. the method according to the adjustable resistance in the said formation multilager base plate of claim 16 is characterized in that these a plurality of endpoint locations can be adjusted arbitrarily.
18. the method according to the adjustable resistance in the said formation multilager base plate of claim 16 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
19. a method that forms the adjustable resistance in the multilager base plate is characterized in that this method comprises:
Arbitrary layer of formation at multilager base plate comprises a planar resistor block; This planar resistor block is provided with a plurality of end points; Set a plurality of end points are regarded as comprising a main resistor and a plurality of interior resistance that is connected with main resistor with this adjustable resistance; And each end points is positioned on the resistance, and said planar resistor block arrangement is between first electrode and second electrode, and wherein said planar resistor block is electrically connected said first electrode and said second electrode respectively;
In a plurality of resistance be ring-like in resistance is connected with main resistor, each end points all is provided with a connecting line and draws and connect mutually to the ring heart, with main resistor, interior resistance formation one resistor network jointly; And
Be reserved with bore position on each connecting line; Form the connecting line open circuit of series connection and/or parallel connection combination through each interconnective connecting line of substrate bore process selective destruction; And connected with main resistor in all interior resistance series connection and/or parallel connection back, with the resistance of this adjustable resistance network of accurate adjustment.
20. the method according to the adjustable resistance in the said formation multilager base plate of claim 19 is characterized in that these a plurality of endpoint locations can be adjusted arbitrarily.
21. the method according to the adjustable resistance in the said formation multilager base plate of claim 19 is characterized in that this multilager base plate can be tellite, ceramic substrate or ic substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102535515A CN102438400A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistor in multi-layer base plate and forming method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011102535515A CN102438400A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistor in multi-layer base plate and forming method thereof |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200610067011 Division CN101048035A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistance in multi-layer substrate and forming method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN102438400A true CN102438400A (en) | 2012-05-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011102535515A Pending CN102438400A (en) | 2006-03-31 | 2006-03-31 | Adjustable resistor in multi-layer base plate and forming method thereof |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0327078A2 (en) * | 1988-02-04 | 1989-08-09 | Kabushiki Kaisha Toshiba | Trimming resistor network |
| EP1045626A1 (en) * | 1999-04-16 | 2000-10-18 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
-
2006
- 2006-03-31 CN CN2011102535515A patent/CN102438400A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0327078A2 (en) * | 1988-02-04 | 1989-08-09 | Kabushiki Kaisha Toshiba | Trimming resistor network |
| EP1045626A1 (en) * | 1999-04-16 | 2000-10-18 | Delphi Technologies, Inc. | Method for high resolution trimming of PCB components |
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Application publication date: 20120502 |