CN101038889A - Substrate table and substrate processing apparatus - Google Patents
Substrate table and substrate processing apparatus Download PDFInfo
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- CN101038889A CN101038889A CN 200710088378 CN200710088378A CN101038889A CN 101038889 A CN101038889 A CN 101038889A CN 200710088378 CN200710088378 CN 200710088378 CN 200710088378 A CN200710088378 A CN 200710088378A CN 101038889 A CN101038889 A CN 101038889A
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- placing platform
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Abstract
The invention provides a substrate carrier table without harm of carrier table body by lifter pin. The substrate carrier table (4) comprises: carrier table body (4a); and lifter pin (30), which vertically inserts the carrier table body (4a) and freely lifts and falls by its front part in the surface of the carrier table body (4a). Wherein, the lifter pin (30) is located in retreat position insides the carrier table body (4a), or support position protruding from the carrier table body (4a) and supporting the substrates. The lifter pin (30) comprises bending part (35), which bends when the lifter pin (30) is located in the support position, and transverse force smaller than the transformative force is located on the surface or top of the carrier table body (4a).
Description
Technical field
The present invention relates in substrates such as the glass substrate of the flat-panel monitor (FPD) of liquid crystal indicator (LCD) etc. being made usefulness or semiconductor wafer carry out substrate board treatment that dry ecthing etc. handles the substrate-placing platform of mounting substrate and be suitable for the substrate board treatment of this substrate-placing platform in container handling.
Background technology
For example, in FPD or semi-conductive manufacture process, glass substrate or semiconductor wafer as processed substrate are carried out dry ecthing, sputter or CVD various processing such as (chemical vapor depositions).
For example, such processing is carried out under the state on the substrate-placing platform that substrate-placing is being arranged in the cavity, and the loading and unloading of substrate on substrate-placing platform are undertaken by a plurality of lifter pin liftings that substrate-placing platform is had.Promptly, when mounting substrate, become the state that makes lifter pin outstanding from the surface of mounting table body, the substrate that is positioned on the carrying arm is moved on the pin, lifter pin is descended.In addition, when unloading carried base board, from the state of substrate-placing on the mounting table body, lifter pin is risen, substrate is risen from the mounting table body surface, under this state, substrate moved be placed on the carrying arm.This technology is a prior art, for example, is disclosed in the patent documentation 1.
In addition, the glass substrate that FPD is used carries out in the Etaching device of plasma etching, configuration pair of parallel plate electrode (upper and lower electrode) in cavity, and substrate-placing platform plays a role as lower electrode.In this case, handle uniformly, be necessary to utilize metal, for example stainless steel (SUS) to constitute lifter pin as conductive material in order in real estate, to realize.
Yet, be that the glass substrate trend that the FPD of representative uses maximizes with LCD, demand surpasses the huge substrate of 2m on one side, and substrate-placing platform also maximizes in trend.And in order to support large substrate, the number of lifter pin also needs a plurality of.Therefore, substrate-placing platform itself becomes the high parts of price.Particularly, as mentioned above,, cooling body or administration of power supply etc. are installed, so price is higher because the substrate-placing platform of Etaching device plays a role as lower electrode.
This substrate-placing platform, because set a plurality of lifter pins lifting in the mounting table body, under the state that lifter pin is given prominence to from the mounting table body, if the fault of generation carrying arm contact lifter pin etc., then might wounded substrate mounting table itself.Particularly, under the situation of the metallic lifter pin of stating in the use, make lifter pin bending itself by the power of the transverse direction of contact carrying arm etc., in a series of conveyance action, keep the state of lifter pin bending, carry out lifting action, the possibility of the substrate-placing platform of damage high price improves.Like this, if produce damage on the mounting table body, the then essential substrate-placing platform of changing high price becomes the main cause that installation cost improves.
[patent documentation 1] spy opens flat 11-340208 communique
Summary of the invention
The present invention proposes in view of the above problems, its objective is to provide to be difficult to produce the substrate-placing platform and substrate board treatment with this substrate-placing platform of lifter pin to the damage of mounting table body.
In order to address the above problem, in first viewpoint of the present invention, provide a kind of substrate-placing platform, the mounting substrate is characterized in that in substrate board treatment, comprising: the mounting table body; And lifter pin, lead to vertically and be inserted in the above-mentioned mounting table body, but be set to free lifting with outstanding with respect to the surface of above-mentioned mounting table body and submerge, with its preceding end bearing and elevation base plate; Wherein, above-mentioned lifter pin can be in and submerge at the intrinsic retreating position of above-mentioned mounting table; On the bearing position of, supporting substrates outstanding from above-mentioned mounting table body, it has kink, when above-mentioned lifter pin is positioned on the above-mentioned bearing position, will be than the power of above-mentioned lifter pin distortion the cross force of little prescribed level when being applied to the surface location of above-mentioned mounting table body or its top position, this kink bending.
In above-mentioned first viewpoint, above-mentioned lifter pin can be for having the structure of lower member and upper-part, and lower member is formed in the below part of the below of above-mentioned kink, and upper-part constitutes the upper section of the top of above-mentioned kink.In this case, above-mentioned lifter pin can be chimeric and constitute by above-mentioned lower member and above-mentioned upper-part, and its telescoping part plays a role as above-mentioned kink.Above-mentioned lifter pin also can be connected with above-mentioned upper-part and be constituted by above-mentioned lower member, and its coupling part plays a role as above-mentioned kink.Above-mentioned lifter pin is also can be by above-mentioned lower member chimeric with above-mentioned upper-part and be connected at least a portion of this telescoping part and constitute, and this telescoping part and coupling part play a role as above-mentioned kink.Perhaps, above-mentioned lifter pin also can constitute by there are the flexible parts that the pliability distortion is set between above-mentioned lower member and above-mentioned upper-part, and above-mentioned flexible parts play a role as above-mentioned kink.
In above-mentioned first viewpoint, above-mentioned lifter pin also can be following structure, also have between above-mentioned lower member and above-mentioned upper-part, apply compression stress apply the compression stress parts, when the cross force with the afore mentioned rules size is applied on the above-mentioned lifter pin, above-mentioned compression stress is disengaged, above-mentioned kink bending.In this case, the above-mentioned compression stress parts that apply are helical spring.
In addition, above-mentioned lifter pin can be following structure, also have to above-mentioned upper-part apply upwards active force apply the active force parts with at the link that under the state that applies active force on the above-mentioned upper-part, is connected above-mentioned lower member and above-mentioned upper-part, when the cross force with the afore mentioned rules size is applied on the above-mentioned lifter pin, the connection of above-mentioned link is disengaged, above-mentioned kink bending.In this case, the above-mentioned active force parts that apply are helical spring, above-mentioned link can be following structure, has the fixed part that is fixed on the above-mentioned lower member and when on above-mentioned upper-part, being applied with active force, card ends the fastener of above-mentioned upper-part, when the cross force with the afore mentioned rules size was applied on the above-mentioned lifter pin, the card of above-mentioned fastener only was disengaged, above-mentioned kink bending.
In above-mentioned first viewpoint, above-mentioned lower member is a metallic, and above-mentioned upper-part is a resin system.In addition, above-mentioned lower member and above-mentioned upper-part have conductivity, and it is connected to, via above-mentioned kink, and the lower end electrically conducting from the front end of above-mentioned upper-part to above-mentioned lower member.In this case, have at above-mentioned kink under the situation of coupling part of above-mentioned upper-part and above-mentioned lower member, can use electrically conducting adhesive as the coupling part.In addition, exist to be provided with under the situation of above-mentioned flexible parts between above-mentioned upper-part and above-mentioned lower member, above-mentioned lower member and above-mentioned upper-part have conductivity, and above-mentioned flexible parts also can be made of electroconductive resin.In addition, above-mentioned lower member and above-mentioned upper-part also can all be made with metal, also can be for above-mentioned lower member is made of metal, and the structure that above-mentioned upper-part is made by electroconductive resin.Above-mentioned upper-part can be for having the structure of metal central part and the resin component that covers its outside.In addition, via above-mentioned kink, under the situation of the structure that the lower end from the front end of above-mentioned upper-part to above-mentioned lower member connects in the mode of electrically conducting, preferred above-mentioned lifter pin and above-mentioned mounting table body are idiostatic like this.
In above-mentioned first viewpoint, above-mentioned processing unit is the device that carries out plasma treatment, and above-mentioned mounting table body can play the bottom electrode.In addition, can be positioned at from the structure of the maintenance position of above-mentioned bearing position rising for above-mentioned lifter pin.
In second viewpoint of the present invention, a kind of substrate board treatment is provided, it is characterized in that, comprising: the container handling of accommodating substrate; Be arranged in the above-mentioned container handling, the substrate-placing platform of mounting substrate; With in above-mentioned process chamber, substrate is carried out the processing mechanism of predetermined processing, wherein, the aforesaid substrate mounting table has the structure of above-mentioned first viewpoint.
In above-mentioned second viewpoint, above-mentioned processing mechanism can be following structure, and above-mentioned processing mechanism comprises that in above-mentioned container handling the plasma of supplying with the gas supply mechanism of handling gas, discharge the exhaust gear of the gas in the above-mentioned container handling and generate the plasma of above-mentioned processing gas in above-mentioned container handling generates mechanism.In addition, above-mentioned plasma generates mechanism can be following structure, has comprised aforesaid substrate mounting table, and the upper electrode that is oppositely arranged of substrate-placing platform and High frequency power is applied to high frequency electric source on the substrate-placing platform of the effect of bottom electrode.
According to the present invention, above-mentioned lifter pin can be in and submerge at the intrinsic retreating position of above-mentioned mounting table; On the bearing position of, supporting substrates outstanding from above-mentioned mounting table body, it has kink, when above-mentioned lifter pin is positioned on the above-mentioned bearing position, will be than the power of above-mentioned lifter pin distortion the cross force of little prescribed level when being applied to the surface location of above-mentioned mounting table body or its top position, this kink bending.Thus, even cross force acts on the lifter pin that is in bearing position on the outstanding part of mounting table body surface, because before the lifter pin distortion, bend at kink, therefore can prevent lifter pin distortion coup injury mounting table body, perhaps also can prevent under the state that keeps the lifter pin distortion, still to carry out lifting action damage mounting table body.
Description of drawings
Fig. 1 is the sectional view of expression one plasma Etaching device, and this plasma Etaching device is an example of processing unit that is provided with the pedestal of the substrate-placing platform that relates to as an embodiment of the invention.
Fig. 2 is the sectional view of the pedestal in the processing unit that amplifies presentation graphs 1.
Fig. 3 is the plane graph of the configuration usefulness of explanation lifter pin on base body.
Fig. 4 is the figure that is illustrated in an example of the structure of employed lifter pin in the pedestal of the substrate-placing platform that relates to as an embodiment of the invention.
The sketch that Fig. 5 uses for the method for maintaining of the lifter pin in the pedestal of explanation present embodiment.
The figure that Fig. 6 uses for the distortion example of the kink of the lifter pin of key diagram 4.
The figure that Fig. 7 uses for another example of the kink of the lifter pin of key diagram 4.
Fig. 8 is the figure of distortion example of the lifter pin of presentation graphs 4.
Fig. 9 is the figure of another example of the structure of expression lifter pin.
Figure 10 is the figure of another example of the structure of expression lifter pin.
Symbol description
1: processing unit (plasma-etching apparatus)
2: cavity (container handling)
3: insulation board
4: pedestal (substrate-placing platform)
4a: base body (mounting table body)
5: basis material
5a: protuberance
6: insulating element
7: dividing plate (spacer) parts
11: spray head (gas feed unit)
20: exhaust apparatus
25: high frequency electric source (plasma generation unit)
30: lifter pin
30a: lower member
30b: upper-part
34: the flexible parts
35: kink
36,36 ': recess
37,37 ': protuberance
38,38 ', 38 " bond layer
39: maintenance department
40: central part
41: resinite
43: helical spring (applying the compression stress parts)
44: recess
51: helical spring (applying the active force parts)
52: link
52b: junction surface
54a: stage portion
55: compressed part
G: glass substrate
Embodiment
Below, with reference to accompanying drawing, embodiments of the present invention are described.Fig. 1 is the sectional view of expression one plasma Etaching device, and this plasma Etaching device is an example of processing unit that is provided with the pedestal of the substrate-placing platform that relates to as an embodiment of the invention.This plasma Etaching device 1 is the device that the glass substrate G that FPD uses is carried out predetermined process, and it constitutes as capacitive coupling type parallel flat plasma-etching apparatus.Here, LCD (LCD), electroluminescence (Electro Luminescence:EL) display and plasma display (PDP) etc. have been represented for example as FPD.
This plasma Etaching device 1 has by the aluminium of surface after pellumina is handled (anodized) cavity 2 that constitute, that form the rib barrel shape.
Bottom in this cavity 2 be provided with mounting as the glass substrate G of processed substrate, as the pedestal 4 of substrate-placing platform.This pedestal 4 comprises base body 4a and carries out the lifter pin 30 that the loading and unloading of glass substrate G are used to this base body 4a.
On base body 4a, be connected with the supply lines 23 that supply high frequency electric power is used, on this supply lines 23, be connected with adaptation 24 and high frequency electric source 25.From high frequency electric source 25 for example High frequency power of 13.56MHz is supplied to pedestal 4.
Above said base 4, with these pedestal 4 parallel spray heads 11 that have been relatively set with the upper electrode effect.Spray head 11 is supported in the top of cavity 2, and inner space 12 is arranged in inside, simultaneously, is formed with the squit hole 13 that gases are handled in a plurality of ejections on the face relative with pedestal 4.These spray head 11 ground connection constitute the pair of parallel plate electrode with pedestal 4.
On spray head 11, be provided with gas introduction port 14, on this gas introduction port 14, be connected with and handle gas supply pipe 15, on this processing gas supply pipe 15, be connected with processing gas supply source 18 via valve 16 and mass flow controller 17.Supply with the processing gas that etching is used from handling gas supply source 18.Can use halogen gas, O as handling gas
2The gas that gas, Ar gas etc. use in this field usually.
Be formed with blast pipe 19 in the bottom of above-mentioned cavity 2, on this blast pipe 19, be connected with exhaust apparatus 20.Exhaust apparatus 20 has turbomolecular pump equal vacuum pump, thus, constitutes and can will be evacuated to the reduced atmosphere of regulation in the cavity 2.In addition, the sidewall of cavity 2 is provided with substrate and moves into and take out of mouthfuls 21 and open and close this substrate and move into and take out of mouthfuls 21 gate valve 22, under the state of opening this gate valve 22, can be between adjacent load locking room (not illustrating among the figure) conveyance substrate G.
Below, with reference to enlarged drawing shown in Figure 2, explain the pedestal 4 of the substrate-placing platform that relates to as an embodiment of the invention.
As mentioned above, this pedestal 4 has base body 4a and lifter pin 30.Base body 4a has metal basis material 5 and is arranged on insulating element 6 on the periphery edge of basis material 5.
On the diapire 2a of cavity 2,, be provided with dividing plate (spacer) parts 7 that constitute by insulator in the mode corresponding with the periphery edge of base body 4a.Mounting has base body 4a thereon.Between partition component 7 and the diapire 2a, sealed airtightly between partition component 7 and the base body 4a, between base body 4a and diapire 2a, be formed with the space 31 of air atmosphere.So, realize air insulation by this space 31.The a plurality of insulating elements 32 that are made of the insulators such as pottery of supporting base body 4a are embedded in the diapire 2a, and the vertical through hole that is provided with at the center of these insulating elements 32 utilizes the screw 33 that is inserted in the through hole fixedly diapire 2a and base body 4a.
On base body 4a, promptly on the surface of basis material 5, become overshooting shape to be formed with a plurality of protuberance 5a that constitute by dielectric material, these protuberances 5a becomes its state on every side of parts 6 encirclements that is insulated.The upper surface of the upper surface of insulating element 6 and protuberance 5a is at equal height, under situation about glass substrate G being positioned on the base body 4a, becomes the upper surface state of contact with the upper surface and the protuberance 5a of insulating element 6.
On lifter pin 30, has kink 35, when lifter pin is positioned at bearing position, this bending part is in the surface location of base body 4a or on the position above relying on a little, when the power cross force little, prescribed level than lifter pin 30 distortion is applied on the ledge of lifter pin 30, this kink bending.
Promptly, lifter pin 30 has lower member 30a and upper-part 30b, on the position of above-mentioned kink 35, these link together.So, by the load more than the setting (power) is applied on the lifter pin 30, can be from kink 35 bendings.
Specifically, as shown in Figure 4, with regard to kink 35, the protuberance 37 that is arranged on the bottom central authorities of upper-part 30b embeds in the recess 36 of the upper end central authorities that are arranged on lower member 30a, and has the bond layer 38 that forms between the front end of the bottom surface of recess 36 and protuberance 37.By regulating recess 36 and the height of protuberance 37 or the area of bond layer 38 etc., the minimum value of the power in the time of can adjusting from kink 35 bendings.Thus, in the lifting action of glass substrate G, kink 35 is indeformable, can as usually, move, still, and when when laterally being applied to the power more than the setting on the lifter pin 30, can be from kink 35 bendings.
Be provided with when maintenances such as the installation taking-up of carrying out lifter pin 30 maintenance department 39 that uses instruments such as spanner in position under the kink 35.In the prior art, this maintenance is carried out on the bearing position of supporting glass substrate G, and therefore, as glass substrate G during at bearing position, shown in Fig. 5 (a), maintenance department 39 is necessary to project on the surface of base body 4a.When adopting this state in the present embodiment, the position of kink 35 above quite relying on more than the surface of base body 4a.But preferably the lifter pin crooked place is near the surface of base body 4a.Therefore, shown in Fig. 5 (b), on bearing position, the height and position that makes kink 35 is in the apparent height of base body 4a or the position of leaning on a little than it, guaranteeing on the basis of this optimum position, reset maintenance position after it is further risen from this bearing position as another stop position of this lifter pin 30, shown in Fig. 5 (C), by making lifter pin 30 be positioned at this maintenance position, make maintenance department 39 be positioned at the position that relies on the top than the surface of base body 4a, thereby can keep in repair lifter pin 30.Certainly, also can as prior art two positions of retreating position and bearing position only be set, on bearing position, carry out the installation of lifter pin and take out.
In addition, the shape of kink 35 is not limited only to shape shown in Figure 4, shown in Fig. 6 (a), also can make small size bond layer 38 ', as the combination of the protuberance 37 ' of the recess 36 ' of mortar shape and circular cone shape.In addition, only otherwise the action of lifter pin 30 is caused obstacle, shown in Fig. 6 (b), also can be that recess 36 and protuberance 37 are chimeric then.And for example shown in Fig. 6 (c), also 35 of kinks can be made plane bond layer 38 ".
In addition, as shown in Figure 7, also kink 35 can be constituted between lower member 30a and upper-part 30b exist be provided with pliability (or crooked) distortion, resinous flexible parts 34 for example, these flexible parts 34 distortion are from kink 35 bendings.In this case,, can form projection 45,46 in the end of lower member 30a and upper-part 30b respectively, flexible parts 34 can be set, to bury these projections 45,46 underground in order to improve the connectivity between lower member 30a and upper-part 30b and the flexible parts 34.Flexible parts 34 also can be configured as one with lower member 30a and upper-part 30b, utilize bonding agent etc. to be connected with upper-part 30b with lower member 30a after also can being shaped.
Viewpoint on the installation portion that does not illustrate from the figure of the below that reliably lifter pin 30 is installed in cavity 2 is as the preferred stainless steel of the material metal materials such as (SUS) that constitutes lower member 30a.In addition, from the viewpoint of the fricative problem of base body 4a that prevents upper-part 30b and hole 5b, preferred upper-part 30b is a resin component.
But, from carry out the viewpoint of uniform etch processes in real estate, the lower member 30a and the upper-part 30b of preferred lifter pin 30 have conductivity, via crimp 35, lower end electrically conducting from the front end of upper-part 30b to lower member 30a, 4a is idiostatic with base body.From this viewpoint, preferred, upper-part 30b constitutes with stainless steel metals such as (SUS), as the bond layer 38 preferred conductive adhesives that use, as the flexible parts 34 preferred electroconductive resins that use.In addition, utilizing bonding agent to connect under the situation of flexible parts 34 and lower member 30a, upper-part 30b,, preferably use conductive adhesive as bonding agent.Like this, via making lifter pin 30 that conductivity be arranged, as mentioned above, lifter pin 30 is via conductivity bellows 62 and block 60, and 4a is electrically connected with base body, and 4a is idiostatic with base body.Other has, and constitutes upper-part 30b by utilizing electroconductive resin, can take into account the problem and the etched uniformity that prevent that the friction with base body 4a from causing simultaneously.Certainly, also can utilize part or all of insulating material formation lifter pin 30, the bonding agent of bonding lower member 30a and upper-part 30b also can be insulating properties.As shown in Figure 8, by upper-part 30b is had central part 40 that constitutes by stainless steel (SUS) and the common resin piece 41 that is wound on its outside, can take into account the problem and the etched uniformity that prevent that the friction with base body 4a from causing simultaneously.
Secondly, the processing action of the plasma-etching apparatus 1 that constitutes like this is described.
At first, utilize the carrying arm that does not illustrate among the figure, will be as the glass substrate G of processed substrate, the load locking room that from figure, does not illustrate, move into via substrate and to take out of mouthfuls 21, move in the cavity 2, be positioned on the protuberance 5a and insulating element 6 lip-deep, that constitute by dielectric material that base body 4a went up, promptly was formed on base body 4a.In this case, lifter pin 30 is outstanding upward, is positioned on the bearing position, and the glass substrate G on the carrying arm is handed off on the lifter pin 30.Then, lifter pin 30 is descended, glass substrate G is positioned on the base body 4a.
Then, closing gate valve 22 utilizes exhaust apparatus 20 to be evacuated to the specified vacuum degree in the cavity 2.Subsequently, open valve 16, from handling gas supply source 18, when utilizing mass flow controller 17 to adjust its flow,, the inner space 12 of gas importing spray head 11 will be handled by handling gas supply pipe 15, gas introduction port 14, again by delivery outlet 13, be ejected to substrate G equably, regulate air displacement, and with cavity 2 inner control at authorized pressure.
In this state, from high frequency electric source 25, via adaptation 24, High frequency power is applied on the base body 4a, between as the pedestal 4 of lower electrode and spray head 11, produce high-frequency electric field as upper electrode, generate the plasma of handling gas, utilize this plasma that glass substrate G is carried out etch processes.
Like this, after carrying out etch processes, stop to apply High frequency power, stop import to handle gas, afterwards, the pressure in the cavity 2 are adjusted to the pressure of regulation, utilize lifter pin 30 that glass substrate G is risen to bearing position from high frequency electric source 25.Under this state, open gate valve 22, the carrying arm that does not illustrate among the figure is inserted in the cavity 2, the glass substrate G on the lifter pin 30 is handed off on the carrying arm.Move into via substrate again and take out of mouthfuls 21, glass substrate G is taken out of to figure in cavity 2 do not illustrate in the load locking room.
In above processing, when carrying out the moving into and take out of of glass substrate G, lifter pin 30 is positioned at from the outstanding bearing position in the surface of base body 4a, but in this case, sometimes produce the accident of conflict lifter pins such as carrying arm, make it be subjected to the effect of cross force.So, at this moment power is to reach under the situation of the size that makes the lifter pin distortion, in the prior art, at this moment power makes lifter pin 30 distortion, cause coup injury for base body 4a, perhaps under the state that keeps lifter pin 30 distortion, still continue to use, thus, produce the state of affairs of causing damage for base body 4a.Relative therewith, under the situation of present embodiment, when the cross force of the prescribed level littler than the power of lifter pin 30 distortion is applied on the ledge of lifter pin 30, owing to be formed with bent kink 35, before lifter pin 30 distortion, in kink 35 bendings, can on lifter pin 30, not produce distortion.Thus, can prevent base body 4a damage.
Below, another example of the structure of lifter pin 30 is described.
Fig. 9 is the schematic sectional view of another example of expression lifter pin.In this example, lifter pin 30 also has helical spring 43, applies the compression stress parts as compression stress is imposed between lower member 30a and the upper-part 30b.This helical spring 43 is arranged in the recess 44 on the top that is formed at lower member 30a, and an end is installed on the lower member 30a, and the other end is installed on the upper-part 30b.So under the common state shown in Fig. 9 (a), this helical spring 43 is housed in the recess 44 under extended state, utilize spring force at this moment between lower member 30a and upper-part 30b, to apply compression stress.Therefore, when lifter pin 30 carries out common lifting action, can produce under the situation of distortion etc. can't help compression stress, carry out lifting action.
Under the situation of the lifter pin 30 of this example, be set to will be than the power of lifter pin 30 distortion the cross force of little prescribed level when being applied on the lifter pin 30, bend at kink 35 places.Specifically, under also bigger than the compression stress between lower member 30a and the upper-part 30b cross force that acts between them is applied to situation on the lifter pin 30, in the bending of kink 35 places,, make the power of force rate lifter pin 30 distortion at this moment little so can adjust the tensile force of spring.Like this, when the cross force of regulation acts on the lifter pin 30, as Fig. 9 (b), bend at kink 35 places.
Secondly, another example of the structure of lifter pin 30 is described.
Figure 10 is the schematic sectional view of another example of expression lifter pin.In this example, lifter pin 30 also has as will be upward being applied to helical spring that applies the active force parts 51 and the resinous link 52 that is connected lower member 30a and upper-part 30b under the state that active force is applied to upper-part 30b on the upper-part 30b to the active force that applies effect.
The recess 53 of opening above the upper end of lower member 30a is formed with is formed with the recess 54 of lower opening in the bottom of upper-part 30b.In addition, have stage portion 54a on the top of recess 54, the above part of stage portion 54a is major diameter part 54b.Link 52 has threaded portion 52a in the bottom, there is the junction surface 52b of umbrella the upper end.Above-mentioned helical spring 51 embeds in the peripheral part of recess 53, and the central portion of recess 53 is inserted in the bottom of link 52, utilizes threaded portion 52a to be tightened on the lower member 30a.The top of link 52 embeds in the recess 54, and its junction surface 52b inserts among the major diameter part 54a, and junction surface 52b engages with stage portion 54a.Lower end at upper-part 30b is formed with compressed part 55 in the form of a ring, with corresponding with helical spring 51, and when connecting lower member 30a and upper-part 30b, compressed part 55 compression helical springs 51, its active force acts on the upper-part 30b.
Shown in Figure 10 (a), when the loading of glass substrate G did not act on the lifter pin 30, upper-part 30b was acted on upward by helical spring 51, and the stage portion 54a of recess 54 engages with the junction surface 52b of link 52, lifter pin 30 does not produce distortion etc., can stably carry out lifting action.In addition, shown in Figure 10 (b), do the time spent when the load of glass substrate G, helical spring is compressed, and the joint of junction surface 52b and stage portion 54a is disengaged, and only otherwise add cross force, just can carry out stable lifting action.
Under the situation of the lifter pin 30 of this example, be designed to when will be than the power of lifter pin 30 distortion the cross force of little prescribed level when being applied on the lifter pin 30, bend at kink 35 places.Specifically, be applied under the situation on the lifter pin 30 than being applied to cross force that the big masterpiece of active force on the upper-part 30b is used in a class on the upper-part 30b, the joint of stage portion 54a and junction surface 52b is disengaged, bend at kink 35 places, therefore can adjust the active force of spring, make that the power of force rate lifter pin 30 distortion at this moment is little.Thus, as Figure 10 (c), when the cross force with regulation is applied on the lifter pin 30, bend at kink 35 places.
In addition, in the example of Fig. 9, Figure 10,, utilize electroconductive resin to constitute upper-part 30b, can make structure as shown in Figure 8 certainly in order to ensure conductivity.
The present invention is not limited only to above-mentioned execution mode, and various distortion can be arranged.
For example, in the present embodiment, represented in pedestal, to use substrate-placing platform of the present invention to describe as example as the lower electrode of the capacitive coupling type parallel flat plasma-etching apparatus that High frequency power is applied to the RIE formula on the lower electrode, but be not limited only to this, in other plasma processing apparatus such as ashing, CVD film forming, also can use.Also can be the type of High frequency power being supplied with upper electrode, in addition, be not limited to the capacitive coupling type, also can be induction coupled mode.In addition, be not limited to plasma treatment, also can use in other processing unit.
In addition, as lifter pin, so long as it is just passable to have a lifter pin of the kink that can bend when applying the cross force of the prescribed level littler than the power of lifter pin distortion, the structure of kink is not limited to above-mentioned execution mode.For example, as long as satisfy this condition, kink also can be otch simply.
In addition, processed substrate is not limited to the glass substrate G that FPD uses, and other substrates such as semiconductor wafer also can.
Claims (23)
1, a kind of substrate-placing platform, the mounting substrate is characterized in that in substrate board treatment, comprising:
The mounting table body; With
Lifter pin leads to vertically and is inserted in the described mounting table body, but is set to free lifting with outstanding with respect to the surface of described mounting table body and submerge, with its preceding end bearing and elevation base plate; Wherein,
Described lifter pin can be in and submerge at the intrinsic retreating position of described mounting table; On the bearing position of, supporting substrates outstanding from described mounting table body, it has kink, when described lifter pin is positioned on the described bearing position, will be than the power of described lifter pin distortion the cross force of little prescribed level when being applied to the surface location of described mounting table body or its top position, this kink bending.
2, substrate-placing platform according to claim 1 is characterized in that:
Described lifter pin has lower member and upper-part, and lower member is formed in the below part of the below of described kink, and upper-part constitutes the upper section of the top of described kink.
3, substrate-placing platform according to claim 2 is characterized in that:
Described lifter pin is chimeric and constitute by described lower member and described upper-part, and its telescoping part plays a role as described kink.
4, substrate-placing platform according to claim 2 is characterized in that:
Described lifter pin is connected with described upper-part by described lower member and constitutes, and its coupling part plays a role as described kink.
5, substrate-placing platform according to claim 2 is characterized in that:
Described lifter pin constitutes by there are the flexible parts that the pliability distortion is set between described lower member and described upper-part, and described flexible parts play a role as described kink.
6, substrate-placing platform according to claim 2 is characterized in that:
Described lifter pin is chimeric with described upper-part and be connected at least a portion of this telescoping part and constitute by described lower member, and this telescoping part and coupling part play a role as described kink.
7, substrate-placing platform according to claim 2 is characterized in that:
Described lifter pin also have between described lower member and described upper-part, apply compression stress apply the compression stress parts, when the cross force with described prescribed level was applied on the described lifter pin, described compression stress was disengaged, described kink bending.
8, substrate-placing platform according to claim 7 is characterized in that:
The described compression stress parts that apply are helical spring.
9, substrate-placing platform according to claim 2 is characterized in that:
Described lifter pin also have to described upper-part apply upwards active force apply the active force parts with at the link that under the state that applies active force on the described upper-part, is connected described lower member and described upper-part, when the cross force with described prescribed level is applied on the described lifter pin, the connection of described link is disengaged, described kink bending.
10, substrate-placing platform according to claim 9 is characterized in that:
The described active force parts that apply are helical spring, described link has the fixed part that is fixed on the described lower member and when being applied with active force on described upper-part, card ends the fastener of described upper-part, when the cross force with described prescribed level is applied on the described lifter pin, the card of described fastener only is disengaged, described kink bending.
11, according to each described substrate-placing platform in the claim 2～10, it is characterized in that:
Described lower member is a metallic, and described upper-part is a resin system.
12, according to each described substrate-placing platform in the claim 2～10, it is characterized in that:
Described lower member and described upper-part have conductivity, and it is connected to, via described kink, and the lower end electrically conducting from the front end of described upper-part to described lower member.
13, substrate-placing platform according to claim 12 is characterized in that:
Have at described kink under the situation of coupling part of described upper-part and described lower member, use electrically conducting adhesive as the coupling part.
14, substrate-placing platform according to claim 5 is characterized in that:
Described lower member and described upper-part have conductivity,
Described flexible parts are made of electroconductive resin.
15, according to each described substrate-placing platform in the claim 12～14, it is characterized in that:
Described lower member and described upper-part are all made with metal.
16, according to each described substrate-placing platform in the claim 12～14, it is characterized in that:
Described lower member is made of metal, and described upper-part is made by electroconductive resin.
17, according to each described substrate-placing platform in the claim 12～14, it is characterized in that:
Described upper-part has metal central part and covers the resin component in its outside.
18, according to each described substrate-placing platform in the claim 12～17, it is characterized in that:
Described lifter pin and described mounting table body are idiostatic.
19, according to each described substrate-placing platform in the claim 1～18, it is characterized in that:
Described processing unit is the device that carries out plasma treatment, the effect of described mounting table main body lower electrode.
20, according to each described substrate-placing platform in the claim 1～19, it is characterized in that:
Described lifter pin can be positioned at the maintenance position that rises from described bearing position.
21, a kind of substrate board treatment is characterized in that, comprising:
Accommodate the container handling of substrate;
Be arranged in the described container handling, the substrate-placing platform of mounting substrate; With
In described process chamber, substrate is carried out the processing mechanism of predetermined processing, wherein,
Described substrate-placing platform has in the claim 1～20 each structure.
22, substrate board treatment according to claim 21 is characterized in that:
Described processing mechanism comprises that in described container handling the plasma of supplying with the gas supply mechanism of handling gas, discharge the exhaust gear of the gas in the described container handling and generate the plasma of described processing gas in described container handling generates mechanism.
23, substrate board treatment according to claim 22 is characterized in that:
Described plasma generates described substrate-placing platform that mechanism comprised the effect of bottom electrode, and the upper electrode that is oppositely arranged of substrate-placing platform and High frequency power put on high frequency electric source on the substrate-placing platform.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006073288 | 2006-03-16 | ||
| JP2006073288 | 2006-03-16 | ||
| JP2007008862 | 2007-01-18 |
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| Publication Number | Publication Date |
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| CN101038889A true CN101038889A (en) | 2007-09-19 |
| CN100477147C CN100477147C (en) | 2009-04-08 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100883781A Active CN100477147C (en) | 2006-03-16 | 2007-03-16 | Substrate table and substrate processing apparatus |
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| Country | Link |
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| CN (1) | CN100477147C (en) |
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| CN102108502A (en) * | 2009-12-25 | 2011-06-29 | 东京毅力科创株式会社 | Film deposition apparatus and film deposition method |
| CN102066602B (en) * | 2008-06-17 | 2012-10-31 | 株式会社新柯隆 | Bias sputtering apparatus |
| CN102820247A (en) * | 2011-06-07 | 2012-12-12 | 东京毅力科创株式会社 | Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatus |
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| KR102215641B1 (en) * | 2013-12-18 | 2021-02-16 | 주성엔지니어링(주) | Lift pin assembly and substrate processing apparatus having the same |
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| CN102066602B (en) * | 2008-06-17 | 2012-10-31 | 株式会社新柯隆 | Bias sputtering apparatus |
| CN102108502A (en) * | 2009-12-25 | 2011-06-29 | 东京毅力科创株式会社 | Film deposition apparatus and film deposition method |
| CN102108502B (en) * | 2009-12-25 | 2015-02-25 | 东京毅力科创株式会社 | Film deposition apparatus and film deposition method |
| CN102820247A (en) * | 2011-06-07 | 2012-12-12 | 东京毅力科创株式会社 | Substrate conveying container opening/closing device, lid opening/closing device and semiconductor manufacturing apparatus |
| CN102820247B (en) * | 2011-06-07 | 2016-04-20 | 东京毅力科创株式会社 | The opening and closing device of substrate transport box, the opening and closing device of lid and semiconductor-fabricating device |
| CN104217977A (en) * | 2013-05-31 | 2014-12-17 | 上海华虹宏力半导体制造有限公司 | Workpiece stage device of laser annealing equipment for silicon wafers |
| CN107393856A (en) * | 2016-05-16 | 2017-11-24 | 北京北方华创微电子装备有限公司 | A kind of lower electrode device, semiconductor processing equipment and residual charge method for releasing |
| CN107546171A (en) * | 2016-06-27 | 2018-01-05 | 东京毅力科创株式会社 | Substrate elevating mechanism, substrate-placing platform and substrate board treatment |
| CN111684102A (en) * | 2018-02-17 | 2020-09-18 | 应用材料公司 | Deposition ring for processing reduced size substrates |
| CN110346951A (en) * | 2018-04-02 | 2019-10-18 | 夏普株式会社 | Substrate support pedestal |
| CN112185882A (en) * | 2019-07-05 | 2021-01-05 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate transfer method |
| CN112185882B (en) * | 2019-07-05 | 2024-05-03 | 东京毅力科创株式会社 | Substrate processing apparatus and substrate transfer method |
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