CN110346951A - Substrate support pedestal - Google Patents
Substrate support pedestal Download PDFInfo
- Publication number
- CN110346951A CN110346951A CN201910239428.4A CN201910239428A CN110346951A CN 110346951 A CN110346951 A CN 110346951A CN 201910239428 A CN201910239428 A CN 201910239428A CN 110346951 A CN110346951 A CN 110346951A
- Authority
- CN
- China
- Prior art keywords
- substrate
- film
- support plate
- support pedestal
- display panel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Nonlinear Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Chemical & Material Sciences (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention is provided and can be easy and cheap the substrate support pedestal repaired.It is made of base station (10a) and support plate (10b), support plate (10b) is the component of the plate with the multiple protrusions (11) for projecting from the surface and being used to support substrate (PO), and organic material (10b1) used in support plate (10b) material used in display panel, such as glass substrate (GS) and the insulating film is constituted, and is replaceably mounted on base station (10a).
Description
Technical field
The present invention relates to be set to various devices used in the manufacture of display panel and be used to support to constitute the display surface
The substrate support pedestal of the substrate of plate.
Background technique
Manufacture liquid crystal display panel, the display panels such as organic EL panel process in, to constitute the substrate of the display panel into
The various processing of row.In the device for carrying out the various processing, it is often provided with the substrate support pedestal for being used to support substrate.For example,
Substrate support pedestal documented by following patent documents 1 is configured in the case where avoiding purpose of the foreign matter to the attachment at the back side of substrate
The surface of plate-shaped member is provided with multiple protrusions, by the front support substrate of above-mentioned multiple protrusions.In addition, following patent documents 1
Documented substrate support pedestal is formed with multiple protrusions and pasting multiple resin bumps in the face of supporting substrate.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2012-28622 bulletin
Summary of the invention
The technical problems to be solved by the invention
The substrate support pedestal as documented by above patent document 1, for as multiple protrusion supporting substrates tie
In the case where structure, above-mentioned multiple protrusions are worn due to caused by the contact with substrate, plasma/chemical liquid etc. and aging,
For example, there is the worry of adherency, stripping charge, ill-exposed, to substrate back scuffing for generating substrate etc..Therefore, more
In the case where a protrusion aging, need repairing substrate support pedestal.Substrate support pedestal documented by above patent document 1 passes through peeling
Multiple resin bumps simultaneously paste new multiple resin bumps, and thus, it is possible to repair multiple protrusions.However, above patent document
Substrate support pedestal documented by 1 must manufacture multiple resin bumps to be prepared, in addition, it is necessary to paste these resin protrusions
Operation as object especially.
The present invention is in view of such actual situation made, and project is to provide in the case where multiple protrusion agings
Etc. can be easy and cheap the substrate support pedestal repaired.
In order to solve the above problems, substrate support pedestal of the invention is used to support the substrate for constituting display panel, feature
Be, be configured to include:
Base station；With
Support plate is the component of the plate with the multiple protrusions for projecting from the surface and being used to support aforesaid substrate, and the branch
Fagging material used in above-mentioned display panel is constituted, and is replaceably mounted on above-mentioned base station.
According to the substrate support pedestal for such structure, since support plate material as used in display panel is formed, because
This does not need to use new material to make the support plate, so as to inhibit to repair spent cost.In addition, only leading to
The support plate that replacement material as used in the display panel is formed, the just maintenance of completing substrate supporting table are crossed, therefore can be contracted
In other words time needed for short maintenance can shorten the time for stopping the manufacture of display panel.In addition, in the base of the structure
In plate supporting table, various devices, method used in the manufacture using display panel, for example, by utilizing photoetching process in glass
Patterned method etc. is carried out to structure on substrate, is able to easily form multiple protrusions of support plate.
In addition, the material for being used to support plate is not particularly limited in the substrate support pedestal of the structure, it is desirable to multiple convex
Material as the back side of the portion as not scratching substrate, the material such as the material of resin system than substrate softness are formed.In addition, closing
The material used in support plate, it may be considered that various viewpoints are selected the material for the deterioration that can reduce multiple protrusions, are not easy
The material etc. of dust etc. is generated because of the abrasion of multiple protrusions.Further, support plate can be formed by individual material, can also be with
It is formed by two or more materials.
Invention effect
In accordance with the invention it is possible to inferior multiple protrusion agings the case where, providing can be easy and cheap repair
Substrate support pedestal.
Detailed description of the invention
Fig. 1 is the figure for schematically showing the substrate board treatment for the substrate support pedestal for having embodiments of the present invention.
Fig. 2 is the vertical view for being configured to the display panel for the substrate that the substrate support pedestal comprising embodiments of the present invention is supported
Figure.
Fig. 3 is the top view for indicating the pixel array of display panel shown in Fig. 2.
Fig. 4 is the cross-sectional view (Section A-A in Fig. 3) of display panel shown in Fig. 2.
Fig. 5 is the perspective view of the substrate support pedestal of embodiments of the present invention.
Fig. 6 is the cross-sectional view for indicating the substrate support pedestal amplification of embodiments of the present invention.
Fig. 7 is the figure for illustrating the manufacturing process of support plate shown in FIG. 1.
Fig. 8 is the figure for illustrating the installation of support plate shown in FIG. 1 to base station.
Specific embodiment
Substrate support pedestal 10 as embodiments of the present invention, which is set in the manufacturing process of liquid crystal display panel, carries out needle
To the various substrate board treatments of the processing for the substrate for constituting the liquid crystal display panel.Fig. 1 is one of the substrate board treatment, is progress
The CVD device 12 of the film forming of insulating film is illustrated the substrate support pedestal 10 of present embodiment by taking the CVD device 12 as an example.
The structure > of < substrate board treatment
Although being described in detail hereinafter, constitute liquid crystal display panel substrate by using known photoetching process come in glass substrate
On successively each conductive film for constituting various wirings etc. and each insulating film are formed a film and pattern and manufacture.Moreover, CVD device 12 exists
When the film forming of above-mentioned conductive film, insulating film etc., carried out using chemical vapor deposition (Chemical Vapor Deposition) method
Film process.CVD device 12 is configured to include: process chamber 14, the objects to be processed PO such as storage glass substrate；Relief portion 16,
It in the process chamber 14 to depressurizing；Pressure-regulating valve 18 connect with the relief portion 16 and adjusts the pressure in process chamber 14
Power；Membrane material supply unit 20, the material of delivery film；And CVD film forming portion 22, configuration is in process chamber 14 and is handling
The materials chemistry of film is set to be vapor-deposited on object PO.
Specifically, the bottom side in process chamber 14 is provided with the substrate branch of the present embodiment of support object to be processed PO
Support platform 10.Top plate side in process chamber 14 is provided with opposed with this substrate support pedestal 10 form configuration and will be from membrane material
The spray head 24 that the material for the film that material supply unit 20 supplies is sprayed into process chamber 14.It is provided integrally with and exchanges in the spray head 24
The upper electrode of power supply AC connection.Membrane material supply unit 20 is connected as to be supplied respectively to mix to spray head 24 via piping 20a
The state of gas and insulating film material.In addition, being provided in the midway of the piping 20a of membrane material supply unit 20 for adjusting film
The membrane material supply amount of the supply amount of material adjusts valve 20b, is controlled electrically by its aperture, and can supply in opposite process chamber 14
The supply amount for the material given is micro-adjusted.On the other hand, though being shown in detail below, this substrate support pedestal 10 be configured to include
Base station 10a and be fixed on base station 10a and be used to support object to be processed PO plate component that is, support plate 10b.
It is provided integrally with the lower electrode connecting with ground wire GND in base station 10a, by the lower electrode and being set to spray head 24
Upper electrode between form electric field, can promote for object to be processed PO film material vapor deposition.Moreover, by the inclusion of
This substrate support pedestal 10 and spray head 24 and constitute CVD film forming portion 22.Relief portion 16 connects via exhaust piping 16a and process chamber 14
It connects, and the vacuum pump with the air in suction process room 14.The midway of exhaust piping 16a is arranged in pressure-regulating valve 18,
Aperture is controlled electrically, so as to which the pressure in process chamber 14 is micro-adjusted.
In addition, be built-in in the base station 10a of this substrate support pedestal 10 makes object to be processed PO lifting on support plate 10b
Substrate lifting device 26.The substrate lifting device 26 is configured to comprising multiple lift pins 26a and makes above-mentioned multiple lift pins 26a
The motor (illustration omitted) moved along the vertical direction.It is formed with the pin housing recess 10a1 of storage lifter pin 26a in base station 10a,
Lifter pin 26a is usually standby in the position (position of readiness) sinking from the upper surface of base station 10a.Substrate lifting device 26 is by making
Lifter pin 26a be moved to from the position of readiness it is outstanding on support plate 10b as defined in height and position (delivery position), and can
State support by object to be processed PO to be lifted from support plate 10b.Thereby, it is possible to the robot arms (not shown) with outside
Between realize object to be processed PO handover.Specifically, when object to be processed PO to be accommodated in process chamber 14, if utilizing machine
Device human arm moves in object to be processed PO in process chamber 14, then is gradually increasing best friend by the way that object to be processed PO to be positioned in
It connects on the lifter pin 26a of position and is connect to 10 top-cross of substrate support pedestal, and declining lifter pin 26a and to be located at position of readiness
It is positioned in object to be processed PO on the support plate 10b of substrate support pedestal 10.On the other hand, by object to be processed PO to processing
When taking out outside room 14, lifter pin 26a rising is made to lift object to be processed PO from substrate support pedestal 10 and be located at handover
Position, robot arm receive object to be processed PO and move out to outside process chamber 14.
The structure > of < display panel
Next, referring to Fig. 2~Fig. 4 to the display panel constituted as the substrate supported comprising this substrate support pedestal 10
Liquid crystal display panel 30 is illustrated.In addition, becoming the substrate of object of the support of the substrate support pedestal 10 of present embodiment and unlimited
In the substrate of liquid crystal display panel, it is also possible to the substrate of organic EL panel etc..
As shown in Fig. 2, liquid crystal display panel 30 is whole in horizontally long rectangular.The display surface of liquid crystal display panel 30 is divided into display figure
Display area (active region) AA of picture and the non-aobvious of image is not shown in the border shape (frame-shaped) around display area AA and
Show region (inactive regions) NAA.Moreover, the single dotted broken line of inside indicates the shape of display area AA, than the inside in Fig. 2
Single dotted broken line region in the outer part be non-display area NAA.In addition, showing X-axis, Y-axis and Z in a part of each attached drawing
Axis, each axis direction are depicted as common direction in the drawings.The X-axis side of longitudinal direction and each attached drawing in liquid crystal display panel 30
To consistent, short side direction is consistent with the Y direction of each attached drawing.In addition, about the up and down direction (table back direction), on the basis of Fig. 4,
Also it will be known as table side on the upside of the figure sometimes, back side will be known as on the downside of the figure.
As shown in figure 4, this liquid crystal display panel 30 has: a pair of of substrate 30a nearly transparent and that there is excellent translucency,
30b；It is folded between two substrates 30a, 30b and includes to make the changed substance of optical characteristics as applying along with electric field
Liquid crystal molecule liquid crystal layer 30c, two substrates 30a, 30b maintain liquid crystal layer 30c thickness size cell gap state
It is bonded by sealant (not shown) down.Constitute the base of the table side (face side) in a pair of of substrate 30a, 30b of liquid crystal display panel 30
Plate is CF substrate (counter substrate) 30a, the substrate of back side (back side) be array substrate (display base plate, active-matrix substrate,
TFT substrate) 30b.CF substrate 30a and array substrate 30b in the inner surface side of glass substrate GS by being laminated to form various films
It forms.As shown in Fig. 2, array substrate 30b therein be more large-scale than CF substrate 30a and array substrate 30b a part relative to
CF substrate 30a, which extends, to be protruded, and in extension part outstanding, (constituting non-display area NAA) is equipped with driver (panel driving
Component) 32 and flexible base board (signal transmission component) 34 as the component for supplying various signals.
Next, being illustrated to the internal structure of liquid crystal display panel 30.As shown in figure 3, in the viewing area of array substrate 30b
Inner surface side in the AA of domain, TFT (thin film transistor (TFT)) 40 and pixel electrode 42 as switch element are each multiplely along the x axis
And Y direction arranges and is arranged to rectangular (ranks shape), and to surround around above-mentioned TFT40 and pixel electrode 42
Mode is equipped with clathrate gate wirings (scan wiring) 44 and source wiring (signal wiring, data wiring) 46.Grid
Wiring 44 almost extends as the crow flies along the x axis, and source wiring 46 substantially extends along the y axis, and part of it is along phase
The ramp extension 46a extended for X-direction and the inclined inclined direction of Y direction.Gate wirings 44 and source wiring 46
It is connect respectively with the gate electrode 40a of TFT40 and source electrode 40b, pixel electrode 42 is connect with the drain electrode 40c of TFT40.
In turn, TFT40 is driven based on the various signals for being respectively fed to gate wirings 44 and source wiring 46, along with the driving
Control the supply of the current potential to pixel electrode 42.The flat shape of pixel electrode 42 is the approximate parallelogram of lengthwise, about
It is folded with source wiring 46 between the adjacent pixel electrode 42 of its short side direction (X-direction), about longitudinal direction (Y direction)
Gate wirings 44 are folded between adjacent pixel electrode 42.The long side of pixel electrode 42 and the ramp extension of source wiring 46
46a is parallel.
As shown in Figures 3 and 4, the inner surface side in the display area AA of array substrate 30b, with electric with whole pixels
The form that pole 42 is overlapped is being formed with common electrode 48 by upper layer side (close to the side of liquid crystal layer 30c) than pixel electrode 42.Altogether
Supply nearly constant reference potential always with electrode 48, and extend throughout the almost whole region of display area AA, with
The part that each pixel electrode 42 is overlapped, which is respectively open, is formed with the pixel overlapping openings portion of multiple (being two in Fig. 3) elongate shapes
(pixel is overlapped gap, tropism control gap) 48a.Pixel overlapping openings portion 48a along source wiring 46 ramp extension 46a
Extend.If being electrically charged along with pixel electrode 42, current potential is generated between the pixel electrode 42 to overlap each other and common electrode 48
Difference generates then between the opening edge and pixel electrode 42 of pixel overlapping openings portion 48a except the plate face along array substrate 30b
Component other than, also comprising relative to array substrate 30b plate face normal direction component fringe field (tilting electric field),
Therefore the state of orientation for the liquid crystal molecule that liquid crystal layer 30c is included can be controlled using the fringe field.That is, present embodiment
The action mode of related liquid crystal display panel 30 is FFS (Fringe Field Switching: fringe field switching) mode.
On the other hand, as shown in figure 4, the display area AA in the inner surface side of CF substrate 30a is provided with and takes on a red color
(R), the colored filter 50 of green (G), blue (B) three color.The colored filter in mutually different color of colored filter 50
Mating plate is arranged with multiple repeatedly along gate wirings 44 (X-direction), and they prolong along source wiring 46 (substantially Y direction)
It stretches, thus overall alignment is at striated.These colored filters 50 are configured to each with the side array substrate 30b in plan view
Pixel electrode 42 is overlapped.Colored filter 50 that is adjacent about X-direction and being in mutually different color is configured to its boundary (face
Color boundary) it is Chong Die with source wiring 46 and aftermentioned light shielding part 52.In the liquid crystal display panel 30, R, G, B for arranging along the x axis
Colored filter 50 and three pixel electrodes 42 opposed with each colored filter 50 respectively constitute the pixel portion PX of three colors.Into
And in the liquid crystal display panel 30, it is configured to show defined ash by the pixel portion PX of tri- color of R, G, B adjacent along the x axis
Spend the display pixel of the colored display of grade.Array pitch about the X-direction in pixel portion PX is, for example, tens of μm or so.
As shown in Figures 3 and 4, in the display area AA in the inner surface side of CF substrate 30a, it is formed with the shading of shading
Portion's (light shielding part, black matrix between pixel) 52.The flat shape of light shielding part 52 is in approximate clathrate, to be spaced apart adjacent pixel
Between portion PX (pixel electrode 42), in plan view with the largely be overlapped position of the pixel electrode 42 of the side array substrate 30b
Set the pixel openings portion 52a with transmitted light.Pixel openings portion 52a is same as pixel electrode 42 in the plate face of CF substrate 30a
Ground is configured to along the x axis and Y direction is each multiplely in rectangular arrangement.Light shielding part 52 prevent light in adjacent pixel portion
It functions in terms of the independence that the gray level of each pixel portion PX is crossed and guaranteed between PX, prolongs especially along source wiring 46
The part stretched prevents the colour mixture between the pixel portion PX in different colors.When light shielding part 52 is configured to along overlook view with array base
The gate wirings 44 and source wiring 46 of the side plate 30b are overlapped.
It is used for as shown in figure 4, configuring to be configured in the form of sandwiched between two substrates 30a, 30b in the AA of display area
The thickness (cell gap, interval) of liquid crystal layer 30c is remained into constant distance member 54.Distance member 54 is in array substrate
The form setting of the upper layer side perforation liquid crystal layer 30c of common electrode 48 in 30b, and it is connected to the colorized optical filtering of CF substrate 30a
Piece 50.In addition, color boundaries of the configuration of distance member 54 in colored filter 50.Moreover, in two substrates 30a, 30b and liquid
The inner surface of crystal layer 30c contact is respectively formed with the alignment films of the liquid crystal molecular orientation for making liquid crystal layer 30c be included
56a,56b.Two alignment films 56a, 56b are for example made of polyimides respectively, at least the viewing area in each substrate 30a, 30b
Be formed as monolithic to the almost whole region of domain AA.Two alignment films 56a, 56b are to pass through illuminated specific wavelength region
Light (such as ultraviolet light etc.) and the optical alignment film that liquid crystal molecule can be made to be orientated along the direction of illumination of the light.Alternatively, it is also possible to
In CF substrate 30a, formed in the form of the sandwiched planarization film between alignment films 56a and colored filter 50.
Here, the various films to be formed are laminated about the inner surface side in array substrate 30b to be illustrated.As shown in figure 4,
In the glass substrate GS of forming array substrate 30b, is stacked gradually from lower layer side (side glass substrate GS) and be formed with the first metal film
(source metal film is led for (grid metal film, conductive film) 30b1, gate insulating film 30b2, semiconductor film 30b3, the second metal film
Electrolemma) 30b4, planarization film (insulating film, organic insulating film) 30b5, first transparency electrode film (conductive film) 30b6, layer insulation
Film (insulating film, inorganic insulating membrane) 30b7, second transparency electrode film (conductive film) 30b8 and organic insulating film 30b9.
First metal film 30b1 and the second metal film 30b4 is by being respectively by selecting from Ag, Al, Cu, Ti, Mo etc.
A kind of monofilm that constitutes of metal material or the stacked film, the alloy that are made of different types of metal material and there is conduction
Property and light-proofness, and configured in the form of across display area AA and non-display area NAA respectively.Wherein, the first metal film 30b1
Constitute gate wirings 44, gate electrode 40a of TFT40 etc..Second metal film 30b4 constitutes the source electrode of source wiring 46, TFT40
Electrode 40b and drain electrode 40c etc..Gate insulating film 30b2 and interlayer dielectric 30b7 is respectively by silicon nitride (SiNx), oxidation
Silicon (SiO2) etc. inorganic material constitute, by the second metal film 30b4, the second transparency electrode film 30b8 of upper layer side and lower layer side
First metal film 30b1, first transparency electrode film 30b6 remain state of insulation.Each insulating film 30b2 for being made of inorganic material,
30b7 is configured in the form of across display area AA and non-display area NAA respectively.Each insulating film 30b2 for being made of inorganic material,
30b7 film thickness compared with aftermentioned planarization film 30b5 and organic insulating film 30b9 is smaller.Planarization film 30b5 and organic insulating film
30b9 is made of organic materials such as acrylic resins (such as PMMA etc.).Planarization film 30b5 will generated than itself by lower layer side
Difference of height planarization aspect function.Organic insulating film 30b9 constitutes distance member 54 etc..Semiconductor film 30b3 is by conduct
Material has for example used the film of amorphous silicon, oxide semiconductor etc. to constitute, and constitutes and source electrode 40b and leakage in TFT40
Channel part (semiconductor portion) 40d of pole electrode 40c connection etc..First transparency electrode film 30b6 and second transparency electrode film 30b8 by
Transparent electrode material (such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide) etc.) constitute, and respectively with
The form of across display area AA and non-display area NAA configures.Wherein, first transparency electrode film 30b6 constitutes pixel electrode 42
Deng second transparency electrode film 30b8 composition common electrode 48 etc..
Next, the structure about TFT40 and pixel electrode 42 is described in detail.As shown in figure 3, drain electrode
40c is in substantially L font when looking down, and one end side is connect in opposed shape and with source electrode 40b with channel part 40d, and another
End side is connect with pixel electrode 42.The pixel electrode 42 being made of first transparency electrode film 30b6 with the pixel of light shielding part 52 by opening
Oral area 52a overlapping approximate parallelogram electrode body portion 42a and from electrode body portion 42a along the y axis towards TFT40
Side contact portion 42b outstanding is constituted, and contact portion 42b therein is connect with drain electrode 40c.By first transparency electrode film 30b6 structure
At contact portion 42b a part and the drain electrode 40c that is made of the second metal film 30b4 it is a part of overlapping one another,
The overlapping part is formed in the contact hole 58 of the planarization film 30b5 of sandwiched between them each other by opening and is connected with each other.
In turn, if TFT40 is fed to source electrode based on being driven from the scanning signal of gate wirings 44 supply to gate electrode 40a
The current potential of the picture signal of wiring 46 is supplied via channel part 40d to drain electrode 40c from source electrode 40b, and thus to picture
Plain electrode 42 charges.
The structure > of < substrate support pedestal
In the process of a pair of of substrate 30a, 30b for manufacturing above-mentioned liquid crystal display panel 30, the processing for carrying out being directed to them is used
Various substrate board treatments.For example, to carry out the film forming of the first metal film 30b1 and the second metal film 30b4 of array substrate 30b
Sputtering equipment, carry out each electrode film 30b6,30b8 of array substrate 30b, each insulating film 30b2,30b5,30b7,30b9 and half
The CVD device of the film forming of electrically conductive film 30b3, to the anticorrosive additive material being coated on substrate using photomask come by circuit pattern shape
The exposure devices of the exposures such as shape, check in the pattern formed on substrate whether defective check device, gone by etching method
The Etaching device for the part (place not covered by anticorrosive additive material) that membrane removal is exposed, the performance in order to improve the element on substrate
And the annealing device of heat treatment is applied to film, the liquid crystal display panel produced with biggish size is divided into point of defined size
Cut device etc..
The substrate support pedestal 10 of present embodiment is set at least one of above-mentioned various substrate board treatments.Hereinafter,
About the substrate support pedestal 10 of present embodiment, it is described in detail referring to Fig. 5 to Fig. 8.This substrate support pedestal 10 is also such as
Illustrate before as, it is configured to include base station 10a, the support for being fixed on base station 10a and being used to support object to be processed
Plate 10b and substrate lifting device 26.As shown in fig. 6, support plate 10b has multiple protrusions 11 on surface, above-mentioned multiple
The front support object to be processed PO of protrusion 11.
In the case where supporting object to be processed PO by multiple protrusions 11, object to be processed is supported with by flat face
The case where PO, compares, and is able to suppress attachment of the foreign matter to the back side of object to be processed PO.However, above-mentioned multiple protrusions 11 due to
The aging with abrasion, plasma/chemical liquid etc. caused by the contact of object to be processed PO generates substrate for example, existing
The worry of adherency, stripping charge, ill-exposed, to substrate back scuffing etc..Therefore, it is supported and is dealt with objects by multiple protrusions
The substrate support pedestal of structure as object PO needs to repair in situation as described above.The substrate of present embodiment supports
Platform 10 in view of the foregoing, for the structure, specifically for being readily able to maintenance, for support plate can be replaced relative to base station 10a
The structure of 10b.Hereinafter, the installation of construction, the base station 10a of support plate 10b about support plate 10b, is described in detail.
As shown in (D) of Fig. 6 and Fig. 7, glass used in a pair of of substrate 30a, the 30b of support plate 10b by liquid crystal display panel 30
Glass substrate GS is used as base material, forms multiple protrusions 11 on the surface of glass substrate GS.In turn, above-mentioned multiple convex
Portion 11 specifically uses above-mentioned various bases using the method and device of a pair of of substrate 30a, 30b of manufacture liquid crystal display panel 30
Plate processing unit, and patterned using photoetching process.
Specifically, as shown in (A) of Fig. 7, firstly, using CVD device on glass substrate GS, pass through planarization film 30b5
And the organic materials such as acrylic resin used in organic insulating film 30b9 form a film organic film 10b1.Further, since organic material
Material is the thicker material of film, therefore suitably forms multiple protrusions 11.Then, anticorrosive additive material is coated on organic film 10b1
Re is exposed using photomask FM, is developed as shown in (B) of Fig. 7, and remaining position corresponding with multiple protrusions 11 resists
Lose agent material Re.Then, it as shown in (C) of Fig. 7, is etched, it will be except the portion of the anticorrosive additive material Re of remaining organic film 10b1
Position other than position is reamed with defined thickness size.Then, the removing for finally carrying out anticorrosive additive material Re, passes through organic film
10b1 forms multiple protrusions 11.
In the present embodiment, the photomask FM used when patterning multiple protrusions 11 is in array substrate 30b shape
Used photomask, says in further detail when at TFT40, is used when planarization film 30b5 patterns contact hole 58
Photomask.Moreover, when planarization film 30b5 patterns contact hole 58, using positive-tone photo method, and will be multiple convex
When portion 11 patterns, negative photo method is used.
Although in addition, photomask FM can also prepare the dedicated photomask for being used to form multiple protrusions 11, if using
In the manufacture of liquid crystal display panel 30, used photomask, then be able to suppress the maintenance cost of support plate 10b.By multiple protrusions 11
Used photomask FM is in addition to the used photomask when planarization film 30b5 patterns contact hole 58 when patterning,
Such as it also can be using photomask used when organic insulating film 30b9 patterns distance member 54.Contact hole 58,
It, can be by multiple protrusions 11 by using above-mentioned photomask every component 54 due to regularly configuring on glass substrate GS
It is regularly formed on glass substrate GS.Although omitting detailed description, in addition to this, also can be used in manufacture CF substrate
Used photomask when 30a.
In addition, in the present embodiment, multiple protrusions 11, but can also be with only by being formed as the organic film 10b1 of a film
More than two film layers are folded to be formed.For example, (D) institute in the case where inhibiting the purpose of abrasion of multiple protrusions 11, relative to Fig. 7
Silicon nitride used in hardness relatively high gate insulating film 30b2 and interlayer dielectric 30b7 can be laminated in the case where showing
(SiNx) form multiple protrusions 11.
It furtherly, also can will be remaining corresponding with multiple protrusions 11 by exposure/development as shown in (B) of Fig. 7
The support plate of the state of the anticorrosive additive material Re of position as support plate 10b come using.That is, can be to use anticorrosive additive material Re
Make the structure of multiple protrusions 11.The support plate of the structure is due to the removing of the etching and anticorrosive additive material of narration before not needing
Process, therefore the manufacturing time of support plate can be shortened, or even shorten the maintenance time of substrate support pedestal.
As shown in figs. 5 and 8, in base station 10a, the multiple lift pins of substrate lifting device 26 are equipped in crosswise
26a.In the manufacturing process of support plate 10b, multiple protrusions 11 are carried out to the glass substrate GS of size almost the same with base station 10a
Patterning.In turn, as shown in figure 8, support plate 10b is divided into four parts to avoid above-mentioned multiple lift pins 26a
10bp, aforementioned four part 10bp are installed on base station 10a.Liquid crystal display panel 30 will be with larger using segmenting device in manufacturing process
The liquid crystal display panel that produces of size be split and be defined size, using the segmenting device, support plate 10b is divided into
Four parts.Moreover, this substrate support pedestal 10 is in crosswise since multiple lift pins 26a is arranged, thus while by support plate 10b points
Four parts are segmented into, but correspondingly can be divided into support plate 10b by segmenting device with the equipping position of multiple lift pins 26a
Proper shape, size.
In the substrate support pedestal 10 of present embodiment, as shown in fig. 6, support plate 10b passes through resin relative to base station 10a
The jointing material 10c of system, silicon systems etc. is fixed.Support plate 10b is not limited to relative to the base station 10a method being fixed
This, such as it is also possible to the method electrically fixed in base station setting electrostatic chuck.In addition, according to substrate board treatment
Type is also possible to support plate is not fixed on base station, and the surface of base station and the back side of support plate are only carried out mirror finish
And it loads.
Above such support plate 10b constructed uses the glass base for possessing many inventories in order to manufacture liquid crystal display panel 30
Plate and filmogen and manufacture, and manufactured using only device used in manufacture liquid crystal display panel 30.Therefore, according to this substrate branch
Platform 10 is supportted, does not need to use material, new equipment to make support plate 10b, so as to inhibit the cost of maintenance.Separately
Outside, only the material as used in liquid crystal display panel 30 is formed support plate 10b, therefore can start the manufacture of support plate 10b at once, only
By replacing the support plate 10b produced, the just maintenance of completing substrate supporting table 10, thus can shorten maintenance needed for when
Between, in other words, the time for stopping the manufacture of liquid crystal display panel can be shortened.
Description of symbols
10 ... substrate support pedestals, 10a ... base station, 10b ... support plate, 10b1 ... organic film, 11 ... protrusions, 12 ... CVD dress
Set (substrate board treatment), 26 ... substrate lifting devices, 26a ... lifter pin, 30 ... liquid crystal display panels, 30a ... CF substrate, 30b ...
Array substrate, 40 ... TFT (switch element), 54 ... distance members, 58 ... contact holes, GS ... glass substrate, PO ... process object
Object (substrate), FM ... photomask, Re ... anticorrosive additive material.
Claims (7)
1. a kind of substrate support pedestal, be used to support the substrate for constituting display panel, which is characterized in that be configured to include:
Base station；With
Support plate, for the component for projecting from the surface and formed and be used to support the plate of multiple protrusions of the substrate,
And support plate material used in the display panel is constituted, and is replaceably mounted on the base station.
2. substrate support pedestal according to claim 1, which is characterized in that
The substrate for constituting the display panel is the composition for being laminated with multiple films on the glass substrate,
The support plate is formed on the glass substrate by material used at least one of the multiple film
State multiple protrusions.
3. substrate support pedestal according to claim 2, which is characterized in that
The multiple protrusion carries out figure using photomask used when forming the multiple film on the glass substrate
Case.
4. substrate support pedestal according to claim 3, which is characterized in that
The substrate for constituting the display panel forms multiple open and the multiple film is laminated on the glass substrate
Element is closed,
The multiple protrusion is using photomask used when forming the multiple switch element come on the glass substrate
It is patterned.
5. the substrate support pedestal according to any one of claim 2~4, which is characterized in that
The multiple protrusion is formed by organic material used in the insulating film in the multiple film.
6. substrate support pedestal according to claim 1, which is characterized in that
The support plate utilizes the anticorrosive additive material shape and anticorrosive additive material is exposed/is developed on the glass substrate
At there is the multiple protrusion.
7. substrate support pedestal described according to claim 1~any one of 5, which is characterized in that
The substrate support pedestal is configured to include substrate lifting device,
The substrate lifting device has the multiple lift pins for being set to the base station, and the multiple lifter pin can be vertically square
To movement, make the substrate elevating in the support plate and moving the lifter pin along the vertical direction,
The support plate be divided into it is multiple, be divided into each multiple support plate avoid the multiple lifter pin and
It is mounted on the base station.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2018070722A JP2019186240A (en) | 2018-04-02 | 2018-04-02 | Substrate support base |
| JP2018-070722 | 2018-04-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110346951A true CN110346951A (en) | 2019-10-18 |
Family
ID=68174249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910239428.4A Pending CN110346951A (en) | 2018-04-02 | 2019-03-27 | Substrate support pedestal |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2019186240A (en) |
| CN (1) | CN110346951A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001117079A (en) * | 1999-10-18 | 2001-04-27 | Ibiden Co Ltd | Heating device of substrate for liquid crystal display plate |
| CN101038889A (en) * | 2006-03-16 | 2007-09-19 | 东京毅力科创株式会社 | Substrate table and substrate processing apparatus |
| CN101043018A (en) * | 2006-03-23 | 2007-09-26 | 大日本网目版制造株式会社 | Substrate support structure, heat treatment apparatus using same, first sheet-like object for use in the substrate support structure, method of manufacturing the substrate support structure, heat trea |
| CN101515115A (en) * | 2008-02-18 | 2009-08-26 | 株式会社Orc制作所 | Substrate supporting mechanism of exposure device |
-
2018
- 2018-04-02 JP JP2018070722A patent/JP2019186240A/en active Pending
-
2019
- 2019-03-27 CN CN201910239428.4A patent/CN110346951A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001117079A (en) * | 1999-10-18 | 2001-04-27 | Ibiden Co Ltd | Heating device of substrate for liquid crystal display plate |
| CN101038889A (en) * | 2006-03-16 | 2007-09-19 | 东京毅力科创株式会社 | Substrate table and substrate processing apparatus |
| CN101043018A (en) * | 2006-03-23 | 2007-09-26 | 大日本网目版制造株式会社 | Substrate support structure, heat treatment apparatus using same, first sheet-like object for use in the substrate support structure, method of manufacturing the substrate support structure, heat trea |
| CN101515115A (en) * | 2008-02-18 | 2009-08-26 | 株式会社Orc制作所 | Substrate supporting mechanism of exposure device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019186240A (en) | 2019-10-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20200203423A1 (en) | Method of maskless parallel pick-and-place transfer of micro-devices | |
| EP4227996A1 (en) | Displaying apparatus having light emitting device, method of manufacturing the same and method of transferring light emitting device | |
| TWI454172B (en) | Organic light emitting diode display device and method of manufacturing the same | |
| KR20230007980A (en) | Light Emitting Diode Display | |
| JP2017521859A (en) | Micro assembled LED display | |
| CN102650789A (en) | Electrophoretic display device and method for manufacturing the same | |
| US6036568A (en) | Method and apparatus for assembling liquid crystal display | |
| EP3289614A1 (en) | Large area oled microdisplay and method of manufacturing same | |
| US20170338288A1 (en) | Display device | |
| CN102998862B (en) | Array substrate and liquid crystal display panel | |
| CN106324919B (en) | A kind of color membrane substrates and preparation method thereof, display panel, display device | |
| CN106158739A (en) | The array base palte of display and manufacture method thereof | |
| CN109765719A (en) | The production method and substrate of substrate | |
| KR20030058760A (en) | Printing system and printing method for fabricating of liquid crystal display | |
| CN102929056B (en) | A kind of array base palte and manufacture method, display device | |
| CN107463043A (en) | Liquid crystal display panel and liquid crystal display device | |
| CN108710242B (en) | Display panel and display device | |
| CN108231790A (en) | Display device and its manufacturing method | |
| CN110346951A (en) | Substrate support pedestal | |
| CN105259711A (en) | Display panel and manufacturing method thereof | |
| CN108155207B (en) | Display device | |
| CN1790140A (en) | Thin film transistor array panel and repairing method therefor | |
| KR20170002719A (en) | Transparent display device and manufacturing method thereof | |
| KR100904260B1 (en) | Apparatus for controlling electric static chuck and stage of bonding machine and method for controlling the electric static chuck | |
| CN103943663A (en) | OLED display device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20191018 |
|
| WD01 | Invention patent application deemed withdrawn after publication |