CN101018454A - Device and method for manufacturing flexible printing substrate - Google Patents
Device and method for manufacturing flexible printing substrate Download PDFInfo
- Publication number
- CN101018454A CN101018454A CN 200610167232 CN200610167232A CN101018454A CN 101018454 A CN101018454 A CN 101018454A CN 200610167232 CN200610167232 CN 200610167232 CN 200610167232 A CN200610167232 A CN 200610167232A CN 101018454 A CN101018454 A CN 101018454A
- Authority
- CN
- China
- Prior art keywords
- film
- mentioned
- conveying channel
- flexible printed
- printed board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention relates to a manufacturing device and manufacturing method of flexible printing circuit board. The invention provides a simple structure to make the flexible printing substrate not form fold when releasing releaser film in the procedure of adhering the overlay film and releaser film on the printing circuit substrate to make flexible printing substrate. The process comprises: overlapping the overlay film and releaser film on the printing circuit substrate, adhering respective film by heating and pressing system, making the transporting channel of the adhered film incline downwards through crimp roller to fiercely rub respective film.
Description
Technical field
The present invention relates to the manufacturing installation and the manufacture method of flexible printed board, particularly relate to coverlay and stripping film are overlapped on the printed circuit base material of the overlength that forms circuit on the insulating substrate, after making each film applying, peel off the manufacturing installation and the manufacture method of the flexible printed board of stripping film continuously by heating and pressurizing.
Background technology
Forming by the flexibility base material in the manufacture process of flexible printed board,, pasting the thin plate shape protective film that is called as coverlay at substrate surface usually on substrate for the circuit that forms is carried out insulation protection.For example, on the one side of the printed circuit base material of overlength, with the coverlay of overlength, the order of the stripping film of 1～2 kind overlength is each film overlay, by heating and pressurizing with after each film applying is on above-mentioned printed circuit base material, peel off stripping film.Coverlay also has the coverlay with sheet to align with above-mentioned printed circuit base material, then the occasion of Nian Tieing except that the coverlay that uses overlength.
About stripping film, be configured in the coverlay side as mentioned above, but the occasion that stripping film is configured in the inside side of the printed circuit base material that does not dispose coverlay is also arranged.(for example, with reference to patent documentation 1)
In addition,, also proposed with flexible polyolefins, formed the scheme of stripping film of the duplex of crystallinity polymethylpentene layer within it on the outer two sides as the intermediate layer in order to follow the concavo-convex of printed circuit substrate surface.In this stripping film, play buffering as the flexible polyolefins layer in intermediate layer.(for example, with reference to patent documentation 2)
An example of the manufacture process of the flexible printed board that is to use a plurality of different types of stripping films that Fig. 3 represents, one of them stripping film is the duplex with intermediate layer.On insulating substrate, form the stripping film 3 and 4 of the printed circuit base material 1 of the overlength of circuit, the coverlay 2 of overlength, two kind of overlength, from roll out the 1a of mechanism, 2a, 3a, 4a, roll out respectively, overlapping by a pair of coincidence roller of being located on the 1st conveying channel A 5,5.Next, by transporting clamp 7 on the back segment that is arranged on heating and pressurizing mechanism 6, with the beat shorter ( Network ト) above-mentioned each overlapping film along continuous straight runs is intermittently moved and heating and pressurizing, each film is pasted by heating and pressurizing than effective length of heating and pressurizing mechanism 6.Stripping film 3 near printed circuit base material 1 is the duplexs with intermediate layer.
Have with inferior structure as above-mentioned heating and pressurizing mechanism 6, a kind of is that each overlapping on above-mentioned printed circuit base material 1 film is intermittently sent, with the structure that hot pressing or vacuum pressing are pasted, another kind is that above-mentioned each film is sent the structure of pasting simultaneously continuously with heating roller or steel band press.In the present embodiment, constitute in the following manner: each film that is overlapped on the above-mentioned printed circuit base material 1 is passed through between the upside hot plate 6a and downside hot plate 6b of hot plate press with the form of intermittently sending, with certain dwell time by upside hot plate 6a and downside hot plate 6b clamping, thereby carry out heating and pressurizing.
In addition, upside hot plate 6a and downside hot plate 6b one open, and each film of stickup will move horizontally by transporting clamp 7, and stripping film 3 and 4 will be stripped from by the mechanism for stripping of being located on the 2nd conveying channel B 8.In case stripping film 3 and 4 is stripped from, then can form the flexible printed board 10 that is under the state of pasting coverlay 2 on the printed circuit base material 1, this flexible printed board 10 is wound up into respectively with the above-mentioned stripping film of being stripped from 3 and 4 and rolls out on the 1b of mechanism, 3b, the 4b.
Above-mentioned mechanism for stripping 8 adopts following stripping means: a side surface (being lower surface in Fig. 3) that metallic roller 8a is docked to each film 1～4 that moves horizontally, go up and, stripping film 3 and 4 is peeled off from each film 1～4 by stripping film 3 and 4 being wound on this roller 8a with respect to the angled method of sending of carriage direction.
No. 2619034 documents of patent documentation 2 Japan Patents
Summary of the invention
Headed by patent documentation 1 described invention, usually, on the surface of printed circuit base material, the height of Printing Department and non-Printing Department is different, when covering with coverlay, forms the space in non-Printing Department, will cause the circuit oxidation that causes through its annual change by air pocket like this, the life-span shortens.In addition, the terminal part of printed circuit base material is exposing at the state that does not cover coverlay, and the solid that is applied on the coverlay melts by adding hot pressing, and the terminal part is covered by adhesive, can cause that probably electrical connection is bad.
Because the stripping film of duplex has resiliency, so pressurized, heated the time, patent documentation 2 described inventions and the represented flexible printed board of Fig. 3 can push exactly with respect to coverlay, can seek the elimination in space.But, when peeling off the stripping film of duplex, have the defective that on flexible printed board 10, produces fold.
As the reason that produces fold, at first, owing to the stripping film with resiliency is followed the concavo-convex of printed circuit base material and is out of shape, so the circuit of stripping film and printed circuit base material is chimeric, peel off and to become difficulty, also have simultaneously stripping film self to be adhered to occasion in the heating and pressurizing mechanism.In case peel off stripping film in this state, then to transport tension force and will on flexible printed board, produce fluctuation in the moment confusion, it is unstable that travelling speed will become.
In addition, a plurality of different types of stripping films 3,4, because coefficient of expansion difference separately, so shown in Fig. 4 (a), even each film 1～4 becomes parallel at once after heating and pressurizing, but cool off as time goes by, then can be shown in Fig. 4 (b) like that, owing to the difference of shrinkage bends.Like this, shown in Fig. 5 (a), under the state that bends, for each film 1～4 that docks with mechanism for stripping 8, stripping film 3,4 is pulled with respect to carriage direction is angled, thus shown in Fig. 5 (b), the bending meeting of each film 1～4 was corrected in moment, presented parastate.The state of Fig. 5 (a) and Fig. 5 (b) by spells repeatedly, local variation all can take place in the stress of then peeling off stripping film 3,4 each time.
Like this, shown in Fig. 6 (a), even flexible printed board 10 is walked smoothly, in case travelling speed changes, perhaps peel stress generation localized variation is then shown in Fig. 6 (b), flexible printed board 10 will be drawn downwards and bending, or shown in Fig. 6 (c), stripping film 3,4 is pulled towards carriage direction with flexible printed board 10, returns to the state of Fig. 6 (a).By these actions, give flexible printed board 10 stress applications load, will produce fold.
This fold can make the flexural property of flexible printed board 10 worsen, and perhaps causes producing error aspect the dimensional accuracy when punch process.In recent years, the user has the trend that needs the better flexible printed board of bendability, and the danger that produces fold is also increasing.
Therefore, the objective of the invention is to: coverlay and stripping film are overlapped on the printed circuit base material of the overlength that forms circuit on the insulating substrate, when after pasting each film, peeling off stripping film,, make fold does not take place on the flexible printed board with simple more structure by heating and pressurizing.
The present invention proposes in order to achieve the above object, and scheme 1 described invention provides a kind of manufacturing installation of flexible printed board, and this manufacturing installation comprises: with flexibility base material and the thin plate shape protective film and the overlapping mechanism of stripping film of overlength; Has the 1st conveying channel with the mechanism of each overlapping film heating and pressurizing and stickup; Have 2nd conveying channel of above-mentioned stripping film from the mechanism that each film of pasting is peeled off, the manufacturing installation of this flexible printed board is characterised in that, back fragment position in above-mentioned heating and pressurizing mechanism, make above-mentioned the 2nd conveying channel with respect to above-mentioned the 1st conveying channel upward or the below tilt.
According to this scheme, the flexibility base material of overlength and thin plate shape protective film and stripping film are rolled out, by overlapping organizational overlapping.Each overlapping film is by being located at the heating and pressurizing mechanism heats pressurization on the 1st conveying channel and pasting.Each film of pasting is by being located at the mechanism for stripping of the 2nd conveying channel, and stripping film is stripped from the formation flexible printed board, and stripping film of being stripped from and flexible printed board are reeled.Because above-mentioned the 2nd conveying channel the back fragment position of heating and pressurizing mechanism with respect to the 1st conveying channel upward or below tilt, so strong friction can take place in each film in this section, the flexibility base material of above-mentioned overlength will separate with the chimeric of stripping film or adhesion, and, crooked can the disappearance owing to the difference of thermal coefficient of expansion.
According to this scheme, make the 2nd conveying channel with respect to the 1st conveying channel upward or the below tilt, be provided with roller from above-mentioned the 1st conveying channel to the part that the 2nd conveying channel changes, therefore, strong friction takes place in each film of pasting by heating and pressurizing by this roller the time, the flexibility base material of overlength separates with the chimeric of stripping film or adhesion, and crooked can the disappearance owing to the difference of thermal coefficient of expansion.
According to this scheme, the coverlay of overlength and the stripping film of overlength are overlapped on the printed circuit base material of overlength, and each film is pasted by heating and pressurizing.Because make each film after the stickup upward or below tilt to transport, so each film generation strong friction, above-mentioned printing element and the chimeric of stripping film or adhesion separate, and the crooked difference of understanding owing to thermal coefficient of expansion disappears.
As mentioned above, the present invention has conveying channel 1 and conveying channel 2, conveying channel 1 has the mechanism that each overlapping film heating and pressurizing is pasted, conveying channel 2 has the mechanism of peeling off above-mentioned stripping film from each film of pasting, because make above-mentioned the 2nd conveying channel on the back fragment position of above-mentioned heating and pressurizing mechanism with respect to above-mentioned the 1st conveying channel upward or below tilt, so strong friction takes place in each film in this section, the flexibility base material of above-mentioned overlength separates with the chimeric of stripping film or adhesion, and crooked can the disappearance owing to the difference of thermal coefficient of expansion.Thereby prevented from when peeling off above-mentioned stripping film, on the flexibility base material of overlength, to produce the phenomenon of fold.
Description of drawings
Fig. 1 is the key diagram of embodiment 1 that relates to the manufacturing installation of flexible printed board of the present invention.
Fig. 2 is the key diagram of embodiment 2 that relates to the manufacturing installation of flexible printed board of the present invention.
Fig. 3 is the key diagram of the manufacturing installation of existing flexible printed board.
Fig. 4 (a), Fig. 4 (b) is the key diagram of the existing defective of expression.
Fig. 5 (a), Fig. 5 (b) is the key diagram of the existing defective of expression.
Fig. 6 (a)～Fig. 6 (c) is the key diagram of the existing defective of expression.
Embodiment
Below enumerate suitable embodiment, manufacturing installation and the manufacture method that relates to flexible printed board of the present invention is described.Coverlay and stripping film are overlapped on the printed circuit base material of the overlength that forms circuit on the insulating substrate, after pasting each film by heating and pressurizing, when peeling off stripping film continuously, with simpler structure, make and do not produce fold on the flexible printed board, in order to reach above purpose, the present invention is by after pasting above-mentioned each film, the conveying channel that makes the printed circuit base material upward or the below tilt, the form of peeling off stripping film in each film of strong friction realizes.
The embodiment 1 of the manufacturing installation that relates to flexible printed board of the present invention that Fig. 1 represents for convenience of description, encloses same symbol at component part place same as the prior art shown in Figure 3.Form the printed circuit base material 1 of the overlength of circuit on insulating substrate, the stripping film 3 and 4 of 2, two kinds of overlength of coverlay of overlength (hereinafter referred to as each film 1～4) rolls out from roll out the 1a of mechanism, 2a, 3a, 4a respectively, and is overlapping by a pair of coincidence roller 5,5.
In above-mentioned stripping film, the stripping film 3 of the inboard that contacts with coverlay 2 (in Fig. 1 for upside) is the film with duplex of resiliency, and the stripping film 4 of the outside (being downside in Fig. 1) is the film of common monolayer constructions will.Above-mentioned each film 1～4 by above-mentioned coincidence roller 5,5 overlapping after, when the 1st conveying channel A is intermittently moved horizontally, paste, by the 2nd conveying channel B stripping film 3,4 is peeled off, thereby is formed flexible printed board 10.
On above-mentioned the 1st conveying channel A, be provided with heating and pressurizing mechanism 6 and stationary clamp 21, above-mentioned heating and pressurizing mechanism 6 is the hot plate press that formed by upside hot plate 6a and downside hot plate 6b, as described below, when each film 1～4 moves horizontally, upside hot plate 6a separates with downside hot plate 6b and opens, when each film 1～4 stopped certain hour, upside hot plate 6a and downside hot plate 6b closed, with each film 1～4 heating and pressurizing and stickup.
Said fixing clamp 21 is fixed on this position according to the state that does not move along carriage direction, and this stationary clamp 21 was opened when each film 1～4 moved horizontally, and moves horizontally when stopping, and this stationary clamp 21 cuts out, each film 1～4 of clamping.
Be provided with crimping roller 22 between the 1st conveying channel A and the 2nd conveying channel B, the carriage direction of each film 1～4 changes by this crimping roller 22, and the 2nd conveying channel B is tilted downwards with respect to above-mentioned the 1st conveying channel A.Above-mentioned crimping roller 22 is by changing the carriage direction of each film 1～4, and stripping film 3,4 side pressures of each film 1～4 are connect, and strong friction takes place each film 1～4.
On above-mentioned the 2nd conveying channel B, be provided with following mechanism: the mechanism 23 that transports each film 1～4; Peel off roller 24 as the mechanism that stripping film 3,4 is peeled off from each film 1～4; Winding mechanism 1b, 3b, 4b that the stripping film 3,4 of being stripped from and flexible printed board 10 are reeled.The flexible printed board 10 that stripping film 3,4 has been stripped from changes direction by deflector roll 30 to coverlay 2 (being downside in Fig. 1) side, and 1b reels by winding mechanism.In addition, near conveyer 23 sides of deflector roll 30, be provided with stationary clamp 31.
Above-mentioned conveyer 23 is by forming along reciprocating carrier of the carriage direction that is parallel to each film 1～4 25 and the movable clamp 26 that is installed on this carrier 25 by the driving mechanism (not shown), and the above-mentioned roller 24 of peeling off is installed on the carrier 25 and can freely rotates.Twist in this and peel off the stripping film of being stripped from the roller 24 3,4 and separate, reeled by winding mechanism 3b, 4b respectively by separation drum 27.
Below according to Fig. 1, be described for the manufacturing process of flexible printed board 10.State as shown in the figure, the upside hot plate 6a of above-mentioned heating and pressurizing mechanism 6 separates with downside hot plate 6b and opens, and is located at the stationary clamp 21 of the back segment of above-mentioned heating and pressurizing mechanism 6 and opens with the stationary clamp 31 of being located at the leading portion of above-mentioned deflector roll 30.From this state, close a stationary clamp 21 and control each film 1～4, simultaneously, close another stationary clamp 31, control each film 1～2.Next, close the upside hot plate 6a and the downside hot plate 6b of above-mentioned heating and pressurizing mechanism 6, give each film 1～4 heating and pressurizing, each film 1～4 is pasted.
After each film 1～4 pasted, the upside hot plate 6a of above-mentioned heating and pressurizing mechanism 6 separated with downside hot plate 6b and opens.Close the movable clamp of being located on the above-mentioned conveyer 23 26, in the time of each film of clamping 1～4, above-mentioned two stationary clamps 21,31 are opened, just as in Fig. 1, representing above-mentioned carrier 25 with double dot dash line, if make clamp 26 to winding mechanism 1b side shifting, each film 1～4 will be pulled from above-mentioned rolling out the 1a of mechanism, 2a, 3a, the 4a and roll out so, simultaneously, will be by each film 1～4 that above-mentioned heating and pressurizing mechanism 6 pastes since the 1st conveying channel A, by way of crimping roller 22, move to the 2nd conveying channel B.
When each film 1～4 by above-mentioned crimping roller 22 time, the 2nd conveying channel B tilts downwards with respect to the 1st conveying channel A.Like this, above-mentioned crimping roller 22 is by changing carriage direction, stripping film 3,4 side pressures of each film 1～4 are connect, strong friction takes place in each film 1～4, above-mentioned printed circuit base material 1 and coverlay 2 will separate with the chimeric of stripping film 3,4 or adhesion, and, crooked can the disappearance owing to the difference of thermal coefficient of expansion.
Next, close above-mentioned two stationary clamps 21,31, control each film 1～4 and each film 1～2 of above-mentioned stickup, simultaneously, if open above-mentioned movable clamp 26, carrier 25 is moved to the position of solid line from the position of double dot dash line, then stripping film 3,4 will be lived with respect to the angled volume of direction of delaminate by the above-mentioned roller 24 of peeling off, therefore, stripping film 3,4 is peeled off from each film 1～4, is reeled by winding mechanism 3b, 4b.In addition, in case stripping film 3,4 is peeled off from each film 1～4, then can be formed on the flexible printed board 10 that has on the printed circuit base material 1 under coverlay 2 sticking states between roller 24 and the stationary clamp 31 peeling off.
Like this, transporting each film 1～4 o'clock, open above-mentioned two stationary clamps 21,31, close movable clamp 26 and each film 1～4 of clamping of conveyer 23, carrier 25 moves and transports each film 1～4.In addition, only the beat that each film 1～4 is carried out certain-length transports, in order not bend on each film 1～4, by each film 1～4 of two stationary clamps, 21,31 clampings, open above-mentioned movable clamp 26, with carrier 25 to heating and pressurizing mechanism 6 side shiftings.At this moment, stripping film 3,4 is peeled off by peeling off roller 24, forms flexible printed board 10.
As mentioned above, each film 1～4 by 6 stickups of heating and pressurizing mechanism, by being located at the crimping roller 22 of above-mentioned the 1st conveying channel A on the part that the 2nd conveying channel B changes, strong friction takes place, above-mentioned flexible printed board 10 separates with the chimeric of stripping film 3,4 or adhesion, and disappear because the difference of thermal coefficient of expansion is crooked, therefore can prevent from peeling off above-mentioned stripping film produced fold at 3,4 o'clock on flexible printed board 10 phenomenon.
The embodiment 2 of the manufacturing installation that relates to flexible printed board of the present invention that Fig. 2 represents for convenience of description, is enclosing identical symbol with embodiment 1 same component part place shown in Figure 1, omits repeat specification.In the present embodiment, the heating and pressurizing mechanism 40 that is located on the 1st conveying channel A is formed by a pair of heating roller 41,41, this heating and pressurizing mechanism 40 is different with the hot plate press described in the foregoing description 1, and it is the structure that each overlapping film 1～4 is transported continuously and pastes.Therefore, do not need beat to transport each clamp of usefulness and carrier etc.
Above-mentioned each film 1～4 by overlap roller 5,5 overlapping after, continuous horizontal moves and pastes on the 1st conveying channel A, stripping film 3,4 is peeled off by the 2nd conveying channel B, forms flexible printed board 10.
Between the 1st conveying channel A and the 2nd conveying channel B, be provided with crimping roller 42, be provided with the dance roller 43 that can easy on and off moves at the back segment of this crimping roller 42.In addition, with the above-mentioned crimping roller 42 relative auxiliary wheels 44 that are provided with, the carriage direction of each film 1～4 changes by above-mentioned crimping roller 42, and the 2nd conveying channel B is tilted downwards with respect to above-mentioned the 1st conveying channel A.The carriage direction of above-mentioned crimping roller 42 by changing each film 1～4 connects stripping film 3,4 side pressures of each film 1～4, and strong friction takes place each film 1～4.And, the carriage direction of each film 1～4 by the mentioned strain dancer rools rotate about 180 the degree be directed upwardly, by above-mentioned auxiliary wheel 44 again along continuous straight runs transport.
On above-mentioned the 2nd conveying channel B, be provided with following mechanism: as stripping film 3,4 is peeled off roller 45 from mechanism that each film 1～4 is peeled off; The separation drum 46 that the stripping film of being stripped from 3,4 is separated; Winding mechanism 1b, 3b, 4b with stripping film 3,4 and flexible printed board 10 coilings.The flexible printed board 10 that stripping film 3,4 has been stripped from changes direction by deflector roll 47 towards coverlay 2 sides (being downside among Fig. 2), and 1b rolls out by winding mechanism.
Then, according to Fig. 2 the manufacturing process of flexible printed board 10 is described.From above-mentioned roll out each film 1～4 of rolling out the 1a of mechanism, 2a, 3a, the 4a by overlap roller 5,5 overlapping after, continuous horizontal moves on the 1st conveying channel A, pastes continuously by the heating roller 41 of heating and pressurizing mechanism 40 simultaneously.
After each film 1～4 is pasted, mentioned strain dancer rools 43 be displaced into the position represented with solid line among Fig. 2 up and down by the driving mechanism (not shown) and the position represented with double dot dash line between, the carriage direction of each film 1～4 changes by crimping roller 42, and the 2nd conveying channel B is tilted downwards with respect to above-mentioned the 1st conveying channel A.At this moment, above-mentioned crimping roller 42 connects stripping film 3,4 side pressures of each film 1～4, strong friction takes place in each film 1～4, above-mentioned printed circuit base material 1 and coverlay 2 separate with the chimeric of stripping film 3,4 or adhesion, and crooked can the disappearance owing to the difference of thermal coefficient of expansion, therefore can prevent from peeling off above-mentioned stripping film produced fold at 3,4 o'clock on flexible printed board 10 phenomenon.
In addition, only otherwise break away from spirit of the present invention, the present invention can do various changes, and the present invention naturally relates to the content of this change.
Claims (3)
1. the manufacturing installation of a flexible printed board, it comprises: with flexibility base material and the thin plate shape protective film and the overlapping mechanism of stripping film of overlength; Has the 1st conveying channel with the mechanism of each overlapping film heating and pressurizing and stickup; Have 2nd conveying channel of above-mentioned stripping film from the mechanism that each film of pasting is peeled off, the manufacturing installation of this flexible printed board is characterised in that,
Back fragment position in above-mentioned heating and pressurizing mechanism, make above-mentioned the 2nd conveying channel with respect to above-mentioned the 1st conveying channel upward or the below tilt.
2. the manufacturing installation of the flexible printed board described in the claim 1 is characterized in that, is being provided with roller from above-mentioned the 1st conveying channel to the part that the 2nd conveying channel changes.
3. the manufacture method of a flexible printed board, on at least one face of the printed circuit base material of the overlength of formation circuit on the insulating substrate, on one side with the order of the stripping film of the coverlay of overlength and overlength with each film overlay, each film is moved on one side, by heating and pressurizing with after each film applying is to above-mentioned printed circuit base material, peel off above-mentioned stripping film, it is characterized in that, after with above-mentioned each film applying, the conveying channel that makes above-mentioned printed circuit base material upward or the below tilt, peel off above-mentioned stripping film after this.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006-033062 | 2006-02-09 | ||
| JP2006033062A JP4936740B2 (en) | 2006-02-09 | 2006-02-09 | Flexible printed circuit board manufacturing apparatus and manufacturing method |
| JP2006033062 | 2006-02-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101018454A true CN101018454A (en) | 2007-08-15 |
| CN101018454B CN101018454B (en) | 2010-06-16 |
Family
ID=38492541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006101672321A Expired - Fee Related CN101018454B (en) | 2006-02-09 | 2006-12-12 | Device and method for manufacturing flexible printing substrate |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4936740B2 (en) |
| CN (1) | CN101018454B (en) |
| TW (1) | TW200731896A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730392A (en) * | 2008-10-15 | 2010-06-09 | 日本梅克特隆株式会社 | Manufacture method of a flexible circuit base-plate and a flexible circuit base-plate |
| CN108633182A (en) * | 2018-05-14 | 2018-10-09 | 张海根 | Wide cut fold flexible electronic device prepares complete machine |
| CN108650792A (en) * | 2018-05-11 | 2018-10-12 | 张海根 | A kind of Portable flexible PCB electronic devices fold preparation structure |
| CN108668427A (en) * | 2018-05-15 | 2018-10-16 | 张海根 | A kind of slide unit fold PCB electronic device preparing mechanisms |
| CN110856366A (en) * | 2019-11-21 | 2020-02-28 | 湖南东神自动化设备有限公司 | Flexible printed circuit board tectorial membrane false machine of pasting |
| CN112534272A (en) * | 2018-08-23 | 2021-03-19 | 株式会社日立高新技术 | Specimen carrier transport line and specimen inspection automation system |
| CN114867222A (en) * | 2022-06-02 | 2022-08-05 | 吉安满坤科技股份有限公司 | Bending-proof and warping-proof touch control PCB production process |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014165351A (en) * | 2013-02-26 | 2014-09-08 | Murata Mfg Co Ltd | Method of manufacturing substrate with coating film, and coating film transfer sheet |
| CN103841765A (en) * | 2014-03-18 | 2014-06-04 | 蔡莳铨 | Method for machining printed circuit board |
| CN107128056A (en) * | 2017-06-20 | 2017-09-05 | 合肥太通制冷科技有限公司 | A kind of continuous overlay film of aluminium sheet covers tree lace |
| CN109531694B (en) * | 2017-09-22 | 2023-06-23 | 昊佰电子科技（上海）有限公司 | Knife-free die cutting method and die cutting device for polyimide film product |
| JP7078434B2 (en) * | 2018-03-28 | 2022-05-31 | 日本メクトロン株式会社 | Laminating equipment and flexible printed substrate manufacturing method |
| KR102479947B1 (en) * | 2018-06-11 | 2022-12-22 | 해성디에스 주식회사 | Apparatus and manufacturing method of flexible circuit board |
| WO2020196497A1 (en) | 2019-03-28 | 2020-10-01 | 三井化学東セロ株式会社 | Mold releasing film for printed wiring board manufacturing process, printed board manufacturing method, printed board manufacturing device, and printed board |
| KR20210094785A (en) * | 2020-01-22 | 2021-07-30 | 주식회사 두산 | Laminator |
| CN114286506B (en) * | 2022-01-06 | 2022-08-05 | 珠海加特精密工业有限公司 | PET membrane laminating mechanism and FPC stiffening plate laminating equipment with same |
| CN117202485B (en) * | 2023-09-20 | 2024-04-02 | 赛维精密科技(广东)有限公司 | FPCB circuit board, combined die-cutting production process and production equipment |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08132531A (en) * | 1994-11-11 | 1996-05-28 | Meiki Co Ltd | Vacuum laminating press apparatus |
| JP3522127B2 (en) * | 1998-11-17 | 2004-04-26 | 日立化成工業株式会社 | Photosensitive film and lamination method thereof |
| JP3901465B2 (en) * | 2001-03-01 | 2007-04-04 | 極東産機株式会社 | Laminating equipment |
| JP3811683B2 (en) * | 2003-03-17 | 2006-08-23 | 株式会社 日立インダストリイズ | Film sticking method |
-
2006
- 2006-02-09 JP JP2006033062A patent/JP4936740B2/en not_active Expired - Fee Related
- 2006-10-20 TW TW095138902A patent/TW200731896A/en unknown
- 2006-12-12 CN CN2006101672321A patent/CN101018454B/en not_active Expired - Fee Related
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101730392A (en) * | 2008-10-15 | 2010-06-09 | 日本梅克特隆株式会社 | Manufacture method of a flexible circuit base-plate and a flexible circuit base-plate |
| CN101730392B (en) * | 2008-10-15 | 2014-01-15 | 日本梅克特隆株式会社 | Manufacture method of a flexible circuit base-plate and a flexible circuit base-plate |
| CN108650792B (en) * | 2018-05-11 | 2020-11-10 | 深圳市三德冠精密电路科技有限公司 | Portable flexible PCB electronic device fold preparation structure |
| CN108650792A (en) * | 2018-05-11 | 2018-10-12 | 张海根 | A kind of Portable flexible PCB electronic devices fold preparation structure |
| CN108633182A (en) * | 2018-05-14 | 2018-10-09 | 张海根 | Wide cut fold flexible electronic device prepares complete machine |
| CN108633182B (en) * | 2018-05-14 | 2020-12-22 | 江西众达泰科技有限公司 | Wide-width folded flexible electronic device preparation complete machine |
| CN108668427A (en) * | 2018-05-15 | 2018-10-16 | 张海根 | A kind of slide unit fold PCB electronic device preparing mechanisms |
| CN108668427B (en) * | 2018-05-15 | 2020-12-22 | 江西众达泰科技有限公司 | Preparation mechanism for sliding table fold PCB electronic device |
| CN112534272A (en) * | 2018-08-23 | 2021-03-19 | 株式会社日立高新技术 | Specimen carrier transport line and specimen inspection automation system |
| CN110856366A (en) * | 2019-11-21 | 2020-02-28 | 湖南东神自动化设备有限公司 | Flexible printed circuit board tectorial membrane false machine of pasting |
| CN110856366B (en) * | 2019-11-21 | 2022-01-07 | 广东则成科技有限公司 | Flexible printed circuit board tectorial membrane false machine of pasting |
| CN114867222A (en) * | 2022-06-02 | 2022-08-05 | 吉安满坤科技股份有限公司 | Bending-proof and warping-proof touch control PCB production process |
| CN114867222B (en) * | 2022-06-02 | 2023-06-09 | 吉安满坤科技股份有限公司 | Anti-warping touch control PCB production process |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200731896A (en) | 2007-08-16 |
| JP4936740B2 (en) | 2012-05-23 |
| JP2007214389A (en) | 2007-08-23 |
| CN101018454B (en) | 2010-06-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101018454B (en) | Device and method for manufacturing flexible printing substrate | |
| KR101793684B1 (en) | Apparatus for transferring grapheme | |
| CN102482135B (en) | Glass substrate including edge mesh portion | |
| JP2010055922A (en) | Equipment and method of manufacturing membrane electrode assembly | |
| CN104602908A (en) | Glass substrate strip | |
| CN103448317A (en) | Method for producing laminate, and laminate | |
| JP3896389B2 (en) | Film laminator | |
| JP4840350B2 (en) | Printing tape and tape cassette | |
| KR101375975B1 (en) | Shielding apparatus for flat cable | |
| JP4186805B2 (en) | Film sticking device | |
| JPH10305544A (en) | Roll laminating device | |
| JP4273023B2 (en) | Film sticking method and apparatus | |
| KR102334426B1 (en) | Method for removing emi release film | |
| JP2009179388A (en) | Label pasting apparatus | |
| JP3028701B2 (en) | Manufacturing method of ceramic electronic components | |
| CN110611992A (en) | Efficient single-side FPC board processing method | |
| JP2006221389A (en) | Ic label and ic label producer | |
| JP3118663B2 (en) | Flat cable manufacturing method | |
| JP7459482B2 (en) | Transfer body manufacturing apparatus and transfer body manufacturing method | |
| JP4158226B2 (en) | Image forming apparatus and image forming method | |
| JP3956174B2 (en) | Manufacturing method of chip support substrate for semiconductor package | |
| JP2003019750A (en) | Method for manufacturing laminated metal strip with resin and manufacturing apparatus therefor | |
| JP4378694B2 (en) | Laminating apparatus and laminating method | |
| JPH1148439A (en) | Method and device for bonding film | |
| JP4439639B2 (en) | Tack label manufacturing method and manufacturing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100616 Termination date: 20181212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |