CN114867222A

CN114867222A - Bending-proof and warping-proof touch control PCB production process

Info

Publication number: CN114867222A
Application number: CN202210619461.1A
Authority: CN
Inventors: 廖乐华; 欧阳小军; 李雷; 王虎; 李羚; 孙招
Original assignee: Ji'an Mankun Technology Co ltd
Current assignee: Ji'an Mankun Technology Co ltd
Priority date: 2022-06-02
Filing date: 2022-06-02
Publication date: 2022-08-05
Anticipated expiration: 2042-06-02
Also published as: CN114867222B

Abstract

The invention discloses a bending-proof touch control PCB production process, which belongs to the field of PCB production and comprises the following steps: preparing raw materials; laminating treatment; molding treatment; baking by hot air, namely placing the touch PCB on the upper end of the uniform baking partition plate in a horizontal manner; detect, can toast in-process elastic covering membrane through the touch-control PCB board hot-blast, level and keep the setting of subassembly and stress relief subassembly, can effectively carry out the heat-conduction to the touch-control PCB board of each layer position and toast the effect, when effectively improving and toast efficiency, can also improve the stoving degree of consistency of touch-control PCB board, the effect of temperature conduction is improved, the effect of reinforcing touch-control PCB inboard stress elimination, and then effectively avoid the problem that the internal stress elimination is bad or overbake the damage appears in the touch-control PCB board, reduce the probability that the PCB board warped, and then effectively improved the production quality of touch-control PCB board, the economic benefits thereof has been increased.

Description

Bending-proof and warping-proof touch control PCB production process

Technical Field

The invention relates to the field of PCB production, in particular to a bending-proof touch PCB production process.

Background

The PCB is also called a printed circuit board, and is a provider of electrical connection of electronic components. With the continuous development of electronic technology, the PCB board is developed from a single layer to a double-sided board, a multi-layer board and a flexible board, and is continuously developed in the directions of high precision, high density and high reliability to continuously reduce the volume, reduce the cost and improve the performance, so that the PCB board still maintains strong vitality in the development process of future electronic products. The development trend of the PCB production and manufacturing technology is to develop the PCB with high density, high precision, fine aperture, fine wire, small space, high reliability, multilayering, high-speed transmission, light weight and thin shape.

Along with the continuous proposition of PCB board high accuracy requirement, the continuous application of touch-control PCB board for the production of PCB board forms the automation gradually, produce the line ization, in actual production process, if the PCB board is the unevenness, can cause the location inaccurate, on the unable cartridge of components and parts is to the hole and the surface mounting pad of board, can crash the automatic cartridge machine even, the board of dress components and parts takes place the bending after welding, the component foot is hardly cut the tie neatly, and then directly increased the defective rate and the rejection rate in the touch-control PCB board production process, the economic benefits of touch-control PCB board has been reduced.

In order to prevent the touch PCB from bending, hot air baking is generally added in the production process of the touch PCB, the touch PCB is cured by resin and internal stress is eliminated, and the flatness of the touch PCB is improved.

Disclosure of Invention

1. Technical problem to be solved

Aiming at the problems in the prior art, the invention aims to provide a bending-proof touch control PCB production process, which can effectively carry out heat conduction baking action on the touch control PCB at each layer through the arrangement of an elastic covering film, a leveling and maintaining component and a stress relieving component in the hot air baking process of the touch control PCB, effectively improve the baking efficiency, improve the baking uniformity of the touch control PCB, improve the temperature conduction effect, enhance the internal stress eliminating effect of the touch control PCB, further effectively avoid the problem of poor internal stress elimination or over-baking damage of the touch control PCB, reduce the bending probability of the PCB, further effectively improve the production quality of the touch control PCB and increase the economic benefit of the touch control PCB.

2. Technical scheme

In order to solve the above problems, the present invention adopts the following technical solutions.

A production process of a bending-proof touch control PCB comprises the following steps:

s1, preparing raw materials, cutting a substrate with a proper size according to a design manuscript, and preprocessing the substrate;

s2, laminating, namely stacking the treated laminated board on a substrate;

s3, forming, namely performing high-temperature hot-pressing treatment on the stacked substrates to shape the substrates to form a touch PCB;

s4, baking by hot air,

s41, placing the touch PCB on the upper end of the uniform baking partition plate in a flat mode, pulling the elastic covering film to enable the elastic covering film to generate stretching deformation, covering the touch PCB, and then placing another touch PCB on the upper end of the elastic covering film, so that the touch PCB and the elastic covering film are stacked at intervals;

s42, sequentially sliding the uniformly baked partition boards on which the touch PCBs are placed into hot air guide sliding rails of a baking cabin;

s43, after the uniform baking partition plates are placed, closing a cabin door of the baking equipment body, starting the baking equipment body, enabling hot air to flow through the upper end and the lower end of the baking equipment body and the hot air cavity, and enabling the hot air flowing in the hot air cavity to enter the heat radiation guide cavity under the guide of the air guide strip holes and the air guide pipes, so that the elastic covering film conducts internal stress eliminating type heat conduction baking on the touch PCB of each layer under the cooperation of the leveling maintaining assembly and the stress eliminating assembly;

s44, after baking is finished, taking out the uniformly baked partition plate and the touch PCB, and naturally cooling the touch PCB;

s5, detecting the flatness of the cooled touch PCB, flowing into the next procedure after the flatness is qualified, covering a film by elasticity in the hot air baking process of the touch PCB, flatly keeping the setting of a component and a stress relief component, effectively performing a heat conduction baking effect on the touch PCB at each layer position, effectively improving the baking efficiency, improving the baking uniformity of the touch PCB, improving the temperature conduction effect, enhancing the internal stress relief effect of the touch PCB, effectively avoiding the problem of poor internal stress relief or over-baking damage of the touch PCB, reducing the bending and warping probability of the PCB, effectively improving the production quality of the touch PCB and increasing the economic benefit of the touch PCB.

Further, the baking equipment comprises a baking equipment body, a baking cabin is arranged in the baking equipment body, a plurality of hot air guide slide rails are fixedly connected to the left inner wall and the right inner wall of the baking cabin, a uniform baking partition plate is slidably connected between the left hot air guide slide rail and the right hot air guide slide rail, an embedded cavity is formed in the uniform baking partition plate, an elastic covering film is fixedly connected to the left inner wall of the embedded cavity, a leading-out hole matched with the embedded cavity is formed in the upper end of the uniform baking partition plate, the right end of the elastic covering film extends to the outer side of the uniform baking partition plate through the leading-out hole and is fixedly connected with a limiting spacer, a heat radiation leading cavity is formed in the elastic covering film, a plurality of stress relieving assemblies are connected to the upper inner wall and the lower inner wall of the heat radiation leading cavity, a leveling maintaining assembly is arranged between the upper stress relieving assembly and the lower stress relieving assembly, and a leveling maintaining assembly and a stress relieving assembly are matched, the flatness of the touch PCB can be effectively maintained in the hot air baking process, the internal stress of the touch PCB is eliminated, the follow-up warping probability of the touch PCB is effectively avoided, the production quality of the touch PCB is improved, and the production difficulty of the touch PCB is reduced.

Further, evenly toast the induced duct that baffle left end fixedly connected with a plurality of and heat radiation lead the chamber and put through mutually, toast and to have seted up the hot-blast chamber in the equipment body, hot-blast guide slide rail is close to evenly toasts baffle one side and sets up the induced air strip hole of putting through mutually with hot-blast chamber, and induced air strip hole and induced duct cooperate, and induced air strip hole and hot-blast chamber can conduct hot-blast, make it can flow in heat radiation lead the intracavity, and then effectively toasts the processing to the touch-control PCB board of each layer, improve and toast thermal degree of consistency, effectively reduce the difference in temperature between each layer touch-control PCB board, reduce its deformation influence each other.

Furthermore, the stress relief assembly comprises a bearing frame, the upper inner wall and the lower inner wall of the heat radiation guide cavity are fixedly connected with the bearing frame, the upper inner wall and the lower inner wall of the heat radiation guide cavity are fixedly connected with a deformation cover, the deformation cover is fixedly connected with the inner wall of one side of the bearing frame, and the deformation cover is matched with the elastic covering film.

Further, elasticity cover membrane one side fixedly connected with spider web post is kept away from to the cover that deforms, spider web post is close to a plurality of spider legs that pull of elasticity cover membrane one side fixedly connected with, it is close to elasticity cover membrane one side and rotates and be connected with the extrusion spider foot to pull spider leg, the extrusion spider foot is close to elasticity cover membrane one side and extends to accepting the frame outside to cooperate with the elasticity cover membrane, in the process that the equipment is toasted this internal temperature and constantly rises, increase the surface activity of elasticity cover membrane, make it can carry out the internal stress elimination of flexible extrusion formula to the touch-control PCB board, promote hot-blast stoving process internal stress elimination effect, reduce the probability that touch-control PCB board internal stress reforms, further reduce the probability that the touch-control PCB board warped, improve the roughness of touch-control PCB board.

Furthermore, the arachnoid post is close to the strong magnetism ejector pad of repulsion that elastic cover membrane one end fixedly connected with, two from top to bottom accept the frame and be close to one side inner wall fixedly connected with and the strong magnetism ejector pad matched with electromagnetism and repel the piece mutually, corresponding the strong magnetism ejector pad of repulsion and the electromagnetism repel the equal fixedly connected with matched with contact conducting rod of the one end that the piece is close to mutually.

Further, after the two corresponding contact breakover poles contact, the electromagnetism repels the piece circular telegram and produces magnetism, and two corresponding after the contact breakover poles contact disconnection, the electromagnetism repels the piece and cuts off the power supply after a certain time, can toast the in-process to it and carry out active destressing effect under the cooperation of piece and contact breakover pole is repelled to the electromagnetism, can also keep resetting the action to the offset stress subassembly in the cooling process of touch-control PCB board, keep the roughness of elasticity cover film, reduce the influence degree of elasticity cover film to touch-control PCB board, improve the cooling effect of touch-control PCB board, effectively improve the production quality of touch-control PCB board.

Further, it is upper and lower two to level the subassembly that keeps including pyrocondensation deformation strip accept the frame and be close to the equal fixedly connected with pyrocondensation deformation strip of one end mutually, two fixedly connected with flexile ball between the pyrocondensation deformation strip, the heat conduction hole has been seted up in the flexile ball, and the heat conduction hole is the level setting, set up the conduction hole that communicates with the heat conduction hole in flexile ball and the pyrocondensation deformation strip, and heat conduction hole and conduction hole are the axis and set up perpendicularly, and the cooperation of pyrocondensation deformation strip and flexile ball not only can restrict the thickness of elastic cover membrane when being heated, and effective surface elasticity covers membrane deformation and leads to the fact the damage to touch-control PCB board greatly to can recycle hot-blast, when improving energy utilization, promote the effect of toasting.

Further, it keeps the chamber to have seted up heating power in the pyrocondensation deformation strip, heating power keeps the chamber to be close to and accepts frame one side to communicate mutually with the conduction hole, heating power keeps the chamber to be close to flexible ball one side inner wall fixedly connected with thermal expansion deformation bag, the thermal expansion deformation intussuseption is filled with the thermal expansion material, when the thermal expansion deformation bag produces thermal expansion deformation, can carry out pressure extrusion to the deformation cover, makes it produce deformation and acts on the elasticity cover film, and effective supplementary elasticity cover film carries out the internal stress to the touch-control PCB board and eliminates, effectively avoids the touch-control PCB board to produce the phenomenon of warping.

Furthermore, one end of the thermal shrinkage deformation strip, which is close to the bearing frame, is fixedly connected with a spider-web column communicated with the bearing frame, and the spider-web column is communicated with the thermal power maintaining cavity.

3. Advantageous effects

Compared with the prior art, the invention has the advantages that:

(1) this scheme is through the hot-blast in-process elastic coating membrane that toasts of touch-control PCB board, level and smooth the setting that keeps subassembly and stress relief subassembly, can effectively carry out the heat-conduction to the touch-control PCB board of each layer position and toast the effect, when effectively improving and toast efficiency, can also improve the stoving degree of consistency of touch-control PCB board, the effect of temperature conduction is improved, the effect of reinforcing touch-control PCB inboard stress elimination, and then effectively avoid the problem that the internal stress elimination is bad or overbake the damage appears in the touch-control PCB board, reduce the probability that the PCB board warped, and then effectively improved the production quality of touch-control PCB board, the economic benefits thereof has been increased.

(2) Under the cooperation of the elastic covering film, the leveling maintaining component and the stress eliminating component, the flatness of the touch control PCB can be effectively maintained in the hot air baking process, the internal stress of the touch control PCB is eliminated, the follow-up warping probability of the touch control PCB is effectively avoided, the production quality of the touch control PCB is improved, and the production difficulty of the touch control PCB is reduced.

(3) The air strip hole and the hot air cavity can conduct hot air, so that the hot air can flow in the heat radiation guide cavity, the touch control PCB boards of all layers are effectively baked, the uniformity of baking heat is improved, the temperature difference between the touch control PCB boards of all layers is effectively reduced, and the mutual deformation influence is reduced.

(4) In the process that the temperature in the baking equipment body rises continuously, the surface activity of the elastic covering film is increased, so that the internal stress of the touch PCB can be eliminated in a flexible extrusion mode, the internal stress eliminating effect in the hot air baking process is promoted, the probability of the internal stress reformation of the touch PCB is reduced, the probability of the bending and warping of the touch PCB is further reduced, and the flatness of the touch PCB is improved.

(5) The cooperation of repelling the piece at the electromagnetism and contacting the conducting rod can be to its activity destressing effect of toasting the in-process to the touch-control PCB board, can also keep in touch-control PCB board cooling process restoring to the throne the action to the offsetting force subassembly, keeps the roughness that the elasticity covers the membrane, reduces the influence degree that the elasticity covers the membrane to the touch-control PCB board, improves the cooling effect of touch-control PCB board, effectively improves the production quality of touch-control PCB board.

(6) The cooperation of pyrocondensation deformation strip and flexible ball not only can restrict the thickness of elastic coating film when being heated, and effective surface elastic coating film deformation is too big to cause the damage to the touch-control PCB board to can recycle hot-blast, when improving energy utilization, promote the effect of toasting.

(7) When the thermal expansion deformation bag generates thermal expansion deformation, the deformation cover can be subjected to pressure extrusion, so that the deformation cover generates deformation to act on the elastic covering film, the elastic covering film is effectively assisted to eliminate the internal stress of the touch PCB, and the phenomenon that the touch PCB is warped is effectively avoided.

Drawings

FIG. 1 is a schematic view of the structure of the production process of the present invention;

FIG. 2 is a schematic view of the internal structure of the baking apparatus body according to the present invention;

FIG. 3 is a schematic view of a cross-sectional structure of an elastic cover film in a hot air baking process of a PCB according to the present invention;

FIG. 4 is a schematic view of a partial structure inside an elastic covering film during hot air baking of a PCB board according to the present invention;

FIG. 5 is a schematic diagram of the structure at A in FIG. 4 according to the present invention;

FIG. 6 is a schematic view of the stress relief assembly of FIG. 5 in a deformed configuration in accordance with the present invention;

FIG. 7 is a schematic axial view of the partition board for uniform baking of the present invention when it is not in operation;

FIG. 8 is a schematic sectional view of the uniform baking partition plate of the present invention when it is not in operation;

FIG. 9 is a schematic view of the internal partial structure of the elastic covering film of the uniform baking partition plate of the present invention when it is not in operation.

The reference numbers in the figures illustrate:

1 baking equipment body, 101 baking cabin, 102 hot air guide slide rail, 103 hot air cavity, 104 air guide strip hole, 2 uniform baking partition board, 201 embedded cavity, 3 elastic covering film, 301 heat radiation guide cavity, 302 spacing spacer, 4 air guide pipe, 5 leveling maintaining component, 501 heat shrinkage deformation strip, 502 flexible ball, 503 heat conduction hole, 504 conduction hole, 505 heat maintaining cavity, 506 heat expansion deformation bag, 6 stress eliminating component, 601 bearing frame, 602 deformation cover, 603 spider web column, 604 traction spider leg, 605 extrusion spider foot, 7 repulsion strong magnetic push block, 701 electromagnetic repulsion block, 702 contact guide rod.

Detailed Description

The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention; it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and all other embodiments obtained by those skilled in the art without any inventive work are within the scope of the present invention.

In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "top/bottom", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "sleeved/connected," "connected," and the like are to be construed broadly, e.g., "connected," which may be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

Example 1:

referring to fig. 1 to 9, a manufacturing process of a bending-proof touch PCB includes the following steps:

s2, laminating, namely stacking the treated laminated board on a substrate;

s4, baking by hot air,

s41, placing the touch PCB on the upper end of the uniform baking partition plate 2 in a flat mode, pulling the elastic covering film 3 to enable the elastic covering film to generate tensile deformation, covering the touch PCB, and then placing another touch PCB on the upper end of the elastic covering film 3, so that the touch PCB and the elastic covering film 3 are stacked at intervals;

s42, sequentially sliding the uniformly baking partition plates 2 on which the touch PCB is placed into a hot air guide slide rail 102 of the baking cabin 101;

s43, after the uniform baking partition plate 2 is placed, closing a cabin door of the baking equipment body 1, starting the baking equipment body 1, enabling hot air to flow through the upper end and the lower end of the baking equipment body 1 and the hot air cavity 103, enabling the hot air flowing in the hot air cavity 103 to enter the heat radiation guide cavity 301 under the guide of the air guide strip hole 104 and the air guide pipe 4, and enabling the elastic covering film 3 to conduct stress-eliminating type heat conduction baking on the touch PCB of each layer under the cooperation of the leveling maintaining assembly 5 and the stress eliminating assembly 6;

s44, after baking is finished, taking out the uniform baking partition plate 2 and the touch control PCB, and naturally cooling the touch control PCB;

s5, detecting the flatness of the cooled touch PCB, flowing into the next procedure after the flatness is qualified, covering the membrane 3 through the elasticity of the hot air baking process of the touch PCB, flatly keeping the arrangement of the component 5 and the stress eliminating component 6, effectively performing the heat conduction baking effect on the touch PCB at each layer position, effectively improving the baking efficiency, simultaneously improving the baking uniformity of the touch PCB, improving the temperature conduction effect, enhancing the internal stress eliminating effect of the touch PCB, further effectively avoiding the problem of poor internal stress elimination or overbaking damage of the touch PCB, reducing the bending probability of the PCB, further effectively improving the production quality of the touch PCB and increasing the economic benefit of the touch PCB.

Referring to fig. 2-9, comprising a baking device body 1, a baking chamber 101 is arranged in the baking device body 1, a plurality of hot air guiding sliding rails 102 are fixedly connected to the left and right inner walls of the baking chamber 101, a uniform baking partition plate 2 is slidably connected between the left and right corresponding hot air guiding sliding rails 102, an embedded cavity 201 is arranged in the uniform baking partition plate 2, an elastic covering film 3 is fixedly connected to the left inner wall of the embedded cavity 201, the elastic covering film 3 is made of a magnetic isolating material, a leading-out hole matched with the embedded cavity 201 is arranged at the upper end of the uniform baking partition plate 2, the right end of the elastic covering film 3 extends to the outer side of the uniform baking partition plate 2 through the leading-out hole, a limiting spacer 302 is fixedly connected to the left inner wall, a heat radiation leading cavity 301 is arranged in the elastic covering film 3, a plurality of stress relieving assemblies 6 are connected to the upper and lower inner walls of the heat radiation leading cavity 301, and a leveling maintaining assembly 5 is arranged between the upper and lower corresponding stress relieving assemblies 6, under the cooperation of the elastic covering film 3, the leveling and maintaining component 5 and the stress eliminating component 6, the flatness of the touch PCB can be effectively maintained in the hot air baking process, the elimination of the internal stress of the touch PCB is promoted, the follow-up warping probability of the touch PCB is effectively avoided, the production quality of the touch PCB is improved, and the production difficulty of the touch PCB is reduced.

Referring to fig. 2 and 3, the left end of the uniform baking partition plate 2 is fixedly connected with a plurality of air ducts 4 communicated with the heat radiation guide cavity 301, a hot air cavity 103 is formed in the baking device body 1, an air guide strip hole 104 communicated with the hot air cavity 103 is formed in one side of the hot air guide slide rail 102 close to the uniform baking partition plate 2, the air guide strip hole 104 is matched with the air ducts 4, the air guide strip hole 104 and the hot air cavity 103 can conduct hot air, so that the hot air can flow in the heat radiation guide cavity 301, the touch PCBs on each layer are effectively baked, the uniformity of baking heat is improved, the temperature difference between the touch PCBs on each layer is effectively reduced, and the deformation influence between the touch PCBs is reduced.

Referring to fig. 4-6 and fig. 9, the stress relief assembly 6 includes a receiving frame 601, the upper and lower inner walls of the heat radiation guiding cavity 301 are fixedly connected with the receiving frame 601, the inner wall of the upper and lower receiving frames 601 far away from the side is fixedly connected with a deformation cover 602, and the deformation cover 602 is matched with the elastic covering film 3.

Referring to fig. 4-6 and fig. 9, a spider-web column 603 is fixedly connected to a side of the deformation cover 602 away from the elastic covering film 3, a plurality of traction spider-legs 604 is fixedly connected to a side of the spider-web column 603 close to the elastic covering film 3, and an extrusion spider-leg 605 is rotatably connected to a side of the traction spider-legs 604 close to the elastic covering film 3, and the extrusion spider-leg 605 extends to an outer side of the receiving frame 601 near the elastic covering film 3 and is matched with the elastic covering film 3, so that in a process of continuously increasing temperature in the baking device body 1, surface activity of the elastic covering film 3 is increased, so that the flexible extrusion type internal stress elimination can be performed on the touch PCB, an internal stress elimination effect in a hot air baking process is promoted, a probability of re-forming an internal stress of the touch PCB is reduced, a probability of bending and warping of the touch PCB is further reduced, and a flatness of the touch PCB is improved.

Referring to fig. 5 and 6, one end of the webbed spider column 603 close to the elastic covering film 3 is fixedly connected with a repulsive force strong magnetic pushing block 7, the inner walls of the upper and lower receiving frames 601 close to one side are fixedly connected with an electromagnetic repelling block 701 matched with the repulsive force strong magnetic pushing block 7, and the ends of the corresponding repulsive force strong magnetic pushing block 7 and the electromagnetic repelling block 701 close to each other are fixedly connected with matched contact conducting rods 702.

Referring to fig. 5 and 6, after two corresponding contact conducting rods 702 are contacted, the electromagnetic repulsion block 701 is energized to generate magnetism, and after the two corresponding contact conducting rods 702 are disconnected, the electromagnetic repulsion block 701 is de-energized after a certain time, and under the cooperation of the electromagnetic repulsion block 701 and the contact conducting rods 702, the active stress relieving effect can be performed on the touch PCB in the baking process, the reset action of the stress relieving component 6 can be kept in the cooling process of the touch PCB, the flatness of the elastic covering film 3 is kept, the influence degree of the elastic covering film 3 on the touch PCB is reduced, the cooling effect of the touch PCB is improved, and the production quality of the touch PCB is effectively improved.

Please refer to fig. 3, fig. 4 and fig. 9, the leveling and maintaining assembly 5 includes a thermal shrinkage deformation strip 501, the upper and lower receiving frames 601 are close to one end of the thermal shrinkage deformation strip 501, a flexible ball 502 is fixedly connected between the two thermal shrinkage deformation strips 501, a heat conduction hole 503 is formed in the flexible ball 502, the heat conduction hole 503 is horizontally arranged, a conduction hole 504 communicated with the heat conduction hole 503 is formed in the flexible ball 502 and the thermal shrinkage deformation strip 501, the heat conduction hole 503 and the conduction hole 504 are vertically arranged along the axis, the thermal shrinkage deformation strip 501 and the flexible ball 502 are matched, not only the thickness of the elastic covering film 3 when being heated can be limited, the effective surface elastic covering film 3 is too large to damage the touch PCB, and can recycle hot air, thereby improving the energy utilization rate and simultaneously promoting the baking effect.

Referring to fig. 4 and 9, a thermal force holding cavity 505 is formed in the thermal shrinkage deformation strip 501, the thermal force holding cavity 505 is close to one side of the receiving frame 601 and is communicated with the conduction hole 504, a thermal expansion deformation bag 506 is fixedly connected to an inner wall of the thermal force holding cavity 505 close to one side of the flexible ball 502, a thermal expansion material is filled in the thermal expansion deformation bag 506, when the thermal expansion deformation bag 506 generates thermal expansion deformation, pressure extrusion can be performed on the deformation cover 602, so that the thermal expansion deformation bag generates deformation to act on the elastic covering film 3, the elastic covering film 3 is effectively assisted to perform internal stress elimination on the touch PCB, and the phenomenon that the touch PCB is warped is effectively avoided.

Referring to fig. 4 and 9, a spider-web column 603 communicated with the receiving frame 601 is fixedly connected to one end of the thermal shrinkage deformation strip 501 close to the receiving frame 601, and the spider-web column 603 is communicated with the thermal power holding cavity 505.

Referring to fig. 1-9, after the baking apparatus body 1 is started, hot air enters the heat radiation cavity 301 through the guidance of the hot air cavity 103, the air-inducing strip hole 104 and the air-inducing pipe 4, so that the heat radiation cavity 301 conducts heat, expands air in the heat radiation cavity 301, partitions adjacent touch PCBs, effectively prevents the interaction of the heat radiation cavity and the adjacent touch PCBs from generating concentration of internal stress, and enables the temperature of each layer of touch PCBs to rise synchronously under the temperature conduction of the elastic covering film 3, thereby improving the efficiency and effect of hot air baking;

after the temperature in the baking chamber 101 rises continuously, when the baking chamber is in a heat preservation state, the heat-shrinkable deformation strip 501 shrinks after being heated, under the action of the heat expansion force of the heat radiation guide cavity 301 and the shrinkage force of the heat-shrinkable deformation strip 501, the flexible ball 502 expands by pulling, the aperture of the heat conduction hole 503 is increased, hot air can be absorbed and guided, the hot air enters the heat retention cavity 505 through the heat conduction hole 504, the heat-shrinkable deformation bag 506 acts, the heat-shrinkable deformation bag 506 generates the heat expansion effect, the space of the heat retention cavity 505 is reduced continuously, air flow in the heat retention cavity 505 enters the bearing frame 601 through the spider-web column 603, the deformation cover 602 generates deformation, when the deformation cover 602 deforms, the spider-web column 603 drives and extrudes the spider legs 604 to generate actions, the elastic covering film 605 is extruded and deformed, and the surface of the elastic covering film 3 generates active deformation, the flexible extrusion type internal stress elimination is carried out on the touch control PCB, the internal stress elimination effect in the hot air baking process is promoted, the probability of the reformation of the internal stress of the touch control PCB is reduced, the probability of the bending of the touch control PCB is further reduced, and the flatness of the touch control PCB is improved;

in the process of continuous deformation of the deformation cover 602, the two corresponding contact conducting rods 702 are continuously close to each other, and after the contact of the two corresponding contact conducting rods, the electromagnetic repulsion blocks 701 are electrified to generate magnetism, the repulsion strong magnetic push block 7 is pushed by the repulsion magnetic force, the magnetic force generated by the electromagnetic repulsion block 701 is larger than the extrusion force caused by the thermal expansion deformation bag 506, the deformation cover 602 generates reset deformation, so that the spider-web column 603 drives the pressing spider foot 605 to reset by drawing the spider legs 604, and simultaneously contacts the conducting rod 702 to separate, after the contact conducting rod 702 is separated for a period of time, the electromagnetic repulsion block 701 is powered off and no longer has magnetism, so that the deformation cover 602 and the spider-web column 603 are deformed again under the extrusion pressure of the thermal expansion deformation bag 506, the above steps are repeated, so that the elastic covering film 3 keeps continuous movement in the baking process, the elastic covering film 3 is effectively assisted to eliminate the internal stress of the touch PCB, and the phenomenon of bending of the touch PCB is effectively avoided;

when the uniform baking partition plate 2 is taken out to cool the touch control PCB, the reduction of the temperature can enable the thermal shrinkage deformation strip 501 and the thermal expansion deformation bag 506 to reset, the deformation effect of the extrusion spider foot 605 on the elastic covering film 3 is removed, the elastic covering film 3 keeps the leveling effect, the probability of the reformation of the internal stress of the touch control PCB is reduced, the probability of the bending and warping of the touch control PCB is further reduced, and the flatness of the touch control PCB is improved; through the hot-blast in-process elastic covering membrane 3 that toasts of touch-control PCB board, level and keep subassembly 5 and stress relief subassembly 6's setting, can effectively carry out the heat-conduction to the touch-control PCB board of each layer position and toast the effect, when effectively improving and toast efficiency, can also improve the stoving degree of consistency of touch-control PCB board, the effect of temperature conduction is improved, the effect of reinforcing touch-control PCB inboard stress elimination, and then effectively avoid the problem that the internal stress elimination is bad or the overbaking damage appears in the touch-control PCB board, reduce the probability that the PCB board warped, and then effectively improved the production quality of touch-control PCB board, the economic benefits thereof has been increased.

The foregoing is only a preferred embodiment of the present invention; the scope of the invention is not limited thereto. Any person skilled in the art should be able to cover the technical scope of the present invention by equivalent or modified solutions and modifications within the technical scope of the present invention.

Claims

1. A production process of a bending-proof touch control PCB is characterized by comprising the following steps: the method comprises the following steps:

s2, laminating, namely stacking the treated laminated board on a substrate;

s4, baking by hot air,

s41, placing the touch PCB on the upper end of the uniform baking partition plate (2) in a flat mode, pulling the elastic covering film (3) to enable the elastic covering film to generate stretching deformation, covering the touch PCB, and then placing another touch PCB on the upper end of the elastic covering film (3) to repeat the process so that the touch PCB and the elastic covering film (3) form interval stacking;

s42, sequentially sliding the uniform baking partition plates (2) on which the touch control PCB is placed into a hot air guide sliding rail (102) of a baking cabin (101);

s43, after the uniform baking partition plates (2) are placed, closing a cabin door of the baking equipment body (1), starting the baking equipment body (1), enabling hot air to flow through the upper end and the lower end of the baking equipment body (1) and the hot air cavity (103), enabling the hot air flowing in the hot air cavity (103) to enter the heat radiation guide cavity (301) under the guide of the air guide strip holes (104) and the air guide pipes (4), and enabling the elastic covering film (3) to conduct stress-eliminating heat conduction baking on the touch control PCB of each layer under the matching of the leveling maintaining component (5) and the stress eliminating component (6);

s44, after baking is finished, taking out the uniform baking partition plate (2) and the touch PCB, and naturally cooling the touch PCB;

and S5, detecting, namely detecting the flatness of the cooled touch control PCB, and flowing into the next procedure after the flatness is qualified.

2. The production process of the bending-proof touch control PCB as claimed in claim 1, wherein the production process comprises the following steps: comprises a baking equipment body (1), a baking cabin (101) is arranged in the baking equipment body (1), a plurality of hot air guide sliding rails (102) are fixedly connected to the left inner wall and the right inner wall of the baking cabin (101), a left corresponding hot air guide sliding rail and a right corresponding hot air guide sliding rail (102) are slidably connected with a uniform baking partition plate (2), an embedded cavity (201) is formed in the uniform baking partition plate (2), an elastic covering film (3) is fixedly connected to the left inner wall of the embedded cavity (201), a leading-out hole matched with the embedded cavity (201) is formed in the upper end of the uniform baking partition plate (2), the right end of the elastic covering film (3) extends to the outer side of the uniform baking partition plate (2) through the leading-out hole and is fixedly connected with a limiting spacer (302), a heat radiation leading cavity (301) is formed in the elastic covering film (3), and a plurality of stress eliminating components (6) are connected to the upper inner wall and the lower inner wall of the heat radiation leading cavity (301), a leveling and maintaining component (5) is arranged between the upper stress relieving component (6) and the lower stress relieving component (6).

3. The production process of the bending-proof touch control PCB as claimed in claim 2, wherein the production process comprises the following steps: evenly toast baffle (2) left end fixedly connected with a plurality of induced ducts (4) of leading chamber (301) to switch on with heat radiation, hot-blast chamber (103) have been seted up in toasting equipment body (1), hot-blast guide slide rail (102) are close to evenly toast baffle (2) one side and offer induced air strip hole (104) of switching on mutually with hot-blast chamber (103), and induced air strip hole (104) and induced duct (4) cooperate.

4. The production process of the bending-proof touch control PCB as claimed in claim 2, wherein the production process comprises the following steps: stress relieving subassembly (6) are including accepting frame (601), the equal fixedly connected with of two inner walls about heat radiation draws chamber (301) accepts frame (601), two from top to bottom accept frame (601) keep away from one side inner wall fixedly connected with deformation cover (602) mutually, and deformation cover (602) and elasticity cover membrane (3) cooperate.

5. The production process of the bending-proof touch control PCB as claimed in claim 4, wherein the production process comprises the following steps: deformation cover (602) are kept away from elastic cover membrane (3) one side fixedly connected with spider-web column (603), spider-web column (603) are close to elastic cover membrane (3) one side fixedly connected with a plurality of spider legs (604) of pulling, it is connected with extrusion spider foot (605) to pull spider leg (604) to rotate near elastic cover membrane (3) one side, extrusion spider foot (605) are close to elastic cover membrane (3) one side and extend to accepting frame (601) outside to cooperate with elastic cover membrane (3).

6. The production process of the bending-proof touch control PCB as claimed in claim 5, wherein the production process comprises the following steps: the spider-web column (603) is close to the strong magnetism ejector pad (7) of elasticity cover membrane (3) one end fixedly connected with repulsion force, two from top to bottom accept frame (601) and be close to one side inner wall fixedly connected with and repulsion force strong magnetism ejector pad (7) matched with electromagnetism and repel piece (701) mutually, corresponding the equal fixedly connected with matched with contact conducting rod (702) of one end that repulsion force strong magnetism ejector pad (7) and electromagnetism are repelled piece (701) and are close to mutually.

7. The production process of the bending-proof touch control PCB board as claimed in claim 6, wherein the production process comprises the following steps: after two corresponding contact conducting rods (702) are contacted, the electromagnetic repulsion blocks (701) are electrified to generate magnetism, and after the two corresponding contact conducting rods (702) are disconnected, the electromagnetic repulsion blocks (701) are powered off after a certain time.

8. The production process of the bending-proof touch control PCB as claimed in claim 4, wherein the production process comprises the following steps: levelly and smoothly keep subassembly (5) including pyrocondensation deformation strip (501), two from top to bottom accept frame (601) and be close to one end equal fixedly connected with pyrocondensation deformation strip (501), two fixedly connected with flexible ball (502) between pyrocondensation deformation strip (501), set up heat conduction hole (503) in flexible ball (502), and heat conduction hole (503) are the level setting, set up in flexible ball (502) and pyrocondensation deformation strip (501) and lead hole (504) that switch on mutually with heat conduction hole (503), and heat conduction hole (503) and conduction hole (504) are the perpendicular setting of axis.

9. The production process of the bending-proof touch control PCB as recited in claim 8, wherein: a thermal power holding cavity (505) is formed in the thermal shrinkage deformation strip (501), the thermal power holding cavity (505) is close to one side of the bearing frame (601) and communicated with the transmission hole (504), a thermal expansion deformation bag (506) is fixedly connected to the inner wall of one side, close to the flexible ball (502), of the thermal power holding cavity (505), and thermal expansion materials are filled in the thermal expansion deformation bag (506).

10. The production process of the bending-proof touch control PCB as claimed in claim 9, wherein the production process comprises the following steps: one end, close to the bearing frame (601), of the thermal shrinkage deformation strip (501) is fixedly connected with a spider-web column (603) communicated with the bearing frame (601), and the spider-web column (603) is communicated with the thermal power holding cavity (505).