1355429 九、發明說明： 【發明所屬之技術領域】 本發明涉及一種電路板製程所用到之設備，尤其涉及 一種軟性電路板之電鍍裝置。 【先前技術】 軟性 ¢(7 刷電路板（Flexible Printed Circuit Board， FPCB)，係指用軟性絕緣基材製成之電路板，可自由彎曲、 |捲繞或折疊，可依照空間佈局要求任意安排，並於三維空 間任意移動及伸縮，具有諸多硬性印刷電路板所不具備之 優點。 目前，軟性印刷電路板通常採用連續式傳送滾筒生產 工藝進行製造。連續式傳送滚筒生產方法係以卷輪對卷輪 之連動式操作方式，首先將軟性帶狀絕緣基材進行壓合、 蝕刻並形成保護層；其次，沖孔形成並行排列之傳動孔， 再次，沿並行排列之傳動孔線切割軟性絕緣基材，得到複 春數條寬度適於製作電路板之軟性絕緣基板，並卷收於卷 輪，最後，利用卷輪對卷輪之連續傳動完成軟性絕緣基板 •上軟性電路板之工藝製程。 ' 卷輪對卷輪連續製作軟性電路板之過程通常會涉及線 路之製作、電子元件於軟性電路板上之封裝等工藝製程， 收錄於 Proceedings of the —IEEE，VOL.93，NO. 8，August 2005，Paper(s):1500-1510,中之標題為 “Flexible electronics and displays: high-resolution, roll-to-roll, projection 7 1355429 ；graphy and processing techn〇1〇gies f〇r ^路板‘作過程中連續式製作線路之過程，以及給出了 軟性電路板上電子元件之連續式封裝之過程。 於連續式製作軟性電路板之製程巾，m緣基板上 傳動孔會多次套入傳動輪之扣針以進行傳動，為避免傳 :…貝壞，造成傳動或其他製程問題，—般情況下，軟 性電路板之傳純域巾除㈣孔之外，其餘區域即傳動孔 7圍設有_。這樣，於軟性電路板之鍵鎳/金處理過程 ，傳動孔周圍銅層之表面也會鍍上鎳 :傳動區偷“非成型區域”，於完…裝:成： ::傳動區域即被拋棄，因此，銅層表面所附著之鎳/金也 3隨之被拋棄，從而造成材料之浪費。 為此’有，必要提供一種可減少電鐘製程中鑛々材料於 軟性電路板之傳動區域上不必要浪費之電鍍裝.置。.. 【發明内容】 以下以實施例說明一種可減少電鍍製程中鍍層材料於 軟f生電路板之傳動區域表面沈積之電鑛裝置。 —一種電鍍裝置，其用於軟性電路板基板之電鍍，該軟 \電路板基板待處理之表面包括至少一第一傳動區域與至 少一第二傳動區域，該電鍍裝置包括鍍槽，該鍍槽包括槽 體與设置於槽體中之陽極，該電鍍裝置還包括一遮蔽裝 置，该遮蔽裝置包括至少一第一遮板與至少一第二遮板， 8 .設平行軟性電路板基板待處理之表面 -路板基板:=:=第一傳動區域設置於距軟性電 二傳動區域;置毫米處，該第二遮板相對該第 :處二遮板之寬度等於或大於第-傳動區域：； 詨第-…^ 或大於第二傳動區域之寬度， χ “、、反/、第二遮板之材質為絕緣材料。 兮雔面震置’其用於雙面軟性電路板基板之電鑛， 基板具有相對之兩個待處理之表面，兮 雙面軟性電路板基板包括兩 〆 相對之第二傳動區域，該電以置紅域與兩個 择雜4 冤鍍衣置包括鍍槽，該鍍槽包括 ，曰心2於槽體之陽極，該電鍍裝置還包括-第-遮蔽 S 第—遮蔽裝置包括—第一 ·遮板 板：?=該，第遮蔽裝置包括-第三遮板與第四遮 〜弟、Μ反.、第二遮板、第三遮板以及第板 軟性電路板基板待處理之表面，該第一遮板與第三遮板： 別相對各自對應之第—傳動區域設置於距各自對應軟性電 路板基板待處理之表面5_2〇毫米處，該第二遮板與第四遮 板刀別相對各自對應之第二傳動區域設置於距各自對應軟 性電路板基板待處理之表面5_2G毫米處，該第—遮板與第 三遮板之寬度等於或大於第一傳動區域之寬度，該第二遮 ，與第四遮板之寬度等於或大於第二傳動區域之寬度，該 第一遮板、第二遮板、第三遮板以及第四遮板之材質為絕 緣材料+。 、、 13.55429 .對於上述第一個技術方案中之電鍍裝置，於軟性電路 •板基板之電鍍過程中，電鍍裝置中具有遮蔽裝置，其設置 於軟性電路板基板傳動區域之一定距離處，如於距第一傳 動區域之表面5-20毫米之高度處設置第一遮板，於距第二 • 2動區域之表面5-20毫米之高度處設置第二遮板，這樣於 電鍍過程中，由於第一遮板與第二遮板之存在，軟性電路 板基板之傳動區域之銅層表面所鍍上之鍍層金屬之厚度可 得到控制，避免鍍層金屬之浪費。另外，由於第一遮板與 •第二遮板之材料為絕緣基材，電鍍過程中，鍍層金屬不^ 形成於第一遮板和第二遮板上，從而也避免了鍍層金屬之 浪費。 對於上述第二個技術方案中之電鍍裝置，於雙面軟性 電路板基板之電鍍過程中，電鍍裝置中具有第一遮蔽裝置 與第二遮蔽裝置’其分別設置於距兩個待處理表面之傳動 ^域之一定距離處，這樣於電鍍過程中，由於第二遮板與 籲第二遮板之存在，軟性電路板基板兩個待處理表面之傳_ 區域之銅層表面所鑛上之鍵層金屬之厚度可得到控制 免鍍層金屬之浪費。且第一遮蔽裝置與第二遮蔽裝置中之 遮板均採用絕緣基材，電鐘過程中，鑛層金屬不會形成於 遮板上，從而也避免了鍵層金屬之浪費。 【實施方式】 方案之電鍍製 下面將結合附圖及複數實施例對本技術 私之遮蔽裝置作進一步之詳細說明。 板之^ 提供—種電鍍裝置，其用於軟性電路板基 板之電鑛’ έ亥軟性雷路_起| 4c 士 包路扳基板待處理之表面包括至少一傳 動區域，該電鍍裝置#鉍锔Μ 财 ·又彳日，泫鍍槽包括槽體與設置於 ^ ^ ^ ％鑛裝置遇包括—遮蔽裝置，該遮蔽裝 G V -遮板該遮板平行軟性電路板基板待處理之表 =置’且該遮板相對該傳動區域設置於距軟性電路板基 值1處理之表面52G *米處’該遮板之寬度等於或大於該 傳動區域之寬度’該遮板之材質為絕緣材料。 一=圖1、圖2及圖3所示，本技術方案第—實施例提供 一種電鐘裝置1〇〇,用於軟性電路板基板2⑼上進行鍵金。 該軟性電路板基板200係指其上已經完成導通孔、線路等 衣作$備進仃金手指製作之電路板基板。該軟性電路 板基板可為單面板或雙面板，本實施例中以單面板為 Γ ί订說明電鍍裝置1G ◦。該待加工之軟性電路板基板2 〇 〇 :f狀通#採用卷輪對卷輪之連續式傳動方式進行加 工。該軟性電路板基板之寬度可製作兩個獨立之軟性 電路板—ID此’軟性電路板基板·包括第—傳動區域 210 ,第二傳動區域22()，第三傳動區域现以及第四傳動 區域240。該第一傳動區域21〇肖第二傳動區域—沿軟性 電路板基板200免度方向界定出一個軟性電路板成型區 :’同樣’第三傳動區域23〇與第四傳動區域24〇沿軟性 %路板基;1¾ 200 k度方向界定出另一個軟性電路板成型區 戈°亥第—傳動區域220與第三傳動區域23〇相鄰設置。 軟11電路板基板2〇〇於電鍍製程中，通常以卷輪對卷 11 1355429 .輪之連續傳送方式被輸送至該電鍍裝置100中進行電鍍。 該電鍍裝置100包括鍍槽110與遮蔽裝置120。該鍍槽110 包括槽體111與固定於槽體111内壁之陽極112,該陽極112 通常為石墨、可溶性鍍層金屬或不溶性鍍層金屬。可溶性 鏡層金屬包括鎳、金等，不溶性鍍層金屬包括氧化銥、鍍 鈦鉑金等。該遮蔽裝置120用於控制軟性電路板基板200 電鍍製程中第一傳動區域210、第二傳動區域220、第三傳 動區域230以及第四傳動區域240之表面形成過厚之鍍層 #金屬.，以避免鍍層金屬之浪費。 根據本貫施例中軟性電路板基板200之結構，該遮 裝置120包括第一遮板121，第二遮板122以及第三遮板 123。該第一遮板121、第二遮板122、第三遮板123平行 地設置於軟性電路板基板.200待電鍍表面之上方，且該.三 個遮板到軟性電路板基板200待電鍍表面之間之距離相 等，即，該三個遮板'處於同一平面内，該三個遮板與軟性 電路板基板200待電鍍表面之間之垂直距離約為5-20毫 ®米，本實施例中，該三個遮板到軟性電路板基板200待電 鍍表面之間之距離均為10毫米。 為了便於安裝或為了使得遮蔽裝置120具有整體性， 該遮蔽裝置120還包括至少一支撐桿124，其將第一遮板 121、第二遮板122以及第三遮板123横向連接起來。該支 撐桿124與第一遮板121、第二遮板122以及第三遮板1:23 所用材料可為PI(聚醯亞胺）、PVC(聚氣乙烯樹脂）、PP(聚 丙烯）等絕緣材料。該支撐桿124與第一遮板121、第二遮 12 1355429 .板122以及第三遮板123之間具體連接方法可通過螺釘連 -接、膠粘劑膠合或一體成型等方法，本實施例中，支撐桿 124、第一遮板121、第二遮板122以及第三遮板123通過 射出成型方法製作為一體成型結構。 • 该第一遮板121對應第一傳動區域210平行地設置於 軟性電路板基板200待電鍍表面之上方，第一遮板121之 寬度L!大於或等於第一傳動區域21〇之寬度&，即， 為適應各類軟性電路板基板200中不同第一傳動區域21〇 籲結構.之要求，第一遮板121之寬度Li可為5 2〇毫米。本實 施例中，第一遮板121之寬度^約為5毫米，且第一遮板 121與第一傳動區域21〇之間之距離約為1〇毫米。 颠似地，該第二遮板122對應相鄰接之第二傳動區域 220與第三傳動區域230平行地設置於軟性電路板基板2〇〇 待電鍍表面之上方，該弟二遮板122之寬度L2等於或大於 苐二傳動區域220之寬度&與第三傳動區域23〇之寬度& 之和即，L^S2 + S3。為適應各類軟性電路板基板2〇〇中 不同第二傳動區域220與第三傳動區域23〇結構之要求， 第二.遮板122之寬度L2可為1〇〜40毫米。本實施例中，第 二遮板122之寬度l2為1〇毫米。 類似地，該第三遮板123對應第四傳動區域24〇平行 地設置於軟性電路板基板200待電鍍表面之上方，第三遮 板123之寬度L3大於或等於第四傳動區域24〇之寬度心， 即，L0S4。為適應各類軟性電路板基板2〇〇中不同第四傳 動區域240結構之要求，第三遮板123之寬度b可為5_2〇 13 13.55429 .毛米。本實施例中，第三遮板123之寬度L3為5毫米。 ， 上述第—遮板121、第二遮板122'第三遮板123之寬 度之和最好不大於軟性電路板基板200之寬度，以便減小 電鍍裝置之空間體積。 - 另外’遮蔽裝置120於軟性電路板基板2〇〇之電鍍過 私中需要固定’遮蔽裝置12〇可固定於鍍槽n0上，亦可 通過其他固定裝置於鍍槽110内部或外部固定。例如，該 錄私110之沿软性電路板基板2〇〇長度方向上之兩個相對 _之内壁表面分別設置有至少一固定塊113，該固定塊之 材質為非金屬，例如P1(聚醯亞胺）、PVC(聚氣乙烯樹脂）、 PP(聚丙烯）等與遮蔽裝置12〇材質相同之材料。本實施例 中，鍍槽110兩個相對之内壁分別設置有一固定塊113，且 兩個口疋塊113沿軟性:電路板基板200長度方向上可開設 有卡槽114用於將遮蔽裝置120之支撐桿124之兩端分別 配合於卡槽114内.，從而將整個遮蔽裝置12〇進行固定： • 於軟丨生电路板基板200之電鐘過程中，由於傳動區域 中傳動孔周圍之銅層面積相對於線路來說較大，因此，於 .电鑛.過私中’傳動區域中傳動孔周圍之銅層電流密度較 大，從而電鍍過程於傳動區域之銅層表面會形成過厚之鍍 層，這樣勢必造成鍍層材料之浪費。本實施例之電鍍裝置 100中具有遮蔽裝置120 ’其設置於軟性電路板基板200傳 動區域之一定距離處，這樣可通過遮蔽裝置12〇與傳動區 域之間距離之設定而限制鍍層於傳動區域表面沈積之高 度。例如，第一遮板121設置於距第一傳動區域21〇之表 14 1355429 .面5-20毫米之高度處，第二遮板122設置於距第二傳動區 .域220與第三傳動區域23〇之表面5_2〇毫米之高度處，第 三遮板123設置於距第四傳動區域24〇之表面52〇毫米之 南度處，這樣於電鍍過程中，由於第一遮板121、第二遮板 * I22、第三遮板123之存在，軟性電路板基板200上述四個 傳動區域之銅層表面所鍍上之鍍層金屬之厚度可得到控 制，避免鍍層金屬之浪費。另外，由於遮蔽裝置12〇之材 料為絕緣基材，電鍍過程中，鍍層金屬不會形成於遮蔽裝 鲁置120上，從而亦避免了錢層金屬之浪費。 如圖4所示，本技術方案第二實施例提供一種電鍍裝 置300，用於電鍍雙面軟性電路板基板4〇〇，該雙面軟性電 路板基板400之兩個相對之待電鍍表面之結構分別與第一 ，實施例中之軟性電路板基板.2〇〇之結構基本相同。即，該 雙面軟性電路板基板4〇〇包括兩個相對之第一傳動區域 ’ 41 〇、兩個相對之第一傳動區域42〇 ,兩個相對之第三傳動 籲區域430以及兩個相對之第四傳動區域44〇。於該雙面軟性 電，板基板400之每一待電鍍表面上，該第一傳動區域41〇 .與第二傳動區域420沿軟性電路板基板400寬度方向界定 ^ 一個軟性電路板成型區域，同樣，第三傳動區域43〇與 第四傳動區域440沿軟性電路板基板4〇〇寬度方向界定出 另一個軟性電路板成型區域，該第二傳動區域42〇與第三 傳動區域430相鄰設置。 ^該電鍍裝置包括鍍槽310、第一遮蔽裝置32〇以及 第二遮蔽裝置330。該鍍槽31〇與第一實施例之鍍槽ιι〇結 15 1355429 .構相同。該第一遮蔽裝置320與第二遮蔽裝置330之結構 .分別與第一實施例之遮蔽裝置120之結構相同，且第一遮 蔽裝置320與第二遮蔽裝置330所用材料亦可為PI、PVC、 PP等絕緣基材。該第一遮蔽裝置320包括第一遮板321、 . 第二遮板322、第三遮板323以及連接第一遮板321、第二 遮板322、第三遮板323之第一支撐桿324 ;該第二遮蔽裝 置330包括與第一遮板321相對之第四遮板331、與第二遮 板322相對之第五遮板332、與第三遮板323相對之第六遮 •板333以及與第一支撐桿324相對之第二支撐桿334。 該第一遮蔽裝置320與第二遮蔽裝置330分別固定於 軟性電路板基板400之兩側，且第一遮蔽裝置320到軟性 電路板基板400其中一個待電鍍之表面之距離約為5-20毫 米，第二遮蔽裝置330到軟性電路板基板400之另一個待 .電鍵之表面之距離約為5-20毫米。本實施例中，第一遮蔽 裝置320與第二遮蔽裝置330分別到各自對應之軟性電路 板基板400待電鍍之表面之距離柜等，且均為10毫米。 * 該第一遮蔽裝置320與第二遮蔽裝置330中，第一遮 板321與第四遮板331之寬度相同，約為5-20毫米；第二 遮板322與第五遮板332之寬度相同，約為10-40毫米；第 三遮板323與第六遮板333之寬度相同，約為5-20毫米。 本實施例中，第一遮板321與第四遮板331之寬度為5毫 米，第二遮板322與第五遮板332之寬度為10毫米，第三 遮板323與第六遮板333之寬度為5毫米。 此外，第一支撐桿324與第二支撐桿334之結構可相 16 1355429 2，亦可不同，第一遮蔽裝置32〇及第二遮蔽裝置330之 冓”第貝施例中之遮蔽裝篁120之結構以及製作方法 相同第一支撐桿324與第二支撐桿334可如遮蔽裝置12〇 之方式固定於鍍槽310中。另外，第一遮蔽裝置32〇 :、第一遮蔽裝置330亦可通過一支撐結構連接起來，具體 連接方法可通過螺釘連接、膠粘劑膠合或者第一遮蔽裝置 32〇與第二遮蔽裝置33〇為一體成型結構。 對於本實施例之電鍍裝置300來說，於雙面軟性電路 板基板400之電鍍過程中，第一遮蔽裝置32〇與第二遮蔽 裝置330分別设置各自所對應之軟性電路板基板4㈨兩個 待電錄表面之傳動區域之—定距離處，如設置於距自所對 應之傳動區域之表面5_2G毫米之高度處，這樣於電鑛過程 中，由於第一遮蔽裝置320和第二遮蔽裝置33〇之存在， 軟性電路板基板兩個表面之傳動區域之銅層表面所鑛 上之鍍層金屬之厚度可得到控制，避..免鍍層金屬之浪費。又 另外’由於第-遮蔽裝f 32〇與第二遮蔽裝i 33〇之材料 為絕緣基材，電鑛過程中，㈣金屬不會形成於第—遮蔽 裝置.320與第二遮蔽裝置33〇上，從而避免了鑛層金屬之 浪費。 如圖5所示，本技術方案第三實施例提供一種電鍵裝 置500’其用於對單面軟性電路板基板._進行電鍵，= 單面軟性電路板基板6〇〇之寬度可製作一個獨立之軟性電/ 路板。因此，單面軟生電路板基板_包括第 區 ⑽與第二傳動區域620,該第一傳動區域61〇與第二；: 17 1355429 .區域620沿軟性電路板基板600寬度方向界定出一個軟性 •電路板成型區域。該電鍍裝置500之結構與第一實施例之 電錄裝置100結構基本相同，除遮蔽裝置520之外。該遮 蔽裝置520包括第一遮板521、第二遮板522以及連接第一 •遮板521與第二遮板522之支撐桿523。該遮蔽裝置520 採用絕緣材料，第一遮板521、第二遮板522、支撐桿523 通過射出成型法制作出一體成型結構之遮蔽裝置52〇。 s玄第一遮板521與第二遮板522固定於鍍槽51〇上， .且第一遮板521與第二遮板522分別到單面軟性電路板基 板600待電鍍表面之垂直距離均為5毫米。第一遮板 與第一傳動區域610相對設置，且第一遮板521與第一傳 動區域610之寬度相同，均為5毫米。第二遮板522與第 二傳動區域620相對設置，且第二遮板522與第二傳動區 域620之I度相同’均為5毫米c_ 上述κ %例之電鍍裝置中，根據所要電鍍之電路板結 ❿構之不同，遮蔽裝置中之遮板數量相應會不同。當所要電 ，之電路板基板於其寬度方向上可容納三個或三個以上: 單個.之電路板時，由於每個電路板會由兩個傳動區域所界 定，因此，此時電路板基板上具有六個傳動區域，並中有 兩對相鄰之傳動區域，即，於第二實施例之基礎上再增加 -對相鄰之傳純域，這樣，遮蔽裝置中之遮板數量上相° 應地於第二實施例之基礎上再增加一個用於遮蔽 傳動區域之遮板。 ^ 綜上所述，本發明破已符合發明專利之要件，遂依法 18 1355429 提出專利申請。惟，以上所述者僅為本發明之較佳實施方 式，自不能以此限制本案之申請專利範圍。舉凡熟悉本案 技藝之人士援依本發明之精神所作之等效修飾或變化，皆 應涵蓋於以下申請專利範圍内。 【圖式簡單說明】 圖1係本技術方案第一實施例之電鍍裝置之立體結構 示意圖。 圖2係本技術方案第一實施例之電鍍裝置之俯視圖。 圖3係沿圖2中沿III-III方向之剖示圖。 圖4係本技術方案第二實施例之電鍍裝置之剖示圖。 圖5係本技術方案第三實施例之電鍍裝置之剖示圖。 【主要:元件符號說明】 電鍍裝置 100， 300， 500 鍍槽 . 110， 310 槽體 111 陽極 112 固定塊 113 卡槽 114 遮蔽裝置 120， 520 第一遮板 121， 321， 521 第二遮板 122 ’ 322， 522 第三遮板 123， 323 支撐桿 124， 523 19 13.55429 軟性電路板基板 200 ， 400 ， 600 第一傳動區域 210 ， 410 ， 610 第二傳動區域 220 ， 420 ， 620 第三傳動區域 230 ， 430 第四傳動區域 240 ， 440 第一遮蔽裝置 320 第一支撐桿 324 第二遮蔽裝置 330 第四遮板 331 第五遮板 332 第六遮板 333 第二支撐桿 334 201355429 IX. Description of the Invention: [Technical Field] The present invention relates to a device for use in a circuit board process, and more particularly to a plating apparatus for a flexible circuit board. [Prior Art] Flexible Printed Circuit Board (FPCB) refers to a circuit board made of a soft insulating substrate, which can be bent, folded or folded freely, and can be arranged according to the spatial layout requirements. And arbitrarily moving and telescopic in three-dimensional space, has many advantages that hard printed circuit boards do not have. Currently, flexible printed circuit boards are usually manufactured by continuous transfer drum production process. The continuous transfer drum production method is based on reel pairs. The interlocking operation mode of the reel firstly presses and etches the soft strip-shaped insulating substrate to form a protective layer; secondly, the punching holes form the transmission holes arranged in parallel, and again, the soft insulating base is cut along the transmission hole lines arranged in parallel. The material is obtained from a plurality of flexible insulating substrates suitable for the production of circuit boards, and is wound up on the reel. Finally, the process of the flexible insulating substrate and the upper flexible circuit board is completed by the continuous driving of the reel to the reel. The process of continuously making a flexible circuit board by the reel to the reel usually involves the fabrication of the circuit and the electronic components in the flexible circuit. Processes such as encapsulation are listed in Proceedings of the IEEE-VOL.93, NO. 8, August 2005, Paper(s): 1500-1510, titled "Flexible electronics and displays: high-resolution, roll -to-roll, projection 7 1355429 ;graphy and processing techn〇1〇gies f〇r ^The process of continuous production of circuits in the process of the board, and the process of continuous packaging of electronic components on the flexible circuit board In the continuous manufacturing of the flexible circuit board process towel, the drive hole on the m-edge substrate will be inserted into the pin of the transmission wheel for transmission, in order to avoid transmission: ... bad, causing transmission or other process problems, the general situation Next, the pure circuit board of the flexible circuit board except the (four) hole, the remaining area, that is, the transmission hole 7 is surrounded by _. Thus, in the soft nickel plate/gold processing process of the flexible circuit board, the surface of the copper layer around the transmission hole will also Nickel plating: the transmission area steals the “non-formed area”, after finishing...Installation: into: ::The transmission area is discarded, therefore, the nickel/gold adhered to the surface of the copper layer is also discarded, resulting in material Waste. For this, there is, necessary Providing an electroplating device capable of reducing unnecessary waste of the mink material in the transmission area of the flexible circuit board in the electric clock process. [Invention] The following describes an embodiment to reduce the plating material in the electroplating process in soft f An electroplating device for depositing a surface of a transmission region of a green circuit board. - an electroplating device for electroplating of a flexible circuit board substrate, the surface to be processed of the soft circuit board substrate comprising at least a first transmission region and at least a second In the transmission region, the plating device comprises a plating tank, the plating tank comprises a tank body and an anode disposed in the tank body, and the plating device further comprises a shielding device, the shielding device comprising at least one first shielding plate and at least one second covering Board, 8. Set the surface of the parallel flexible circuit board substrate to be processed - the road board substrate: =: = the first transmission area is set at a distance from the soft electric two-transmission area; at the millimeter, the second shutter is opposite to the second: The width of the shutter is equal to or greater than the first transmission region: 詨 詨 -...^ or greater than the width of the second transmission region, χ ",, / /, the second shutter is made of insulating material. The surface of the double-sided flexible circuit board substrate has two opposing surfaces to be treated, and the double-sided flexible circuit board substrate includes two opposite second transmission regions. The red field and the two optional 4 冤 plating devices include a plating tank, the plating tank includes a core 2 at the anode of the tank body, and the plating device further includes a - first-shield S-shield device including - first The slat board: ? ???, the shielding device comprises: a third visor and a fourth visor, a second visor, a second visor, a third visor and a surface of the slab flexible circuit board substrate to be processed, The first shielding plate and the third shielding plate are disposed opposite to each other corresponding to the first transmission region 5 to 2 mm from the surface of the corresponding flexible circuit board substrate to be processed, and the second shielding plate is opposite to the fourth shielding plate The respective second transmission regions are disposed at a distance of 5-2 Gm from the surface of the corresponding flexible circuit board substrate, and the widths of the first and third shutters are equal to or greater than the width of the first transmission region, and the second cover , and the width of the fourth shutter is equal to or greater than The width of the transmission area, the first shutter, a second shutter, and the third shutter of the shutter material as a fourth insulating material +. 13.54029. In the electroplating apparatus of the first technical solution, in the electroplating process of the flexible circuit board substrate, the electroplating apparatus has a shielding device disposed at a certain distance of the flexible circuit board substrate transmission area, as in a first shutter is disposed at a height of 5-20 mm from the surface of the first transmission region, and a second shutter is disposed at a height of 5-20 mm from the surface of the second movable region, so that during the electroplating process, The presence of the first shutter and the second shutter, the thickness of the plated metal plated on the surface of the copper layer of the transmission region of the flexible circuit board can be controlled to avoid waste of the plating metal. In addition, since the materials of the first shutter and the second shutter are insulating substrates, the plating metal is not formed on the first shutter and the second shutter during the plating process, thereby avoiding waste of the plating metal. In the electroplating apparatus of the second technical solution, in the electroplating process of the double-sided flexible circuit board substrate, the electroplating apparatus has the first shielding device and the second shielding device respectively disposed on the two surfaces to be treated. ^ a certain distance of the domain, so that in the electroplating process, due to the presence of the second shutter and the second shutter, the bond layer on the surface of the copper layer of the two regions of the flexible circuit board substrate The thickness of the metal can be used to control the waste of the plating-free metal. Moreover, the shielding plates in the first shielding device and the second shielding device are all made of an insulating substrate. During the process of the electric clock, the metal of the mineral layer is not formed on the shielding plate, thereby avoiding waste of the bonding layer metal. [Embodiment] Electroplating System of the Present Embodiment The shielding device of the present technology will be further described in detail below with reference to the accompanying drawings and the embodiments. The board provides a kind of electroplating device for the electric ore of the flexible circuit board substrate. έ海软雷雷__ | 4c The surface of the substrate to be treated includes at least one transmission area, the plating apparatus #铋锔Μ ····························································································· And the shielding plate is disposed at a distance of 52 G*m from the surface of the soft circuit board base value 1 with respect to the transmission area. The width of the shielding plate is equal to or greater than the width of the transmission area. The material of the shielding plate is an insulating material. As shown in Fig. 1, Fig. 2 and Fig. 3, the first embodiment of the present invention provides an electric clock device 1A for performing key gold on the flexible circuit board substrate 2 (9). The flexible circuit board substrate 200 refers to a circuit board substrate on which a via hole, a line, and the like have been completed. The flexible circuit board substrate can be a single panel or a double panel. In this embodiment, the plating apparatus 1G is described in a single panel. The flexible circuit board substrate to be processed 2 〇 f :f-shaped pass # is processed by a continuous transmission method of a reel to a reel. The width of the flexible circuit board substrate can be made into two independent flexible circuit boards - ID 'the flexible circuit board substrate · including the first transmission area 210, the second transmission area 22 (), the third transmission area and the fourth transmission area 240. The first transmission region 21 defines a second transmission region—defining a flexible circuit board forming region along the free direction of the flexible circuit board substrate 200: 'same' third transmission region 23 〇 and fourth transmission region 24 〇 soft % The board base; the 12⁄4 200 k-degree direction defines another flexible board forming area. The transmission area 220 is disposed adjacent to the third transmission area 23A. The soft 11 circuit board substrate 2 is placed in the electroplating apparatus 100 for electroplating, usually in the form of a reel-to-roll 11 1355429. The plating apparatus 100 includes a plating tank 110 and a shielding device 120. The plating tank 110 includes a tank body 111 and an anode 112 fixed to an inner wall of the tank body 111. The anode 112 is usually graphite, a soluble plating metal or an insoluble plating metal. The soluble mirror metal includes nickel, gold, etc., and the insoluble plating metal includes ruthenium oxide, titanium-plated platinum, and the like. The shielding device 120 is configured to control the surface of the first transmission region 210, the second transmission region 220, the third transmission region 230, and the fourth transmission region 240 in the electroplating process of the flexible circuit board substrate 200 to form an excessively thick plating layer #metal. Avoid wasting metal plating. According to the structure of the flexible circuit board substrate 200 in the present embodiment, the shielding device 120 includes a first shutter 121, a second shutter 122, and a third shutter 123. The first shutter 121, the second shutter 122, and the third shutter 123 are disposed in parallel above the surface of the flexible circuit board substrate 200 to be plated, and the three shutters are to be surfaced to the flexible circuit board substrate 200 to be plated. The distance between the three shutters is equal to each other, and the vertical distance between the three shutters and the surface to be plated of the flexible circuit board substrate 200 is about 5-20 millimeters. The distance between the three shutters to the surface to be plated of the flexible circuit board substrate 200 is 10 mm. In order to facilitate installation or to make the shielding device 120 integral, the shielding device 120 further includes at least one support rod 124 that laterally connects the first shutter 121, the second shutter 122, and the third shutter 123. The material of the support rod 124 and the first shutter 121, the second shutter 122 and the third shutter 1: 23 may be PI (polyimide), PVC (polyethylene resin), PP (polypropylene), etc. Insulation Materials. The specific connecting method between the support bar 124 and the first shutter 121, the second cover 12 1355429, the plate 122 and the third shutter 123 can be connected by screwing, adhesive bonding or integral molding, etc., in this embodiment, The support rod 124, the first shutter 121, the second shutter 122, and the third shutter 123 are formed into an integrally formed structure by an injection molding method. The first shutter 121 is disposed in parallel with the first transmission region 210 above the surface to be plated of the flexible circuit board substrate 200, and the width L! of the first shutter 121 is greater than or equal to the width of the first transmission region 21〇& That is, in order to meet the requirements of different first transmission regions 21 in the various flexible circuit board substrates 200, the width Li of the first shutter 121 may be 52 mm. In this embodiment, the width of the first shutter 121 is about 5 mm, and the distance between the first shutter 121 and the first transmission region 21 is about 1 mm. In a similar manner, the second shielding plate 122 is disposed in parallel with the adjacent second transmission region 220 and the third transmission region 230 on the surface of the flexible circuit board substrate 2 to be plated, and the second shielding plate 122 The width L2 is equal to or greater than the width of the second transmission region 220 & and the sum of the width & the third transmission region 23, that is, L^S2 + S3. In order to meet the requirements of different second transmission regions 220 and third transmission regions 23〇 in various types of flexible circuit board substrates, the width L2 of the second shielding plate 122 may be 1 〇 40 40 mm. In this embodiment, the width l2 of the second shutter 122 is 1 mm. Similarly, the third shielding plate 123 is disposed in parallel with the fourth transmission region 24〇 above the surface to be plated of the flexible circuit board substrate 200, and the width L3 of the third shielding plate 123 is greater than or equal to the width of the fourth transmission region 24〇. Heart, ie, L0S4. In order to meet the requirements of the structure of the different fourth driving regions 240 in the various flexible circuit board substrates 2, the width b of the third shutter 123 may be 5_2 〇 13 13.55429. In this embodiment, the width L3 of the third shutter 123 is 5 mm. Preferably, the sum of the widths of the first shutter 121 and the second shutter 122' of the third shutter 123 is not greater than the width of the flexible circuit board substrate 200 in order to reduce the space volume of the plating apparatus. - In addition, the shielding device 120 needs to be fixed in the plating of the flexible circuit board 2, and the shielding device 12 can be fixed to the plating tank n0, or can be fixed inside or outside the plating tank 110 by other fixing means. For example, the two opposite inner wall surfaces of the flexible circuit board substrate 2 are respectively provided with at least one fixing block 113, and the fixing block is made of a non-metal material, such as P1. Materials such as imine), PVC (polyethylene vinyl), and PP (polypropylene) are the same materials as the shielding device 12〇. In this embodiment, the two opposite inner walls of the plating tank 110 are respectively provided with a fixing block 113, and the two port blocks 113 are soft: a card slot 114 can be opened in the longitudinal direction of the circuit board substrate 200 for shielding the device 120. The two ends of the support rod 124 are respectively fitted into the card slot 114 to fix the entire shielding device 12: • During the electric clock of the soft circuit board substrate 200, due to the copper layer around the transmission hole in the transmission region The area is relatively large with respect to the line. Therefore, the current density of the copper layer around the transmission hole in the transmission area is large, so that the plating process forms an excessively thick coating on the surface of the copper layer in the transmission area. This will inevitably result in waste of plating materials. The plating apparatus 100 of the present embodiment has a shielding device 120' disposed at a certain distance of the transmission region of the flexible circuit board substrate 200, so that the plating layer can be restricted on the surface of the transmission region by the setting of the distance between the shielding device 12 and the transmission region. The height of the deposit. For example, the first shutter 121 is disposed at a height of 5-20 mm from the surface 14 1355429 of the first transmission region 21, and the second shutter 122 is disposed at a distance from the second transmission region, the domain 220, and the third transmission region. The height of the surface of the 23 〇 5 2 〇 mm, the third visor 123 is disposed at a distance of 52 mm from the surface of the fourth transmission region 24 ,, so that in the electroplating process, due to the first shutter 121, the second The presence of the shutter * I22 and the third shutter 123 can control the thickness of the plated metal plated on the surface of the copper layer of the four transmission regions of the flexible circuit board substrate 200 to avoid waste of the plating metal. In addition, since the material of the shielding device 12 is an insulating substrate, the plating metal is not formed on the shielding device 120 during the electroplating process, thereby avoiding waste of the money layer metal. As shown in FIG. 4, the second embodiment of the present invention provides a plating apparatus 300 for plating a double-sided flexible circuit board substrate 4, and two structures of the double-sided flexible circuit board substrate 400 opposite to a surface to be plated. The structure is basically the same as that of the first, soft circuit board substrate in the embodiment. That is, the double-sided flexible circuit board substrate 4 includes two opposite first transmission regions '41', two opposite first transmission regions 42A, two opposite third transmission regions 430, and two opposite The fourth transmission region 44 is. The first transmission region 41 and the second transmission region 420 are defined along the width direction of the flexible circuit board substrate 400 on the surface to be plated of the double-sided flexible circuit, and a flexible circuit board molding region is also defined. The third transmission region 43A and the fourth transmission region 440 define another flexible circuit board forming region along the width direction of the flexible circuit board substrate 4, and the second transmission region 42A is disposed adjacent to the third transmission region 430. The plating apparatus includes a plating tank 310, a first shielding device 32A, and a second shielding device 330. The plating tank 31 is the same as the plating tank of the first embodiment. The structures of the first shielding device 320 and the second shielding device 330 are the same as those of the shielding device 120 of the first embodiment, and the materials used for the first shielding device 320 and the second shielding device 330 may also be PI, PVC, Insulating substrate such as PP. The first shielding device 320 includes a first shielding plate 321 , a second shielding plate 322 , a third shielding plate 323 , and a first supporting rod 324 connecting the first shielding plate 321 , the second shielding plate 322 , and the third shielding plate 323 . The second shielding device 330 includes a fourth shielding plate 331 opposite to the first shielding plate 321 , a fifth shielding plate 332 opposite to the second shielding plate 322 , and a sixth shielding plate 333 opposite to the third shielding plate 323 . And a second support rod 334 opposite the first support rod 324. The first shielding device 320 and the second shielding device 330 are respectively fixed on two sides of the flexible circuit board substrate 400, and the distance between the first shielding device 320 and the surface of the flexible circuit board substrate 400 to be plated is about 5-20 mm. The distance from the second shielding device 330 to the surface of the other of the flexible circuit board substrates 400 is about 5-20 mm. In this embodiment, the first shielding device 320 and the second shielding device 330 respectively reach a distance cabinet or the like of the surface of the corresponding flexible circuit board substrate 400 to be plated, and both are 10 mm. * In the first shielding device 320 and the second shielding device 330, the widths of the first shutter 321 and the fourth shutter 331 are the same, about 5-20 mm; the width of the second shutter 322 and the fifth shutter 332 The same, about 10-40 mm; the third shutter 323 and the sixth shutter 333 have the same width, about 5-20 mm. In this embodiment, the width of the first shutter 321 and the fourth shutter 331 is 5 mm, the width of the second shutter 322 and the fifth shutter 332 is 10 mm, and the third shutter 323 and the sixth shutter 333 The width is 5 mm. In addition, the structure of the first support bar 324 and the second support bar 334 may be 16 1355429 2 , or may be different, and the first shielding device 32 〇 and the second shielding device 330 冓 第 第 第 第 第 第 第 120 The structure of the first support rod 324 and the second support rod 334 can be fixed in the plating tank 310 in the manner of the shielding device 12 . In addition, the first shielding device 32 〇: the first shielding device 330 can also pass A supporting structure is connected, and the specific connecting method can be integrally formed by screwing, adhesive bonding or the first shielding device 32 and the second shielding device 33. For the plating device 300 of the embodiment, the double-sided softness During the electroplating process of the circuit board substrate 400, the first shielding device 32 and the second shielding device 330 respectively set the respective flexible circuit board substrates 4 (9) at a fixed distance of the transmission area of the surface to be recorded, such as At a height of 5_2 Gm from the surface of the corresponding transmission region, such that in the process of electric ore, due to the presence of the first shielding device 320 and the second shielding device 33, the flexible circuit board The thickness of the plated metal on the surface of the copper layer in the transmission area of the two surfaces of the substrate can be controlled to avoid the waste of the plated metal. In addition, the 'shading device f 32 〇 and the second shielding device i 33 The material of the crucible is an insulating substrate. During the electric ore process, (4) the metal is not formed on the first shielding device 320 and the second shielding device 33, thereby avoiding waste of the metal of the ore layer. As shown in FIG. The third embodiment of the present invention provides a key device 500' for performing a key on a single-sided flexible circuit board substrate. _, and a width of the single-sided flexible circuit board substrate 6 can be used to fabricate an independent flexible circuit board. Therefore, the single-sided soft-circuit board substrate_ includes a first region (10) and a second transmission region 620, the first transmission region 61〇 and the second; 17 1355429. The region 620 defines a softness along the width direction of the flexible circuit board substrate 600. a circuit board forming area. The structure of the plating apparatus 500 is substantially the same as that of the electric recording apparatus 100 of the first embodiment, except for the shielding apparatus 520. The shielding apparatus 520 includes a first shutter 521, a second shutter 522, and Connection first The shielding plate 521 and the supporting rod 523 of the second shielding plate 522. The shielding device 520 is made of an insulating material, and the first shielding plate 521, the second shielding plate 522, and the support rod 523 are formed by the injection molding method to form the shielding device 52 of the integrally formed structure. The first shutter 521 and the second shutter 522 are fixed on the plating groove 51, and the first shutter 521 and the second shutter 522 are respectively perpendicular to the surface to be plated of the single-sided flexible circuit board substrate 600. The distance is 5 mm. The first shutter is opposite to the first transmission region 610, and the first shutter 521 has the same width as the first transmission region 610, both of which are 5 mm. The second shutter 522 and the second transmission region 620 is oppositely disposed, and the second shutter 522 and the second transmission region 620 are the same as I degree 'all 5 mm c_ κ %. In the plating apparatus, the shielding device is different according to the structure of the circuit board to be plated. The number of shutters will vary accordingly. When the circuit board substrate to be charged can accommodate three or more in a width direction: a single circuit board, since each circuit board is defined by two transmission regions, the circuit board substrate at this time There are six transmission zones on the top, and there are two pairs of adjacent transmission zones, that is, on the basis of the second embodiment, the adjacent transmission pure domain is added, so that the number of the shielding plates in the shielding device is the same. A further visor for shielding the transmission area is added to the second embodiment. ^ In summary, the invention has been in compliance with the requirements of the invention patent, and the patent application is filed according to law 18 1355429. However, the above description is only a preferred embodiment of the present invention, and it is not possible to limit the scope of the patent application of the present invention. Equivalent modifications or variations made by persons skilled in the art in light of the present invention are intended to be included within the scope of the following claims. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing the structure of a plating apparatus according to a first embodiment of the present technical solution. 2 is a plan view of a plating apparatus according to a first embodiment of the present technical solution. Figure 3 is a cross-sectional view taken along line III-III of Figure 2; Figure 4 is a cross-sectional view showing a plating apparatus of a second embodiment of the present technical solution. Figure 5 is a cross-sectional view showing a plating apparatus of a third embodiment of the present technical solution. [Main: description of component symbols] Electroplating apparatus 100, 300, 500 plating tank. 110, 310 tank 111 anode 112 fixed block 113 card slot 114 shielding device 120, 520 first shutter 121, 321, 521 second shutter 122 '322, 522 third shutter 123, 323 support rod 124, 523 19 13.55429 flexible circuit board substrate 200, 400, 600 first transmission area 210, 410, 610 second transmission area 220, 420, 620 third transmission area 230 430 fourth transmission area 240, 440 first shielding device 320 first support rod 324 second shielding device 330 fourth shutter 331 fifth shutter 332 sixth shutter 333 second support rod 334 20