CN101018449A - Ceramic substrate - Google Patents
Ceramic substrate Download PDFInfo
- Publication number
- CN101018449A CN101018449A CN 200710006710 CN200710006710A CN101018449A CN 101018449 A CN101018449 A CN 101018449A CN 200710006710 CN200710006710 CN 200710006710 CN 200710006710 A CN200710006710 A CN 200710006710A CN 101018449 A CN101018449 A CN 101018449A
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- Prior art keywords
- hole
- bore
- small
- ceramic substrate
- wiring pattern
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Abstract
The invention provides a compacted ceramic substrate. It escapes the small aperture state to form wiring pattern when the wiring pattern is formed in the lamination with the connection of the small aperture. It obtains densification of the wiring pattern in the lamination and miniaturization of the ceramic wafer so as to get a cheap ceramic wafer.
Description
Technical field
The present invention relates to the respond well ceramic substrate of use in various electronic equipments and electronic circuit cell etc.
Background technology
At first existing ceramic substrate view is described, Fig. 4 is the profile of the major part of existing ceramic substrate, Fig. 5 is the key diagram of the manufacture method of the existing ceramic substrate of expression, below, in conjunction with Fig. 4 the structure of existing ceramic substrate is described, ceramic substrate 51 is formed by multi-disc ceramic thin plate 52 laminations.
This ceramic thin plate 52 is provided with and forms round table-like hole 53, such shown in the upper portion (the 1st structure) of Fig. 4, be positioned at top in the small-bore that makes hole 53, the large aperture in hole 53 is positioned under the state of bottom, forms in a plurality of holes 53 on the above-below direction and interconnects (hole 53 is configured on the same direction), constitutes through hole (via) 54 thus, in addition, as as described in the following quadrate part (the 2nd structure) of Fig. 4, be interconnected with one another in the large aperture of lamination endoporus 53, constitute through hole 54 thus.
Then, peripheral part in the hole 53 of the ceramic thin plate 52 that is positioned at topmost and foot is provided with terminal pad (land) portion 55, and in the through hole 54 that forms by hole 53, be provided with conductor (not shown), form existing ceramic substrate (for example with reference to patent documentation 1) thus.
Manufacture method with ceramic substrate of such structure, as shown in Figure 5, on supporting station 57, place the sheet billet (green sheet) 56 that is used to form ceramic thin plate 52, the drift 58 that is configured on the sheet billet 56 is moved downwards, on sheet billet 56, form hole 53.
So as shown in Figure 5, hole 53 becomes in the aperture of the inserting surface side of drift 58 little, in the big round table-like hole 53, aperture of the face of the going out side of drift 58.
Then, though at this not shown (with reference to Fig. 4), but in upper side, so that the small-bore in hole 53 is positioned at top, the large aperture in hole 53 is positioned at the state of bottom, lamination multi-disc sheet billet 56, in addition, in lower side, the state lamination multi-disc sheet billet 56 that is interconnected with one another with the large aperture in the hole in the lamination 53, carry out sintering then, thereby manufacture existing ceramic substrate 51 (for example with reference to patent documentation 1).
No. 2546455 communique of [patent documentation 1] special permission
But, existing ceramic substrate is owing to be to be configured in state on the same direction with the small-bore in hole 53 and large aperture, the 1st structure with multi-disc ceramic thin plate 52 laminations, so the 1st is constructed to the state that has large aperture and small-bore between same lamination, in addition, owing to be the 2nd structure that the large aperture in hole 53 is interconnected with one another in the lamination, so the 2nd be constructed to and between same lamination, have large aperture state each other.
Therefore, in the 1st, the 2nd structure, between each lamination, there is the large aperture in hole 53, when between lamination, forming wiring pattern, need wiring pattern be set, therefore, exist the problem that ceramic substrate is maximized to avoid wide-aperture state.
Summary of the invention
The present invention is in view of the practical problem of such prior art and propose, and its objective is provides a kind of small-sized, cheap ceramic substrate.
To achieve the above object, the invention is characterized in, have: the ceramic thin plate of multi-disc lamination; Be located at the round table-like hole that forms on the ceramic thin plate; The through hole that a plurality of holes is connected on above-below direction and be provided with; With the conductor that is located in this through hole, a plurality of ceramic thin plates overlap each other by the face side with the small-bore in hole, have formed small-bore through hole connected to one another in lamination.
The present invention of Gou Chenging like this, under situation about wiring pattern being formed between the lamination connected to one another of small-bore, as long as form wiring pattern with the state of avoiding the small-bore, thereby can realize the densification of the wiring pattern in the lamination, miniaturization with ceramic substrate, and along with its miniaturization, can reduce fee of material, obtain cheap ceramic substrate.
In addition, of the present invention other are characterised in that, in foregoing invention, are provided with wiring pattern on the lamination at place each other in the small-bore.
The present invention of Gou Chenging like this, because wiring pattern is set at the small-bore each other on the lamination at place, thus can form wiring pattern with state near the small-bore, thus can realize highdensity wiring.
In addition, of the present invention other are characterised in that in foregoing invention, the small-bore is located at the outer surface of the ceramic substrate that is positioned at topmost, and is provided with wiring pattern at the outer surface of the ceramic thin plate that is positioned at topmost.
The present invention of Gou Chenging like this can increase the area of the upper surface of ceramic substrate, thereby can form wiring pattern easily, carries out highdensity wiring.
In addition, of the present invention other are characterised in that, in foregoing invention, the small-bore each other with the setting that adjoined each other of a plurality of through holes that the large aperture is positioned at different laminations each other, each other between the through hole at place, be provided with wiring pattern in the small-bore.
The present invention of Gou Chenging like this can form wiring pattern, thereby can realize the miniaturization of ceramic substrate between the through hole of position each other, small-bore.
In addition, of the present invention other are characterised in that, in foregoing invention, are provided with the terminal pad portion that is made of electric conducting material in small-bore and wide-aperture periphery, this terminal pad portion is connected with conductor, and is provided with wiring pattern between the terminal pad portion between the through hole at place each other in the small-bore.
The present invention of Gou Chenging like this, existence based on terminal pad portion, can constitute being connected of wiring pattern and conductor between the lamination, and can between the terminal pad portion between the through hole of position each other, small-bore, form wiring pattern, thereby can realize the miniaturization of ceramic substrate.
(invention effect)
The present invention is under situation about wiring pattern being formed between the lamination connected to one another of small-bore, as long as form wiring pattern with the state of avoiding the small-bore, thereby can realize the densification of the wiring pattern in the lamination, miniaturization with ceramic substrate, and along with its miniaturization, can reduce fee of material, obtain cheap ceramic substrate.
Description of drawings
Fig. 1 is the major part profile of the 1st embodiment of ceramic substrate of the present invention.
Fig. 2 is the major part profile of the 2nd embodiment of ceramic substrate of the present invention.
Fig. 3 is the key diagram of the manufacture method of expression ceramic substrate of the present invention.
Fig. 4 is the major part profile of existing ceramic substrate.
Fig. 5 is the key diagram of the manufacture method of the existing ceramic substrate of expression.
Among the figure: the 1-ceramic substrate; The 2-ceramic thin plate; The 3-hole; The 4-through hole; The 5-wiring pattern; 6-terminal pad portion; The 7-conductor; The 8-sheet billet; The 9-supporting station; The 10-drift.
Embodiment
Below, with reference to accompanying drawing embodiments of the present invention are described, Fig. 1 is the major part profile of the 1st embodiment of ceramic substrate of the present invention, Fig. 2 is the major part profile of the 2nd embodiment of ceramic substrate of the present invention, and Fig. 3 is the key diagram of the manufacture method of expression ceramic substrate of the present invention.
Below, in conjunction with Fig. 1 the structure of the 1st embodiment of ceramic substrate of the present invention being described, ceramic substrate 1 is by LTCC formations such as (LTCC), for example by multi-disc (4) ceramic thin plate 2a～2d lamination is formed.
Be provided with on this ceramic thin plate 2a～2d and form round table-like hole 3, this hole 3 connects on above-below direction mutually, forms through hole (state that a plurality of holes 3 are connected) 4, and it is adjacent one another are to form a plurality of through hole 4.
In addition, the round table-like hole 3 that is that is located on ceramic thin plate 2a～2d forms the one side side that its small-bore is positioned at ceramic thin plate 2a～2d, and the large aperture is positioned at the state of another side side.
And, ceramic thin plate 2a～2d for example with upper surface side as benchmark, the small-bore and the large aperture in hole 3 are alternately overlapped, promptly overlap into following state, the small-bore in hole 3 of ceramic thin plate 2a that is positioned at topmost is at upper surface (outer surface), the large aperture in the hole 3 of the 2nd layer ceramic thin plate 2b is being positioned at the upper surface of lamination, the small-bore in the hole 3 of the 3rd layer ceramic thin plate 2c is being positioned at the upper surface of lamination, and the large aperture in the hole 3 of the 4th layer ceramic thin plate 2d is being positioned at the upper surface of lamination.
Its result, form through hole 4 with following state, promptly, the small-bore in hole 3 is in the outer surface side of the ceramic thin plate 2a, the 2d that are positioned at topmost and foot, in addition, the large aperture in hole 3 interconnects at above-below direction each other, and between ceramic thin plate 2a, the 2b and between the lamination between ceramic thin plate 2c, the 2d, and, the small-bore in hole 3 each other interconnect on the above-below direction between the lamination between ceramic thin plate 2b, the 2c.
Wiring pattern 5 is set between each lamination of the upper surface (upper surface of ceramic thin plate 2a) of ceramic substrate 1 and lower surface (lower surface of ceramic thin plate 2d), and is set at the upper surface (upper surface of ceramic thin plate 2a) and the lower surface (ceramic thin plate 2d's is following) of ceramic substrate that the terminal pad portion 6 that is made of electric conducting material is positioned at the peripheral part in hole 3.
Promptly, upper surface side at ceramic substrate 1, form wiring pattern 5 and be set between the terminal pad portion 6 of (between the position, small-bore) between the through hole 4, and the position beyond between this terminal pad portion 6, the state that wiring pattern 5 and terminal pad portion 6 are connected aptly.
In addition, in the lamination of ceramic substrate 1, wiring pattern 5 is set between the through hole 4 that the small-bore is connected with each other (between the position, small-bore), and the position (not shown here) beyond between this through hole 4.
And, lower face side at ceramic substrate 1, form wiring pattern 5 and be set between the terminal pad portion 6 of (between the position, small-bore) between the through hole 4, and the position (not shown here) beyond between this terminal pad portion 6, the state that wiring pattern 5 and terminal pad portion 6 are connected aptly.
In addition, conductor 7 is made of silver paste etc., is filled to be arranged in the through hole 4, and the terminal pad portion 6 that will be positioned at ceramic substrate 1 upper and lower surface by this conductor 7 connects, thereby the wiring pattern 5 of upper-lower position is connected.
Such ceramic substrate 1 though illustrate at this, is in fact installed various electronic devices in upper surface side, forms desired circuit, and lower face side becomes the installed surface of mother substrate, is connected with electronic equipment.
In addition, Fig. 2 represents the 2nd embodiment of ceramic substrate of the present invention, if the 2nd embodiment is described, then between ceramic thin plate 2a and 2b, between 2b and the 2c, and the hole between 2c and the 2d 3 around be provided with the terminal pad portion 6 that constitutes by electric conducting material that is connected aptly with wiring pattern 5, these terminal pad portions 6 are by conductor 7 connections.
In addition, be located between ceramic thin plate 2a and the 2b, terminal pad portion 6 around the hole 3 between 2c and the 2d, owing to be the position, large aperture, so the profile of terminal pad portion 6 is big, in addition, be located at the hole 3 terminal pad portion 6 on every side between ceramic thin plate 2b and the 2c, owing to be the position, small-bore, so the profile of terminal pad portion 6 is little.
Therefore, in adjoining each other between the through hole 4 that is provided with, between the terminal pad portion 6 of position, large aperture, can not obtain the formation space of wiring pattern 5, but between the terminal pad portion 6 of position, small-bore, can guarantee the formation space of wiring pattern 5, therefore be formed with wiring pattern 5.
Other structure has structure same as the previously described embodiments, the symbol identical to identical parts mark, and omit its explanation at this.
In addition, in the above-described embodiments, illustrated that ceramic thin plate is 4 situation, self-evident, as long as the ceramic thin plate of use more than 2.
Manufacture method with ceramic substrate of such structure as shown in Figure 3, is placed on the sheet billet 8 that is used to form ceramic thin plate 2 on the supporting station 9, and the drift 10 that is configured on the sheet billet 8 is moved downwards, forms hole 3 on sheet billet 8.
So as shown in Figure 3, hole 3 is little in the aperture of the inserting surface side of drift 10, big in the aperture of the face of the going out side of drift 10, formed round table-like hole 3.
In addition, though not shown here, on sheet billet 8 to wait the state formed wiring pattern 5 and terminal pad portion 6 to carry out the formation in hole 3 by printing in advance.
Then, though at this not shown (with reference to Fig. 1,2), but on the sheet billet 8 that is used to form ceramic thin plate 2a, make the small-bore in hole 3 be positioned at top, and, on the sheet billet 8 that is used to form ceramic thin plate 2b, make the large aperture in hole 3 be positioned at top conversely, and on the sheet billet 8 that is used to form ceramic thin plate 2c, make the small-bore in hole 3 be positioned at top, and, on the sheet billet 8 that is used to form ceramic thin plate 2d, make the large aperture in hole 3 be positioned at top conversely, lamination multi-disc sheet billet 8 under such state.
At this moment, the hole 3 of sheet billet 8 interconnects on above-below direction each other by making the large aperture, and the small-bore is interconnected on above-below direction each other, form through hole 4, in this through hole 4, fill conductor 7 then, carry out sintering afterwards, produce ceramic substrate 1 of the present invention thus.
Claims (5)
1. a ceramic substrate is characterized in that,
Have: the ceramic thin plate of multi-disc lamination; Be located at the round table-like hole that forms on the described ceramic thin plate; The through hole that a plurality of described holes is connected on above-below direction and be provided with; With the conductor that is located in this through hole, a plurality of described ceramic thin plates overlap each other by the face side with the small-bore in described hole, have formed described small-bore described through hole connected to one another in lamination.
2. ceramic substrate according to claim 1 is characterized in that,
The lamination at place is provided with wiring pattern each other in described small-bore.
3. ceramic substrate according to claim 2 is characterized in that,
Described small-bore is located at the outer surface of the described ceramic substrate that is positioned at topmost, and is provided with described wiring pattern at the outer surface of the described ceramic thin plate that is positioned at topmost.
4. according to claim 2 or 3 described ceramic substrates, it is characterized in that,
Described small-bore each other with the setting that adjoined each other of a plurality of described through hole that the large aperture is positioned at different laminations each other, each other between the described through hole at place, be provided with described wiring pattern in described small-bore.
5. ceramic substrate according to claim 4 is characterized in that,
Be provided with the terminal pad portion that is made of electric conducting material in described small-bore and described wide-aperture periphery, this terminal pad portion is connected with described conductor, and each other between the described terminal pad portion between the described through hole at place, is provided with described wiring pattern in described small-bore.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006028561 | 2006-02-06 | ||
| JP2006028561A JP2007208193A (en) | 2006-02-06 | 2006-02-06 | Ceramic substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101018449A true CN101018449A (en) | 2007-08-15 |
Family
ID=38487362
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200710006710 Pending CN101018449A (en) | 2006-02-06 | 2007-02-02 | Ceramic substrate |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2007208193A (en) |
| CN (1) | CN101018449A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9907164B2 (en) | 2010-12-24 | 2018-02-27 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101154720B1 (en) * | 2010-12-24 | 2012-06-08 | 엘지이노텍 주식회사 | The printed circuit board and the method for manufacturing the same |
| TWI542260B (en) | 2010-12-24 | 2016-07-11 | Ｌｇ伊諾特股份有限公司 | Printed circuit board and method for manufacturing the same |
| DE112020004962T5 (en) * | 2019-11-14 | 2022-06-30 | Murata Manufacturing Co., Ltd. | CIRCUIT BOARD AND METHOD OF MAKING A CIRCUIT BOARD |
-
2006
- 2006-02-06 JP JP2006028561A patent/JP2007208193A/en not_active Withdrawn
-
2007
- 2007-02-02 CN CN 200710006710 patent/CN101018449A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9907164B2 (en) | 2010-12-24 | 2018-02-27 | Lg Innotek Co., Ltd. | Printed circuit board and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2007208193A (en) | 2007-08-16 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Open date: 20070815 |