CN1010108B - 电沉积抗电侵蚀复合银层的方法 - Google Patents

电沉积抗电侵蚀复合银层的方法

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Publication number
CN1010108B
CN1010108B CN 85102279 CN85102279A CN1010108B CN 1010108 B CN1010108 B CN 1010108B CN 85102279 CN85102279 CN 85102279 CN 85102279 A CN85102279 A CN 85102279A CN 1010108 B CN1010108 B CN 1010108B
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China
Prior art keywords
silver
plating layer
compound
grams per
per liter
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Expired
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CN 85102279
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English (en)
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CN85102279A (zh
Inventor
郭鹤桐
唐志远
王兆勇
姚素薇
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Tianjin University
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Tianjin University
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Priority to CN 85102279 priority Critical patent/CN1010108B/zh
Publication of CN85102279A publication Critical patent/CN85102279A/zh
Publication of CN1010108B publication Critical patent/CN1010108B/zh
Expired legal-status Critical Current

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Abstract

采用复合电沉积的方法,在铜或其他金属基体上沉积一层以银为主,含有占镀层体积0.1-2%,粒径为0.5-20微米的氧化镧微粒。这种复合银镀层具有较高的显微硬度,HV达90-100,比纯银高得多的耐磨性和耐电浸蚀性,电气性能与纯银相近,用来作电触点的表面层可以节约50-85%的白银。

Description

本发明涉及一种电沉积抗电浸蚀复合银层的方法。
目前,一般家用电器及小电流低压器上的电触点均采用纯银,银合金或铜基复银材料制造,这种制造方法耗银量大,而且纯银的硬度低(HV为50),不耐磨,不耐电浸蚀,银合金虽然硬度较高,但电性能稍差,复银触点的制作工艺和设备均较复杂。
自本世纪六十年代以来,复合电沉积技术得到迅速发展,经机检WPI1970-1984年的全部专利,未发现有关电沉积方法制造Ag-La2O3电触点的报导。
本发明的特点是采用复合电沉积的方法在铜或基它金属基体上沉积一层具有抗电浸蚀,耐磨的复合镀银层来制作电触点,这种复合镀银层中弥散有占镀层体积0.1-2%的,具有抗电浸蚀及耐磨性能的氧化镧微粒,粒径在0.5-2%微米之间,这种复合镀层作为电触点的表面层具有优良的电性能,其电阻率及接触电阻与纯锡相近,但耐电浸蚀性、耐磨性及显微硬度均比纯银提高很多,HV达到90-100,100微米厚的这种复合镀银层触点在电压220V,电流5A,功率因数在0.6以上时,开关寿命在5万次以上,与纯银触点相比,采用在铜制触点上电沉积复合镀银层可节约白银50-85%。有明显的社会效益和经济效益。
本发明的复合镀银工艺条件如下:
氯化银35-40克/升
氰化钾65-80克/升
氧化镧微粒(粒径<5微米)0.1-50克/升
镀液温度15-30℃
阴极电流密度0.1-1安/分米2
阳极为纯限板,镀液靠机械搅拌或镀液循环使微粒充分悬浮。
采用本发明的复合镀银工艺,根据需要可获得厚度10-200微米的复合银镀层。

Claims (1)

1、一种电沉积抗电浸蚀的复合银层的方法,其特征在于镀液中含有:氯化银35-40克/升;氰化钾65-80克/升;氧化镧微粒(粒径<5微米)0.1-50克/升;镀液温度15-30℃,阴极电流密度0.1-1安/分米2;阴极为纯银板,靠机械搅拌或镀液循环使微粒在镀液循环中充分悬浮,所得到的复合镀银层中弥散有占镀层体积0.1-2%的氧化镧微粒。
CN 85102279 1985-04-01 1985-04-01 电沉积抗电侵蚀复合银层的方法 Expired CN1010108B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN 85102279 CN1010108B (zh) 1985-04-01 1985-04-01 电沉积抗电侵蚀复合银层的方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN 85102279 CN1010108B (zh) 1985-04-01 1985-04-01 电沉积抗电侵蚀复合银层的方法

Publications (2)

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CN85102279A CN85102279A (zh) 1987-07-29
CN1010108B true CN1010108B (zh) 1990-10-24

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CN 85102279 Expired CN1010108B (zh) 1985-04-01 1985-04-01 电沉积抗电侵蚀复合银层的方法

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1326191C (zh) 2004-06-04 2007-07-11 复旦大学 用印刷电路板构建的离子阱质量分析仪
CN110923785B (zh) * 2019-12-11 2022-04-22 哈尔滨东大高新材料股份有限公司 共沉积制备断路器用银合金/铜合金复合触头材料的方法

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