CN100586249C - Pressing base board bar - Google Patents
Pressing base board bar Download PDFInfo
- Publication number
- CN100586249C CN100586249C CN200610127542A CN200610127542A CN100586249C CN 100586249 C CN100586249 C CN 100586249C CN 200610127542 A CN200610127542 A CN 200610127542A CN 200610127542 A CN200610127542 A CN 200610127542A CN 100586249 C CN100586249 C CN 100586249C
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- China
- Prior art keywords
- base board
- plating line
- hole
- slotted eye
- pressing
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Abstract
A stamped substrate strip includes a plurality of substrate units and has a plurality of grooves and at least one electroplated wires assembling hole. The grooves are formed at the circumference of the substrate unit; the electroplated wires assembling hole is formed on the outer side of the substrate unit; the substrate strip is provided with a plurality of connecting pads in the substrate units as well as a plurality of first electroplated wires and at least one second electroplated wire connected to the connecting pads; the first electroplated wires have a plurality of first broken circuit ends positioned in the grooves; the second electroplated wire passes among the grooves and has a second broken circuit end positioned in the electroplated wires assembling hole to provide more drawing space for the electroplated wires.
Description
Technical field
The present invention relates to a kind of pressing base board bar (punch type substrate strip), particularly relate to a kind of pressing base board bar that after plating, can increase plating line trip point configuration space.
Background technology
Existing pressing base board bar includes the base board unit of a plurality of one combinations, described base board unit is as chip carrier, for making various IC circuit packing structure or integrated circuit die block structure, separate described IC circuit packing structure or integrated circuit die block structure with punching press (punch) mode singulation again.Because IC circuit packing structure microminiaturization, therefore make that the configuration density of described base board unit is more and more intensive, make that relatively the space of configuration is more and more littler, if directly change the internal wiring structure of described base board unit, then can influence cost or dielectric layer bond strength that the electrical propagation function, electric screen function, the circuit number of plies of described base board unit increase.For fear of the internal wiring structure of the described base board unit of change, therefore should focus on the improvement in substrate strip dual-side rail space, otherwise can have influence on the original design framework of final products.
TaiWan, China patent certificate I246380 number " manufacture method of printed circuit board (PCB) " discloses a kind of method that conductive finger is opened circuit, one plating line connects the electroplating busbar line (plating bus) that a ground connection/power line to is positioned at the substrate periphery district earlier, connect this ground connection/power line to conductive finger with a connecting line (can be considered the line segment of setting up of plating line) in addition, form welding resisting layer afterwards and appear this connecting line especially, the mode that covers this connecting line with patterning is electroplated this conductive finger, can remove this connecting line by etching mode afterwards, reach between this conductive finger and this electroplating busbar line and electrically open circuit, can prevent that this lead of electrostatic discharge damage from referring to or the internal wiring of its connection.Its district that opens circuit promptly is this connecting line, and is positioned at this substrate inside, thus changed the internal wiring design of this substrate, and fabrication steps increases.In addition, printed circuit board (PCB) there is no slotted hole structure and is not suitable for pressing base board bar.
In addition, TaiWan, China patent announcement No. 479334 " the plating circuit processing procedure in the sphere grid several-group type chip-packaging structure " discloses in addition a kind of plating line breaking method, it promptly discloses a kind of pressing base board bar in the prior art, the plating line of a plurality of connection conductive fingers is connected to a plating bus that is positioned at outside, base board unit district respectively, after electroplating, form a long and narrow slotted eye, this slotted eye forms the position in alignment with this plating bus, to remove this plating bus, with the described plating line that opens circuit, make described plating line for electrically independent respectively.It is the length that is subject to slotted eye that yet the configuration of most plating line forms the position.
As shown in Figure 1, a kind of existing pressing base board bar 1 comprises a plurality of base board units 10.And this pressing base board bar 1 has a plurality of slotted eyes 20, and described slotted eye 20 is formed at the periphery of described base board unit 10, is beneficial to die-cut.This substrate strip 1 is provided with a plurality of connection gasket 11 of described base board unit 10 and plating lines 12 of the described connection gasket 11 of a plurality of connection of being positioned at, and a plurality of end points 12A that open circuit of described plating line 12 are positioned at an inboard long limit 21 of described slotted eye 20.When the plating line configuration space was not enough, a plurality of side direction connected the inboard minor face 22 that plating line 13 extends to described slotted eye 20, and described plating line 13 also has a plurality of end points 13A that open circuit that are positioned at this inboard minor face 22.Because these inboard minor face 22 width of this slotted eye 20 are limited, can dispose the limited amount of the described end points 13A that opens circuit, therefore can't provide the pull out extension of more space as intensive plating line.
Summary of the invention
Main purpose of the present invention is to provide a kind of pressing base board bar.
For realizing described purpose, the present invention comprises a plurality of base board units and has a plurality of slotted eyes and at least one plating line compiles the hole or plating line compiles breach, described slotted eye is formed at the periphery of described base board unit, this plating line compiles the hole and is positioned at the described base board unit outside, the plating line of part can compile hole/plating line toward this plating line and compile breach and extend and have one and be positioned at this plating line and compile the end points that opens circuit that hole/plating line compiles breach, so that more plating line drawing space to be provided, increase plating line trip point configuration space, with the spacing or the too intensive problem of solution plating line of diffusion plating line.
A kind of pressing base board bar that the invention provides can enlarge the spacing of described plating line or solve the too intensive problem of plating line.
The present invention's purpose feature and advantage will be elaborated in conjunction with the accompanying drawings with embodiment.
Description of drawings
Fig. 1 shows the local enlarged diagram at its plating line position for existing pressing base board bar.
Fig. 2 is the schematic diagram according to a kind of pressing base board bar of first specific embodiment of the present invention.
Fig. 3 shows that for this pressing base board bar according to first specific embodiment of the present invention its plating line compiles the local enlarged diagram in hole.
Fig. 4 shows the local enlarged diagram at its plating line position for the another kind of pressing base board bar according to second specific embodiment of the present invention.
Embodiment
In one first specific embodiment of the present invention, as shown in Figure 2, disclosed a kind of pressing base board bar 100, it comprises a plurality of base board units 110, described base board unit 110 as chip bearing member to make various IC circuit packing structure or module structure.And, this pressing base board bar 100 has a plurality of slotted eyes 120 and compiles hole 130 with at least one plating line, wherein, described slotted eye 120 is formed at the periphery of described base board unit 110, so that described base board unit 110 can see through the singulation separation easily of die-cut mode behind encapsulation procedure or module processing procedure.Described slotted eye 120 can be strip hole, L shaped hole or ㄇ shape hole, and in the present embodiment, described slotted eye 120 is the strip slotted eye.This plating line compiles hole 130 and is positioned at outside the described base board unit 110, promptly is positioned at the garbage area of this substrate strip 100.In the present embodiment, this plating line compiles wherein at least one corner that hole 130 can be close to described base board unit 110.In addition, definable has an adhesive area 115 in each base board unit 110, wherein corner at each base board unit 110 is formed with metal notes cast gate 150, this metal is annotated cast gate 150 and is extended to this adhesive area 115, being beneficial to mould adhesive body (figure does not draw) can be formed on this adhesive area 115 via this metal notes cast gate 150, and annotate cast gate 150 demoulding easily by this, can not damage the line construction of described base board unit 110 inside.
As shown in Figure 3, in described base board unit 110, this substrate strip 100 is provided with first plating line 112 and at least one second plating line 113 of a plurality of connection gaskets 111 and the described connection gasket 111 of a plurality of connection.Because it is that this plating step forms afterwards that described slotted eye 120 compiles hole 130 with this plating line, therefore described connection gasket 111 has been formed with an electroplated metal layer.In addition, in the present embodiment, this substrate strip 100 is provided with a plurality of plated-through-holes 114 in addition, with electrically connect described connection gasket 111 to these substrate strip 100 another surperficial ball pads or outside connection pad (figure do not draw), described plated-through-hole 114 also electrically connects with described first plating line 112 or with this second plating line 113.
Described first plating line 112 has a plurality of first of described slotted eye 120 end points 112A that open circuit that are positioned at, and in the present embodiment, the described first end points 112A that opens circuit is arranged in the wherein inboard long limit of described slotted eye 120.Between the described slotted eye 120 of these second plating line, 113 extend throughs and have one and be positioned at this plating line and compile second of the hole 130 end points 113A that opens circuit.In the present embodiment, the zone definitions of this substrate strip 100 between described slotted eye 120 is a pressing part 121, and this second plating line 113 is by described pressing part 121.Because, described first plating line 112 has the described first end points 112A that opens circuit, this second plating line 113 has this second end points 113A that opens circuit, and described first end points 112A and this second end points 113A that opens circuit that opens circuit lays respectively at described slotted eye 120 and compiles in the hole 130 with plating line, therefore can avoid producing Electrostatic Discharge when this substrate strip 100 of transportation and damages this substrate strip 100.In addition, compile hole 130 by this plating line and compile second of this second plating line 113 end points 113A that opens circuit, can make the pitch enlargement of described plating line maybe can solve the too intensive problem of plating line.In addition, in the present embodiment, as Fig. 2, shown in Figure 3, this substrate strip 100 has a plurality of location holes 140, in a process work bench, be beneficial to transport this substrate strip 100 for this substrate strip 100 of location, and this plating line compiles hole 130 and is adjacent to a wherein location hole 140.
The present invention's this plating line in first specific embodiment compiles hole 130 except can be the through hole kenel, in different embodiment, also can be the shape of gap slot.
In one second specific embodiment of the present invention, as shown in Figure 4, other has disclosed a kind of pressing base board bar 200, and it comprises a plurality of base board units 210, and this pressing base board bar 200 has a plurality of slotted eyes 220 and compiles breach 230 with at least one plating line.Described slotted eye 220 is formed at the periphery of described base board unit 210, is beneficial to die-cut mode singulation and separates.In the present embodiment, described slotted eye 220 is L shaped slotted eye 220.This plating line compiles breach 230 and is positioned at side outside the described base board unit 210, and its notch geometry can be U-shaped or circular arc.In described base board unit 210, this substrate strip 200 is provided with a plurality of first plating lines 211 and at least one second plating line 212, described first plating line 211 is connected to suitable connection gasket or plated-through-hole with this second plating line 212, is beneficial to form an electroplated metal layer in the metal surface of connection gasket before forming described slotted eye 220.Described first plating line 211 has a plurality of first of described slotted eye 220 end points 211A that open circuit that are positioned at, between the described slotted eye 220 of these second plating line, 212 extend throughs and have one and be positioned at this plating line and compile second of the breach 230 end points 212A that opens circuit, to avoid producing Electrostatic Discharge when this substrate strip 200 of transportation.Therefore, compile breach 230 by this plating line and compile second of this second plating line 212 end points 212A that opens circuit, the more plating line space that is pulled can be provided, with the spacing that enlarges plating line or solve the too intensive problem of plating line.
The above only is the present invention's preferred embodiment wherein, is not to be used for limiting practical range of the present invention; Be that all equalizations of doing according to claim of the present invention change and modification, be all claim of the present invention and contain.
Claims (10)
1, a kind of pressing base board bar, it is characterized in that, comprise a plurality of base board units and have a plurality of slotted eyes and at least one plating line compiles the hole, described slotted eye is formed at the periphery of described base board unit, this plating line compiles the outside that the hole is positioned at described base board unit, this substrate strip is provided with a plurality of connection gasket of each base board unit and first plating line and at least one second plating line of the described connection gasket of a plurality of connections of being positioned at, described first plating line has a plurality of first of described slotted eye end points that open circuit that are positioned at, between the described slotted eye of this second plating line extend through and have one and be positioned at this plating line and compile second of the hole end points that opens circuit.
2, pressing base board bar as claimed in claim 1 is characterized in that, this substrate strip part between described slotted eye is defined as a pressing part, and this second plating line is by described pressing part.
3, pressing base board bar as claimed in claim 1 is characterized in that, other has a plurality of location holes, is adjacent to one of them this location hole and this plating line compiles the hole.
4, pressing base board bar as claimed in claim 1 is characterized in that, described connection gasket is formed with an electroplated metal layer.
5, pressing base board bar as claimed in claim 1 is characterized in that, described slotted eye is strip hole, L shaped hole or ㄇ shape hole.
6, a kind of pressing base board bar, it is characterized in that, comprise a plurality of base board units and have a plurality of slotted eyes and at least one plating line compiles breach, described slotted eye is formed at the periphery of described base board unit, this plating line compiles breach and is positioned at the described base board unit outside, this substrate strip is provided with a plurality of connection gasket of each base board unit and first plating line and at least one second plating line of the described connection gasket of a plurality of connections of being positioned at, described first plating line has a plurality of first of described slotted eye end points that open circuit that are positioned at, between the described slotted eye of this second plating line extend through and have one and be positioned at this plating line and compile second of the breach end points that opens circuit.
7, pressing base board bar as claimed in claim 6 is characterized in that, this substrate strip part between described slotted eye is defined as a pressing part, and this second plating line is by described pressing part.
8, pressing base board bar as claimed in claim 6 is characterized in that, described connection gasket is formed with an electroplated metal layer.
9, pressing base board bar as claimed in claim 6 is characterized in that, described slotted eye is strip hole, L shaped hole or ㄇ shape hole.
10, pressing base board bar as claimed in claim 6 is characterized in that, what this plating line compiled breach is shaped as U-shaped or circular arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610127542A CN100586249C (en) | 2006-09-12 | 2006-09-12 | Pressing base board bar |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610127542A CN100586249C (en) | 2006-09-12 | 2006-09-12 | Pressing base board bar |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101146403A CN101146403A (en) | 2008-03-19 |
| CN100586249C true CN100586249C (en) | 2010-01-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610127542A Active CN100586249C (en) | 2006-09-12 | 2006-09-12 | Pressing base board bar |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100586249C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347780B (en) * | 2013-08-06 | 2018-12-04 | 惠州市华阳光电技术有限公司 | A kind of substrate and its manufacturing process of chip on board |
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2006
- 2006-09-12 CN CN200610127542A patent/CN100586249C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101146403A (en) | 2008-03-19 |
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