CN100582292C - Sputtering apparatus - Google Patents
Sputtering apparatus Download PDFInfo
- Publication number
- CN100582292C CN100582292C CN200510034247A CN200510034247A CN100582292C CN 100582292 C CN100582292 C CN 100582292C CN 200510034247 A CN200510034247 A CN 200510034247A CN 200510034247 A CN200510034247 A CN 200510034247A CN 100582292 C CN100582292 C CN 100582292C
- Authority
- CN
- China
- Prior art keywords
- die
- sputtering apparatus
- tool
- diameter
- step surface
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
The sputtering apparatus includes one fixture, which has at least one through hole and one surface, and one mold core, which is one shaft with end and may be installed inside the fixture through the hole with the end aligning with the surface of the fixture. Applying the sputtering apparatus can coat the end of the mold core homogeneously.
Description
[technical field]
The present invention relates to a kind of sputtering apparatus, the sputtering apparatus that uses during particularly a kind of die end face sputter coating.
[background technology]
The core technology of moulded glass is the making of die and mould.Because the temperature of glass fusion is higher, and die need bear the molding pressure in the model process, thereby need consider following points when making die: (1) release, to avoid reacting, stick phenomenon with glass; (2) enough hardness and physical strength is in order to molding glass and avoid surperficial scratch; (3) resistance to sudden heating is to bear the thermal cycling in the model process.For making die reach above-mentioned requirements, need usually carry out plated film, so coating technique is not only the gordian technique of mould and die on the surface of die, influence moulded glass yield key just especially.
Sputter coating (being called for short " sputter ") is to use coating technique quite widely, as shown in Figure 1, and the synoptic diagram when it carries out sputter for existing sputter machine 4.Sputter machine 4 has vacuum chamber 40, target 41, baffle plate 42, matrix (promptly by the sputter thing) 43, base 44 and power supply 45.Vacuum chamber 40 has inflation inlet 46 and bleeding point 47, connects inflation and air-bleed system (figure does not show) respectively.Power supply 45 connects targets 41 and vacuum chambers 40, thus with target 41 as negative electrode, the base 44 of placing matrix 43 is as anode.Wall, inflation and the air-bleed systems of base 44 and vacuum chamber 40 etc. are ground connection simultaneously, and add negative high voltage on the target 41 as negative electrode.After being evacuated to vacuum in the vacuum chamber 40, charge into sputter gas (being generally Ar).Regulate the voltage of power supply 45, the beginning sputter.Between baffle plate 42 and target 41, form discharge earlier, after removing the pollutent on target 41 surfaces, remove baffle plate 42, glow discharge takes place at target 41 and between as anodic base 44, positive ion flies to as the target 41 of negative electrode and bombards target 41, and the result produces electron emission on the one hand, and flies to anode and make it to take place ionization to keep discharge, produce the sputter of negative electrode target 41 on the other hand, the atoms metal that sputters out etc. flies to and places on the anodic matrix 43.Simultaneously base 44 keeps rotations, thus on matrix 43 surperficial sputters more uniform film.
Yet because there is certain influence in the geometrical shape of matrix 43 to film uniformity, if matrix 43 is planeforms, the surface is subjected to ion bombardment equably; If matrix 43 is not the plane, then because geometrical effect will make film uniformity relatively poor.And core of moulded glass as matrix when the sputter coating, because the die depth-width ratio is big and it is outstanding a lot of from base 44, make die much closer than base 44 to the distance of target 41 to the distance of target 41, thereby the aura situation strong far beyond the aura of base top directly over the die can take place, add base 44 rotations and cause the unsettled phenomenon of generation glow discharge zone aura intensity on the contrary, and then cause the homogeneity of film relatively poor.
[summary of the invention]
According to above-mentioned situation, be necessary to provide a kind of plated film uniform sputtering apparatus.
A kind of sputtering apparatus, comprise tool and at least one die, tool comprises an at least one counterbore and surface with step surface, at least one die is one and has end face to be coated, at least one die is stair-stepping axle, its end away from this end face forms a step surface, and the height of this tool equates with the height of this at least one die.At least one die at least one counterbore is packed tool separably into after, the end face of at least one die is surperficial concordant with tool, the step surface of at least one die is by the step surface backstop in the counterbore corresponding with it.
Further being improved to of above-mentioned sputtering apparatus: sputtering apparatus further comprises ceramic shield, and this ceramic shield comprises dividing plate, at least onely is opened in hole on the dividing plate, extend the pipe that forms and extend the sidewall that forms from separator edge to the dividing plate below from the position of edge radial dilatation one segment distance in hole to the dividing plate below.
Compared with prior art, described sputtering apparatus is because the end face of die and tool surperficial concordant, this makes the surface of end face to be coated and tool form the plane than big area on the whole, it is bigger and outstanding base is a lot of and the plated film geometrical effect that produces makes film uniformity be improved largely to overcome the die depth-width ratio.
Further, described sputtering apparatus can prevent from the arc-over phenomenon to occur near the step surface, thereby guarantee coating quality because ceramic shield is isolated the step surface and the tool insulation of die.
[description of drawings]
Fig. 1 is existing sputter machine synoptic diagram.
Fig. 2 is the sputtering apparatus combination synoptic diagram of first embodiment of the invention.
Fig. 3 is the ceramic shield synoptic diagram of the sputtering apparatus of second embodiment of the invention.
Fig. 4 is the synoptic diagram of the ceramic shield other direction of Fig. 3.
Fig. 5 is the sputtering apparatus assembling synoptic diagram of second embodiment of the invention.
[embodiment]
See also Fig. 2, it is the sputtering apparatus 100 of first embodiment of the invention, and this sputtering apparatus 100 comprises tool 1 and the die 2 that is made of metal.Tool 1 has at least one through hole 10 (being the four-way hole in the present embodiment) and surface 12.Through hole 10 is a counterbore, has step surface 14.Die 2 is a stepped axle, and it has two step surfaces 22,24.The height of tool 1 equates with die 2, and so when die 2 was packed in the through hole 10 of tool 1, the end face 20 of die 2 was concordant with the surface 12 of tool 1, and step surface 24 is by step surface 14 backstops of tool 1.
Please together consult Fig. 1, when the end face 20 to die 2 carries out the sputter operation, the tool 1 that installs die 2 is installed on the base 34 by known manner.Because the end face 20 of die 2 is concordant with the surface 12 of tool 1, this makes the surface 12 of end face to be coated 20 and tool 1 form the plane than big area on the whole, it is a lot of and the plated film geometrical effect that produces makes film uniformity be improved largely to overcome the bigger and outstanding base of die depth-width ratio 34.
Please together consult Fig. 3, Fig. 4 and Fig. 5, it is the sputtering apparatus 100 ' of the present invention's second embodiment.This sputtering apparatus 100 ' comprises tool 1, die 2 and ceramic shield 3.Tool 1, die 2 are with aforementioned basic identical, and only the diameter of the through hole 10 on the tool 1 enlarges slightly, so repeat no more.The shell-like structure that ceramic shield 3 is formed in one, it has dividing plate 30, be opened at least one hole 32 (for corresponding tool 1 four holes being set in the present embodiment) on the dividing plate 30, from the hole position of 32 edge radial dilatation, one segment distance extend the pipe 34 that forms downwards and from dividing plate 30 edges up and down both sides extend ora terminalis 36, the sidewall 38 that forms.The diameter in hole 32 is slightly larger than the diameter of the end face 20 of die 2 less than die middle part diameter.Pipe 34 outside diameter is equal to or slightly less than the diameter of through hole 10, and the interior diameter of pipe 34 equals or be slightly larger than the middle part diameter of die 2, and manages 34 length and only reach step surface 14 in tool 1.During installation, pipe 34 correspondences with ceramic shield 3 embed in the through hole 10 of tools 1 earlier, insert die 2 again.
Please together consult Fig. 1, when the end face 20 to die 2 carries out the sputter operation, sputtering apparatus 100 ' is installed on the base 34 by known manner.Because of ceramic shield 3 has insulation characterisitic, thus its step surface 22 of die 2 can be isolated with tool 1 insulation, thereby prevent near the step surface 22 the arc-over phenomenon that may produce, guarantee that coating quality is stable.When finishing plated film, because ceramic shield 3 is with its dividing plate 30 supporting tools 1, tool 1 step surface 14 backstop dies 2, thereby with after the sputtering apparatus 100 ' counter-rotating, can be used as bearing apparatus uses, at this moment, the ora terminalis 36 of ceramic shield 3 end face 20 that can prevent die 2 and other surface are touched mutually as ground etc. and are destroyed plated film.
Be appreciated that ground, tool 1 not only can utilize metallic substance to make, and also can utilize insulating material such as pottery to make; Ceramic shield 3 also can be made for utilizing other insulating material.
Claims (8)
1. sputtering apparatus, comprise a tool and at least one die, this at least one die is one, has an end face to be coated, it is characterized in that: this tool comprises an at least one counterbore and surface with step surface, this at least one die is stair-stepping axle, its end away from this end face forms a step surface, the height of this tool equates with the height of this at least one die, this at least one die is when this at least one counterbore is packed in the tool separably, the end face of this at least one die is surperficial concordant with this tool, and the step surface of this at least one die is by the step surface backstop in the counterbore corresponding with it.
2. sputtering apparatus according to claim 1 is characterized in that: this sputtering apparatus further comprises a ceramic shield.
3. sputtering apparatus according to claim 2 is characterized in that: this ceramic shield comprise a dividing plate, at least one be opened in hole on the dividing plate, certainly this bore edges radial dilatation one segment distance the position to the dividing plate below extend the pipe that forms and certainly this separator edge extend the sidewall that forms to the dividing plate below.
4. sputtering apparatus according to claim 3 is characterized in that: the diameter in this hole is slightly less than die middle part diameter and is slightly larger than the diameter of die end face.
5. sputtering apparatus according to claim 3 is characterized in that: the outside diameter of this pipe is equal to or slightly less than the diameter of through hole, and the interior diameter of pipe equals or be slightly larger than the middle part diameter of die.
6. sputtering apparatus according to claim 5 is characterized in that: the length of this pipe only reaches the step surface in tool.
7. sputtering apparatus according to claim 3 is characterized in that: this separator edge extends upward the formation ora terminalis.
8. sputtering apparatus according to claim 2 is characterized in that: the shell-like structure that this ceramic shield is formed in one.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510034247A CN100582292C (en) | 2005-04-15 | 2005-04-15 | Sputtering apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510034247A CN100582292C (en) | 2005-04-15 | 2005-04-15 | Sputtering apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1847447A CN1847447A (en) | 2006-10-18 |
| CN100582292C true CN100582292C (en) | 2010-01-20 |
Family
ID=37077183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510034247A Expired - Fee Related CN100582292C (en) | 2005-04-15 | 2005-04-15 | Sputtering apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100582292C (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101538699B (en) * | 2008-03-17 | 2012-06-20 | 鸿富锦精密工业（深圳）有限公司 | Film plating device and film-plating umbrella stand mask using same |
| CN101545091B (en) * | 2008-03-24 | 2012-03-14 | 鸿富锦精密工业（深圳）有限公司 | Film plating fixture |
| TWI443211B (en) | 2010-05-05 | 2014-07-01 | Hon Hai Prec Ind Co Ltd | Sputtering device |
| CN102234772B (en) * | 2010-05-06 | 2014-03-26 | 鸿富锦精密工业（深圳）有限公司 | Coating device |
| CN102747335B (en) * | 2012-08-01 | 2014-05-07 | 天津南玻节能玻璃有限公司 | Device and method for adjusting uniformity of vacuum magnetic control glow |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003306336A (en) * | 2002-04-15 | 2003-10-28 | Matsushita Electric Ind Co Ltd | Metal mold for forming optical device |
| CN1467165A (en) * | 2002-07-11 | 2004-01-14 | 一品光学工业股份有限公司 | Metal mold of moulding glass |
| CN1648081A (en) * | 2004-01-30 | 2005-08-03 | 亚洲光学股份有限公司 | Method and its device for improving glass die made die core hardening film coating precision |
-
2005
- 2005-04-15 CN CN200510034247A patent/CN100582292C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003306336A (en) * | 2002-04-15 | 2003-10-28 | Matsushita Electric Ind Co Ltd | Metal mold for forming optical device |
| CN1467165A (en) * | 2002-07-11 | 2004-01-14 | 一品光学工业股份有限公司 | Metal mold of moulding glass |
| CN1648081A (en) * | 2004-01-30 | 2005-08-03 | 亚洲光学股份有限公司 | Method and its device for improving glass die made die core hardening film coating precision |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1847447A (en) | 2006-10-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100582292C (en) | Sputtering apparatus | |
| WO2005103321A3 (en) | Ionized physical vapor deposition (ipvd) process | |
| RU2625698C1 (en) | Method of application of protective coatings and device for its implementation | |
| CN105887036B (en) | A kind of workpiece fixture | |
| CN102066604A (en) | Cathode unit and spattering device having same | |
| WO2008033724A3 (en) | Enhanced virtual anode | |
| TWI330205B (en) | Sputtering device | |
| TW200903597A (en) | Ion implanter, internal structure of ion implanter and method of forming a coating layer in the ion implanter | |
| CN210657118U (en) | Device for increasing deposition rate of magnetron sputtering coating | |
| CN109496344A (en) | Pulse shape controller for sputtering source | |
| CN108368599A (en) | A kind of surface to for coating carries out pretreated method | |
| CN113061863A (en) | Film coating jig, film coating equipment and film coating method | |
| CN100446649C (en) | Heat radiator | |
| WO2002043905A3 (en) | A method and apparatus for the production of metal powder granules by electric discharge | |
| CN206447933U (en) | A kind of alloy material vacuum sputtering film plating machine | |
| CN205688006U (en) | A kind of workpiece fixture | |
| CN2916963Y (en) | Connector | |
| CN218175091U (en) | Plasma alloying device | |
| WO2012069395A1 (en) | Vapour deposition | |
| CN215628257U (en) | Cooling jig for sputtering machine | |
| CN210085559U (en) | Etching anode shielding and insulating device | |
| TW200615997A (en) | Image display device and its manufacturing method | |
| CN115198240B (en) | Large-size vacuum coating equipment and use method thereof | |
| CN111020481B (en) | Magnetic conductive coating for electromagnetic cooker and preparation method thereof | |
| CN100500930C (en) | Non-grid ion plating aid |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100120 Termination date: 20150415 |
|
| EXPY | Termination of patent right or utility model |