CN100578769C - 含有纳米材料以增强体积导热率的有机基体 - Google Patents
含有纳米材料以增强体积导热率的有机基体 Download PDFInfo
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- CN100578769C CN100578769C CN200480043613A CN200480043613A CN100578769C CN 100578769 C CN100578769 C CN 100578769C CN 200480043613 A CN200480043613 A CN 200480043613A CN 200480043613 A CN200480043613 A CN 200480043613A CN 100578769 C CN100578769 C CN 100578769C
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
- C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3737—Organic materials with or without a thermoconductive filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
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- C08K3/34—Silicon-containing compounds
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2004/015745 WO2005119771A1 (en) | 2004-05-20 | 2004-05-20 | Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1989614A CN1989614A (zh) | 2007-06-27 |
CN100578769C true CN100578769C (zh) | 2010-01-06 |
Family
ID=34958661
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200480043613A Expired - Fee Related CN100578769C (zh) | 2004-05-20 | 2004-05-20 | 含有纳米材料以增强体积导热率的有机基体 |
Country Status (6)
Country | Link |
---|---|
EP (1) | EP1751796A1 (de) |
JP (1) | JP5005538B2 (de) |
KR (1) | KR101116506B1 (de) |
CN (1) | CN100578769C (de) |
BR (1) | BRPI0418816A (de) |
WO (1) | WO2005119771A1 (de) |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7592045B2 (en) * | 2004-06-15 | 2009-09-22 | Siemens Energy, Inc. | Seeding of HTC fillers to form dendritic structures |
JP5103364B2 (ja) * | 2008-11-17 | 2012-12-19 | 日東電工株式会社 | 熱伝導性シートの製造方法 |
JP2013540353A (ja) * | 2010-09-29 | 2013-10-31 | エンパイア テクノロジー ディベロップメント エルエルシー | セラミックナノチューブ複合体中の相変化エネルギー貯蔵 |
CN103378022B (zh) * | 2012-04-13 | 2016-06-08 | 普罗旺斯科技(深圳)有限公司 | 散热片及其制造方法 |
US20140080951A1 (en) * | 2012-09-19 | 2014-03-20 | Chandrashekar Raman | Thermally conductive plastic compositions, extrusion apparatus and methods for making thermally conductive plastics |
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KR970002120A (ko) * | 1995-06-20 | 1997-01-24 | 구자홍 | 전자조리기의 조리제어장치 |
US20020123285A1 (en) * | 2000-02-22 | 2002-09-05 | Dana David E. | Electronic supports and methods and apparatus for forming apertures in electronic supports |
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US20020058140A1 (en) * | 2000-09-18 | 2002-05-16 | Dana David E. | Glass fiber coating for inhibiting conductive anodic filament formation in electronic supports |
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JP2003342021A (ja) * | 2002-05-28 | 2003-12-03 | Polymatech Co Ltd | 酸化アルミニウム粉末組成物及びそれを含有する熱伝導性成形体 |
DE10241510A1 (de) * | 2002-09-07 | 2004-03-18 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Nanokomposite, Verfahren zu ihrer Herstellung und ihre Verwendung |
US20040102529A1 (en) * | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
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- 2004-05-20 EP EP04776046A patent/EP1751796A1/de not_active Withdrawn
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JP5005538B2 (ja) | 2012-08-22 |
JP2007538135A (ja) | 2007-12-27 |
EP1751796A1 (de) | 2007-02-14 |
BRPI0418816A (pt) | 2007-11-13 |
WO2005119771A1 (en) | 2005-12-15 |
CN1989614A (zh) | 2007-06-27 |
KR101116506B1 (ko) | 2012-03-13 |
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