CN100578201C - The wiring figure inspection method - Google Patents
The wiring figure inspection method Download PDFInfo
- Publication number
- CN100578201C CN100578201C CN200410090559A CN200410090559A CN100578201C CN 100578201 C CN100578201 C CN 100578201C CN 200410090559 A CN200410090559 A CN 200410090559A CN 200410090559 A CN200410090559 A CN 200410090559A CN 100578201 C CN100578201 C CN 100578201C
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- transillumination
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The objective of the invention is, by falling to penetrating throw light on inspection of carrying out and the inspection of being undertaken by indirect illumination, can not check the thick or narrow thin of wiring figure by the flase drop geodetic by combination.On the inspection object figure (10a) of TAB band (10), make camera head (1c), transmission illuminator (1a), falling to penetrating lighting device (1b) scans, and obtain the transillumination image and fall to penetrating illumination image, in addition, in predefined each inspection area, with aforementioned transillumination image and fall to penetrating illumination image and compare as the test pattern of check criteria, to judge whether wiring figure is qualified, peripheral edge margin of the slit portion of partly peeling off etc. in the peripheral edge margin of device aperture or with resin film, form across the periphery of aforementioned light-transmitting substrate in the zone of wiring, fall to penetrating illumination image based on aforementioned, check whether wiring figure is qualified, the zone beyond it is checked based on the transillumination image.
Description
Technical field
The present invention relates to wire layout checking device and method, relate in particular to TAB (Tape Automated Bonding) band irradiating illumination light to loading regime, utilize camera head picked-up be formed on TAB with on wiring figure, and by with as the test pattern of check criteria relatively, and carry out the wire layout checking device that wiring figure checks and the inspection method of wiring figure automatically.
Background technology
Semiconductor devices is just advancing multioutletization and microminiaturization in response to highly integrated and requirement high-density installation.Owing to help this multioutletization or microminiaturization, thus adopt with semi-conductor chip and the TAB that is located at film like with on the method that is connected of a plurality of lead-in wires.
Fig. 5 represents to make the order of TAB band.
(1) shown in Fig. 5 (a), TAB is to be formed by the resin film about (most 25-75 μ m of being), width 35-165mm about thickness 20-150 μ m with 10, on this resin film, except the both sides periphery that is formed with perforation 103, all be coated with the bonding agent about thickness 10-15 μ m.
(2) shown in Fig. 5 (b), the metal formings 105 such as Copper Foil of fitting thereon.
(3) shown in Fig. 5 (e), process this metal forming (Copper Foil) 105 by exposure and etching, and form wiring figure.At this moment, 104 layers of adhesive phases are not removed and former state is residual.
Fig. 6 is 1 example representing to be formed with as previously mentioned the TAB band of wiring figure.
As shown in the drawing, go up at the band (TAB band) of band shape and to make a plurality of same circuit continuously, and with the part that dotted line was surrounded of this figure as 1 wiring figure (being called 1 section).Among this figure, the 111st, the wired circuit figure.In addition, inner rectangle is that the peristome (device aperture) 110 of semi-conductor chip is installed, the part that is arranged at rectangular both sides be can be on this part the slit portion 112 of flipe line graph.
This TAB with 10 manufacturing process in, need to check whether correctly to form wiring figure, check by wire layout checking device.
Whether wire layout checking device is to be with 10 to throw light on illumination light to the TAB that is checked, with camera head or the visual state (outward appearance) that detects wiring figure, and compares with test pattern, qualified to judge formed wiring figure.
In recent years, also adopt automatic checking device, the wiring figure of memory storage test pattern in the storage part of the control part of testing fixture, and the test pattern of relatively storage in advance and the reality by the camera head picked-up, whether automatically judge qualified.
In aforesaid automatic checking device, to the method for TAB band irradiating illumination light, the method for using to fall to penetrating light is arranged and use the transmitted light method in order to absorb wiring figure.
Use the method that falls to penetrating light, be top (being formed with the both sides of wiring) irradiating illumination light from the TAB band, by the image of irradiating illumination direction of light observation by the catoptrical wiring figure of being with from TAB that forms, for example, absorb the picture of wiring figure by imaging apparatus, and carry out Flame Image Process as ccd video camera and so on.
On the other hand, use the method for transillumination, be to throw light on from the below (an opposite side) of TAB band with the face that is formed with wiring, the picture of the wiring figure that the transmitted light of being with by transmission TAB by top (an opposite side with the irradiating illumination light one side) observation of TAB band forms.
The material of the resin film of TAB band all uses polyimide under most situation, by adjusting thickness, can transmission peak wavelength greater than the light of 500nm.Therefore, when carrying out transillumination, select to contain the light of the above wavelength of 500nm as illumination light.
In addition, both of illumination light and transillumination light have also been proposed to use to fall to penetrating, with the method (for example referring to Patent Document 1 conventional example) of checking tabular workpiece.
Patent documentation 1: TOHKEMY 2001-305074 communique
Whether the purpose of the inspection of wiring figure (below, also have only to be called figure) is to judge whether wiring figure is formed desired shape, and for example, the thickness of judging formed wiring figure is with respect to test pattern, in allowed band.During the thickness of formed wiring figure too thick (below, be called thick), then have the situation with the wiring figure short circuit of facing mutually, during its thickness too thin (below, be called narrow carefully), the situation of broken string is arranged then.
When checking this wiring figure thick or narrow thin, expectation is checked by transillumination.It is based on following reason.
As shown in Figure 7, the metal forming of etching Copper Foil etc. is when forming figure, and the section of formed figure is trapezoidal shape, and as the size of the wide b of the wide a of the upside of figure relatively and downside, then the wide b of downside is bigger.This be based on etching solution by the surface of Copper Foil diffusion and the speed during toward etched inside, be widely known by the people.
When checking this figure, falling to penetrating in the illumination, imaging apparatus obtains the light by the surface reflection of wiring figure, the part deepening beyond it.
Therefore, shown in Fig. 8 (a), even wiring figure in downside and adjacent figure short circuit, the image that is absorbed also is mapped as the normal figure that does not have short circuit.Therefore, have and fall to underproof situation.This wiring figure is called as " undesirable root (root at the state of downside and adjacent figure short circuit
り) ".
On the other hand, when using transillumination, imaging apparatus obtains the light of transmissive resin film, the part deepening beyond it.
Therefore, shown in Fig. 8 (b), in downside and adjacent figure short circuit, then this part does not have the illumination light transmission as wiring figure, and the image mapped of being absorbed is the unusual wiring figure of thickness, therefore, can detect defective.Certainly, by wiring fine rule caused defectively also can detect.
But, in transillumination, but can't check the figure as upper/lower positions of substrate.
For example, in aforesaid device aperture 110, as shown in Figure 6, be connected with semi-conductor chip, therefore, by its side (boundary member of device aperture 110 and resin film 102, below, be also referred to as periphery) 4 limits towards the inboard of device aperture 110 and expose a plurality of wirings (lead) 111.So, the lead that is suspended in the hollow bulb is called unsettled lead, and need checks this unsettled lead.
, when using transillumination in order to check near this unsettled wire portion and its, as shown in Figure 9, the side of device aperture 110 (periphery) becomes shadow, can't distinguish mutually with wiring figure.
Under situation, can differentiate the periphery and the wiring figure of device aperture 110 with visual examination.But, in the self-verifying of being undertaken by Flame Image Process, can't differentiate it, testing fixture can be judged by accident defective for what cause because of thick (short circuit).
In addition, in order to make equipment miniaturization, be with the situation that folds and be installed on the device to increase TAB recently, shown in Figure 6 as described above, be provided with slit portion 112.
Carry out the folded portions (slit portion 112) of this kind TAB band, resin film is partly peeled off being easy to and is folded.
Figure 10 represents the making step of aforementioned slit portion.
On the resin film 102 shown in this figure (a), be coated with on the matrix material of bonding agent 104, shown in this figure (b), carry out punching.Then, shown in this figure (c), the metal forming 105 of applying copper etc. shown in figure (d), covers the part of punching with the flexible diaphragm 107 of resin etc.Then, as previously mentioned, this metal forming is processed by exposure, etching.
Even in above-mentioned slit portion 112, also the situation with device aperture 110 is identical, when using transillumination, its periphery becomes shadow, can't distinguish mutually with wiring figure, can be judged as by thick cause defective equally.
As mentioned above,, can't contain the whole of substrate and carry out the thick or narrow thin inspection of wiring figure falling to penetrating in wherein a kind of inspection of carrying out of illumination light or transillumination light only.
Summary of the invention
The present invention finishes in view of the above problems, and its purpose is: by combination by falling to penetrating the inspection carried out of illumination and, can contain the Zone Full of substrate by the inspection that indirect illumination carries out, can flase drop and check the thick or narrow thin of wiring figure exactly.
Wire layout checking device of the present invention, be formed on the transillumination image of the wiring figure on the light-transmitting substrate by reception, and with the image and the test pattern contrast that receive, thereby whether qualified carry out wiring figure inspection, its wiring figure that is provided with light-transmitting substrate shines the lighting device that falls to penetrating illumination light.
And, absorb the transillumination image of wiring figure and fall to penetrating illumination image, and set the zone of checking based on the transillumination image (inspection area), and based on falling to penetrating the zone (inspection area) that illumination image is checked, in each zone with the transillumination image and fall to penetrating illumination image and compare, to judge whether wiring figure qualified as the test pattern of check criteria.
Peripheral edge margin of the slit portion of partly peeling off etc., form in the zone of wiring across the periphery of aforementioned light-transmitting substrate in the peripheral edge margin of device aperture or with resin film, as previously mentioned, in the transillumination image, produce shadow, therefore, fall to penetrating illumination image and check whether wiring figure is qualified based on aforementioned, and the zone beyond it is then checked based on the transillumination image.
The invention effect
In the present invention, can obtain following effect.
(1) for the wiring figure of checking, nearly all zone is to use the transillumination of the short circuit that is suitable for detecting the wiring that is caused by " undesirable root " to check, in addition, in special zone such as the device aperture of inapplicable transillumination, slit portion, check by falling to penetrating illumination, thereby, can not can the flase drop geodetic detect underproof wiring figure.
(2) make up the transillumination image and fall to penetrating illumination image, thereby carry out the whether qualified inspection of wiring figure, therefore, need hardly the people with visual judge whether qualified, the Zone Full that can contain the substrate of inspection, can not can the flase drop geodetic carry out the thick or narrow thin self-verifying of wiring figure.
Description of drawings
Fig. 1 is the block scheme of the wire layout checking device of embodiments of the invention.
Fig. 2 is near the figure of the setting example of the inspection area the expression device aperture.
Fig. 3 is near the figure of the setting example of the inspection area the portion of expression slit.
Fig. 4 be expression device aperture or slit portion peripheral edge margin reality the transillumination image and fall to penetrating the light chart image pattern.
Fig. 5 is the block diagram that the TAB band is made in expression.
Fig. 6 is the figure of the example of the expression TAB band that is formed with wiring figure.
Fig. 7 represents metal formings such as etching Copper Foil and the sectional view of formed figure when forming figure.
Fig. 8 is that explanation will fall to penetrating illumination light as under the situation of illumination light, the figure of the defective figure of institute's over sight (OS).
Fig. 9 is near the figure of an example of the transillumination image of the periphery of expression device aperture.
Figure 10 is the making step figure that shows slit portion.
Embodiment
Fig. 1 is the block scheme of the wire layout checking device of expression embodiments of the invention.In addition, in following embodiment, though be that the situation of TAB band describes with regard to substrate, still, method of the present invention is removed TAB is with, and also can be used in the inspection of the various substrates that undertaken by transillumination light.
As shown in Figure 1, the wire layout checking device of present embodiment possesses, by transmitting the tape transport 11 that the output panel 12 of TAB with 10, take-up reel 13 etc. are become, and inspection portion 1, and defective figure is carried out the labeling section 3 of mark.
In inspection portion 1, the TAB that is sent by output panel 12 is with 10 irradiation transillumination light and fall to penetrating illumination light, and is formed on TAB with 10 figure 10a by camera head 1c picked-up.Scanister 2 be TAB with 10 figure 10a on transmission illuminator 1a, fall to penetrating lighting device 1b, camera head 1c scans.
In labeling section 3, in order clearly to distinguish underproof figure,, promptly defective figure is imposed the perforation of being undertaken by tapping machine or tint etc. in case check out defective figure with respect to certified products.
In addition, be provided with control part 4, it is used to control aforementioned inspection portion 1, scanister 2, labeling section 3, and the action of tape transport 11, and compare the transillumination image graphics that is absorbed or fall to penetrating the illumination image figure and the test pattern of conduct standard separately, to judge whether figure is qualified.
In control part 4, import test pattern in advance as the figure check criteria.Test pattern is prepared to be useful on to fall to penetrating illumination usefulness and to be used for 2 kinds of figures that transillumination is used.
In addition, test pattern can be the image that absorbs the figure of the reality that is judged as certified products, also can be to use the figure of cad data.
The light source of transmission illuminator 1a can suitably select to send transmissive TAB with the wavelength of 10 resin film, but in the present embodiment, use can be penetrated the LED of the above light of wavelength 850nm.
Camera head 1c is for example ccd linear sensor that the wavelength of illumination light is had luminous sensitivity, below to the situation of ccd linear sensor as camera head 1b described.In addition, enough big as the light quantity that can make transmission illuminator 1a, fall to penetrating lighting device 1b, also can use group shot and round a ccd video camera of checking figure with replaced C CD linear transducer.
Display part 5 is used to show the image of the figure 10a of picked-up, or the image of the test pattern of input in advance.Input part 6 is keyboard or slide-mouse of the check criteria etc. of input wiring figure.
Former figures 10a is printed with alignment mark, and control part 4 is searched aforementioned alignment mark on the figure 10a of picked-up, the figure 10a that absorbs and the contraposition of test pattern, and at each each inspection area comparison figure.
Aforementioned each inspection area is set at satisfies following standard.
(i) in inspection area, inspection item is identical.
(ii) in inspection area, the width of wiring is identical.
(iii) in inspection area, check that specification is identical.
Be with in 10 at TAB shown in Figure 6 as described above, be divided into a plurality of inspection areas of wiring figure part, device aperture part, slotted section to major general's figure 10a, and in each inspection area figure relatively, thereby judge whether qualified.
The setting of inspection area is, shows the transillumination images, falls to penetrating illumination image in aforementioned display 5, uses the keyboard or the slide-mouse of aforementioned input part 6, sets the rectangle or polygonal closed region (inspection area (ROI)) that check.In addition, though aforementioned inspection area can corresponding TAB with on graphics shape etc. and suitably set, still,, be that the peripheral part with device aperture (デ バ イ ス ホ one Le) 110, slit portion 112 is set at the inspection area about falling to penetrating illumination image.
In addition, be used to judge inspection item and judge the whether qualified check gauge scale value of figure by aforementioned each inspection areas input of 6 pairs of aforementioned input parts, and carry out the setting of inspection item and check gauge scale value.The check gauge scale value for example is thick, the narrow thin criterion (width of wiring, its allowed band etc.) of double quantification critical value, wiring.
The location coordinate of the aforementioned inspection area that sets and inspection item, check gauge scale value, and the aforesaid standards graphics memory is in the memory storage 4c of aforementioned control part 4, carry out identical TAB with on the inspection of wiring figure the time, reusable.
Whether qualified in addition, using image to check, to judge under the situation, distinguishing suitable zone, and be the inspection that carry out on the basis with the image information that becomes object, be to carry out in the past.About this technology, for example please refer to (FEST Project Knitting Ji Wei STAFF meeting Knitting, “ Xin real
Portrait is handled ", the リ of Co., Ltd. Application Network ス publishing portion, June 6 calendar year 2001 development capable) P33-34 of appended CDROM etc.
The inspection step of the wiring figure of the embodiments of the invention that use aforementioned wire layout checking device then, is described.
(1) shown in Figure 6 as described above, make a plurality of identical wiring figures at TAB continuously on 10.Control part 4 rotating band connecting gears 11 are with 10 to be sent to inspection portion 1 TAB.
(2) in the time will becoming the figure 10a of TAB with 10 inspection object and be sent to the ad-hoc location of inspection portion 1 by tape transport 11, TAB Volume is with 10 to stop in this position.
By transmission illuminator 1a, by TAB with 10 below (side of wiring figure is not set) irradiating illumination light.In addition this moment, do not have from falling to penetrating lighting device 1b irradiating illumination light.
And, by scanister 2, make ccd linear sensor 1c and transmission illuminator 1a and fall to penetrating lighting device 1b and on the paper left and right directions of this figure, scan.Thus, the illumination light transmission TAB that is penetrated by transmission illuminator 1a is with 10, and 1c is subjected to light by ccd linear sensor, obtains the image of figure 10a.
Image by ccd linear sensor 1c is received has the part deepening mapping of wiring figure, the bright mapping of the part beyond it.This image is stored in control part 4 as the transillumination image.
(3) then, stop illumination from transmission illuminator 1a, and by fall to penetrating lighting device 1b from TAB with 10 top (being provided with wiring figure one side) irradiating illumination light, by scanister 2, make ccd linear sensor 1c, transmission illuminator 1a and fall to penetrating lighting device 1b and scan.In addition, scan, can make inspection portion 1 reply original position as the reverse direction of the direction of scanning with the aforementioned transillumination image of picked-up the time.
Ccd linear sensor 1c receives from TAB with 10 reflected light, and by the take the diagram image of 10a of ccd linear sensor 1c.
In the image that receives, the bright mapping by visuals indirect illumination light, other part deepening mappings.Aforesaid image light and shade is reversed, and be stored in control part 4 as falling to penetrating illumination image.In addition, the reason that light and shade is reversed is, because the image that forms by transillumination and by falling to penetrating its light and shade changeabout in the image that illumination forms, therefore must compare the transillumination image with fall to penetrating illumination image with the whether qualified situation of judgement under, make the light and shade unanimity can be easy to comparison.
(4) the transillumination image of the figure 10a that will absorb as previously mentioned and store is shown in display part 5, as previously mentioned, and according to transillumination image setting inspection area (ROI).Here, serve as to check object with the almost Zone Full beyond the peripheral edge margin of device aperture 110 and slit portion 112.
In addition, as previously mentioned, the inspection item and the check gauge scale value of each inspection area that input is set and distinguished.
Then, the illumination image that falls to penetrating of figure 10a is shown in display part 5, as previously mentioned, sets inspection area (RIO) according to falling to penetrating illumination image.Here, if the peripheral edge margin of device aperture 110 or slit portion 112 etc. produce shadow by the image that transillumination forms, the zone of knowing in advance is set at the inspection object.In addition, as previously mentioned, import the inspection item and the check gauge scale value of each inspection area.
Fig. 2, Fig. 3 represent near the setting example of the inspection area device aperture 110 and the slit portion 112.The dotted line of this figure is represented the setting example with the inspection area of transillumination image inspection, and the solid line of this figure is the setting example of expression by the inspection area that falls to penetrating the illumination image inspection.
In the present embodiment, shown in Fig. 2 (a), the side (periphery) of device aperture 110 is set at by falling to penetrating the inspection area that illumination image forms, other parts is set at the inspection area that forms by the transillumination image.
Near slit portion 112, shown in Fig. 3 (a), also the side (periphery) with slit portion 112 is set at by falling to penetrating the inspection area that illumination image forms, and other parts is set at the inspection area that is formed by the transillumination image.In addition, falling to penetrating illumination image in a use carries out usually, shown in Fig. 2, Fig. 3 (b), entire device hole 110 and slit portion 112 being set at an inspection area under the situation of wiring figure inspection.
(6) execution of Jian Chaing
Aforementioned operation one finishes, and checks with regard to each inspection area whether figure is qualified.
The decision maker 4b of control part 4 is being in the zone of object with the inspection based on the transillumination image, Cun Chu transillumination image and test pattern thereof relatively, in addition, being in the zone of object based on the inspection that falls to penetrating illumination image, relatively transillumination image and test pattern thereof carry out the wiring figure that absorbed with respect to the whether inspection in the range of size of regulation of test pattern.
Promptly, decision maker 4b searches alignment mark to the transillumination image, thereby carry out the contraposition with test pattern, in predefined each inspection area, measure live width, will be judged to be underproof " thick " or " narrow thin " from what aforementioned predefined check gauge scale value departed from.Similarly, search alignment mark, carry out the contraposition with test pattern, in predefined each inspection area, will be judged to be underproof " thick " or " narrow thin " from what aforementioned predefined check gauge scale value departed to falling to penetrating illumination image.
In case figure is judged as defective, then the decision maker 4b of control part 4 stores this figure, when this defective figure one is transferred into labeling section 3 shown in Figure 1, just this figure is added defective mark.
In addition,, then in display part 5, show its part transillumination image and fall to penetrating illumination image, check by visual being difficult to by the self-verifying of only being undertaken to judge under the whether qualified situation by Flame Image Process, whether qualified to judge.
Fig. 4 be expression device aperture 110 or slit portion 112 peripheral edge margin reality the transillumination image and fall to penetrating illumination image.
Fig. 4 (a) is the transillumination image of the peripheral edge margin of expression device aperture, figure (b) be the same device aperture peripheral edge margin of expression fall to penetrating illumination image, Fig. 4 (c) is the transmission image of the peripheral edge margin of expression slit portion, figure (d) be expression slit portion peripheral edge margin fall to penetrating illumination image.In addition, the illumination image that falls to penetrating shown in Figure 4 is that aforesaid light and shade reverses preceding image.
In the transillumination image, shown in this figure (a), figure (c), the periphery of device aperture 110, and the cut marginal portion of resin film of slit portion 112 are that wiring presents with shadow and links to each other, and can't distinguish mutually with the short circuit of wiring.
On the other hand, falling to penetrating in the illumination image, shown in this figure (b), figure (d), for the edge of device aperture 110, the bright mapping of wiring produces the poor of contrast, therefore, by Flame Image Process, can clearly distinguish with the edge.In addition, in slit portion 112, slit portion itself does not shine upon, only mapping wiring.
In addition, the inspection area that forms by the transillumination image that sets in aforementioned (4) and by falling to penetrating the position of the inspection area that illumination image forms, be when setting aforementioned inspection area, be stored in the control part 4 as location coordinate, therefore, as long as the figure 10a that checks is identical, at inspection item or check under the constant situation of specification, need not resets the inspection area and just can check.
Claims (1)
1, a kind of wiring figure inspection method is used to check whether the wiring figure that is formed on the light-transmitting substrate is qualified, and it is characterized by: it possesses:
The 1st operation is to the test pattern irradiating illumination light as check criteria, with the transillumination image that obtains the aforesaid standards figure with fall to penetrating illumination image;
The 2nd operation, with reference to the transillumination image of aforesaid standards figure with fall to penetrating illumination image and set the inspection area, make the zone basis that forms wiring across the periphery of aforementioned light-transmitting substrate fall to penetrating illumination image inspection, and the zone beyond it is checked according to the transillumination image;
The 3rd operation is to the wiring figure irradiating illumination light of checking, with the transillumination image that obtains aforementioned wiring figure with fall to penetrating illumination image; And
Whether qualified the 4th operation based on the image that sets in the 2nd operation, carry out wiring figure judgement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP378159/2003 | 2003-11-07 | ||
| JP2003378159A JP4403777B2 (en) | 2003-11-07 | 2003-11-07 | Wiring pattern inspection apparatus and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1614398A CN1614398A (en) | 2005-05-11 |
| CN100578201C true CN100578201C (en) | 2010-01-06 |
Family
ID=34688634
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200410090559A Expired - Fee Related CN100578201C (en) | 2003-11-07 | 2004-11-08 | The wiring figure inspection method |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP4403777B2 (en) |
| KR (1) | KR100769807B1 (en) |
| CN (1) | CN100578201C (en) |
| TW (1) | TW200516243A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103995003A (en) * | 2013-02-15 | 2014-08-20 | 大日本网屏制造株式会社 | Film detection apparatus, inspection system, and method of inspecting printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101198859B (en) * | 2005-06-21 | 2012-03-28 | 郡是株式会社 | Film inspection device and film inspection method |
| JP4705813B2 (en) * | 2005-07-05 | 2011-06-22 | ナビタス株式会社 | TAB inspection equipment |
| JP5145495B2 (en) * | 2007-06-21 | 2013-02-20 | 国際技術開発株式会社 | Inspection device |
| JP2009128268A (en) * | 2007-11-27 | 2009-06-11 | Nippon Avionics Co Ltd | Pattern inspection apparatus |
| JP5207820B2 (en) * | 2008-05-13 | 2013-06-12 | 株式会社Ｐｆｕ | Drawing information management apparatus and verification inspection method |
| US8766192B2 (en) * | 2010-11-01 | 2014-07-01 | Asm Assembly Automation Ltd | Method for inspecting a photovoltaic substrate |
| JP6085188B2 (en) * | 2013-02-15 | 2017-02-22 | 株式会社Ｓｃｒｅｅｎホールディングス | Pattern inspection device |
| CN104865271A (en) * | 2015-04-15 | 2015-08-26 | 浙江工业大学 | Detection method for distinguishing upper and lower surface image of transparent thin plate |
| DE102015213352B4 (en) * | 2015-07-16 | 2018-10-31 | Krones Ag | Inspection device for a preform |
| KR101873278B1 (en) | 2016-11-17 | 2018-08-02 | 김원효 | Apparatus for inspecting upper shoe and the method thereof |
| JP7157580B2 (en) * | 2018-07-19 | 2022-10-20 | 東京エレクトロン株式会社 | Board inspection method and board inspection apparatus |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000340626A (en) * | 1999-05-31 | 2000-12-08 | Fujitsu Ltd | Pattern inspecting method and apparatus, and recording medium for recording therein pattern inspecting program |
| JP2002071330A (en) * | 2000-08-25 | 2002-03-08 | Seiko Instruments Inc | Method and apparatus for inspecting pattern defect |
| JP4711570B2 (en) * | 2001-09-14 | 2011-06-29 | 株式会社東京精密 | Pattern inspection method and inspection apparatus |
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2003
- 2003-11-07 JP JP2003378159A patent/JP4403777B2/en not_active Expired - Fee Related
-
2004
- 2004-08-31 TW TW093126234A patent/TW200516243A/en not_active IP Right Cessation
- 2004-11-05 KR KR1020040089849A patent/KR100769807B1/en not_active IP Right Cessation
- 2004-11-08 CN CN200410090559A patent/CN100578201C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103995003A (en) * | 2013-02-15 | 2014-08-20 | 大日本网屏制造株式会社 | Film detection apparatus, inspection system, and method of inspecting printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4403777B2 (en) | 2010-01-27 |
| JP2005140663A (en) | 2005-06-02 |
| KR100769807B1 (en) | 2007-10-23 |
| KR20050044292A (en) | 2005-05-12 |
| CN1614398A (en) | 2005-05-11 |
| TWI319087B (en) | 2010-01-01 |
| TW200516243A (en) | 2005-05-16 |
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