TW200516243A - Wire layout checking device and method - Google Patents

Wire layout checking device and method

Info

Publication number
TW200516243A
TW200516243A TW093126234A TW93126234A TW200516243A TW 200516243 A TW200516243 A TW 200516243A TW 093126234 A TW093126234 A TW 093126234A TW 93126234 A TW93126234 A TW 93126234A TW 200516243 A TW200516243 A TW 200516243A
Authority
TW
Taiwan
Prior art keywords
region
illumination image
illumination
wiring pattern
wiring
Prior art date
Application number
TW093126234A
Other languages
Chinese (zh)
Other versions
TWI319087B (en
Inventor
Takashi Sasabe
Original Assignee
Ushio Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ushio Electric Inc filed Critical Ushio Electric Inc
Publication of TW200516243A publication Critical patent/TW200516243A/en
Application granted granted Critical
Publication of TWI319087B publication Critical patent/TWI319087B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The objective of the invention is to inspect a wiring pattern, without misdetecting the thickening or thinning of the wiring pattern, by combining the inspection due to vertical illumination and the inspection due to reflecting illumination. An imaging means 1c, a transmitting illumination means 1b and an incident-light illumination means 1c are scanned on the pattern 10a to be inspected of a TAB tape 10 to obtain a transmitting illumination image and a vertical illumination image. The transmitting illumination image and the vertical illumination image are compared with a master pattern, becoming an inspection standard at every preset inspection region to decide the quality of the wiring pattern. The quality of the wiring pattern is inspected, on the basis of the vertical illumination image, with respect to a region where wiring is formed so as to straddle the peripheral edge of a light pervious substrate, such as the peripheral edge regions of a device hole, the peripheral edge region of a slit part from which a resin film is partially peeled or the like, and a region other than the wiring formed region is inspected, on the basis of the transmitting illumination image.
TW093126234A 2003-11-07 2004-08-31 Wire layout checking device and method TW200516243A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003378159A JP4403777B2 (en) 2003-11-07 2003-11-07 Wiring pattern inspection apparatus and method

Publications (2)

Publication Number Publication Date
TW200516243A true TW200516243A (en) 2005-05-16
TWI319087B TWI319087B (en) 2010-01-01

Family

ID=34688634

Family Applications (1)

Application Number Title Priority Date Filing Date
TW093126234A TW200516243A (en) 2003-11-07 2004-08-31 Wire layout checking device and method

Country Status (4)

Country Link
JP (1) JP4403777B2 (en)
KR (1) KR100769807B1 (en)
CN (1) CN100578201C (en)
TW (1) TW200516243A (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006137385A1 (en) * 2005-06-21 2006-12-28 Gunze Limited Film inspection apparatus and method
JP4705813B2 (en) * 2005-07-05 2011-06-22 ナビタス株式会社 TAB inspection equipment
JP5145495B2 (en) * 2007-06-21 2013-02-20 国際技術開発株式会社 Inspection device
JP2009128268A (en) * 2007-11-27 2009-06-11 Nippon Avionics Co Ltd Pattern inspection apparatus
JP5207820B2 (en) * 2008-05-13 2013-06-12 株式会社Ｐｆｕ Drawing information management apparatus and verification inspection method
US8766192B2 (en) * 2010-11-01 2014-07-01 Asm Assembly Automation Ltd Method for inspecting a photovoltaic substrate
JP2014157086A (en) * 2013-02-15 2014-08-28 Dainippon Screen Mfg Co Ltd Pattern inspection device
JP6085188B2 (en) * 2013-02-15 2017-02-22 株式会社Ｓｃｒｅｅｎホールディングス Pattern inspection device
CN104865271A (en) * 2015-04-15 2015-08-26 浙江工业大学 Detection method for distinguishing upper and lower surface image of transparent thin plate
DE102015213352B4 (en) * 2015-07-16 2018-10-31 Krones Ag Inspection device for a preform
KR101873278B1 (en) 2016-11-17 2018-08-02 김원효 Apparatus for inspecting upper shoe and the method thereof
JP7157580B2 (en) * 2018-07-19 2022-10-20 東京エレクトロン株式会社 Board inspection method and board inspection apparatus

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000340626A (en) * 1999-05-31 2000-12-08 Fujitsu Ltd Pattern inspecting method and apparatus, and recording medium for recording therein pattern inspecting program
JP2002071330A (en) * 2000-08-25 2002-03-08 Seiko Instruments Inc Method and apparatus for inspecting pattern defect
JP4711570B2 (en) * 2001-09-14 2011-06-29 株式会社東京精密 Pattern inspection method and inspection apparatus

Also Published As

Publication number Publication date
JP4403777B2 (en) 2010-01-27
CN1614398A (en) 2005-05-11
TWI319087B (en) 2010-01-01
KR20050044292A (en) 2005-05-12
CN100578201C (en) 2010-01-06
KR100769807B1 (en) 2007-10-23
JP2005140663A (en) 2005-06-02

Similar Documents

Publication Publication Date Title
TW200516243A (en) Wire layout checking device and method
ATE227434T1 (en) METHOD AND DEVICE FOR OBJECT IMAGING
WO2020136624A3 (en) Laser-assisted method for parting crystalline material
TW200612090A (en) Pattern inspection device
EP1765002A3 (en) Coated wafer level camera modules and associated methods
JP2007093258A (en) Visual inspection device
TW200508599A (en) Wiring pattern check up apparatus
TW200801495A (en) Method and apparatus for inspecting wiring pattern of flexible printed wiring board
US6825924B2 (en) Dual peak wavelength tube, illuminator for inspection, inspecting apparatus, and method thereof
TW200506346A (en) Pattern inspection apparatus
JP2009300351A (en) Inspection apparatus and inspection method
KR101017300B1 (en) Apparatus for measurement of surface profile
JP2009128268A (en) Pattern inspection apparatus
EP0871027A3 (en) Inspection of print circuit board assembly
JP2009002796A (en) Inspection apparatus
KR20070068169A (en) Vision inspection system
JP2008227301A (en) Inspecting method and device for electronic circuit component mounting
CN111855672A (en) Method for detecting COF flexible board defects
JP3454142B2 (en) Soldering inspection equipment
KR20050009867A (en) Optical inspection system for detecting defect of flexible printed circuit board and method of the same
JP3803677B2 (en) Defect classification apparatus and defect classification method
JP2010117142A (en) Device and method for inspecting flaw
WO2016093597A9 (en) Method for inspecting terminal of component formed on substrate and substrate inspection apparatus
KR960003534A (en) Vision Recognition Device for Printed Circuit Board Inspection
JP2007108049A (en) Surface inspection method

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees