CN100566934C - The large die polishing method of infrared aspheric surface optical accessory - Google Patents
The large die polishing method of infrared aspheric surface optical accessory Download PDFInfo
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- CN100566934C CN100566934C CNB2007101853001A CN200710185300A CN100566934C CN 100566934 C CN100566934 C CN 100566934C CN B2007101853001 A CNB2007101853001 A CN B2007101853001A CN 200710185300 A CN200710185300 A CN 200710185300A CN 100566934 C CN100566934 C CN 100566934C
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Abstract
The present invention relates to a kind of infrared optical material---the high-efficiency polishing method of monocrystalline silicon aspheric surface optical accessory comprises the following steps to be: 1. the aspheric surface part before the polishing is by the optics machining center or the moulding of aspheric surface lathe of precision; 2. utilize computer software to simulate the petal shape of polished silicon wafer, print pattern, cut out identical shaped polished silicon wafer, be bonded on the polished die according to pattern according to the principle of balanced grinding; 3. adopt numerical control polishing to polish, workpiece spindle and tool spindle all are driving shafts, fixed optics part on the workpiece spindle, fix described polished die on the tool spindle, it is that each endless belt of realizing piece surface has approximate relative linear velocity that the rotating speed of workpiece spindle and tool spindle settles the standard, and the subtended angle of polished die is 2 times of part subtended angle; 4. the colored shape to polished silicon wafer is repaired, to realize quality control.
Description
Technical field
The present invention relates to the high-efficiency polishing method of a kind of infrared optical material-monocrystalline silicon aspheric surface optical accessory.
Background technology
Generally adopt the single-point diamond lathe to process infrared aspheric surface optical accessory at present, this method has realized the numerical controlization of polishing process, the smart quantification, has improved production efficiency to a certain extent.But also there is certain defective in this technology: 1, can not process all infra-red materials., can't process because hardness is bigger for monocrystalline silicon etc.; 2, single-point diamond lathe price is very expensive, general every millions of to up to ten million units, too high processing cost has limited the extensive popularization of this technology; 3, of paramount importance is that the surface smoothness of processing is low, has tangible tool marks, can only improve or the degradation use by retouching.
Summary of the invention
In order to overcome the shortcoming of prior art, the invention provides a kind of large die polishing method of infrared aspheric surface optical accessory, it is stable processing quality not only, and the efficient height.
The present invention solves the technical scheme that its technical problem takes: comprise the following steps to be: 1, the aspheric surface part before the polishing is by the optics machining center or the moulding of aspheric surface lathe of precision, and surface roughness reaches 1 μ m, and face shape error reaches 0.15 μ m; 2, according to the aspheric surface formula of part, calculate its immediate spherical radius R, utilize computer software to simulate the petal shape of polished silicon wafer, print pattern according to the principle of balanced grinding, cut out identical shaped polished silicon wafer according to pattern, be bonded on the polished die; 3, adopt numerical control polishing to polish, workpiece spindle and tool spindle all are driving shafts, fixed optics part on the workpiece spindle, fix described polished die on the tool spindle, it is that each endless belt of realizing piece surface has approximate relative linear velocity that the rotating speed of workpiece spindle and tool spindle settles the standard, and the subtended angle of polished die is 2 times of part subtended angle; 4, the colored shape to polished silicon wafer is repaired, to realize quality control.
Advantage of the present invention is: 1, the polished die surface is greater than part, and surperficial face shape is more stable, improves several times service life; 2, the grinding tool surface is more identical with part, and polishing back piece surface fineness ensures easily; 3, adopt the cheap relatively general NC burnishing machine of cost to meet the demands, promote the use of easily; 4, process is convenient to quantize and solidify, and has reduced the dependence to workman's experience.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples.
Accompanying drawing is a schematic diagram of the present invention.
The specific embodiment
The present invention includes the following step is: 1, the aspheric surface part before the polishing is by the optics machining center or the moulding of aspheric surface lathe of precision, and surface roughness reaches 1 μ m, and face shape error reaches 0.15 μ m; 2, according to the aspheric surface formula of part, calculate its immediate spherical radius R, utilize computer software to simulate the petal shape of polished silicon wafer according to the principle of balanced grinding, print pattern, cut out identical shaped polished silicon wafer according to pattern, be bonded on the polished die, described polished silicon wafer is the damping cloth of thickness 1.2mm; 3, adopt numerical control polishing to polish, workpiece spindle and tool spindle all are driving shafts, fixed optics part on the workpiece spindle, fix described polished die on the tool spindle, it is that each endless belt of realizing piece surface has approximate relative linear velocity that the rotating speed of workpiece spindle and tool spindle settles the standard, and the subtended angle of polished die is 2 times of part subtended angle; 4, the colored shape to polished silicon wafer is repaired, to realize quality control.
Major parameter in the processing is selected: workpiece spindle rotating speed 30～50n/min, and tool spindle rotating speed 70～100n/min, the horizontal amplitude of oscillation 3～8mm of workpiece spindle, the horizontal wobble frequency per minute of workpiece spindle 10-20 time, operating pressure 0.5Mpa, be 3～8min process time.Progressively fix concrete technological parameter by examination processing.
Claims (3)
1, a kind of large die polishing method of infrared aspheric surface optical accessory, it is characterized in that: comprise the following steps to be: 1, the aspheric surface part (3) before the polishing is by the optics machining center or the moulding of aspheric surface lathe of precision, surface roughness reaches 1 μ m, and face shape error reaches 0.15 μ m; 2, aspheric surface formula according to aspheric surface part (3), calculate its immediate spherical radius R, utilize computer software to simulate the petal shape of polished silicon wafer (2) according to the principle of balanced grinding, print pattern, cut out identical shaped polished silicon wafer (2) according to pattern, be bonded at polished die (5) last 3, adopt numerical control polishing to polish, workpiece spindle (4) all is a driving shaft with tool spindle (1), workpiece spindle (4) is gone up fixedly aspheric surface part (3), tool spindle (1) is gone up fixing described polished die (5), the polished die surface is greater than part, it is that each endless belt of realizing aspheric surface part (3) surface has approximate relative linear velocity that the rotating speed of workpiece spindle (4) and tool spindle (1) settles the standard, and the subtended angle of polished die (5) is 2 times of aspheric surface part (3) subtended angle; 4, the colored shape to polished silicon wafer (2) is repaired, to realize quality control.
2, finishing method according to claim 1 is characterized in that: described polished silicon wafer (2) is the damping cloth of thickness 1.2mm.
3, finishing method according to claim 1, it is characterized in that: the rotating speed 30～50n/min of workpiece spindle (4), rotating speed 70～the 100n/min of tool spindle (1), the horizontal amplitude of oscillation 3～8mm of workpiece spindle (4), the horizontal wobble frequency per minute of workpiece spindle (4) 10-20 time, operating pressure 0.5Mpa, be 3～8min process time.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101853001A CN100566934C (en) | 2007-11-24 | 2007-11-24 | The large die polishing method of infrared aspheric surface optical accessory |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101853001A CN100566934C (en) | 2007-11-24 | 2007-11-24 | The large die polishing method of infrared aspheric surface optical accessory |
Publications (2)
| Publication Number | Publication Date |
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| CN101168239A CN101168239A (en) | 2008-04-30 |
| CN100566934C true CN100566934C (en) | 2009-12-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2007101853001A Active CN100566934C (en) | 2007-11-24 | 2007-11-24 | The large die polishing method of infrared aspheric surface optical accessory |
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Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101941169B (en) * | 2010-08-25 | 2012-10-10 | 重庆川仪自动化股份有限公司 | Method for polishing spherical surfaces of cylindrical sapphire lens |
| CN102139465B (en) * | 2010-09-16 | 2012-11-07 | 湖南大学 | High-efficiency ultra-precision machining method for parts with aspheric curved surfaces and high-efficiency ultra-precision machining device therefor |
| CN102975136B (en) * | 2012-12-26 | 2015-08-26 | 西安北方捷瑞光电科技有限公司 | A kind of preparation method of high speed compound polished die |
| CN103481155A (en) * | 2013-08-23 | 2014-01-01 | 中国航天科工集团第三研究院第八三五八研究所 | Numerical control machining method of Si aspherical lens |
| CN105252379A (en) * | 2015-10-30 | 2016-01-20 | 福建福晶科技股份有限公司 | Polishing repairing method for removing prints on glass spherical lens |
| CN109514384A (en) * | 2018-11-07 | 2019-03-26 | 西安工业大学 | The polishing method and device of aspherical optical element |
| CN109909871B (en) * | 2019-04-23 | 2024-04-16 | 蚌埠中光电科技有限公司 | Glass tin face micro-wave texture grinding and polishing device |
| CN110990968B (en) * | 2019-11-26 | 2023-08-11 | 天津津航技术物理研究所 | Design method for high-speed polishing process parameters of spherical optical lens |
| CN112059812B (en) * | 2020-08-05 | 2022-02-18 | 中国工程物理研究院激光聚变研究中心 | Optical cone grinding and polishing device and method |
| CN112157532A (en) * | 2020-09-29 | 2021-01-01 | 中国航发动力股份有限公司 | Pipe joint repairing device and using method thereof |
| CN115464349A (en) * | 2022-06-10 | 2022-12-13 | 眉山博雅新材料股份有限公司 | Mould processing method and system |
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2007
- 2007-11-24 CN CNB2007101853001A patent/CN100566934C/en active Active
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| CN101168239A (en) | 2008-04-30 |
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Address after: 056002 Hebei Province, Handan city Congtai District Lianfang Road No. 32 Patentee after: Hebei Hanguang Heavy Industry Ltd. Address before: 056028 Hebei Province, Handan city Congtai District Lianfang Road No. 32 Patentee before: State-OPerated Hanguang Machinery Plant |