CN112059812B - Optical cone grinding and polishing device and method - Google Patents

Optical cone grinding and polishing device and method Download PDF

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Publication number
CN112059812B
CN112059812B CN202010776279.8A CN202010776279A CN112059812B CN 112059812 B CN112059812 B CN 112059812B CN 202010776279 A CN202010776279 A CN 202010776279A CN 112059812 B CN112059812 B CN 112059812B
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polishing
cone
plane
speed
processed
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CN112059812A (en
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鲍振军
杨李茗
朱衡
李智钢
蔡红梅
崔建朋
周衡
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Laser Fusion Research Center China Academy of Engineering Physics
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Laser Fusion Research Center China Academy of Engineering Physics
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B13/00—Machines or devices designed for grinding or polishing optical surfaces on lenses or surfaces of similar shape on other work; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/02—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces
    • B24B29/04—Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents designed for particular workpieces for rotationally symmetrical workpieces, e.g. ball-, cylinder- or cone-shaped workpieces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B45/00—Means for securing grinding wheels on rotary arbors
    • B24B45/003—Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/006—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B5/00—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor
    • B24B5/02—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work
    • B24B5/14—Machines or devices designed for grinding surfaces of revolution on work, including those which also grind adjacent plane surfaces; Accessories therefor involving centres or chucks for holding work for grinding conical surfaces, e.g. of centres

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

The invention belongs to the field of optical device processing, and discloses an optical cone grinding and polishing device and method. The device comprises a support frame, a movable mechanism, a thimble, a plane polishing disc and a polishing disc motor; the movable mechanism is arranged on the support frame and has two degrees of freedom: a first degree of freedom in which the end rotates, and a second degree of freedom in which the center of rotation is perpendicular to the axis of rotation of the end; the end part of the movable mechanism is used for connecting a cone to be processed; the thimble is positioned in a plane where a rotating shaft at the end part of the movable mechanism moves in the second degree of freedom; the plane polishing disc is in universal connection with the ejector pins, the ejector pins are connected with a polishing disc motor shaft, and a polishing material layer is arranged on the surface of the plane polishing disc. And the cone is connected to the shaft end of the movable mechanism, the contour line of the cone is adjusted to be horizontal, the cone is polished in a spiral line track around the axis of the cone, and the rotating speed of the cone is controlled according to the pressure born by the plane polishing disk, the moving speed, the rotating speed, the swinging speed and the amplitude of the plane polishing disk.

Description

Optical cone grinding and polishing device and method
Technical Field
The invention relates to the field of optical device processing, in particular to an optical cone grinding and polishing device and a polishing method.
Background
The laser applied to the fields of aviation, aerospace, military, national defense and the like has the requirements of miniaturization and light weight, and the principle and the structure of the leading laser are greatly changed, so that a large number of heterogeneous optical elements are needed in the design of the laser, wherein conical elements are increasingly applied due to the special optical properties of the conical elements, and in the application environment of high-energy laser, in order to ensure the quality of laser beams, the elements are required to have extremely high mechanical precision and optical index requirements.
Disclosure of Invention
The invention aims to: aiming at the existing problems, the device and the method for grinding and polishing the optical cone are provided to realize shape-preserving quick polishing and precise shape modification of the optical cone.
The technical scheme adopted by the invention is as follows:
an optical cone grinding and polishing device comprises a support frame, a movable mechanism, a polishing disc motor, a thimble and a plane polishing disc; the movable mechanism is arranged on the support frame, and the movable mechanism has two movable degrees of freedom: a first degree of freedom in which the end rotates, and a second degree of freedom in which the center of rotation is perpendicular to the axis of rotation of the end; the end part of the movable mechanism is used for connecting a cone to be processed; the thimble is positioned in a plane where a rotating shaft at the end part of the movable mechanism moves in a second degree of freedom; the plane polishing disc is in universal connection with the ejector pins, the ejector pins are connected with the shaft end of a polishing disc motor, and a polishing material layer is arranged on the surface of the plane polishing disc.
Before polishing, the cone is connected to the end (shaft end) of the movable mechanism, and the thimble is adjusted to a proper position. During polishing, the plane polishing disc is rotated under the drive of the polishing disc motor, and in the rotating process of the plane polishing disc, the whole surface of a polishing material layer has a processing effect, and meanwhile, the polishing disc and a cone have a mutual polishing effect, so that the polishing disc and the cone are prevented from being in line contact in the cone polishing process, the action area is small, the abrasion of a polishing die layer is serious, the surface of the plane polishing disc is not matched with the surface of the processed cone after the contact area is enlarged, and the removal amount of the material is unstable.
Further, the movable mechanism comprises an axial driving mechanism and a turnover driving mechanism; the overturning driving mechanism is arranged on the supporting frame, the axial driving mechanism is connected to a rotating shaft of the overturning driving mechanism, and the rotating shaft of the axial driving mechanism is perpendicular to the rotating shaft of the overturning driving mechanism. The axial driving mechanism is a mechanism for driving the cone to rotate automatically, and the overturning driving mechanism is a mechanism for driving the axial driving mechanism to overturn (further driving the cone to overturn) around the shaft of the overturning driving mechanism, so that the movement of two mutually perpendicular degrees of freedom is realized.
Further, the axial driving mechanism comprises a driving motor, a driving speed reducer and a connecting disc, the driving motor is connected with the driving speed reducer, and the connecting disc is arranged at the output shaft end of the driving speed reducer; the axial driving mechanism is hinged to the supporting frame through a connecting block, and a rotating shaft of the connecting block is connected to a rotating shaft of the overturning driving mechanism.
Furthermore, the overturning driving mechanism comprises an overturning motor, an overturning reducer, a worm and a turbine, the overturning motor is connected with the overturning reducer, the worm is connected to the output shaft end of the overturning reducer, the turbine and the worm are installed in a matching mode, and the axial driving mechanism is connected with the rotation center of the turbine. Through a worm-turbine transmission mode (instead of an axial connection mode), the structure and the position of the overturning driving mechanism are convenient to design, and the structural design of the polishing device is more flexible.
The invention provides a grinding and polishing machine tool, which comprises a rack and the optical cone grinding and polishing device; the support frame of the optical cone grinding and polishing device is arranged on the rack, a motor mounting shaft is further arranged on the rack, and a polishing disc motor of the optical cone grinding and polishing device is arranged on the motor mounting shaft.
The invention also provides an optical cone polishing method, which adopts the optical cone grinding and polishing device to polish the cone to be processed, and the polishing path is a spiral line taking the axis of the cone to be processed as the central line.
Further, in the process of polishing the cone to be processed, the rotating speed of the end part of the movable mechanism is controlled according to the pressure born by the plane polishing disk, the rotating speed, the moving speed, the swinging speed and the amplitude of the plane polishing disk.
Further, the pressure distribution p (x, y) of the flat polishing disk (2) and the cone at any point d (x, y) on the whole contact area is calculated by the following method:
Figure BDA0002618532570000031
wherein P is the pressure acting on the plane polishing disk (2), l (x) is the contact half-width of the plane polishing disk and the cone to be processed along the x axis on the whole contact area, and D is the diameter of the plane polishing disk.
Further, the speed of the plane polishing disk (2) and the cone at any point d (x, y) on the whole contact area is calculated by the following method:
Figure BDA0002618532570000032
wherein, wlIs the rotational angular velocity, v, of the flat polishing disc (2)xThe swing speed of the plane polishing disk (2) along the x axis is adopted.
Further, the method for calculating the residence time t (x, y) of the fixed-point machining of the plane polishing disk (2) in one reciprocating motion cycle comprises the following steps:
Figure BDA0002618532570000033
wherein e is the swing amplitude of the plane polishing disk, D is the diameter of the plane polishing disk, vxThe swing speed of the plane polishing disk (2) along the x axis is adopted.
Further, in the process of polishing the cone by the plane polishing disk (2), according to a Preston equation, based on the pressure distribution and the movement speed of the plane polishing disk (2) and the cone at any point on the whole contact area and the residence time of the plane polishing disk (2) in a reciprocating motion period in fixed point machining, the material removal amount is calculated.
Further, to achieve consistent removal of surface material throughout the process, the rotational speed w of the movable mechanism tip is adjustedeThe control mechanism of (1) is as follows: controlling the rotating speed of the end part of the movable mechanism (namely the first degree of freedom of the movable mechanism) at different processing positions so as to satisfy the following relation at each processing position:
Figure BDA0002618532570000041
wherein h is1，h2，h3…hnIndicating the material removal rate, w, of any machined location of the conee1，we2，we3…wenIndicates the corresponding rotation speed, S, of each machining position1，S2，S3…SnThe contact area between the plane polishing disk (2) and the cone (4) to be processed at each processing position is shown.
Further, in order to realize the precise shape modification of the processed surface, the rotating speed w of the processed cone is controlledeThe residence time of the polishing disk at the position of the surface-shaped high point of the processed element is long, the high points are removed more, and the rotating speed w of the end part of the movable mechanism is adjustedeThe control mechanism of (1) is as follows: controlling the rotating speed of the end part of the movable mechanism at different processing positions so that the following relation is satisfied at each processing position:
Figure BDA0002618532570000042
wherein h is1，h2，h3…hnIndicating the material removal rate, w, of any machined location of the conee1，we2，we3…wenIndicates the corresponding rotation speed, S, of each machining position1，S2，S3…SnA plane polishing disk (2) and a cone to be processed for each processing position(4) Contact area of H1，H2，H3…HnThe height of the face at each machining position of the cone is shown.
Furthermore, before polishing the cone to be processed, the large end of the cone to be processed is connected to the shaft end of the movable mechanism of the optical cone grinding and polishing device, and the contour line of the conical surface of the cone to be processed is adjusted to be in a horizontal state by adjusting the second degree of freedom of the movable mechanism.
The conical surface is kept in a horizontal state, so that the distribution uniformity of polishing liquid when the polishing liquid is scattered on an element is ensured, namely the consistency of the removal speed of the material is ensured.
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
1. the polishing device designed by the invention can control two degrees of freedom of rotation and overturning of the cone, the swinging/moving of the plane polishing disk is matched with the rotation of the cone, and the shape-preserving quick polishing and precise shape modification of the cone can be realized.
2. According to the polishing device designed by the invention, in the rotation process of the plane polishing disc, the whole surface of the polishing material layer has a processing effect, and meanwhile, the polishing disc and the cone have a mutual polishing effect, so that the problems that the contact area between the polishing disc and the cone is small in the cone polishing process, the polishing die layer is seriously abraded, the surface of the plane polishing disc is not matched with the surface of the processed cone after the contact area is enlarged, and the material removal amount is unstable can be solved. The surface of the whole polishing disk is fully utilized, and the service life of the polishing disk and the stability of material removal are prolonged.
3. The polishing device and the corresponding polishing method designed by the invention can adjust the contour line of the conical surface of the cone to be in a horizontal state, so that the processed area of the conical surface is always horizontal when being processed, the distribution uniformity of polishing liquid when being scattered on an element is ensured, and the consistency of the removal speed of the material is ensured.
4. The polishing method of the invention adopts a method of controlling (changing and controlling according to the processing point position) the rotation speed of the cone, and can control the whole surface material to be uniformly removed or to be shaped and processed according to the height of the surface shape.
Drawings
The invention will now be described, by way of example, with reference to the accompanying drawings, in which:
FIG. 1 is a schematic structural diagram of an optical cone lapping and polishing device.
Fig. 2 is a schematic view of the structure of the grinding and polishing machine.
Fig. 3 is a three-view of a conical viewing angle.
In the figure, 1-thimble, 2-plane polishing disk, 3-polishing material layer, 4-cone, 5-connecting disk, 6-driving reducer, 7-connecting block, 8-supporting frame, 9-driving motor, 10-turbine, 11-worm, 12-overturning reducer, 13-overturning motor, 14-frame, 15-motor mounting shaft, 16-polishing disk motor.
Detailed Description
All of the features disclosed in this specification, or all of the steps in any method or process so disclosed, may be combined in any combination, except combinations of features and/or steps that are mutually exclusive.
Any feature disclosed in this specification (including any accompanying claims, abstract) may be replaced by alternative features serving equivalent or similar purposes, unless expressly stated otherwise. That is, unless expressly stated otherwise, each feature is only an example of a generic series of equivalent or similar features.
Example one
The embodiment discloses an optical cone grinding and polishing device, which is shown in the attached figure 1 and comprises a support frame 8, a movable mechanism, a thimble 1, a plane polishing disc 2 and a polishing disc motor 16; the movable mechanism is mounted on the support frame 8, and the movable mechanism has two degrees of freedom: a first degree of freedom in which the end rotates, and a second degree of freedom in which the center of rotation is perpendicular to the axis of rotation of the end; the end part of the movable mechanism is used for connecting a cone to be processed; the thimble 1 is positioned in a plane where a rotating shaft at the end part of the movable mechanism moves in a second degree of freedom; the plane polishing disk 2 is in universal connection with the ejector pin 1, the ejector pin 1 is driven by a polishing disk motor 16, and the surface of the plane polishing disk 2 is provided with a polishing material layer 3.
In specific implementation, referring to fig. 1, the optical cone grinding and polishing apparatus includes a support frame 8, an axial driving mechanism, a turnover driving mechanism, a polishing disk motor 16, a thimble 1, a planar polishing disk 2, and a polishing material layer 3. The overturning driving mechanism is arranged on the support 8, the axial driving mechanism is connected to a rotating shaft of the overturning driving mechanism, the rotating shaft of the axial driving mechanism is perpendicular to the rotating shaft of the overturning driving mechanism, and the axial driving mechanism overturns under the action of the overturning driving mechanism. The polishing material layer 3 is connected to the plane polishing disk 2, and the plane polishing disk 2 is connected with the thimble 1 in a universal manner. The thimble 1 is positioned in the turning plane of the rotating shaft of the axial driving mechanism and is driven to rotate by a polishing disk motor 16. The rotating shaft of the axial driving mechanism is used for installing the large end of the cone 4 so as to drive the cone 4 to rotate, and the thimble 1 is matched with the axial driving mechanism so that the polishing material layer 3 acts on the conical surface of the cone 4. The thimble 1 is connected with the plane polishing disk 2 in a universal mode, the plane polishing disk 2 rotates under the driving of the polishing disk motor 16, the surface of the whole polishing disk is fully utilized by the mode, and the service life of the polishing disk is prolonged, and the material removal stability is improved.
According to the grinding and polishing device, the control of the material removal rate, the polishing processing path and the residence time is completed by setting the corresponding ejector pin pressure, the rotating speed of the polishing disc, the ejector pin moving speed, the swing amplitude and speed, the rotating speed of the axial driving mechanism, the output angle of the turnover driving mechanism and the like. The realization process is as follows:
the polishing material layer 3 is usually made of materials such as asphalt, damping cloth, polyurethane polishing pad, etc., the polishing material layer 3 is elastically deformed under the action of processing pressure, the contact between the polishing material layer and the cone 4 is changed from static line contact into trapezoidal surface contact, the size of the contact area and the pressure distribution of the contact area are obtained according to the elastic deformation theory, the data of the size of the contact area and the surface pressure distribution are applied, a theoretical removal function model of conical surface polishing is calculated and obtained by utilizing a Preston material removal theoretical equation, and the theoretical removal function model is used as a basic basis for removing the polishing material to perform path planning and control of the resident processing time, and the specific process is as follows.
As shown in FIG. 3, which is a three-dimensional view of the polishing process of the component, the contact between the planar polishing disk 2 and the component (i.e., the cone 4) is linear-to-circular in the y-z section, and corresponds to Hertz contactContact half width l of polishing disk with diameter D deformed under pressure P0And contact area pressure distribution (since the modulus of elasticity of the polishing pad material is much greater than the modulus of elasticity of the polishing layer material, the deformation of the polishing pad is ignored here, and it is assumed that the polishing pressure is uniformly distributed on the polishing layer material after being transmitted through the polishing pad):
Figure BDA0002618532570000071
Figure BDA0002618532570000072
according to the Hertz's theory of contact, the equivalent radius R of the curved contact surface area formed after the contact of the two surfaces0Comprises the following steps:
Figure BDA0002618532570000073
R1is the surface radius of the polishing disk, R2Radius of the contact circle in the y-z surface of the cone, R since the polishing disk is planar1Is ∞ so that R0＝R2。
Figure BDA0002618532570000074
Wherein E1，E2Modulus of elasticity, v, of polishing pad and element, respectively1，v1Is the poisson ratio of the polishing disc and the element.
In the x-axis direction, the contact between the plane and the cone is the contact between the plane and the cylinder in the unit length, so the contact half width l (x) along the x-axis and the pressure distribution p (x, y) at any point d (x, y) on the whole contact area have:
Figure BDA0002618532570000081
Figure BDA0002618532570000082
the polishing disk is moved at an angular velocity w during processinglWhile rotating, at a speed v along the x-axisxThe swing amplitude e swings back and forth, and the speed v of any point d (x, y) of the contact area is as follows:
Figure BDA0002618532570000083
the residence time in one reciprocating motion period of fixed point processing is as follows:
Figure BDA0002618532570000084
according to the Preston removal equation, the removal amount h of the material is proportional to the pressure p, the velocity v and the residence time, and is represented by the following formula, wherein K is a proportionality coefficient, and the value of K is related to parameters such as the property of the processed material, the property of the material of the polishing film layer, the granularity and concentration of the polishing solution, the polishing temperature and the like:
h＝Kpvt
using the analysis results of the pressure, velocity, and dwell time, the material removal h in one motion cycle is:
Figure BDA0002618532570000085
using the above calculation results of the material removal efficiency, the following method is used to plan the processing path and the residence time of the whole component:
the machining path of the element is a spiral line taking the axis of the cone as the center, and the uniform removal of materials or the high-low precision shape modification of the surface shape is realized by controlling the rotating speed according to the parameters of the material removal rate, the contact area, the surface shape of the element to be machined and the like.
For uniform removal of surface material throughout the process, the ends of the movable body being adaptedRotational speed weThe control mechanism of (1) is as follows: controlling the rotating speed of the axial driving mechanism at different machining points so that the following relation is satisfied at each machining position:
Figure BDA0002618532570000091
wherein h is1，h2，h3…hnIndicating the material removal rate, w, of any machined location of the conee1，we2，we3…wenIndicates the corresponding rotation speed, S, of each machining position1，S2，S3…SnThe contact area between the plane polishing disk (2) and the cone (4) to be processed at each processing position is shown.
For realizing precise shaping of the processed surface, the rotating speed w of the processed cone is controlledeThe residence time of the polishing disk at the position of the surface-shaped high point of the processed element is long, the high points are removed more, and the rotating speed w of the end part of the movable mechanism is adjustedeThe control mechanism of (1) is as follows: controlling the rotating speed of the axial driving mechanism at different machining points so that the following relation is satisfied at each machining position:
Figure BDA0002618532570000092
h. w and S have the same meanings as in the above examples, H1，H2，H3…HnThe height of each face shape at each machining position of the cone is shown.
Before machining, the overturning driving mechanism is firstly controlled to adjust the contour line of the conical surface of the cone to be in a horizontal state, so that the machined area of the conical surface is always horizontal when the conical surface is machined, the distribution uniformity of polishing liquid when the polishing liquid is scattered on an element is ensured, and the consistency of the material removal speed is ensured.
Theoretically, the axial driving mechanism and the overturning driving mechanism only need to be matched to complete the rotation and the overturning of the cone. In the present embodiment, as shown in fig. 1 and 2, preferably, the axial driving mechanism is mounted on the support frame 8, the axial driving mechanism includes a driving motor 9, a driving reducer 6 and a connecting disc 5, the driving motor 9 is connected to the driving reducer 6, and the connecting disc 5 is disposed at an output shaft end of the driving reducer 6. The axial driving mechanism is hinged on the supporting frame 8 through a connecting block 7, and a rotating shaft of the connecting block 7 is connected with a rotating shaft of the overturning driving mechanism.
In one embodiment, as shown in fig. 1 and 2, the turnover driving mechanism comprises a turnover motor 13, a turnover reducer 12, a worm 11 and a worm wheel 10, wherein the turnover motor 13 is connected with the turnover reducer 12, the worm 11 is connected with an output shaft end of the turnover reducer, the worm wheel 10 is matched with the worm 11, and the axial driving mechanism is connected with a rotation center of the worm wheel 10. The axial driving mechanism corresponding to the above structure is such that the rotating shaft of the connecting block 7 is connected to the rotating center of the turbine 10. The turning motor 13 drives the mechanism consisting of the worm 11 and the worm wheel 10 to rotate through the turning reducer 12, and the axial driving mechanism connected to the rotation center of the worm wheel 10 turns around the rotation center.
Example two
The embodiment discloses a grinding and polishing machine tool, as shown in fig. 2, which includes a frame 14 and an optical cone grinding and polishing device in the above embodiment, wherein a supporting frame 8 of the optical cone grinding and polishing device is mounted on the frame 14, a polishing disc motor mounting shaft 15 is further arranged on the frame 14, and a polishing disc motor 16 of the optical cone grinding and polishing device is mounted on the polishing disc motor mounting shaft 15. Obviously, the position of the polishing disc motor mounting shaft 15 needs to correspond to the position of the mounting support frame 8, so that the last ejector pin 1 corresponds to the position of the output shaft of the axial driving mechanism (i.e. the shaft end of the movable mechanism).
In one embodiment, the frame is a single-shaft grinding and polishing machine frame, and the polishing disk motor mounting shaft is in a swing shaft structure, that is, a polishing disk motor of the polishing device is connected to a swing frame of the frame.
In another embodiment, the machine frame is a three-axis numerical control polishing machine, the mounting shaft of the polishing disk motor is a Z axis of the numerical control machine, the polishing disk motor is programmed according to the polishing method during processing, and a numerical control system of the numerical control machine controls the rotation and the movement of the polishing disk and the processed cone to realize the control of the residence time, namely the material removal amount.
EXAMPLE III
In an embodiment, as shown in fig. 2, for the case that the frame is a single-shaft grinding and polishing machine frame, a method of polishing a workpiece with a full aperture (the size of the polishing disk is equivalent to the size of the workpiece) is designed, and a method of polishing a workpiece quickly is designed.
In another embodiment, in the case of a three-axis numerically controlled machine tool, a control method of precise shaping is designed by using a method of sub-aperture polishing (the size of the polishing disk is much smaller than that of the element to be processed), the polishing path is a spiral line taking the axis of the cone to be processed as the central line, and the rotating speed of the axial driving mechanism is controlled according to the rotating speed, the moving speed, the swinging speed and the amplitude of the plane polishing disk 2 during the polishing process.
First, the pressure distribution of the polishing device/machine tool during polishing the conical surface is determined, as shown in fig. 3, which is a three-view diagram of the conical polishing process, the contact between the polishing disk and the element (i.e. the cone) is a straight line contact with a circle, which meets the contact condition between a plane and a cylinder of the hertzian contact theory, and the contact half-width l of the polishing disk with the diameter D after deformation under the action of the pressure P is determined0And contact area pressure distribution (since the modulus of elasticity of the polishing pad material is much greater than the modulus of elasticity of the polishing layer material, the deformation of the polishing pad is ignored here, and it is assumed that the polishing pressure is uniformly distributed on the polishing layer material after being transmitted through the polishing pad):
Figure BDA0002618532570000111
Figure BDA0002618532570000112
according to the Hertz's theory of contact, the equivalent radius R of the curved contact surface area formed after the contact of the two surfaces0Comprises the following steps:
Figure BDA0002618532570000113
R1is the surface radius of the polishing disk, R2Radius of the contact circle in the y-z surface of the cone, R since the polishing disk is planar1Is ∞ so that R0＝R2。
Figure BDA0002618532570000114
Wherein E1，E2Modulus of elasticity, v, of polishing pad and element, respectively1，v1Is the poisson ratio of the polishing disc and the element.
In the x-axis direction, the contact between the plane and the cone is the contact between the plane and the cylinder in the unit length, so the contact half width l (x) along the x-axis and the pressure distribution p (x, y) at any point d (x, y) on the whole contact area have:
Figure BDA0002618532570000121
Figure BDA0002618532570000122
then, a conical polishing material removal rate is calculated based on the calculated pressure distribution, and the moving speed, the rotating speed, and the swing amplitude of the planar polishing disk.
The movement mode of the polishing disc during processing is as follows: at an angular velocity wlWhile rotating, at a speed v along the x-axisxAnd the swinging amplitude e swings back and forth, and the speed v of any point d (x, y) of the contact area is as follows:
Figure BDA0002618532570000123
the residence time in one reciprocating motion period of fixed point processing is as follows:
Figure BDA0002618532570000124
according to the Preston removal equation, the amount of material removed h is proportional to the pressure P, velocity v and residence time, and is represented by the following equation, K being the proportionality coefficient:
h＝Kpvt
using the analysis results of the pressure, velocity, and dwell time, the material removal h in one motion cycle is:
Figure BDA0002618532570000125
and finally, designing the rotating speeds at different polishing points based on the calculated material removal rate.
For uniform removal of surface material throughout the process, the speed of rotation w of the moving mechanism endeThe control mechanism of (1) is as follows: controlling the rotating speed of the axial driving mechanism at different machining points so that the following relation is satisfied at each machining position:
Figure BDA0002618532570000131
wherein h is1，h2，h3…hnIndicating the material removal rate, w, of any machined location of the conee1，we2，we3…wenIndicates the corresponding rotation speed, S, of each machining position1，S2，S3…SnThe contact area between the plane polishing disk (2) and the cone (4) to be processed at each processing position is shown.
For realizing precise shaping of the processed surface, the rotating speed w of the processed cone is controlledeRealizing long residence time of the polishing disk at the position of the surface-shaped high point of the processed element and realizing multi-point removal of the high pointRotational speed w of the end of the moving bodyeThe control mechanism of (1) is as follows: controlling the rotating speed of the axial driving mechanism at different machining points so that the following relation is satisfied at each machining position:
Figure BDA0002618532570000132
h. w and S have the same meanings as in the above examples, H1，H2，H3…HnThe height of the face at each machining position of the cone is shown.
Wherein the movement and oscillation of the polishing disc is effected by movement and oscillation of the x-axis of the machine tool.
Thus, the design of the polishing method is completed.
Based on the polishing method of the design, this embodiment also discloses a cone polishing method using the above optical cone grinding and polishing device, where the cone polishing method takes a movable mechanism including an axial driving mechanism and an inversion driving mechanism as an example (the other same types of structures are the same), and includes:
connecting the cone to an axial drive mechanism (shaft end) of the optical cone grinding and polishing device; the contour line of the conical surface of the cone to be processed is adjusted to be in a horizontal state by controlling the turnover driving mechanism, so that the processed area of the conical surface is always horizontal when the conical surface is processed, the distribution uniformity of polishing liquid when the polishing liquid is scattered on an element is ensured, and the consistency of the material removal speed is ensured.
And then polishing the cone to be processed according to the designed polishing method.
The invention is not limited to the foregoing embodiments. The invention extends to any novel feature or any novel combination of features disclosed in this specification and any novel method or process steps or any novel combination of features disclosed.

Claims (9)

1. An optical cone polishing method is characterized in that an optical cone grinding and polishing device is adopted to polish a cone to be processed, and a polishing path is a spiral line taking the axis of the cone to be processed as a central line;
the optical cone grinding and polishing device comprises a support frame (8), a movable mechanism, a polishing disc motor (16), a thimble (1) and a plane polishing disc (2); the movable mechanism is arranged on the support frame (8), and the movable mechanism has two movable degrees of freedom: a first degree of freedom in which the end rotates, and a second degree of freedom in which the center of rotation is perpendicular to the axis of rotation of the end; the end part of the movable mechanism is used for connecting a cone to be processed; the thimble (1) is positioned in a plane where a rotating shaft at the end part of the movable mechanism moves in a second degree of freedom; the plane polishing disc (2) is in universal connection with the ejector pin (1), the ejector pin (1) is connected with the shaft end of a polishing disc motor (16), and a polishing material layer (3) is arranged on the surface of the plane polishing disc (2);
in the process of polishing the cone to be processed, controlling the rotating speed of the end part of the movable mechanism according to the pressure born by the plane polishing disk (2), the rotating speed, the moving speed, the swinging speed and the amplitude of the plane polishing disk (2):
to the rotation speed of the end of the movable mechanismw e The control mechanism of (1) is as follows: controlling the rotating speed of the end part of the movable mechanism at different processing positions so that the following relation is satisfied at each processing position:
Figure 277700DEST_PATH_IMAGE001
wherein,h 1 ，h 2 ，h 3 …h n indicating the material removal rate of any machined location of the cone,w e1 ，w e2 ，w e3 …w en the rotating speed corresponding to each processing position is shown,S 1 ，S 2 ，S 3 …S n the contact area between the plane polishing disk (2) and the processed cone (4) at each processing position is shown;
or, the rotation speed of the end part of the movable mechanismw e The control mechanism of (1) is as follows: controlling the rotating speed of the end part of the movable mechanism at different processing positions so that the following relation is satisfied at each processing position:
Figure 672909DEST_PATH_IMAGE002
wherein,h 1 ，h 2 ，h 3 …h n indicating the material removal rate of any machined location of the cone,w e1 ，w e2 ，w e3 …w en the rotating speed corresponding to each processing position is shown,S 1 ，S 2 ，S 3 …S n showing the contact area of the plane polishing disk (2) and the cone (4) to be processed at each processing position,H 1 ，H 2 ，H 3 …H n the height of each face shape at each machining position of the cone is shown.
2. The optical taper polishing method according to claim 1, wherein the plane polishing plate (2) and the taper are formed at any point over the entire contact aread(x,y)Pressure distribution ofp(x,y)The calculation method comprises the following steps:
Figure 424964DEST_PATH_IMAGE003
wherein,Pin order to apply a pressure on the flat polishing plate (2),l(x)for the flat polishing disc to contact with the cone to be machined over the entire contact areaxThe contact half-width of the shaft,Dis the flat polishing disk diameter.
3. The optical cone polishing method of claim 1,the plane polishing disk (2) and the cone are arranged at any point on the whole contact aread(x,y)The speed of (2) is calculated by:
Figure 247427DEST_PATH_IMAGE004
wherein,w l is the rotation angular speed of the plane polishing disk (2),v x the swing speed of the plane polishing disk (2) along the x axis is adopted.
4. The optical taper polishing method according to claim 1, wherein said flat polishing disk (2) is spot-machined for a dwell time within one cycle of reciprocating motiont(x,y) The calculation method comprises the following steps:
Figure 514460DEST_PATH_IMAGE005
wherein,ein order to be the amplitude of oscillation of the flat polishing disk,Din order to obtain the diameter of the plane polishing disk,v x the swing speed of the plane polishing disk (2) along the x axis is adopted.
5. The optical cone polishing method according to any one of claims 1 to 4, characterized in that during the polishing of a cone by the flat polishing disk (2), a material removal amount is calculated based on a pressure distribution and a moving speed of the flat polishing disk (2) and the cone at any point over the entire contact area and a dwell time of the flat polishing disk (2) in a reciprocating period of fixed-point machining according to the Preston's equation.
6. The optical cone polishing method according to any one of claims 1 to 4, wherein before polishing the cone to be processed, the large end of the cone to be processed is connected to the shaft end of the movable mechanism of the optical cone polishing apparatus, and the contour line of the conical surface of the cone to be processed is adjusted to a horizontal state by adjusting the second degree of freedom of the movable mechanism.
7. The optical cone polishing method of claim 1 wherein said moving mechanism comprises an axial drive mechanism and a tumble drive mechanism; the overturning driving mechanism is arranged on the supporting frame (8), the axial driving mechanism is connected to a rotating shaft of the overturning driving mechanism, and the rotating shaft of the axial driving mechanism is perpendicular to the rotating shaft of the overturning driving mechanism.
8. The optical cone polishing method according to claim 7, characterized in that the axial driving mechanism comprises a driving motor (9), a driving reducer (6) and a connecting disc (5), the driving motor (9) is connected with the driving reducer (6), and the connecting disc (5) is arranged at the output shaft end of the driving reducer (6); the axial driving mechanism is hinged to the supporting frame (8) through a connecting block (7), and a rotating shaft of the connecting block (7) is connected to a rotating shaft of the overturning driving mechanism.
9. The optical cone polishing method as claimed in claim 7 or 8, characterized in that the turnover driving mechanism comprises a turnover motor (13), a turnover reducer (12), a worm (11) and a worm wheel (10), the turnover motor (13) is connected with the turnover reducer (12), the worm (11) is connected with the output shaft end of the turnover reducer, the worm wheel (10) and the worm (11) are installed in a matching way, and the axial driving mechanism is connected with the rotation center of the worm wheel (10).
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