CN100561663C - 湿法蚀刻装置 - Google Patents
湿法蚀刻装置 Download PDFInfo
- Publication number
- CN100561663C CN100561663C CNB2007100374423A CN200710037442A CN100561663C CN 100561663 C CN100561663 C CN 100561663C CN B2007100374423 A CNB2007100374423 A CN B2007100374423A CN 200710037442 A CN200710037442 A CN 200710037442A CN 100561663 C CN100561663 C CN 100561663C
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- CN
- China
- Prior art keywords
- control
- pump
- wet etching
- circulating pump
- control device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Description
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100374423A CN100561663C (zh) | 2007-02-12 | 2007-02-12 | 湿法蚀刻装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007100374423A CN100561663C (zh) | 2007-02-12 | 2007-02-12 | 湿法蚀刻装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101246807A CN101246807A (zh) | 2008-08-20 |
| CN100561663C true CN100561663C (zh) | 2009-11-18 |
Family
ID=39947172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007100374423A Expired - Fee Related CN100561663C (zh) | 2007-02-12 | 2007-02-12 | 湿法蚀刻装置 |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100561663C (zh) |
-
2007
- 2007-02-12 CN CNB2007100374423A patent/CN100561663C/zh not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101246807A (zh) | 2008-08-20 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111116 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20091118 Termination date: 20190212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
