CN100559924C - Liquid circulation type cooling system - Google Patents
Liquid circulation type cooling system Download PDFInfo
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- CN100559924C CN100559924C CNB2004100840176A CN200410084017A CN100559924C CN 100559924 C CN100559924 C CN 100559924C CN B2004100840176 A CNB2004100840176 A CN B2004100840176A CN 200410084017 A CN200410084017 A CN 200410084017A CN 100559924 C CN100559924 C CN 100559924C
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- 239000007788 liquid Substances 0.000 title claims abstract description 211
- 230000004087 circulation Effects 0.000 title claims abstract description 102
- 238000001816 cooling Methods 0.000 title claims abstract description 66
- 239000012530 fluid Substances 0.000 claims abstract description 21
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 7
- 239000006096 absorbing agent Substances 0.000 claims description 15
- 238000011144 upstream manufacturing Methods 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 7
- 230000000630 rising effect Effects 0.000 description 6
- 239000000110 cooling liquid Substances 0.000 description 4
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000008595 infiltration Effects 0.000 description 2
- 238000001764 infiltration Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000012809 cooling fluid Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007115 recruitment Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000009885 systemic effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2250/00—Arrangements for modifying the flow of the heat exchange media, e.g. flow guiding means; Particular flow patterns
- F28F2250/08—Fluid driving means, e.g. pumps, fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to liquid circulation type cooling system.Liquid circulation type cooling system provided by the invention can be provided with this e-machine upside down in lift-launch under the occasion on the e-machine.Formation makes the fluid circulation system that liquid circulates in system when, the heat that will produce from heater is transported to the liquid circulation type cooling system that heat-dissipating space dispels the heat via aforesaid liquid, have the heat exchanger (12) of mid portion (18), reserve tank (16) and reserve tank (17) in the heat-dissipating space setting, liquid outlet is set in the bottom surface of mid portion (18) one sides of reserve tank (17).Like this, even because of the configuration of turning upside down causes reserve tank (17) to be positioned at the top of mid portion (18), the liquid outlet of reserve tank (17) also is full of by liquid always.
Description
Technical field
The present invention relates to the liquid circulation type cooling system that makes liquid in system, circulate and to dispel the heat to heat-dissipating space via liquid transfer by the heat that heater produces, particularly relate to the liquid circulation type cooling system that can be provided with upside down at this e-machine of occasion that carries on e-machine.
Background technology
In recent years, the high performance of e-machine develops rapidly, and particularly the central arithmetic processing apparatus circuit blocks such as (CPU:Central Processing Units) of folding and unfolding in main body or the caloric value increase of supply unit wish to improve the thermal diffusivity to the outside.
As the device that promotes the heater heat radiation, though the metallic fin that thermal conductivity is good is arranged on the heaters such as CPU cooling device with this fin of air cooling by known, but the drawback that the cooling device of air-cooled type exists is, owing to the maximization that need cause device corresponding to the area of dissipation of the fin of heat dissipation capacity.In addition, follow the high-speed computation property handled and the multifunctionality that require e-machine in recent years, the caloric value of CPU has the tendency of increase, and in the cooling device of air-cooled type, thermal diffusivity has almost reached the limit.
As the device that improves thermal diffusivity, known has the liquid circulation type cooling system that uses heat-conducting mediums such as cooling fluid (for example, with reference to patent documentation 1-TOHKEMY 2003-209210 communique, Fig. 2).
Fig. 8 is the schematic drawing in loop of the liquid circulation type cooling system of expression prior art.This liquid circulation type cooling system 50 possesses: the circulating pump 51 that makes liquid circulation; Be connected, effectively heat passed to from cooled object the absorber 53 of liquid with cooled objects such as heater elements; The radiator 52 that is configured in heat-dissipating space, outside the machine basket, dispels the heat; Be arranged on radiator 52 the top, store the reserve tank 56 of the liquid of circulation; Be arranged on the fluid box 57 of the below of radiator 52; The pipeline 54 that connects each parts, constitutes by flexible pipe or rigid pipe and to the fan 55 of radiator 52 blowings carrying out forced air-cooling.
In this liquid circulation type cooling system 50, by driving circulating pump 51 liquid is circulated in circulation circuit, accept the heat that produces by cooled objects such as heater elements and pass to liquid by absorber 53, be transported to radiator 52 and carry out the forced air-cooling heat radiation with fan 55 by the liquid that circulates.
In this liquid circulation type cooling system 50, though reserve tank 56 is to consider from the coupling part of each parts or the liquid infiltration of parts surface etc., for the liquid recoverable amount that makes system is kept constant the setting, but the occasion being provided with near e-machine must adopt the hermetically-sealed construction that prevents fluid seepage.But in closed structure,, the variations in temperature of liquid changes because of can causing intrasystem pressure.Particularly because the temperature of liquid when rising pressure also rise, so, liquid 56A not only is set in reserve tank 56 air layer 56B also is set so that make it can adapt to the rising of pressure.In addition, owing to sneaking under the situation of circulating pump 51 or radiator 52, absorber 53 at air, performance obviously descends, so the position of reserve tank 56 generally is configured in the extreme higher position of system.
Yet, the occasion that the state that is provided with when e-machine uses has been fixed, though the position of reserve tank 56 can be remained on always the top in the machine,, changed the occasion that posture is set, the occasion that promptly turns upside down because of the user arbitrarily uses, reserve tank 56 will be in below.
Fig. 9 represents to make the schematic drawing in the loop of the occasion that the liquid circulation type cooling system 50 of Fig. 8 turned upside down.This occasion, fluid box 57 is positioned at the top of radiator 52, and liquid flows via the direction of fluid box 57 to circulating pump 51 from radiator 52.Yet in fluid box 57, because air layer 57B is in the top of liquid 57A, cause when liquid flows to the pipe arrangement 54 of downstream one side of fluid box 57, air also flows in the pipe arrangement 54.The cyclicity of liquid is descended, cause circulatory function obviously to reduce.
Like this, the situation that the state that is provided with during as the use of e-machine turns upside down can be enumerated for example projector.There is the situation that is keeping flat the occasion of using and be installed in the top in projector, and the occasion liquid circulation type cooling system being carried in projector requires to adapt to the variation (turning upside down) of this posture.
Summary of the invention
Thereby, the object of the present invention is to provide and a kind ofly carrying can the turn upside down liquid circulation type cooling system of this e-machine of occasion on e-machine.To achieve these goals, liquid circulation type cooling system of the present invention, formation makes the fluid circulation system that liquid circulates in system when, to be transported to heat-dissipating space via aforesaid liquid from the heat that heater produces dispels the heat, it is characterized in that: in the upstream of above-mentioned heat-dissipating space one side and downstream one side the reserve tank that stores aforesaid liquid is set respectively, so that one side is full of the liquid outlet of this reserve tank with aforesaid liquid in the downstream in the running of said apparatus always; Also have from above-mentioned heater and will carry out the absorber and the circulating pump that make liquid circulation of heat conducting heat to liquid heat transfer; Connect in the pipe arrangement between above-mentioned reserve tank and above-mentioned circulating pump and the above-mentioned heated body filled with liquid always; Above-mentioned circulating pump is work when liquid circulation always.Also have, to achieve these goals, liquid circulation type cooling system of the present invention, formation makes the fluid circulation system that liquid circulates in system when, to be transported to heat-dissipating space via aforesaid liquid from the heat that heater produces dispels the heat, it is characterized in that: have mid portion and be separately positioned on the heat exchanger of reserve tank up and down of the vertical direction of this mid portion in above-mentioned heat-dissipating space setting, so that in the running of said apparatus, be full of the liquid outlet of the reserve tank of downstream one side that is positioned at above-mentioned mid portion with aforesaid liquid always; Also have from above-mentioned heater and will carry out the absorber and the circulating pump that make liquid circulation of heat conducting heat to liquid heat transfer; Connect in the pipe arrangement between above-mentioned reserve tank and above-mentioned circulating pump and the above-mentioned heated body filled with liquid always; Above-mentioned circulating pump is work when liquid circulation always.In the aforesaid liquid circulating cooling plant, aforesaid liquid also can be full of the liquid introducing port of the reserve tank of upstream one side that is positioned at above-mentioned mid portion always.
Have again, to achieve these goals, liquid circulation type cooling system of the present invention, formation makes the fluid circulation system that liquid circulates in system when, to be transported to heat-dissipating space via aforesaid liquid from the heat that heater produces dispels the heat, it is characterized in that: above-mentioned heat-dissipating space setting have mid portion and be separately positioned on this mid portion horizontal direction about the heat exchanger of reserve tank so that in the running of said apparatus, be full of the liquid outlet of the reserve tank of downstream one side that is positioned at above-mentioned mid portion with aforesaid liquid always; Also have from above-mentioned heater and will carry out the absorber and the circulating pump that make liquid circulation of heat conducting heat to liquid heat transfer; Connect in the pipe arrangement between above-mentioned reserve tank and above-mentioned circulating pump and the above-mentioned heated body filled with liquid always; Above-mentioned circulating pump is work when liquid circulation always.
In the aforesaid liquid circulating cooling plant, aforesaid liquid also can be full of the liquid introducing port of the reserve tank of upstream one side that is positioned at above-mentioned mid portion always.
As above-mentioned heat exchanger, use by pipe, fin, and the heat exchanger of " the direct fin mid portion of corrugated " formula structure of constituting of fluid box, the aforesaid liquid case also can the double as reserve tank.
The fan of forcing this heat exchanger of cooling also can be set in the outside of above-mentioned heat exchanger.
In liquid circulation type cooling system of the present invention, the reserve tank of storaging liquid is set respectively in the upstream of heat-dissipating space one side and downstream one side, in the running of device, at least one side is full of the structure of the liquid outlet of this reserve tank always with liquid in the downstream owing to adopt, and can prevent that also air from flowing in the reserve tank system in addition even be provided with upside down.Therefore, e-machine can be set upside down, thereby can enlarge the scope of application of liquid circulation type cooling system.
Description of drawings
Fig. 1 is the schematic drawing in loop of the liquid circulation type cooling system of expression the 1st embodiment of the present invention.
Fig. 2 is the enlarged drawing of heat exchanger that is used for the liquid circulation type cooling system of the 1st embodiment of the present invention, is that end view, (b) are front views (a).
Fig. 3 is the schematic drawing in loop of occasion of representing to dispose upside down the liquid circulation type cooling system of the 1st embodiment of the present invention.
Fig. 4 is the schematic drawing in loop of the liquid circulation type cooling system of expression the 2nd embodiment of the present invention.
Fig. 5 is the enlarged drawing of heat exchanger that is used for the liquid circulation type cooling system of the 2nd embodiment of the present invention, is that end view, (b) are front views (a).
Fig. 6 is the schematic drawing in loop of occasion of representing to dispose upside down the liquid circulation type cooling system of the 2nd embodiment of the present invention.
Fig. 7 is the enlarged drawing of heat exchanger that is used for the liquid circulation type cooling system of the 3rd embodiment of the present invention, is that end view, (b) are vertical views (a).
Fig. 8 is the schematic drawing in loop of the liquid circulation type cooling system of expression prior art.
Fig. 9 is the turn upside down schematic drawing in loop of occasion of liquid circulation type cooling system of prior art of expression.
Embodiment
Below, with reference to accompanying drawing embodiments of the invention are described.
Embodiment 1
Fig. 1 is the schematic drawing in loop of the liquid circulation type cooling system of expression the 1st embodiment of the present invention.This liquid circulation type cooling system 10 possesses: the circulating pump 11 that makes liquid circulations such as water; The heat exchanger 12 that is configured in heat-dissipating space, outside the machine basket, dispels the heat; Be connected, effectively heat passed to from cooled object the absorber 13 of liquid with cooled objects such as heater elements; Connect between each parts, with cold wind give with by flexible pipe or the fixing pipe arrangement 14 formed of pipe arrangement and heat exchanger 12 fan 15 that carries out forced air-cooling.
Fig. 2 is the enlarged drawing of heat exchanger 12, (a) is that end view, (b) are front views.This heat exchanger 12 uses the heat exchanger of " the direct fin mid portion of corrugated " formula structures, and it is made of mid portion 18, the reserve tank 17 that is arranged on the reserve tank 16 of top among the figure of this mid portion 18 and is arranged on below among the figure of this mid portion 18.
What mid portion 18 used is " the direct fin mid portion of corrugated " that is made of one by soldering accordion fin 121 that will be formed by the metals such as aluminium of fine heat radiation property and the flat pipe 122 that is made of metals such as aluminium.
In addition, reserve tank 16 and reserve tank 17 use two fluid boxes up and down of the heat exchanger of " the direct fin mid portion of corrugated " formula structure, and their size is made and made it have needed capacity as reserve tank together.
Have again, be provided with the injection and the exhaust nozzle 125 that are used to inject liquid or regulate air pressure in the side of reserve tank 16.
The volume of reserve tank 16 and reserve tank 17 inside is according to the volume of whole system and be used to absorb the air capacity of interior pressure recruitment of the volume increase when rising along with fluid temperature and the liquid loss amount (liquid infiltration capacity) of whole system determines.In addition, injection and exhaust nozzle 125 time except that injecting liquid is blocked.
Below, with reference to Fig. 1 and Fig. 2 the action of liquid circulation type cooling system 10 is described.
At first, in Fig. 1, when driving liquid circulation pump 11, just carry the liquid of the full of liquid circulatory system.Absorber 13 will be from as the heat conducting heat transferred liquid of the heater of cooled object.Liquid is transported in the heat exchanger 12 via pipe arrangement 14.Shown in Fig. 2 (a), in heat exchanger 12, liquid when being arranged on liquid circulation mouth 123 on the reserve tank 16 and flowing into, liquid via reserve tank 16 by mid portion 18.In mid portion 18, shown in Fig. 2 (b), liquid is by managing 122 o'clock, by dispelling the heat with pipe 122 fin that are made of one 121.Air is sent into heat exchanger 12 by fan 15 (with reference to Fig. 1), promotes the heat radiation of fin 121.The liquid that is transported to reserve tank 17 flows out from liquid circulation mouth 124, sends into circulating pump 11 (with reference to Fig. 1) via pipe arrangement 14.In this a series of flowing, the heat temperature rising that fluid circulation system is accepted cooled object because of liquid causes internal pressure to increase, and the air layer 16B in the reserve tank 16 is as buffer absorption pressure rising part.
Secondly, with reference to Fig. 3 the action of the occasion that disposes this liquid circulation type cooling system 10 is upside down described.
Fig. 3 is the schematic drawing in loop of occasion of representing to dispose upside down the liquid circulation type cooling system of the 1st embodiment of the present invention.This occasion, when driving liquid circulation pump 11, the liquid of the full of liquid circulatory system is carried to the direction of arrow, will be by as the heat conducting heat transferred absorber 13 of the heater of cooled object.Liquid is transported to the reserve tank 16 of heat exchanger 12 via pipe arrangement 14, heat radiation and send into liquid circulation pump 11 via reserve tank 17 by mid portion 18 time.
Like this, in Fig. 3, reserve tank 17 will be positioned at the top of mid portion 18, and liquid flows to circulating pump 11 via reserve tank 17 from middle part 18.At this moment,, make outlet (the liquid circulation mouth 124 of Fig. 2) full of liquid of liquid, so when the pipe arrangement 14 of the downstream of reserve tank 17 side is mobile, air can not flow into pipe arrangement 14 because air layer 17B is in the top of liquid 7A reserve tank 17 in.Therefore, even in the occasion of liquid circulation type cooling system 10 that turned upside down, air can not sneaked into pipe arrangement 14 yet, thereby can prevent to follow the cyclicity of liquid to descend and cause flow to descend or circulating pump stops etc.
When using the liquid circulation type cooling system 10 of above-mentioned the 1st embodiment, can obtain following effect.
(1) in reserve tank 16 and reserve tank 17, owing to be provided with liquid circulation mouth 123,124 on the side of each comfortable mid portion 18, thereby, even the occasion that turns upside down at the e-machine that carries, liquid circulation mouth 123,124 is full of liquid always also, air can not sneaked into pipe arrangement 14 yet, thereby can prevent to follow the cyclicity of liquid to descend and cause flow to descend or circulating pump stops etc.
(2) as heat exchanger 12, owing to use the heat exchanger of " the direct fin mid portion of corrugated " formula structure, make fluid box part double as reserve tank up and down, so need not being set individually, a plurality of reserve tanks also can make pipe 122 be full of cooling liquid always.Therefore, can simplify the structure of liquid circulation loop, suppress the increase of parts increase and mounting space, can realize miniaturization, the cost degradation of e-machine when guaranteeing good thermal diffusivity.
(3) owing on the reserve tank 16,17 of radiator 12, be provided with air layer 16B, the 17B of the pressure rising part of absorption liquid systemic circulatory system, rise so can absorb the pressure of following the variations in temperature in the fluid circulation system and causing.
Embodiment 2
Fig. 4 is the schematic drawing in loop of the liquid circulation type cooling system of expression the 2nd embodiment of the present invention.This liquid circulation type cooling system 20 possesses: the circulating pump 21 that makes liquid circulation; The heat exchanger 22 that is configured in heat-dissipating space, outside the machine basket, dispels the heat; Be connected, effectively heat passed to by cooled object the absorber 23 of liquid with cooled objects such as heater elements; Link between each parts, with cold wind give with by flexible pipe or fixing pipe arrangement 24 and the fan 25 of heat exchanger 22 formed of pipe arrangement to carry out forced air-cooling.
Fig. 5 is the enlarged drawing of heat exchanger 22, (a) is that end view, (b) are vertical views.This heat exchanger 22 uses the heat exchanger of " the direct fin mid portion of corrugated " formula structures, is made of mid portion 18, the reserve tank 26 that is arranged on left side among the figure of mid portion 18, the reserve tank 27 that is arranged on the right side of mid portion 18.
The device 10 of mid portion 18 and the 1st embodiment is similarly made.
Below, with reference to Fig. 4 and Fig. 5 the action of liquid circulation type cooling system 20 is described.
At first, in Fig. 4, when driving liquid circulation pump 21, just carry the liquid of the full of liquid circulatory system.Absorber 23 will be from as the heat conducting heat transferred liquid of the heater of cooled object.Liquid is transported in the heat exchanger 22 via pipe arrangement 24.Shown in Fig. 5 (a), in heat exchanger 22, liquid when being arranged on liquid circulation mouth 224 on the reserve tank 27 and flowing into, liquid via reserve tank 27 by mid portion 18.In mid portion 18, shown in Fig. 5 (b), liquid was passing through pipe at 122 o'clock, by dispelling the heat with pipe 122 fin that are made of one 121.Air is sent into heat exchanger 22 by fan 25 (with reference to Fig. 4), promotes the heat radiation of fin 121.The liquid that is transported to reserve tank 27 flows out from liquid circulation mouth 224, sends into circulating pump 21 (with reference to Fig. 4) via pipe arrangement 24.
Secondly, with reference to Fig. 6 the action of the occasion that disposes this liquid circulation type cooling system 20 is upside down described.
Fig. 6 is the schematic drawing in loop of occasion of representing to dispose upside down the liquid circulation type cooling system 20 of the 2nd embodiment of the present invention.When driving liquid circulation pump 21 in this case, the liquid of the full of liquid circulatory system is carried to the direction of arrow, will be from as the heat conducting heat transferred absorber 23 of the heater of cooled object.Liquid is transported to the reserve tank 27 of heat exchanger 22 via pipe arrangement 24, heat radiation and be admitted to circulating pump 21 via reserve tank 26 by mid portion 18 time.
Like this, in Fig. 6, liquid flows to circulating pump 21 via reserve tank 26 from middle part 18.At this moment,, make outlet (the liquid circulation mouth 223 of Fig. 5) full of liquid of liquid, so when the pipe arrangement 24 of the downstream of reserve tank 26 side is mobile, air can not flow into pipe arrangement 24 because air layer 26C is present in the top of liquid 26A reserve tank 26 in.Therefore, even in the occasion of liquid circulation type cooling system 20 that turned upside down, air can not sneaked into pipe arrangement 24 yet, thereby can prevent to follow the cyclicity of liquid to descend and cause flow to descend or circulating pump stops etc.
In the liquid circulation type cooling system 20 of above-mentioned the 2nd embodiment, also can obtain the effect identical with the liquid circulation type cooling system 10 of the 1st embodiment.
Embodiment 3
Fig. 7 is the structure chart of heat exchanger 32 that expression is used for the liquid circulation type cooling system of the 3rd embodiment, is that end view, (b) are vertical views (a).
This heat exchanger 32 uses the heat exchanger of " the direct fin mid portion of corrugated " formula structures, is made of mid portion 18, the reserve tank 36 that is arranged on left side among the figure of this mid portion 18, the reserve tank 37 that is arranged on the right side of mid portion 18.
In this heat exchanger 32, be provided with the liquid circulation mouth 323 that can flow into drain in the side of reserve tank 36, form same liquid circulation mouth 324 in the side of reserve tank 37, above reserve tank 36, be used to inject liquid or regulate the injection and exhaust nozzle 325 of air pressure except being provided with, also have the structure identical with heat exchanger 22.By replace the heat exchanger 22 of liquid circulation type cooling system shown in Figure 4 with this heat exchanger 32, just can obtain the effect identical with the liquid circulation type cooling system 20 of the 2nd embodiment.
In addition, in the above-described embodiment, though be the structure that 2 reserve tanks are set in heat exchanger, also can make the structure that is provided with more than 3.Also have, though be to illustrate with the structure of in the passing through of air, mid portion 18 being made one deck, also can make more than 2 layers or 2 layers according to heat dissipation capacity.Have again, though the reserve tank of cooling liquid not being made the structure of indivedual settings, also can in fluid circulation system, be provided with individually.
Also have, by the liquid position detector is set on reserve tank, the situation of cooling liquid minimizing that just can be in reserve tank issues responding and responds with just and can replenish cooling liquid.
Claims (6)
1. liquid circulation type cooling system, formation makes the fluid circulation system that liquid circulates in system when, to be transported to heat-dissipating space via aforesaid liquid from the heat that heater produces dispels the heat, it is characterized in that: in the upstream of above-mentioned heat-dissipating space one side and downstream one side the reserve tank that stores aforesaid liquid is set respectively, so that one side is full of the liquid outlet of this reserve tank with aforesaid liquid in the downstream in the running of said apparatus always;
Also have from above-mentioned heater and will carry out the absorber and the circulating pump that make liquid circulation of heat conducting heat to liquid heat transfer;
Connect in the pipe arrangement between above-mentioned reserve tank and above-mentioned circulating pump and the above-mentioned heated body filled with liquid always;
Above-mentioned circulating pump is work when liquid circulation always.
2. liquid circulation type cooling system, formation makes the fluid circulation system that liquid circulates in system when, to be transported to heat-dissipating space via aforesaid liquid from the heat that heater produces dispels the heat, it is characterized in that: have mid portion and be separately positioned on the heat exchanger of reserve tank up and down of the vertical direction of this mid portion in above-mentioned heat-dissipating space setting, so that in the running of said apparatus, be full of the liquid outlet of the reserve tank of downstream one side that is positioned at above-mentioned mid portion with aforesaid liquid always;
Also have from above-mentioned heater and will carry out the absorber and the circulating pump that make liquid circulation of heat conducting heat to liquid heat transfer;
Connect in the pipe arrangement between above-mentioned reserve tank and above-mentioned circulating pump and the above-mentioned heated body filled with liquid always;
Above-mentioned circulating pump is work when liquid circulation always.
3. liquid circulation type cooling system, formation makes the fluid circulation system that liquid circulates in system when, to be transported to heat-dissipating space via aforesaid liquid from the heat that heater produces dispels the heat, it is characterized in that: above-mentioned heat-dissipating space setting have mid portion and be separately positioned on this mid portion horizontal direction about the heat exchanger of reserve tank so that in the running of said apparatus, be full of the liquid outlet of the reserve tank of downstream one side that is positioned at above-mentioned mid portion with aforesaid liquid always;
Also have from above-mentioned heater and will carry out the absorber and the circulating pump that make liquid circulation of heat conducting heat to liquid heat transfer;
Connect in the pipe arrangement between above-mentioned reserve tank and above-mentioned circulating pump and the above-mentioned heated body filled with liquid always;
Above-mentioned circulating pump is work when liquid circulation always.
4. as claim 2 or 3 described liquid circulation type cooling systems, it is characterized in that: as above-mentioned heat exchanger use by pipe, fin, and fluid box constitute the heat exchanger of " the direct fin mid portion of corrugated " formula structure, make aforesaid liquid case double as reserve tank.
5. as any one described liquid circulation type cooling system in claim 2 or 3, it is characterized in that: the outer setting at above-mentioned heat exchanger has the fan of forcing this heat exchanger of cooling.
6. liquid circulation type cooling system as claimed in claim 4 is characterized in that: the outer setting at above-mentioned heat exchanger has the fan of forcing this heat exchanger of cooling.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004033761 | 2004-02-10 | ||
| JP2004033761A JP3897024B2 (en) | 2004-02-10 | 2004-02-10 | Liquid circulation type cooling system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1655666A CN1655666A (en) | 2005-08-17 |
| CN100559924C true CN100559924C (en) | 2009-11-11 |
Family
ID=34824264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100840176A Expired - Fee Related CN100559924C (en) | 2004-02-10 | 2004-10-13 | Liquid circulation type cooling system |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20050173097A1 (en) |
| JP (1) | JP3897024B2 (en) |
| KR (1) | KR100605422B1 (en) |
| CN (1) | CN100559924C (en) |
| TW (1) | TW200526913A (en) |
Families Citing this family (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070252499A1 (en) * | 2004-10-18 | 2007-11-01 | Leica Microsystems Cms Gmbh | Scanning microscope |
| JP2007103633A (en) * | 2005-10-04 | 2007-04-19 | Matsushita Electric Ind Co Ltd | Cooling device and electronic apparatus including the same |
| JP2009088051A (en) * | 2007-09-28 | 2009-04-23 | Hitachi Ltd | Cooling device for electronic instrument |
| US8327654B2 (en) * | 2008-03-17 | 2012-12-11 | Denso International America, Inc. | Condenser, radiator, and fan module with Rankine cycle fan |
| US20090272144A1 (en) * | 2008-05-02 | 2009-11-05 | Thermaltake Technology Co., Ltd. | Computer cooling apparatus |
| KR20090122157A (en) * | 2008-05-23 | 2009-11-26 | 송세흠 | Air source heat exchange system and method utilizing temperature gradient and water |
| CN101730436B (en) * | 2008-10-24 | 2012-05-23 | 南京理工大学 | Convection heat-radiation system for temperature control of electronic equipment close to space vehicle |
| TWM380493U (en) * | 2009-12-30 | 2010-05-11 | Man Zai Ind Co Ltd | Water-cooling heat-dissipating device |
| US20120298339A1 (en) * | 2010-02-10 | 2012-11-29 | Naoki Masuda | Liquid cooling system and electronic device including the same |
| US9010141B2 (en) * | 2010-04-19 | 2015-04-21 | Chilldyne, Inc. | Computer cooling system and method of use |
| CN102486940A (en) * | 2010-12-06 | 2012-06-06 | 大连市铭源全科技开发有限公司 | Circulating cooling water system |
| CN102592686B (en) * | 2011-01-18 | 2015-09-30 | 台达电子工业股份有限公司 | Heat exchanger |
| US8711563B2 (en) | 2011-10-25 | 2014-04-29 | International Business Machines Corporation | Dry-cooling unit with gravity-assisted coolant flow |
| JP2014053467A (en) * | 2012-09-07 | 2014-03-20 | Fujitsu Ltd | Cooling system |
| US9861012B2 (en) * | 2014-10-21 | 2018-01-02 | International Business Machines Corporation | Multifunction coolant manifold structures |
| EP3104009B1 (en) * | 2015-05-12 | 2018-09-19 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
| US9992910B2 (en) | 2015-06-11 | 2018-06-05 | Cooler Master Co., Ltd. | Liquid supply mechanism and liquid cooling system |
| CN105072872A (en) * | 2015-08-08 | 2015-11-18 | 衢州昀睿工业设计有限公司 | Heat dissipation system for power device |
| NL2015841B1 (en) * | 2015-11-23 | 2017-06-07 | Aecorsis B V | A device comprising heat producing components with liquid submersion cooling. |
| CN105841534A (en) * | 2016-05-11 | 2016-08-10 | 华南理工大学 | Anti-gravity loop heat pipe integrated with electrofluid power micropump and method |
| JP6593252B2 (en) * | 2016-05-25 | 2019-10-23 | 富士通株式会社 | Cooling device and electronic equipment |
| CN108019726A (en) * | 2018-01-23 | 2018-05-11 | 广东工业大学 | A kind of LED liquid-cooling heat radiations circulatory system |
| JP7225666B2 (en) * | 2018-10-18 | 2023-02-21 | 日本電産株式会社 | cooling unit |
| CN109618530B (en) * | 2018-12-05 | 2020-04-07 | 西安石油大学 | Cooling system of heating electronic equipment of downhole tool |
| CN114040665B (en) * | 2021-12-01 | 2022-07-26 | 博浩数据信息技术(广州)有限公司 | Box type liquid cooling equipment for data center |
| CN117156789A (en) * | 2022-05-24 | 2023-12-01 | 台达电子工业股份有限公司 | Immersion type water cooling system and cooling method thereof |
| US20240023288A1 (en) * | 2022-07-12 | 2024-01-18 | Dell Products L.P. | Radiator with top layer coolant tank |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2200620A (en) * | 1938-05-12 | 1940-05-14 | Eaton Mfg Co | Heat exchanger |
| US2264945A (en) * | 1939-08-07 | 1941-12-02 | Stewart Warner Corp | Pump |
| US5794692A (en) * | 1993-10-28 | 1998-08-18 | Modine Manufacturing Co. | Header and tank construction for a heat exchanger |
| US5587880A (en) * | 1995-06-28 | 1996-12-24 | Aavid Laboratories, Inc. | Computer cooling system operable under the force of gravity in first orientation and against the force of gravity in second orientation |
| US7084931B2 (en) * | 2000-08-28 | 2006-08-01 | Matsushita Electric Industrial Co., Ltd. | Projection video device |
-
2004
- 2004-02-10 JP JP2004033761A patent/JP3897024B2/en not_active Expired - Fee Related
- 2004-07-07 US US10/885,005 patent/US20050173097A1/en not_active Abandoned
- 2004-07-16 KR KR1020040055356A patent/KR100605422B1/en not_active IP Right Cessation
- 2004-10-13 CN CNB2004100840176A patent/CN100559924C/en not_active Expired - Fee Related
- 2004-10-15 TW TW093131471A patent/TW200526913A/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050080722A (en) | 2005-08-17 |
| KR100605422B1 (en) | 2006-07-31 |
| JP2005228810A (en) | 2005-08-25 |
| TWI302980B (en) | 2008-11-11 |
| JP3897024B2 (en) | 2007-03-22 |
| CN1655666A (en) | 2005-08-17 |
| US20050173097A1 (en) | 2005-08-11 |
| TW200526913A (en) | 2005-08-16 |
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Granted publication date: 20091111 Termination date: 20131013 |