CN207573821U - A kind of two-sided water cooling plate heat dissipating device - Google Patents
A kind of two-sided water cooling plate heat dissipating device Download PDFInfo
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- CN207573821U CN207573821U CN201721742290.2U CN201721742290U CN207573821U CN 207573821 U CN207573821 U CN 207573821U CN 201721742290 U CN201721742290 U CN 201721742290U CN 207573821 U CN207573821 U CN 207573821U
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Abstract
This application discloses a kind of two-sided water cooling plate heat dissipating device, including：The cooled plate of water cooling runner is carried in it, the power heater element of arrangement is contacted with the plate face of the cooled plate；The cooled plate has the first plate face and the second plate face mutually deviated from, first plate face and second plate face respectively contact at least one power heater element of arrangement, and the power heater element positioned at first plate face is distributed with the power heater element mutual dislocation positioned at second plate face.This two-sided water cooling plate heat dissipating device of the application can increase the layout density of power heater element, so as to help to reduce the build of power module case.
Description
Technical field
This application involves field of radiating, and in particular to a kind of two-sided water cooling plate heat dissipating device, for power heater element
Suction heat dissipation.
Background technology
In existing power module case field of radiating, although air-cooled radiator is substantially departing from high noisy violence heat dissipation
Vicious circle, but generally towards large volume, the direction of more heat pipes, also excess weight is developed, and this actually makes user in radiator
Very big inconvenience is brought, while be also required to special Duct design with installation, heat emission hole design etc..In view of wind after above-mentioned
The predicament that the cold epoch occur, liquid cold water cold plate heat dissipation being used by everybody gradually
Cooled plate heat dissipation technology is applied to power module case, is not because wind-cooling heat dissipating has had evolved to the greatest extent in fact
Head, but since the radiating rate of liquid is far longer than air, liquid cooling heat radiator often has good heat dissipation effect, together
When can also be well controlled in terms of noise.Due in radiating efficiency and mute etc. all the advantages having, making us
The good news is even to this day, the liquid-cooling heat radiation of computer realm, which is gaining popularity, to come, this situation returns root knot in the cold safety of liquid
Property and stability make great progress.
The heat of power module case is transported on heat exchanger by water cooling technology using circulation fluid from water-cooled block to be dissipated again
It sends out, instead of the homogeneous metal or heat pipe of wind-cooling heat dissipating, heat exchanger section therein again almost air-cooled radiator
Reprint.There are two the characteristics of water-cooling heat radiating system are maximum：Heat and the low noise work of balanced heating device.Due to the specific heat of water
Hold super large, therefore a large amount of heat can be absorbed and temperature is kept significantly not change, the temperature of heating device in water-cooling system
The control that can be got well is spent, the operation of burst will not all cause heating device internal temperature moment significantly to change, and
Whole cooling system is just very quiet compared with air cooling system.The human oriented design of newest water-cooling product also has
Significant progress, cooled plate heat dissipation technology also use it is more expanded come, put goods on the market.
However, existing water-cooling heat radiating device is single side heat dissipation (single side layout heating device), it is unfavorable for heating device
High-density arrangement causes power module box body shape huge.Also, the spot temperature being in contact in cooled plate with heater element is inevitable
Higher than the position for arrangement heater element, so cause the runner wall temperature of water cooling runner different parts different, but existing water
The water cooling runner of cooling and radiation device is cross-section structure, and the uniform fluid flow of each flow channel section is contacted with flow path wall homalographic in runner,
Water velocity is consistent everywhere, and the flow passage structure of high temperature runner wall site is not specifically designed, this is unfavorable for cooling water and stream
The high efficient heat exchanging of road wall.
Invention content
The purpose of the application is：In view of the deficiencies of the prior art, a kind of two-sided water cooling plate heat dissipating device is proposed, to increase work(
The layout density of rate heater element reduces the build of power module case.
In order to achieve the above object, the technical solution of the application is：
A kind of two-sided water cooling plate heat dissipating device, including：
Cooled plate in it with water cooling runner and
The power heater element of arrangement is contacted with the plate face of the cooled plate；
The cooled plate has the first plate face and the second plate face mutually deviated from, first plate face and second plate face
Respectively at least one power heater element is arranged in contact, and positioned at the power heater element of first plate face
With the power heater element mutual dislocation distribution positioned at second plate face.
The application based on the above technical solution, further includes following preferred embodiment：
The part for arranging the power heater element is provided with heat radiating fin in first plate face and the second plate face
Piece.
The radiating fin is structure as a whole with the cooled plate.
It is formed with not in contact with the part for arranging the power heater element in first plate face and the second plate face and inwardly collapses
Sunken numerous grooves, the radiating fin are formed between the groove.
Each described power heater element is arranged on the circulation path of the water cooling runner.
A water cooling runner is provided only in the cooled plate, each power heater element is along the water cooling
The circulation path of runner is sequentially arranged.
At least two water cooling runners are provided in the cooled plate.
The cooled plate is aluminium or copper material.
The side of the cooled plate is provided with radiator fan.
The cooled plate is rectangular slab, and the inlet and outlet of the water cooling runner are arranged in the same of the cooled plate
On side.
The application has the advantages that：
1st, positive and negative two plate face of the application cooled plate arranges power heater element, substantially increases power heater element
Layout density, be conducive to the Miniaturization Design of power module case.
2nd, because power heater element can make the plate face regional temperature contacted higher at work, if the same portion of cooled plate
Position positive and negative two region contact arrangement power heater element, then the temperature at the position will be very high, this can influence this two
A power heater element is to the heat transfer rate of cooled plate.And the power heater element of positive and negative two plate face is dislocatedly distributed by the application,
This problem is well solved.
3rd, water cooling runner includes numerous numerous a flows caching chambers being spaced apart successively along circulation path direction, and
Each flow caching chamber is arranged at a corresponding power heater element.Flow caching chamber has larger volume,
It is interior to accommodate more water, and the temperature at the cooled plate position at flow caching chamber is higher, has a large amount of water herein simultaneously
It absorbs heat to it, the heat of cooled plate herein can be absorbed rapidly, improve the whole heat absorption efficiency of flow in water cooling runner.Also,
Because the volume of flow caching chamber is larger, so the flow velocity in flow caching intracavitary water is relatively small, water is cached in flow in chamber
Residence time it is longer, this is also beneficial to heat absorption of the flow caching intracavitary cooling water to cooled plate herein.
4th, because the flow of water cooling runner is constantly persistently absorbed heat on circulation path, so its temperature can gradually rise,
Higher and higher along the circulating direction water temperature of water cooling runner, water inlet water temperature is minimum, water outlet water temperature highest.It is got over according to the temperature difference
Principle small, heat exchange rate is smaller, water cooling flow paths downstream flow are less than water cooling flow path upstream certainly to the heat absorption speed of cooled plate
For flow to the heat absorption speed of cooled plate, this does not utilize the heat dissipation for the power heater element for being arranged in water cooling flow paths downstream position.And
Volume in the application along each flow caching chamber on the circulating direction of water cooling runner is increasing, downstream flow heat absorption speed
The insufficient of rate is compensated by increasing water and heat absorption time, well solves foregoing problems.
5 also, along the circulating direction of water cooling runner, each flow caches chamber on the perspective plane of water cooling plate thickness direction
Product is increasing, is inhaled thus by the heat exchange area for gradually increasing flow caching intracavitary flow and cooled plate to compensate downstream flow
The deficiency of hot rate.
6th, the inlet and outlet of water cooling runner are arranged on the same side of cooled plate, and water cooling runner uses
Single bending structure.It so not only contributing to increase stroke of the flow in water cooling runner so that flow fully exchanges heat with cooled plate,
The connection of external water circulation system and water cooling runner intake-outlet is also facilitated simultaneously.
Description of the drawings
Fig. 1 is the side structure schematic view of two-sided water cooling plate heat dissipating device in the embodiment of the present application one；
Fig. 2 is the overlooking the structure diagram of two-sided water cooling plate heat dissipating device in the embodiment of the present application one；
Fig. 3 is the side structure schematic view of two-sided water cooling plate heat dissipating device in the embodiment of the present application two；
Fig. 4 is the overlooking the structure diagram of two-sided water cooling plate heat dissipating device in the embodiment of the present application two；
Fig. 5 is the side structure schematic view of two-sided water cooling plate heat dissipating device in the embodiment of the present application three；
Fig. 6 is the overlooking the structure diagram of two-sided water cooling plate heat dissipating device in the embodiment of the present application three.
Wherein：1- water cooling runners, 2- cooled plates, 3- power heater elements, 4- radiating fins, 5- flows caching chamber, 6- dissipate
Hot-air fan.
Specific embodiment
The application is described in further detail below by specific embodiment combination attached drawing.The application can be with a variety of
Different forms is realized, however it is not limited to the present embodiment described embodiment.The purpose of detailed description below is provided
It is easy for becoming apparent from present disclosure thorough explanation, the words of the wherein indicating positions such as upper and lower, left and right is only needle
To shown structure in respective figure for position.
However, those skilled in the art may be aware that one or more detail description can be by
Omit or can also adopt with other methods, component or material.In some instances, some embodiments are not described
Or it is not described later in detail.
In addition, technical characteristic described herein, technical solution can also be closed arbitrarily in one or more embodiments
Suitable mode combines.For those skilled in the art, should be readily appreciated that with provided herein is embodiment related method
Step or operation order can also change.Therefore, any sequence in drawings and examples is merely illustrative purposes, not secretly
Show requirement in a certain order, required unless expressly stated according to a certain sequence.
" connection " described in the application unless otherwise instructed, includes directly or indirectly connecting (connection).
Embodiment one：
Figures 1 and 2 show that first specific embodiment of this two-sided water cooling plate heat dissipating device of the application, with traditional water
Cold plate radiator is identical, which also includes：Cooled plate 2 in it with water cooling runner 1 and the plate with cooled plate 2
The power heater element 3 of face contact arrangement.Obviously, aforementioned cooled plate 2 has mutually away from two plate faces, describes this for convenience
The technical solution of application is now called the two plate faces respectively for the first plate face and the second plate face or positive and negative plate face.
The key improvements of the present embodiment are that above-mentioned first plate face and the second plate face respectively contact the multiple power hairs of arrangement
Thermal element 3, and the power heater element 3 positioned at the first plate face and 3 mutual dislocation of power heater element positioned at the second plate face
Distribution.
That is, two plate faces up and down of cooled plate 2 contact and are disposed with multiple power heater elements 3 in Fig. 1 ---
Just so-called " two-sided water cooling ", and each power heater element 3 at the plate face of top and each power fever at the plate face of lower part
Element 3 misses one another --- and it is misaligned on vertical direction in Fig. 1.
The present embodiment arranges many power heater elements 3 in positive and negative two plate face of cooled plate 2, substantially increases work(
The layout density of rate heater element 3 is conducive to the Miniaturization Design of power module case.Because power heater element 3 at work can
Make the plate face regional temperature contacted higher, if positive and negative two region at the same position of cooled plate contacts arrangement power fever member
Part 3, then the temperature at the position will be very high, this can influence heat transfer rate of the two power heater elements 3 to cooled plate.
And the power heater element 3 in two plate faces is dislocatedly distributed by the present embodiment, has well solved this problem.
A plurality of water cooling runner 1 can be set in cooled plate 2, but the present embodiment is only provided with one.Each above-mentioned work(
Rate heater element 3 is arranged on the circulation path of this water cooling runner 1, and in other words, these power heater elements 3 are along this
The circulation path of water cooling runner 1 is sequentially arranged.
As shown in Fig. 2, above-mentioned cooled plate 2 is rectangular slab, the inlet and outlet of water cooling runner 1 are arranged in cooled plate 2
Same side on, water cooling runner 1 is turned back structure (can certainly use continuous U-shaped bending structure) using U-shaped.Such as
This not only contributes to increase stroke of the flow in water cooling runner 1 so that flow fully exchanges heat with cooled plate, while also facilitates
External water circulation system and the connection of water cooling runner 1.
It refers again to shown in Fig. 2, it is contemplated that the position that power heater element 3 is disposed in cooled plate 2 can be because directly absorb
The work calories of power heater element 3 and with higher temperature, and remaining does not arrange the spot temperature of power heater element 3
It is relatively low.Based on the temperature difference is bigger, this bigger principle of heat exchange rate, the present embodiment makees the structure type of water cooling runner 1
It improves, specially：Water cooling runner 1 includes numerous numerous a flows caching chambers 5 being spaced apart successively along circulation path direction,
And each flow caching chamber 5 is arranged at a corresponding power heater element 3.More specifically：Each flow is delayed
The one of power heater element 3 of 5 equal face of chamber is deposited to arrange.
Being so designed that is advantageous in that, flow caching chamber 5 have larger volume, in can accommodate more water, and
The temperature at the cooled plate position at flow caching chamber 5 is higher, has a large amount of water to absorb heat simultaneously to it herein, can absorb this rapidly
Locate the heat of cooled plate, improve the whole heat absorption efficiency of flow in water cooling runner.Also, the because volume of flow caching chamber 5
Larger, so the flow velocity of water is relatively small in flow caching chamber 5, residence time of the flow in flow caches chamber 5 is longer, this
It is also beneficial to heat absorption of the cooling water to cooled plate herein in flow caching chamber 5.
Because the flow of water cooling runner 1 is constantly persistently absorbed heat on circulation path, so its temperature can gradually rise, edge
The circulating direction water temperature of dampening cold runner 1 is higher and higher, and water inlet water temperature is minimum, water outlet water temperature highest.According to the temperature difference it is smaller,
The smaller principle of heat exchange rate, 1 downstream flow of water cooling runner are less than 1 upper water of water cooling runner certainly to the heat absorption speed of cooled plate
The heat absorption speed to cooled plate is flowed, this does not utilize the heat dissipation for the power heater element 3 for being arranged in water cooling flow paths downstream position.For
This problem, the present embodiment have made further improvement to the structure of water cooling runner 1 again, specially：
Along the circulating direction of water cooling runner 1, the volume of above-mentioned each flow caching chamber 5 is increasing.Downstream flow is inhaled
The insufficient of hot rate is compensated by increasing water and heat absorption time.
Further, along the circulating direction of water cooling runner 1, above-mentioned each flow caches chamber 5 in water cooling plate thickness side
To projected area it is increasing, such as Fig. 2.So increase the heat exchange area of flow and cooled plate 2 in flow caching chamber 5.
It has been explained above：In the present embodiment, each flow caching chamber 5 face, one power heater element 3 is arranged,
I.e. flow caching chamber 5 and power heater element 3 are one-to-one position relationship.But, in some other implementations of the application
In example, it can also be cached in some (or certain is several) flow and be correspondingly arranged multiple power heater elements 3 at chamber 5.Such as：Certain phase
Adjacent two (or more) 3 positions of power heater element lean on it is close, at this moment can be at the two power heater elements 3
Only a flow is set to cache chamber 5, the two power heater elements 3 is made to share same flow caching 5 absorbing and cooling temperature of chamber.
Embodiment two：
Fig. 3 and Fig. 4 shows second specific embodiment of this two-sided water cooling plate heat dissipating device of the application, the present embodiment
The structure of this two-sided water cooling plate heat dissipating device and water cooling plate heat dissipating device two-sided in above-described embodiment one is essentially identical, Wei Yiqu
It is not：In the present embodiment, the part in the first plate face and the second plate face not in contact with arrangement power heater element 3 is (or idle
The pan section of rate heater element) there is provided numerous radiating fins 4, to further enhance the heat-sinking capability of cooled plate 2.
Above-mentioned radiating fin 4 is structure as a whole with cooled plate 2, and the two is aluminium or copper material.
Specifically, in above-mentioned first plate face and the second plate face not in contact with arrangement power heater element 3 part formed it is oriented
The numerous grooves inside collapsed, radiating fin 4 are formed between groove.Also it is with regard to saying, exactly because it is molded in plate face corresponding position
Numerous grooves for inwardly collapsing, so that the structure of radiating fin 4 occurs.
Embodiment three：
Fig. 5 and Fig. 6 shows the third specific embodiment of this two-sided water cooling plate heat dissipating device of the application, the present embodiment
The structure of this two-sided water cooling plate heat dissipating device and water cooling plate heat dissipating device two-sided in above-described embodiment two is essentially identical, Wei Yiqu
It is not：In one radiator fan 6 of the side of cooled plate 2 increase, work, radiator fan 6 is sent to cooled plate 2 in the present embodiment
Wind to accelerate the flowing of the air around cooled plate 2, improves the heat exchange efficiency of cooled plate 2 and air.
The foregoing is a further detailed description of the present application in conjunction with specific implementation manners, it is impossible to assert this Shen
Specific implementation please is confined to these explanations.For those of ordinary skill in the art to which this application belongs, it is not taking off
Under the premise of conceiving from the application, several simple deduction or replace can also be made.
Claims (10)
1. a kind of two-sided water cooling plate heat dissipating device, including：
Cooled plate (2) in it with water cooling runner (1) and
The power heater element (3) of arrangement is contacted with the plate face of the cooled plate (2)；
It is characterized in that, the cooled plate (2) has the first plate face and the second plate face mutually deviated from, first plate face and institute
It states the second plate face and respectively contacts at least one power heater element (3) of arrangement, and positioned at the institute of first plate face
Power heater element (3) is stated to be distributed with power heater element (3) mutual dislocation positioned at second plate face.
2. two-sided water cooling plate heat dissipating device as described in claim 1, which is characterized in that in first plate face and the second plate face
The part for arranging the power heater element (3) is provided with radiating fin (4).
3. two-sided water cooling plate heat dissipating device as claimed in claim 2, which is characterized in that the radiating fin (4) and the water
Cold plate (2) is structure as a whole.
4. two-sided water cooling plate heat dissipating device as claimed in claim 3, which is characterized in that in first plate face and the second plate face
The numerous grooves inwardly collapsed, radiating fin (4) shape are formed with not in contact with the part for arranging the power heater element (3)
Between groove described in Cheng Yu.
5. two-sided water cooling plate heat dissipating device as described in claim 1, which is characterized in that each described power heater element
(3) it is arranged on the circulation path of the water cooling runner (1).
6. two-sided water cooling plate heat dissipating device as claimed in claim 5, which is characterized in that be provided only in the cooled plate (2)
One water cooling runner (1), each power heater element (3) along the water cooling runner (1) circulation path sequentially
Arrangement.
7. two-sided water cooling plate heat dissipating device as described in claim 1, which is characterized in that be provided in the cooled plate (2) to
Few two water cooling runners (1).
8. two-sided water cooling plate heat dissipating device as described in claim 1, which is characterized in that the cooled plate (2) is aluminium or copper
Material.
9. two-sided water cooling plate heat dissipating device as described in claim 1, which is characterized in that the side setting of the cooled plate (2)
There is radiator fan (6).
10. two-sided water cooling plate heat dissipating device as described in claim 1, which is characterized in that the cooled plate (2) is rectangular slab,
The inlet and outlet of the water cooling runner (1) are arranged on the same side of the cooled plate (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721742290.2U CN207573821U (en) | 2017-12-14 | 2017-12-14 | A kind of two-sided water cooling plate heat dissipating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721742290.2U CN207573821U (en) | 2017-12-14 | 2017-12-14 | A kind of two-sided water cooling plate heat dissipating device |
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| CN207573821U true CN207573821U (en) | 2018-07-03 |
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| CN201721742290.2U Active CN207573821U (en) | 2017-12-14 | 2017-12-14 | A kind of two-sided water cooling plate heat dissipating device |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2020065427A (en) * | 2018-10-19 | 2020-04-23 | 株式会社ソニー・インタラクティブエンタテインメント | Power supply device |
| CN112002355A (en) * | 2020-07-27 | 2020-11-27 | 北京浪潮数据技术有限公司 | Hard disk liquid cooling heat dissipation system and server |
| CN112292007A (en) * | 2020-11-02 | 2021-01-29 | 阳光电源股份有限公司 | Water-cooling heat dissipation device and electrical apparatus |
| US11647593B2 (en) | 2018-10-19 | 2023-05-09 | Sony Interactive Entertainment Inc. | Semiconductor device manufacturing method |
| US11824429B2 (en) | 2018-10-19 | 2023-11-21 | Sony Interactive Entertainment Inc. | Multi-phase step-down DC/DC power source device |
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2017
- 2017-12-14 CN CN201721742290.2U patent/CN207573821U/en active Active
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020065427A (en) * | 2018-10-19 | 2020-04-23 | 株式会社ソニー・インタラクティブエンタテインメント | Power supply device |
| WO2020080526A1 (en) * | 2018-10-19 | 2020-04-23 | 株式会社ソニー・インタラクティブエンタテインメント | Power source device |
| JP2021185740A (en) * | 2018-10-19 | 2021-12-09 | 株式会社ソニー・インタラクティブエンタテインメント | Power source device |
| JP7250866B2 (en) | 2018-10-19 | 2023-04-03 | 株式会社ソニー・インタラクティブエンタテインメント | power supply |
| JP7250474B2 (en) | 2018-10-19 | 2023-04-03 | 株式会社ソニー・インタラクティブエンタテインメント | power supply |
| US11647593B2 (en) | 2018-10-19 | 2023-05-09 | Sony Interactive Entertainment Inc. | Semiconductor device manufacturing method |
| US11824429B2 (en) | 2018-10-19 | 2023-11-21 | Sony Interactive Entertainment Inc. | Multi-phase step-down DC/DC power source device |
| US12009750B2 (en) | 2018-10-19 | 2024-06-11 | Sony Interactive Entertainment Inc. | Power source device |
| CN112002355A (en) * | 2020-07-27 | 2020-11-27 | 北京浪潮数据技术有限公司 | Hard disk liquid cooling heat dissipation system and server |
| CN112292007A (en) * | 2020-11-02 | 2021-01-29 | 阳光电源股份有限公司 | Water-cooling heat dissipation device and electrical apparatus |
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