CN100538166C - The thermal radiation arrangement of vertical power LED and horizontal type power LED - Google Patents
The thermal radiation arrangement of vertical power LED and horizontal type power LED Download PDFInfo
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- CN100538166C CN100538166C CNB2006100833684A CN200610083368A CN100538166C CN 100538166 C CN100538166 C CN 100538166C CN B2006100833684 A CNB2006100833684 A CN B2006100833684A CN 200610083368 A CN200610083368 A CN 200610083368A CN 100538166 C CN100538166 C CN 100538166C
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Abstract
The thermal radiation arrangement of a kind of vertical power LED and a kind of horizontal type power LED is disclosed, the heat that it can effectively radiation vertical power LED produces.This vertical power LED obtains by the LED element being installed on the lamp type LED and encapsulating the described lamp type LED that described LED element is installed.This vertical power LED comprises: first lead frame, has the cup-shaped recess that is built-in with the LED element, be connected to described LED element so that be described LED element power supply from the outside via lead, and have at least one the heat radiation through hole that is used to increase heat radiation speed; Second lead frame is connected to described LED element so that be described LED element power supply from the outside via lead, and is arranged to relative with described first lead frame; And molded portion, by being that the top molding of described first and second lead frames forms so that comprise described LED element with transparent material.
Description
Technical field
The present invention relates to the thermal radiation arrangement of vertical power LED and horizontal type power LED, the characteristic variations minimum that it can prolong the life-span of its parts and make parts by the heat that the chip of radiation vertical power LED is effectively produced, described vertical power LED chip obtains by the LED element being installed on lamp type LED and being encapsulated the lamp type LED that the LED element is installed.
More specifically, the present invention relates to the thermal radiation arrangement of vertical power LED and horizontal type power LED, its rapidly radiation have the heat that the horizontal type power LED chip of high brightness and high-power vertical power LED and encapsulation is produced, described horizontal type power LED chip is by crooked with lead frame and it is attached to heat sink (heat sink) obtains.
Background technology
Generally speaking, light emitting diode (LED) is the opto-electronic conversion semiconductor element with n-type semiconductor and the semi-conductive junction structure of p-type.The LED that is categorized as red LED, blue LED and yellow LED is the high power luminous element of encapsulation, is used for front lit or side illumination in 280 to 650nm the wavelength band.
More specifically, LED launches light by the minority carrier (such as electronics and hole) that uses semi-conductive p-n junction structure generation and compound injection.Semiconductor light-emitting elements is categorized as LED and laser diode (LD) briefly.Because LED or LD are from beginning promptly to launch the light in the narrow wavelength band of expectation, therefore, it is compared with the existing incandescent lamp that uses black body radiation to produce wide range light and to use the expectation colour filter that the light that is produced is filtered has very high efficient.
LED or LD can drive with the obvious low power consumption in 50mW to the 100mW scope, and, contrast with such low-power consumption, have good luminous efficiency.But the defective of LED or LD is: because its small size and low luminous efficiency, its use as illumination component is limited.
With reference to figure 1, a kind of conventional lights type LED comprises: first lead frame 2, wherein be equipped with LED element 1 on the core that forms cup-shaped groove 6; Second lead frame 4 is connected to LED element 1 so that be 1 power supply of LED element from the outside via lead 3, and is arranged to relative with first lead frame 2; And lens 5, by being that the top and 1 molding of LED element of first and second lead frames 2 and 4 forms with transparent material such as silicon etc.
The technology of making lamp type LED comprises briefly: be installed in LED on the lead frame and the preceding technology of the contact of Connection Element, with cap be placed in one back technology on the semi-finished product that the contact of element is connected and the electrical characteristics of test product and the test technology of outward appearance.
Simultaneously, in order to realize having high brightness and high-power light-emitting device, led chip by the surface be installed on aluminum heat sink on, with the heat that led chip was produced in this encapsulation of radiation.Be applied at LED under the situation of high power (being higher than 1W) product, LED makes the characteristic of element to change usually owing to high thermal resistance (120 ℃) suffers electricity or thermal stress, and the lost of life of element.
With reference to figure 2, the traditional hot irradiation structure of a kind of lamp type LED comprises: first lead frame 2, wherein be equipped with LED element 1 on the core that forms cup-shaped groove 6; Second lead frame 4 is connected to LED element 1 so that be 1 power supply of LED element from the outside via lead 3, and is arranged to relative with first lead frame 2; And framework 8, by being that the top of first and second lead frames 2 and 3 and LED element 1 and lead 3 moldings form with epoxy resin.
This traditional hot sink structure also comprises: lens 5 are formed on the upper surface of framework 8, to hold LED element 1; And heat sink 7, be fixed in the bottom of first and second lead frames 2 and 4, so that the heat that radiation LED element 1 is produced.
This traditional hot sink structure is owing to independent framework 8 has been used in the upper surface molding that with epoxy resin is LED element 1, lead 3 and first and second lead frames 2 and 4.Being attached to heat sink 7 of first and second lead frames 2 and 4 also should design separately.As a result, its manufacturing process and number of components increase, and its manufacturing cost is also increased.
In addition, the traditional hot irradiation structure of described lamp type LED only can be applicable to horizontal type power LED (also being called SMD type LED), and can not be applied to vertical power LED, has therefore weakened its practical use.
Summary of the invention
Therefore, to be present in the problems referred to above of the prior art and to have made the present invention in order to solve, an object of the present invention is to provide the thermal radiation arrangement of a kind of vertical power LED and a kind of horizontal type power LED, its rapidly radiation have the heat that the horizontal type power LED chip of high brightness and high-power vertical power LED and encapsulation is produced, described horizontal type power LED chip is attached to heat sink the acquisition by the bending lead framework and with it.
Another object of the present invention provides the thermal radiation arrangement of a kind of vertical power LED and a kind of horizontal type power LED, and thus, it is heat sink that this horizontal type power LED can be applicable to tradition, and need not to design independent heat sink.
Another purpose of the present invention provides the thermal radiation arrangement of a kind of vertical power LED and a kind of horizontal type power LED, the characteristic variations minimum that it can prolong the life-span of its parts and make parts by the heat that the chip of radiation vertical power LED is effectively produced, described vertical power LED chip obtains by the LED element being installed on lamp type LED and being encapsulated the lamp type LED that the LED element is installed.
To achieve these goals, a kind of vertical power LED is provided, it obtains by the LED element being installed on lamp type LED and being encapsulated the described lamp type LED that described LED element is installed, according to the present invention, this vertical power LED comprises: first lead frame, have the cup-shaped recess that is built-in with the LED element, be connected to described LED element so that be described LED element power supply from the outside via lead, and have at least one the heat radiation through hole that is used to increase heat radiation speed; Second lead frame is connected to described LED element so that be described LED element power supply from the outside via lead, and is arranged to relative with described first lead frame; And molded portion, by being that the top molding of described first and second lead frames forms so that comprise described LED element with transparent material.
According to a further aspect in the invention, a kind of thermal radiation arrangement of horizontal type power LED is provided, the vertical power LED that this horizontal type power LED acquisition obtains from the described lamp type LED that described LED element is installed by installation LED element and encapsulation on lamp type LED, this thermal radiation arrangement comprises: first lead frame, has the cup-shaped recess that is built-in with the LED element, be connected to described LED element so that be described LED element power supply from the outside via lead, and have at least one the heat radiation through hole that is used to increase heat radiation speed; Second lead frame is connected to described LED element so that be described LED element power supply from the outside via lead, and is arranged to relative with described first lead frame; Molded portion is by being that the top molding of described first and second lead frames forms with the lens that formation comprises described LED element with transparent material; And heat sink, be fixed in reach molded outer and respectively towards the positive direction and the end of crooked described first and second lead frames in the other direction, the heat radiation that is used for described LED element is produced is to outside.
In a preferred embodiment, it is that 50 ° to 70 ° and the degree of depth are first notch of 0.3mm to 0.7mm that in described first and second lead frames each can be provided with the angle of cut (cut angle) in the side, and can be in the front or to be provided with the angle of cut be that 80 ° to 90 ° and the degree of depth are second notch of 0.01mm to 0.1mm at the back side, and in described first and second frameworks each be crooked together with described first and second notches.
Described first and second lead frames can be made of aluminum or copper.
And described first and second frameworks that stretch out from described molded portion can be crooked on the direction vertical with the light emission direction of described LED element, so that freely adjust the orientation angle (orientation angle) of the light of launching forward from described LED element.
Description of drawings
According to the following detailed description of carrying out in conjunction with the accompanying drawings, above and other objects of the present invention, feature and advantage will become more obvious, in the accompanying drawings:
Fig. 1 is the perspective view of a conventional lights type LED;
Fig. 2 is the perspective view of the thermal radiation arrangement of a conventional lights type LED of diagram;
Fig. 3 is the perspective view according to the vertical power LED of encapsulation of the present invention;
Fig. 4 is the perspective view of diagram according to the thermal radiation arrangement of horizontal type power LED of the present invention;
Fig. 5 is the side view of Fig. 4;
Fig. 6 is the plane of diagram according to the thermal radiation arrangement of horizontal type power LED of the present invention;
Fig. 7 is the view of diagram according to the lead frame of the thermal radiation arrangement of horizontal type power LED of the present invention, and wherein lead frame illustrates with front view and side view; And
But Fig. 8 is the perspective view of diagram according to the vertical power LED of the encapsulation of an alternative embodiment of the present invention.
The specific embodiment
The preferred embodiments of the present invention hereinafter will be described with reference to the drawings.The content that limits in the specification as detailed construction and element, is only used for helping those of ordinary skill in the art's complete understanding specific detail of the present invention, and therefore the invention is not restricted to these contents.
With reference to figure 3,7 and 8, a kind of according to of the present invention, by power chip being installed in lamp type LED goes up and encapsulation is equipped with the vertical power LED that this lamp type LED of this power chip obtains and comprises: first lead frame 13, has the cup-shaped recess that is built-in with LED element (also being called power chip) 11, be connected to this LED element so that power via lead 12 from the outside for this LED element, and has at least one the heat radiation through hole 18 (for example, two heat radiation through holes) that is used to increase heat radiation speed; Second lead frame 15 is connected to LED element 11 so that power from the outside for this LED element via lead 14, and is arranged to relative with first lead frame 13; And molded 16, by being that the top molding of first and second lead frames 13 and 15 forms so that comprise LED element 11 with transparent material.
As shown in Fig. 3 to 7, a kind of according to of the present invention, comprise by the thermal radiation arrangement that power chip is installed in lamp type LED goes up and encapsulation is equipped with the horizontal type power LED that the described lamp type LED of this power chip obtains: first lead frame 13, has the cup-shaped recess 10 that is built-in with LED element (also being called power chip) 11, be connected to LED element 11 so that power via lead 12 from the outside for this LED element, and has at least one the heat radiation through hole 18 (for example, two heat radiation through holes) that is used to increase heat radiation speed; Second lead frame 15 is connected to LED element 11 so that power from the outside for this LED element via lead 14, and is arranged to relative with first lead frame 13; Molded 16, by being that the top molding of first and second lead frames 13 and 15 forms with the lens that formation comprises this LED element with transparent material; And heat sink 17, by adhesive outside reaching lens and the end of crooked first and second lead frames 13 and 15 (also being called the horizontal type lead frame), so that the heat radiation that described LED element is produced is to outside.
In this case, be provided with angle of cut θ in the side in easily crooked first and second lead frames 13 and 15, the first and second lead frames 13 and 15 each
1Be 50 ° to 70 ° and depth D
1Be first notch 19 of 0.3mm to 0.7mm, and in the front or the back side be provided with angle of cut θ
2Be 80 ° to 90 ° and depth D
2 Second notch 20 for 0.01mm to 0.1mm.
First and second lead frames 13 and 15 and heat sink 17 can be made as aluminium (Al) or copper (Cu) by the material with thermal conductive resin.
In the accompanying drawings, reference number 30 indications one mark, it is provided on second lead frame 15, so that show trade mark or sign that manufacturer limited.
The application of the thermal radiation arrangement of vertical power LED and horizontal type power LED is described referring now to accompanying drawing.
As shown in Fig. 3 to 7, the part of the heat that is contained on the core of groove 10 and is produced by molded 16 sealed L ED11 by lead 12, first lead frame 13 and heat sink 17 to external radiation.This can prevent that lead 12 is owing to thermal stress is damaged.
And, the part of the heat that LED 11 is produced by first lead frame 13 that is made of aluminum or copper and the end that is made of aluminum or copper and is attached to first and second lead frames 13 and 15 heat sink 17 to external radiation.Therefore, suffering to prevent the characteristic variations of product under the situation with high brightness and high-power product of electricity or thermal stress owing to high thermal resistance (120 ℃).In addition, because therefore permission, is compared with traditional lamp more than the electric current of about 150mA, can obtain the high brightness effect with low cost.
And, because heat radiation through hole 18 (for example, two heat radiation through holes shown in the accompanying drawing) is formed on first lead frame 13, therefore increased the contact area of first lead frame 13 with air.In this case, owing to shortened the hot required time that radiation LED element 11 is produced, therefore increased heat radiation speed.
As shown in Figure 7, the angle of cut θ that has 50 ° to 70 °
1Be formed at first and second lead frames 13 made with thin plate and each side of 15 with first notch 19 of the depth D 1 of 0.3mm to 0.7mm, and have 80 ° to 90 ° angle of cut θ
2Be formed at each front or the back side of first and second lead frames 13 and 15 with second notch 20 of the depth D 2 of 0.01mm to 0.1mm.Therefore, owing to be formed at first and second notches 19 on first and second lead frames 13 and 15 and 20 structure, from the part of molded 16 first and second lead frame 13 that stretch out and 15 can be easily crooked (also being called the horizontal type lead frame) in the horizontal direction.
Groove 10 plays the effect of speculum, with the light of LED element 11 radiation to front-reflection.
Simultaneously, as shown in Figure 8, but in the vertical power LED of the alternative embodiment according to the present invention, crooked on the direction vertical from molded 16 first and second lead frame 13 that stretch out with the light emission direction of LED element 11 with 15, so that freely adjust the orientation angle of the light of launching forward from LED element 11.Since except first and second lead frames 13 and 15 with the right-angle bending, this embodiment is similar basically to the embodiment shown in Fig. 3, so will omit detailed description.
As mentioned above, because heat sink 17 by the end of adhesive in first and second lead frames 13 and 15, therefore, the heat sink LED of the being applied to element of tradition be need not independent heat sink design technology.And, compare with traditional LED by lens sealings, can be improved from the orientation angle of the light launched forward by the LED element 11 of molding.
In addition, by being attached to heat sink 17 structure of first and second lead frames 13 and 15, the heat that can be produced to external radiation LED element 11 effectively.Therefore,, also can prevent this LED element owing to heat is damaged even when the electric current more than about 150mA flows through the LED element, and the characteristic variations minimum that parts are caused owing to heat.
According to aforesaid the present invention, the thermal radiation arrangement of described vertical power LED and described horizontal type power LED has following advantage.
Because the extension of lead frame is crooked, and the heat sink sweep that is attached to lead frame so as radiation from the heat of vertical power LED, therefore, the heat that produced of the horizontal type power LED chip of radiation encapsulation rapidly, and therefore to have used product of the present invention be competitive on market.
Owing to the heat sink horizontal type power LED that is attached to need not to design independent heat sink, the horizontal type power LED can be applied to existing heat sink plate, to reduce manufacturing cost.
In addition, effectively radiation by power chip being installed on lamp type LED goes up and encapsulation is equipped with the heat that vertical power LED produced that this lamp type LED of this power chip obtains, thereby prolonged the life-span of parts and made the characteristic variations minimum of parts.
Although abovely described the preferred embodiments of the present invention for illustrative purposes, those of ordinary skill in the art should be appreciated that and can carry out various modifications, interpolation and replace in the disclosed the scope and spirit of the present invention of claims.
Claims (6)
1. vertical power LED, it obtains by the described lamp type LED that the LED element is installed in lamp type LED and goes up and encapsulation is equipped with described LED element, and this vertical power LED comprises:
First lead frame has the cup-shaped recess that is built-in with the LED element, is connected to described LED element so that be described LED element power supply from the outside via lead, and has at least one the heat radiation through hole that is used to increase heat radiation speed;
Second lead frame is connected to described LED element so that be described LED element power supply from the outside via lead, and is arranged to relative with described first lead frame; And
Molded portion, by with transparent material be the top molding of described first and second lead frames so that comprising described LED element forms,
In wherein said first and second lead frames each is provided with the angle of cut in the side be that 50 ° to 70 ° and the degree of depth are first notch of 0.3mm to 0.7mm, and in the front or to be provided with the angle of cut be that 80 ° to 90 ° and the degree of depth are second notch of 0.01mm to 0.1mm at the back side, make that the part of described first and second lead frames that stretch out from described molded portion can be easily crooked in the horizontal direction together with described first and second notches.
2. vertical power LED as claimed in claim 1, wherein described first and second frameworks that stretch out from described molded portion are crooked on the direction vertical with the light emission direction of described LED element, so that freely adjust the orientation angle of the light of launching forward from described LED element.
3. as the vertical power LED of claim 1 or 2, wherein said first and second lead frames are made of aluminum or copper.
4. the thermal radiation arrangement of a horizontal type power LED, this horizontal type power LED obtain from by the LED element being installed in lamp type LED goes up and encapsulation is equipped with the vertical power LED that the described lamp type LED of described LED element obtains, and this thermal radiation arrangement comprises:
First lead frame has the cup-shaped recess that is built-in with the LED element, is connected to described LED element so that be described LED element power supply from the outside via lead, and has at least one the heat radiation through hole that is used to increase heat radiation speed;
Second lead frame is connected to described LED element so that be described LED element power supply from the outside via lead, and is arranged to relative with described first lead frame;
Molded portion is by being that the top molding of described first and second lead frames forms with the lens that formation comprises described LED element with transparent material; And
Heat sink, be fixed in reach described molded outer and respectively towards the positive direction and the end of crooked described first and second lead frames in the other direction, the heat radiation that is used for described LED element is produced is to outside.
5. thermal radiation arrangement as claimed in claim 4, in wherein said first and second lead frames each is provided with the angle of cut in the side be that 50 ° to 70 ° and the degree of depth are first notch of 0.3mm to 0.7mm, and in the front or to be provided with the angle of cut be that 80 ° to 90 ° and the degree of depth are second notch of 0.01mm to 0.1mm at the back side, and in wherein said first and second frameworks each is crooked together with described first and second notches.
6. thermal radiation arrangement as claimed in claim 4, wherein said first and second lead frames are made of aluminum or copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100833684A CN100538166C (en) | 2006-06-06 | 2006-06-06 | The thermal radiation arrangement of vertical power LED and horizontal type power LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100833684A CN100538166C (en) | 2006-06-06 | 2006-06-06 | The thermal radiation arrangement of vertical power LED and horizontal type power LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101086328A CN101086328A (en) | 2007-12-12 |
| CN100538166C true CN100538166C (en) | 2009-09-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100833684A Expired - Fee Related CN100538166C (en) | 2006-06-06 | 2006-06-06 | The thermal radiation arrangement of vertical power LED and horizontal type power LED |
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| Country | Link |
|---|---|
| CN (1) | CN100538166C (en) |
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| CN101086328A (en) | 2007-12-12 |
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