CN211450391U - Flip-chip module with replaceable light-emitting angle - Google Patents
Flip-chip module with replaceable light-emitting angle Download PDFInfo
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- CN211450391U CN211450391U CN202020349190.9U CN202020349190U CN211450391U CN 211450391 U CN211450391 U CN 211450391U CN 202020349190 U CN202020349190 U CN 202020349190U CN 211450391 U CN211450391 U CN 211450391U
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Abstract
The utility model discloses a removable luminous angle flip-chip module, including the PCB base plate, PCB base plate below position is provided with the heat dissipation base, PCB base plate upper surface both sides position is provided with the LED power supply electrode that two symmetries set up, PCB base plate upper surface is located the flip-chip that the position was provided with a plurality of evenly distributed between two LED power supply electrode, the PCB base plate is located position and is provided with resistance between a plurality of flip-chip, PCB base plate upper surface is located and is provided with four lens fixed orificess around a plurality of flip-chip. The utility model discloses can change luminous lens adjustment luminous angle at any time, avoid luminous lens and environment to mismatch the appearance that causes the facula, the thorough effectual protection lamp of dispelling the heat simultaneously.
Description
Technical Field
The utility model relates to a LED lamp technical field especially relates to a removable luminous angle flip-chip module.
Background
A light Emitting diode (led), which is a solid semiconductor device capable of converting electrical energy into visible light, can directly convert electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes predominate and the other of which is an N-type semiconductor in which electrons predominate. When the two semiconductors are connected, a P-N junction is formed between them. When current is applied to the wafer through the wire, electrons are pushed to the P region where they recombine with holes and then emit energy in the form of photons, which is the principle of LED lamp illumination. The wavelength of light, i.e., the color of light, is determined by the material forming the P-N junction, and the LED can directly emit red, yellow, blue, green, cyan, orange, violet, and white light. The LED is used as the indicating light source of instruments and meters at first, and then the LEDs with various light colors are widely applied to traffic signal lamps and large-area display screens, so that good economic and social benefits are generated. In the united states, a long-life, low-light visual efficiency 140 watt incandescent lamp, which produces 2000 lumens of white light, is originally used as the light source, as exemplified by a 12 inch red traffic light. After passing through the red filter, the light is lost 90% leaving only 200 lumens of red light.
In traditional module, LED lamp pearl paster is on PCB, that is to say that chip and lens are fixed, and the luminous angle that different lens controlled is different, and the luminous angle of lens that if use and the LED lamp that does not match to the environment of using can leave the facula on wall or floor.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the defects existing in the prior art and providing a flip-chip module with replaceable luminous angle.
In order to achieve the above purpose, the utility model adopts the following technical scheme: the utility model provides a removable luminous angle flip-chip module, includes the PCB base plate, PCB base plate below position is provided with the heat dissipation base, PCB base plate upper surface both sides position is provided with the LED power supply electrode that two symmetries set up, PCB base plate upper surface is located the flip-chip that the position was provided with a plurality of evenly distributed between two LED power supply electrode, the PCB base plate is located and is provided with resistance between a plurality of flip-chip, PCB base plate upper surface is located and is provided with four lens fixed orificess around a plurality of flip-chip.
As a further description of the above technical solution:
and a light-emitting lens is bonded on the upper surface of the PCB substrate at the position of the lens fixing hole.
As a further description of the above technical solution:
the two LED power supply electrodes are connected with the plurality of flip chips and the resistors in series through leads, and the LED power supply electrodes are electrically connected with a power supply through leads.
As a further description of the above technical solution:
the PCB base plate below position is provided with the heat dissipation base, fixedly connected with heating panel is inlayed to heat dissipation base upper surface central point, the heating panel below is the cockscomb structure, a plurality of evenly distributed's bleeder vent is seted up to heat dissipation base both sides wall position, PCB base plate and heating panel upper surface fixed connection.
As a further description of the above technical solution:
the heat dissipation plate is made of brass materials, and heat conduction silicone grease is coated on the position, in contact with the lower surface of the PCB substrate, of the upper surface of the heat dissipation plate.
As a further description of the above technical solution:
the heat dissipation base is used for dissipating heat of copper.
As a further description of the above technical solution:
and the fixing claws of the light-emitting lens are bonded with the lens fixing holes through latex.
The utility model discloses following beneficial effect has:
the utility model discloses a set up lens fixed orifices and flip chip, through making luminescent lens and PCB base plate components of a whole that can function independently design, mismatch when luminescent lens and current environment, can change luminescent lens when having the condition that appears the facula, press from both sides out the latex with tweezers and can take off luminescent lens and change, the heating panel makes the radiating effect better simultaneously, avoids the chip circular telegram heat production to lead to equipment ageing to accelerate, or the long-time circular telegram leads to the chip to be heated and burns out.
The utility model discloses can change luminous lens adjustment luminous angle at any time, avoid luminous lens and environment to mismatch the appearance that causes the facula, the thorough effectual protection lamp of dispelling the heat simultaneously.
Drawings
Fig. 1 is a perspective view of a flip module with changeable light-emitting angle according to the present invention;
fig. 2 is an exploded view of a PCB substrate position of the flip-chip module with replaceable light-emitting angle according to the present invention;
fig. 3 is a side sectional view of a heat dissipation base of the flip-chip module with replaceable light-emitting angle according to the present invention.
Illustration of the drawings:
1. a PCB substrate; 2. an LED power supply electrode; 3. a light emitting lens; 4. a lens fixing hole; 5. flip chip mounting; 6. a resistance; 7. a heat dissipation base; 8. a heat dissipation plate; 9. and (4) air holes.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance, and furthermore, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a removable luminous angle flip-chip module, including PCB base plate 1, PCB base plate 1 below position is provided with heat dissipation base 7, 1 upper surface both sides position of PCB base plate is provided with two LED power supply electrode 2 that the symmetry set up, 1 upper surface of PCB base plate is located between two LED power supply electrode 2 the position and is provided with a plurality of evenly distributed's flip-chip 5, PCB base plate 1 is located and is provided with resistance 6 in the position between a plurality of flip- chip 5, 1 upper surface of PCB base plate is located and is provided with four lens fixed orificess 4 around a plurality of flip-chip 5.
The upper surface of the PCB substrate 1 is adhered with a light emitting lens 3 at the position of the lens fixing hole 4. Two LED power supply electrodes 2 are connected in series with a plurality of flip chips 5 and a resistor 6 through a wire, and the LED power supply electrodes 2 are electrically connected with a power supply through the wire, so that the LED power supply electrodes 2 can conveniently supply power for the flip chips 5.
The heating panel 8 is the brass material, and the position of 8 upper surfaces of heating panel and the contact of PCB base plate 1 lower surface scribbles heat conduction silicone grease, and the heating panel 8 radiating effect of brass material is good, and makes the heat dissipation accelerate through heat conduction silicone grease. The heat dissipation base 7 is made of copper for heat dissipation, and the copper material has good heat dissipation performance. The fixing claws of the light-emitting lens 3 are bonded with the lens fixing holes 4 through latex, and the latex is bonded to facilitate disassembly, so that the light-emitting lens 3 with different light-emitting angles can be replaced conveniently.
The working principle is as follows: wire and power electricity to LED power supply electrode 2 are connected, make flip chip 5 and resistance 6 circular telegram luminous, wall or subaerial facula can appear when emitting lens 3 does not match with the environment, cut off the power supply electrode 2 again, smash the latex in the lens fixed orifices 4 with tweezers, press from both sides emitting lens 3, emitting lens 3 changing other luminous angles can, simultaneously when 5 circular telegrams of flip chip generate heat the heat conduction silicone grease can even conduct the heat on copper's heating panel 8, make the heat give off.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (7)
1. The utility model provides a removable luminous angle flip-chip module, includes PCB base plate (1), its characterized in that: PCB base plate (1) below position is provided with heat dissipation base (7), PCB base plate (1) upper surface both sides position is provided with LED power supply electrode (2) that two symmetries set up, PCB base plate (1) upper surface is located between two LED power supply electrode (2) position and is provided with a plurality of evenly distributed's flip chip (5), PCB base plate (1) is located between a plurality of flip chip (5) position and is provided with resistance (6), PCB base plate (1) upper surface is located and is provided with four lens fixed orificess (4) around a plurality of flip chip (5).
2. The flip-chip module with replaceable light-emitting angle of claim 1, wherein: and the upper surface of the PCB substrate (1) is bonded with a light-emitting lens (3) at the position of the lens fixing hole (4).
3. The flip-chip module with replaceable light-emitting angle of claim 1, wherein: the two LED power supply electrodes (2) are connected with the flip chips (5) and the resistor (6) in series through leads, and the LED power supply electrodes (2) are electrically connected with a power supply through leads.
4. The flip-chip module with replaceable light-emitting angle of claim 1, wherein: PCB base plate (1) below position is provided with heat dissipation base (7), fixedly connected with heating panel (8) are inlayed to heat dissipation base (7) upper surface central point position, heating panel (8) below is the cockscomb structure, a plurality of evenly distributed's bleeder vent (9) are seted up to heat dissipation base (7) both sides wall position, fixed surface is connected on PCB base plate (1) and heating panel (8).
5. The flip-chip module with replaceable light-emitting angle of claim 4, wherein: the heat dissipation plate (8) is made of brass materials, and heat conduction silicone grease is coated on the position, in contact with the lower surface of the PCB substrate (1), of the upper surface of the heat dissipation plate (8).
6. The flip-chip module with replaceable light-emitting angle of claim 4, wherein: the heat dissipation base (7) dissipates heat for copper.
7. The flip-chip module with replaceable light-emitting angle of claim 2, wherein: and the fixing claws of the light-emitting lens (3) are bonded with the lens fixing holes (4) through latex.
Priority Applications (1)
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CN202020349190.9U CN211450391U (en) | 2020-03-19 | 2020-03-19 | Flip-chip module with replaceable light-emitting angle |
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CN202020349190.9U CN211450391U (en) | 2020-03-19 | 2020-03-19 | Flip-chip module with replaceable light-emitting angle |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114447180A (en) * | 2022-01-11 | 2022-05-06 | 深圳市伟方成科技有限公司 | White light LED packaging structure |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114447180A (en) * | 2022-01-11 | 2022-05-06 | 深圳市伟方成科技有限公司 | White light LED packaging structure |
CN114447180B (en) * | 2022-01-11 | 2024-01-12 | 深圳市伟方成科技有限公司 | White light LED packaging structure |
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