CN100511611C - Surface mounted semiconductor electronic parts and producing method - Google Patents
Surface mounted semiconductor electronic parts and producing method Download PDFInfo
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- CN100511611C CN100511611C CNB200410091696XA CN200410091696A CN100511611C CN 100511611 C CN100511611 C CN 100511611C CN B200410091696X A CNB200410091696X A CN B200410091696XA CN 200410091696 A CN200410091696 A CN 200410091696A CN 100511611 C CN100511611 C CN 100511611C
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- bare chip
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
Abstract
This invention provides a method for installing surface mounting semiconductor electronic components on a surface of an electrode welded on the base board and the electronic components processed by this method, which conducts the conductor graphs set on both sides of the insulation base board with through-holes with metallic conducting films formed on the internal wall to form a double-side through-hole PCB filling the through-hole and with the open-end of the through-hole covered by two erosion layers, at the same time, LED bare chips and photic bare chips are fixed on the conductor graphs connecting to the through-holes and the lower electrodes of the bare chips are connected with the graphs, the upper electrodes are connected with the conductor graphs separating from the conductor graphs with the bare chips and connected with the through-hole via leads and transmission resin is used to cover the chips and leads for sealing.
Description
Technical field
The present invention relates to the manufacture method of surface mounted semiconductor electronic parts, specifically relate to having and in the shaping dies that is provided with the printed substrate that disposes semiconductor bare chip, be pressed into liquid resin carries out the surface mounted semiconductor electronic parts of resin-sealed operation to semiconductor bare chip manufacture method and surface mounted semiconductor electronic parts.
Background technology
In recent years, along with small-sized, the lightweight of electronic equipment, in electronic unit, also correspondingly doing one's utmost to advance miniaturization, mounted on surfaceization.Example as the surface installing type small-sized electronic part, can list light-emitting diode (LED), the manufacture method of surface mounting luminous diode (being called chip-type LED later on) is: be provided with on the two sides of insulated substrate on the conductor fig of one side of printed substrate of conductor fig, when vertical and transverse direction disposed a plurality of LED bare chips at certain intervals and be fixed on the LED bare chip on the printed substrate, the lower electrode of LED bare chip was electrically connected with conductor fig by conductive adhesive.And the upper electrode of LED bare chip is wired to the conductor fig that separates with the conductor fig that has disposed the LED bare chip, realizes electrically conducting.In addition, when making printed substrate, disposed the conductor fig of LED bare chip and connected the conductor fig of lead, waited the through hole that is formed with metal conductive film, be electrically connected with the electrode pad of the conductor fig of opposing face by on inner peripheral surface, utilizing to electroplate.
Then; utilize translucent resin sealing printed substrate configuration the one side of LED bare chip (being called part side later on); make protection LED bare chip and lead is not vibrated and external stress such as impact and external environment influence such as moisture and dust in, have the lens function of control from the luminous intensity distribution of the light of LED bare chip radiation.But in the sealing operation, translucent resin enters in the through hole, and spreads to the back side (being called solder side later on) of printed substrate and the coated electrode pad, causes producing the product with the failure welding of electrode pad.In order to prevent this situation, have before utilizing translucent resin to seal, utilize electric conducting material to fill whole through hole, make translucent resin not spread to the technology (for example, with reference to patent documentation 1 and patent documentation 2) of the solder side of printed substrate from the part side of through hole.
In addition, also has following technology: will be positioned at the conductor fig that through hole that the two sides is formed with the printed substrate of conductor fig is provided with the solder side of position and remove, carry out laser from solder side one side, processing such as boring, the conductor fig of reserved unit face, leave through hole and use the hole, then, on the inner peripheral surface in hole, form the metal plating film by electroplating to wait, simultaneously in the removal of solder side the position of conductor fig also form the metal plating film, form electrode pad again, make the conductor fig of part side and the electrode pad of solder side pass through through hole conducting (for example, with reference to patent documentation 2 and patent documentation 3).
After having implemented the printed substrate of this processing with the translucent resin sealing, be unit with each LED bare chip, the longitudinal and transverse cutting of the through hole of halving is equably produced a plurality of chip-type LEDs from a bar printing wiring board.
To be installed in the function that the electronic unit in the electronic equipment is kept perfectly for a long time in order making, electronic unit need to be installed in securely on the printed substrate that is assemblied in the electronic equipment and electrical connection reliably, therefore the welding to electrode pad plays an important role.At this moment, in the miniaturized electric subset, because electrode pad is very little, so the electrode shape that uses in the welding of electronic unit influences welding reliability greatly.Particularly be mounted to and make under the through hole face situation relative with the printed substrate of electronic equipment at the above-mentioned surface mounting electronic member that will in whole through hole, fill electric conducting material, through hole is cut into half (being called half through hole later on), the required scaling powder of welding can not be fully flow through on the surface that forms the electric conducting material on plane, and is fixed on the printed substrate to weld halfway state.In addition, the plane weld part that has only electrode pad is compared when forming half through hole that will not be filled with the three-dimensional weld part that electrode pad is connected, and the extension of scaling powder and scolding tin is insufficient, might cause the welding performance deterioration.
In addition, to be positioned at the conductor fig of the solder side that the position is set of through hole that the two sides is formed with the printed substrate of conductor fig removes, utilize laser or drilling machine to leave the hole that arrives conductor fig, on the inner peripheral surface in hole, form the method for through hole by formation metal conductive films such as plating, the operation that in the process of making printed substrate, needs to remove conductor fig, and, in order on a printed substrate, to obtain a plurality of electronic units, printed substrate is provided with a plurality of through holes, need many times in order to utilize laser to form these holes, and when forming through hole and use the hole by drilling machine, the tooth that requirement makes drilling machine is feedthrough figure and make the insulant of printed substrate not remain in processing on the conductor fig not, when the degree of depth of considering the hole is set, reproducibility and when satisfying these and requiring needed homework precision etc., the rate of finished products of product becomes a big problem.Therefore, when utilizing these methods to form through holes, the rising of the increase of the time and labor that machining period relates to and the product cost that causes because of the rate of finished products reduction of finishing product becomes problem.And the burr that produces when the cutting through hole hinders scolding tin to rise on the electrode pad that is located at the direction vertical with through hole, makes scolding tin can not fully flow through the surface of entire electrode pad, has the problem that causes the weak welding of constant intensity.
Summary of the invention
The present invention proposes in view of the above problems, its purpose is, provides a kind of and can be manufactured on the method for surface mounted semiconductor electronic parts of the welding performance that can guarantee high reliability when being installed on the printed substrate that is assemblied in the electronic equipment and the surface mounted semiconductor electronic parts that uses this method to make with low cost.
In order to solve above-mentioned problem, the manufacture method of one of the present invention's surface mounted semiconductor electronic parts is characterised in that, comprise following operation: an end opening portion of stopping up the described through hole of two sides through hole printed substrate, wherein through hole printed substrate in two sides is provided with a plurality of independent conductors figures, the conducting by the through hole that is formed with metal conductive film on inner peripheral surface of the conductor fig on described two sides on the two sides of insulated substrate; Configuring semiconductor bare chip on the conductor fig of the one side of the peristome of the described through hole that has stopped up described two-face printing wiring board; By in the shaping dies that is provided with the described two sides through hole printed substrate that disposes described semiconductor bare chip, being pressed into the 1st resin, carry out resin-sealed to cover described semiconductor bare chip, stop up in the operation of described peristome, form the 1st etchant resist on the top of described through hole, formation the 2nd etchant resist on the 1st etchant resist.
And the present invention's two is characterised in that in one of the present invention, described the 1st etchant resist stops up described through hole midway.
And the present invention's three is characterised in that, in one of the present invention, the face that contacts with described the 1st etchant resist of described through hole is implemented roughened.
And, the manufacture method of the present invention's four surface mounted semiconductor electronic parts is characterised in that, comprise following operation: an end opening portion of stopping up the through hole of two sides through hole printed substrate, wherein the two sides of two sides through hole printed substrate insulated substrate is provided with a plurality of independent conductors figures, the conducting by the through hole that is formed with metal conductive film on inner peripheral surface of the conductor fig on described two sides; On the conductor fig of the one side of the peristome of the described through hole that has stopped up described two sides through hole printed substrate, semiconductor bare chip is installed; By in the shaping dies that is provided with the described two sides through hole printed substrate that disposes described semiconductor bare chip, being pressed into the 1st resin, carry out resin-sealed to cover described semiconductor bare chip, stop up in the operation of described peristome, in the through hole printed substrate of described two sides, near the position that disposes described semiconductor bare chip at least of described conductor fig, and the insulating trip that stickup has adhesive sheet near the part of the position that another end connected of the lead that is connected with described semiconductor bare chip of end outside, described adhesive sheet is a prepreg, and the heat reactive resin that is flooded in this prepreg stops up described through hole midway.
And, the present invention's five is characterised in that, one of the present invention～four any inventions in, to carry out described resin-sealed method be transfer moudling by be pressed into the 1st resin in the described shaping dies that is provided with the described two sides through hole printed substrate that disposes described semiconductor bare chip.
And the present invention's six surface mounted semiconductor electronic parts is characterised in that to have: two sides through hole printed substrate, the two sides of insulated substrate are provided with a plurality of independent conductors figures; Through hole has the inner peripheral surface that is formed with metal conductive film and has peristome at two ends, is arranged on the through hole printed substrate of described two sides with the state that runs through described conductor fig; Double-deck etchant resist, the 1st etchant resist midway and the 2nd etchant resist that is formed on above described the 1st etchant resist of described inner peripheral surface stop up in the end opening portion from described peristome that comprises; Semiconductor bare chip is configured on the conductor fig of described two sides through hole printed substrate of described double-deck etchant resist one side; And the resin that seals with the state that covers described semiconductor bare chip.
And the present invention's seven is characterised in that, the present invention six in, described the 1st etchant resist is covered by described the 2nd etchant resist.
And the present invention's eight surface mounted semiconductor electronic parts is characterised in that to have: two sides through hole printed substrate, the two sides of insulated substrate are provided with a plurality of independent conductors figures; Through hole has the inner peripheral surface that is formed with metal conductive film and has peristome at two ends, is arranged on the through hole printed substrate of described two sides with the state that runs through described conductor fig; Insulating trip has the prepreg that stops up the end opening portion in the described peristome; Heat reactive resin is immersed in the described prepreg, and described prepreg stops up described inner peripheral surface midway from described peristome; Semiconductor bare chip is configured on the conductor fig of described two sides through hole printed substrate of described prepreg one side; And the resin that seals with the state that covers described semiconductor bare chip.
Description of drawings
Fig. 1 is the fragmentary cross-sectional view of the process chart of the two sides through hole printed substrate that relates to of the expression first embodiment of the present invention, (a) be the figure of expression through-hole structure, (b) be the figure that expression forms the 1st etchant resist, (c) be the figure that a part the 1st etchant resist is removed in expression, (d) being the figure that represents to form the 2nd etchant resist, (e) is that the metal conductive film of the 1st etchant resist removal portion of expression formation through hole reaches the gold-plated figure of formation on electrode pad.
Fig. 2 is the stereogram of the surface mounted semiconductor electronic parts that relates to from the first embodiment of the present invention that solder side is seen.
Fig. 3 is to obtain the vertical view that a plurality of form forms the surface mounted semiconductor electronic parts that the first embodiment of the present invention relates on printed substrate.
Fig. 4 is the stereogram of the surface mounted semiconductor electronic parts that relates to from the first embodiment of the present invention that part side is seen.
Fig. 5 is the profile of the installment state of the surface mounted semiconductor electronic parts that relates to of the expression first embodiment of the present invention.
Fig. 6 is to obtain the vertical view that a plurality of form forms the surface mounted semiconductor electronic parts that the third embodiment of the present invention relates on printed substrate.
Fig. 7 is the stereogram during from the surface mounted semiconductor electronic parts that the third embodiment of the present invention that part side is seen relates to.
Symbol description
1: two sides through hole printed substrate; 2: insulated substrate; 3: conductor fig; 4: metal conductive film; 5: through hole; 5 ': half through hole; 6: the 1 resists; 7: the 2 resists; 8: gold-plated; 9: peristome; 9 ': peristome; The 10:LED bare chip; 11: be subjected to nude chip; 12: lead; 13: translucent resin; 14: lens; 15: surface mounted semiconductor electronic parts; 16: printed substrate; 17: conductor fig; 18: scolding tin; 19: electrode pad; 20: prepreg; 21: insulating trip.
Embodiment
Below, referring to figs. 1 through Fig. 7, to preferred implementation of the present invention be elaborated (giving same-sign) to same section.In addition, the following stated execution mode is a preferred concrete example of the present invention, thus carried out various preferred qualifications technically, but short of in the following description qualification special record of the present invention, scope of the present invention just is not limited to these modes.
(first embodiment)
In the first embodiment of the present invention, at first be provided with in the printed substrate of conductor fig, utilize the operation of Fig. 1 (a) shown in (e), stop up the processing of peristome of part side one side of through hole on the two sides of insulated substrate.At first, shown in figure (a), on the two-face printing wiring board of the electrode pad 19 that is provided with conductor fig 3 on the two sides of insulated substrate 2 and forms, through hole is set with conductor fig, on the inner peripheral surface in hole, wait formation metal conductive film 4 to form through hole 5, make the conductor fig 3 and electrode pad 19 conductings on two sides by through hole 5 by electroplating.Then, shown in figure (b), make each surface roughening (roughened) of the metal conductive film 4 of conductor fig 3, electrode pad 19 and through hole 5 by chemical etching or sandblast etc., increase surface area.Then, when in the whole through hole of through hole 5, filling third rare class I liquid I shape resist (the 1st resist) 6, cover the via openings portion 9 on through hole printed substrate 1 two sides, two sides, the conductor fig 3 and the electrode pad 19 of 9 ' periphery.Then, shown in figure (c), utilize energy to be about 300mJ/cm from the solder side direction of two sides through hole printed substrate 1
2Ultraviolet ray expose after, utilize organic solvent to develop, remove midway from solder side one side covering the 1st resist 6 of electrode pad 19 of solder side one side and the 1st resist 6 that is filled in the through hole 5 up to through hole 5.Time by controlling ultraviolet energy, irradiation ultraviolet radiation etc., can adjust the depth D of removing the 1st resist 6 in the through hole 5.In addition, the face that contacts with the 1st resist 6 is carried out roughened, increase surface area, so the adhesive strength of the 1st resist 6 strengthens and be firm.Then, shown in figure (d), utilize the 2nd resist 7 of third rare class further to cover the 1st resist 6 that covers for the peristome 9 of the through hole 5 of the part side of stopping up two sides through hole printed substrate 1.Then, at last, shown in figure (e), it is gold-plated 8 that metal conductive film 4 that the 1st resist 6 of the through hole 5 of removing solder side one side is exposed and electrode pad (electrode pad 19 of the stereogram of seeing from the solder side direction shown in Figure 2) 19 implemented, and finishes the processing of printed substrate.Herein, at the thickness of insulated substrate 2 is that the thickness of 0.72mm, conductive pattern 3 and electrode pad 19 (forming the state of Ni and Au film on the Cu film) is that the diameter of 18～45 μ m, through hole 5 usefulness through holes is in the two sides through hole printed substrate 1 of 0.35mm, the removal depth D of the 1st resist 6 in the preferred through hole 5 is about 0.4mm, be about 70 μ m from the thickness on the surface of surface to the 2 resists 7 of the conductor fig 3 of part side, but needn't stick to this numerical value.
In addition; as mentioned above; in order to protect the LED bare chip 10 that is configured on the two sides through hole printed substrate 1; be subjected to nude chip 11 and lead 12; utilize translucent resin 13 to seal; but the mold of utilization transmission at this moment is shaped under the situation about sealing; translucent resin 13 can rely on the forming pressure (the moulding material injection pressure when transmitting the mold shaping) when being shaped to enter through hole 5; and spread to the solder side and the coated electrode pad 19 of two sides through hole printed substrate 1; cause producing the product that can not be welded on the electrode pad 19, in through hole 5, fill resist 6; 7 come the peristome 9 of plug members face side exactly in order to prevent this situation.But it is limited utilizing one deck resist to stop pressurized translucent resin 13 to enter through hole 5, so resist is made double-layer structure, prevents that reliably translucent resin 13 from entering through hole 5.
Through in the operation of a pair of semiconductor bare chip of configuration on the part side of the two sides through hole printed substrate 1 after the processing of having carried out through hole 5 like this and the state after utilizing the operation of translucent resin sealing semiconductor bare chip as shown in Figure 3, when disposing a plurality of LED bare chips 10 and be subjected to nude chip 11 and be fixed on the two sides through hole printed substrate 1 on each conductor fig 3 that is connected with through hole 5 by conductive adhesive (not shown), the lower electrode of each chip 10,11 and conductor fig 3 are electrically connected.And the upper electrode of each chip 10,11 is connected to and conductor fig 3 conductor figs 3 that are connected with through hole 5 that separate that dispose each chip 10,11 by lead 12, has realized electrically conducting.
And; for disposing a plurality of LED bare chips 10 and the one side that is subjected to nude chip 11; for each chip 10,11 of protection and lead 12 is not vibrated or the influence of external stress such as impact and external environment conditions such as moisture and dust in; have the function of control, utilize translucent resin 13 to seal with the state of the part side of covering two sides through hole printed substrate 1 from the lens 14 of the luminous intensity distribution of the light of LED bare chip radiation.The method of utilizing this translucent resin 13 to seal is: for example utilize the transmission mold to be shaped and seal; Be arranged on the two sides through hole printed substrate 1 that disposes each chip 10,11 and lead 12 in the mould and matched moulds is fixed, go into mobile translucent resin 13 to mould inner pressure and seal by shaping.In addition, as the molding condition of this moment, the stamping machine clamping pressure is about 20t, and diameter of plunger is that (ram area is 9.6cm to Φ 35mm
2), plunger penetrates pressure and is about 1t, mold temperature is about 160 ℃, consider connect each chip 10,11 and electrode to be connected lead indeformable etc., forming pressure is preferably 80kg/cm
2To 120kg/cm
2Carried out under the resin-sealed situation in the transmission mold shaping that utilizes this condition, only the 1st above-mentioned etchant resist is filled into through hole midway the time, be filled in forming pressure that resist in the through hole is subjected to resin in through hole to solder side one side shifting, resin enters through hole with about 20% probability, produce resin leakage, become the reason of bringing out failure welding.Therefore, by resist is formed double-layer structure, can make the generation probability of resin leakage be almost 0%.And, after utilizing translucent resin 13 to finish sealing, is that unit cuts in length and breadth along double dot dash line with pair of LEDs bare chip 10 with being subjected to nude chip 11, through hole 5 is divided into two parts equably, from a printed substrate, produces a plurality of surface mounted semiconductor electronic parts shown in Figure 4 15.
In addition, Fig. 5 represents the profile of the state on the printed substrate that is assemblied in the electronic equipment that each surface mounted semiconductor electronic parts 15 after cutting apart by cutting is installed in.Surface mounted semiconductor electronic parts is configured to make the face and the relative state of printed substrate 16 in being assemblied in electronic equipment of half through hole 5 ' of surface mounted semiconductor electronic parts 15, metal conductive film 4 and electrode pad 19 that the conductive pattern 17 of printed substrate 16 exposes with the 1st resist 6 of half through hole 5 ' of removing surface mounted semiconductor electronic parts 15 engage by scolding tin 18, have realized fixing and electrically conducting.In this joint form, the face of half through hole 5 ' of surface mounted semiconductor electronic parts 15 is connected with printed substrate 16 by the three-dimensional ground of scolding tin 18 with the two sides of electrode pad 19 on being located at perpendicular one side, so can guarantee to be fixed on securely on the printed substrate 16.The frequency that the vibration of the surface mounted semiconductor electronic parts of therefore, installing owing to imposing on 15 and the loose contact that stress is caused cause producing electronic failure obviously reduces.
(second embodiment)
The processing of the peristome 9 of part side one side of the second embodiment of the present invention by stopping up through hole in the operation of the Fig. 1 shown in above-mentioned first embodiment (a)～(c).This operation is to utilize anticorrosive additive material to form two membranes in first embodiment, but in the present embodiment, to through hole 5 filling epoxy resins, by the part epoxy of removal solder side one sides such as laser processing, the metal conductive film 4 of through-hole wall is exposed then.Therefore,, can handle by enough filling work procedures, therefore have the advantage in the time of to reduce worker by using epoxy resin as the packing material that is filled in the through hole 5.In addition, be filled in the vitrification point that epoxy resin in the through hole 5 preferably has the forming temperature of the transmission mold that is higher than translucent resin when being shaped, in the present embodiment, having used vitrification point is 180～220 ℃ epoxy resin.Then, after being placed on semiconductor bare chip on the part side, utilize translucent resin to seal, finish surface mounted semiconductor electronic parts according to the operation identical with first embodiment.
Herein, be shaped by transmitting mold, the forming temperature that utilizes translucent resin sealing semiconductor bare chip is about 150 ℃ high temperature, and the vitrification point of the third rare class anticorrosive additive material that uses for the obstruction through hole in first embodiment is 110～120 ℃, in the present embodiment, the vitrification point of the employed epoxy resin of filling vias is 180～220 ℃.When vitrification point is higher than forming temperature, can prevent more reliably that translucent resin softening and that caused by transmission mold shaping from entering through hole.In addition, the advantage of present embodiment is that epoxy resin is better than resist with the tight contact that becomes the translucent resin of sealing resin, is expected to improve rate of finished products and improves durability.And, when the material of printed substrate is epoxy resin, can reduce the coefficient of thermal expansion differences of substrate and packing material, so be expected to improve the thermal endurance of device.
(the 3rd embodiment)
Fig. 6 is illustrated in the part vertical view that has formed the state of the surface mounted semiconductor electronic parts that obtains a plurality of third embodiment of the present invention on the two sides through hole printed substrate.On two sides through hole printed substrate 1, dispose LED bare chip 10 and be subjected to nude chip 11 and utilize the practice of translucent resin 13 seal member faces identical with the first above-mentioned embodiment, but, stop up through hole 5 so that when utilizing translucent resin 13 to seal translucent resin 13 do not flow into the method difference of through hole 5.Under this situation, resin film with cementability (prepreg) 20 is configured on the peristome 9 of part side one side of through hole 5, by prepreg 20 insulating trip 21 that constitutes by insulated substrate 2 identical materials of thermo-compressed in the above again with two sides through hole printed substrate 1.Like this, by the peristome 9 that divides two-layer obstruction through hole 5, the ejaculation pressure in the time of can preventing translucent resin 13 owing to seal molding reliably enters through hole 5.The prepreg 20 of Shi Yonging makes carbon fiber, glass fibre or aromatic polyamide fibre etc. flood uncured heat-curing resins such as epoxy resin to obtain herein, on the peristome 9 that it is arranged on through hole 5, utilize the heat-curing resin that flows out to be filled into through hole midway.At this moment, the filling degree of depth in through hole 5 can be adjusted by the amount of adjusting the heat-curing resin that fiber flooded.And, make the management of not sneaking into bubble, crackle and foreign matter etc. in the heat-curing resin of being filled, do not prevent that translucent resin 13 from flowing into the effect of through hole 5 so that do not influence.In addition, carrying out this processing in the everywhere of a plurality of through holes 5 is the very operation of spended time, so that prepreg 20 and insulating trip 21 form by necessity partly constitute laminar, they are sticked on the two sides through hole printed substrate 1 in the lump.In addition, the insulating trip 21 that why makes the peristome 9 that stops up through hole 5 and the insulated substrate 2 of two sides through hole printed substrate 1 be same material be because: owing to will exert pressure and heat when sticking on insulating trip 21 on the two sides through hole printed substrate 1, so in cooling procedure,, might produce in the worst case and peel off owing to the different between stress applications of thermal coefficient of expansion.Therefore,, can prevent to produce stress, guarantee the reliability of pasting by using the thermal coefficient of expansion identical materials.
Identical with first embodiment, on the part side of the two sides through hole printed substrate 1 after the processing of having carried out through hole 5 like this, when disposing a plurality of pair of LEDs bare chips 10 and be subjected to nude chip 11 and be fixed on the printed substrate on each conductor fig 3 that is connected with through hole 5 by conductive adhesive (not shown), the lower electrode of each chip 10,11 and conductor fig 3 are electrically connected.And the upper electrode of each chip 10,11 is connected to and conductor fig 3 conductor figs 3 that are connected with through hole 5 that separate that dispose each chip 10,11 by lead 12, thereby has realized electrically conducting.
Then, utilize translucent resin 13, to cover LED bare chip 10 and the state that is subjected to nude chip 11, with the part side sealing of two sides through hole printed substrate 1, cut along double dot dash line, be divided into each surface mounted semiconductor electronic parts 15 shown in Figure 7.
In addition, the invention is not restricted to the foregoing description.For example, packing material about the peristome that stops up through hole, so long as the high resin of vitrification point can use, in the sealing process of semiconductor bare chip, can suitably select according to conditions such as the kind of translucent resin, forming temperature, back operations.And,, also can adopt and use anchor clamps etc. in advance resin to be filled into midway method of through hole, after being filled into through hole, utilize methods such as etching or plasma irradiation to remove the method etc. of the part resin of solder side one sides about stopping up the method for through hole.
As mentioned above, in the present invention, by with the two-layer obstruction of the opening portion of through hole, transmit mold and be shaped seal arrangement that bare chip is arranged and when being subjected to the part side of nude chip, can stop the forming pressure when being shaped reliably is 80kg/cm utilizing
2～120kg/cm
2Translucent resin enter through hole.Therefore, can prevent that sealing resin from entering through hole and spreading to the solder side of printed substrate and coated electrode pad and cause producing the product that can not be welded on the electrode pad.
And, the resist that can utilize methods such as printing, injection to form in the lump to use when stopping up through hole, form insulating trip with adhesive sheet by pasting.Therefore, can reduce the number of working processes, reduce manufacturing cost.
And, because cover in the two layers of material of peristome of through hole, the material of contact through hole only is filled into through hole midway, so be split into to obtain each a plurality of surface mounted semiconductor electronic parts the time, insulating material can not be filled into through hole and be divided in half resulting half through hole, and has the part of exposing metal conductive film.Thus, half through hole face of surface mounted semiconductor electronic parts is connected on the printed substrate that surface mounted semiconductor electronic parts is installed with three-dimensional ground, the two sides that is located at the electrode pad on perpendicular face scolding tin, so can guarantee to be fixed on the installation base plate securely.And, be divided into the burr of the conductor fig that the cutting part of resulting half through hole of two parts produces equably at through hole, be limited at the part outside the hole of through hole.Therefore, can avoid following situation: burr hinders scolding tin to rise on the electrode pad, and scolding tin can not fully flow through the entire electrode bond pad surface, causes the weak welding of constant intensity.That is, can reach following excellent results: can reduce owing to the surface mounted semiconductor electronic parts on being installed in the printed substrate that is assemblied in the electronic equipment applies the electronic failure that vibration and stress cause loose contact and produces as reason.
Claims (8)
1. the manufacture method of a surface mounted semiconductor electronic parts is characterized in that, comprises following operation:
Stop up an end opening portion of the through hole of two sides through hole printed substrate, wherein the two sides of two sides through hole printed substrate insulated substrate is provided with a plurality of independent conductors figures, the conducting by the described through hole that is formed with metal conductive film on inner peripheral surface of the conductor fig on described two sides;
On the conductor fig of the one side of the peristome of the described through hole that has stopped up described two sides through hole printed substrate, semiconductor bare chip is installed;
By in the shaping dies that is provided with the described two sides through hole printed substrate that disposes described semiconductor bare chip, being pressed into the 1st resin, carry out resin-sealed covering described semiconductor bare chip,
Stop up in the operation of described peristome, form the 1st etchant resist, formation the 2nd etchant resist on the 1st etchant resist in an end opening portion of described through hole.
2. the manufacture method of surface mounted semiconductor electronic parts according to claim 1 is characterized in that, described the 1st etchant resist stops up described through hole midway.
3. the manufacture method of surface mounted semiconductor electronic parts according to claim 1 is characterized in that, the face that contacts with described the 1st etchant resist of described through hole is implemented roughened.
4. the manufacture method of a surface mounted semiconductor electronic parts is characterized in that, comprises following operation:
Stop up an end opening portion of the through hole of two sides through hole printed substrate, wherein the two sides of two sides through hole printed substrate insulated substrate is provided with a plurality of independent conductors figures, the conducting by the described through hole that is formed with metal conductive film on inner peripheral surface of the conductor fig on described two sides;
On the conductor fig of the one side of the peristome of the described through hole that has stopped up described two sides through hole printed substrate, semiconductor bare chip is installed;
By in the shaping dies that is provided with the described two sides through hole printed substrate that disposes described semiconductor bare chip, being pressed into the 1st resin, carry out resin-sealed covering described semiconductor bare chip,
Stop up in the operation of described peristome, in the through hole printed substrate of described two sides, near the position that disposes described semiconductor bare chip at least of described conductor fig, and the position that another end connected of the lead that is connected with described semiconductor bare chip of end near outside part on the insulating trip of stickup with adhesive sheet
Described adhesive sheet is a prepreg, and the heat reactive resin that is flooded in this prepreg stops up described through hole midway.
5. according to the manufacture method of any described surface mounted semiconductor electronic parts in the claim 1～4, it is characterized in that to carry out described resin-sealed method be transfer moudling by be pressed into the 1st resin in the described shaping dies that is provided with the described two sides through hole printed substrate that disposes described semiconductor bare chip.
6. surface mounted semiconductor electronic parts is characterized in that having:
Two sides through hole printed substrate, the two sides of insulated substrate are provided with a plurality of independent conductors figures;
Through hole has the inner peripheral surface that is formed with metal conductive film and has peristome at two ends, is arranged on the through hole printed substrate of described two sides with the state that runs through described conductor fig;
Double-deck etchant resist, the 1st etchant resist midway and the 2nd etchant resist that is formed on above described the 1st etchant resist of described inner peripheral surface stop up in the end opening portion from described peristome that comprises;
Semiconductor bare chip is configured on the conductor fig of described two sides through hole printed substrate of described double-deck etchant resist one side; And
The resin that seals with the state that covers described semiconductor bare chip.
7. surface mounted semiconductor electronic parts according to claim 6 is characterized in that, described the 1st etchant resist is covered by described the 2nd etchant resist.
8. surface mounted semiconductor electronic parts is characterized in that having:
Two sides through hole printed substrate, the two sides of insulated substrate are provided with a plurality of independent conductors figures;
Through hole has the inner peripheral surface that is formed with metal conductive film and has peristome at two ends, is arranged on the through hole printed substrate of described two sides with the state that runs through described conductor fig;
Insulating trip has the prepreg that stops up the end opening portion in the described peristome;
Heat reactive resin is immersed in the described prepreg, and described prepreg stops up described inner peripheral surface midway from described peristome;
Semiconductor bare chip is configured on the conductor fig of described two sides through hole printed substrate of described prepreg one side; And
The resin that seals with the state that covers described semiconductor bare chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410091696XA CN100511611C (en) | 2004-11-30 | 2004-11-30 | Surface mounted semiconductor electronic parts and producing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB200410091696XA CN100511611C (en) | 2004-11-30 | 2004-11-30 | Surface mounted semiconductor electronic parts and producing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1783445A CN1783445A (en) | 2006-06-07 |
| CN100511611C true CN100511611C (en) | 2009-07-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB200410091696XA Expired - Fee Related CN100511611C (en) | 2004-11-30 | 2004-11-30 | Surface mounted semiconductor electronic parts and producing method |
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| CN (1) | CN100511611C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101807632B (en) * | 2009-02-17 | 2012-07-11 | 亿光电子工业股份有限公司 | Light emitting diode package |
| CN102455519B (en) * | 2010-10-14 | 2016-11-23 | 上海科斗电子科技有限公司 | LED aerial projection display |
| CN103824904A (en) * | 2014-01-28 | 2014-05-28 | 深圳市九洲光电科技有限公司 | Manufacturing method of LED package substrate |
| CN106298749B (en) * | 2015-05-18 | 2020-11-13 | 深圳光台实业有限公司 | Light emitting diode, electronic device and manufacturing method thereof |
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2004
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| CN1783445A (en) | 2006-06-07 |
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