CN100483258C - Exposure pattern forming method - Google Patents
Exposure pattern forming method Download PDFInfo
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- CN100483258C CN100483258C CNB2005800131153A CN200580013115A CN100483258C CN 100483258 C CN100483258 C CN 100483258C CN B2005800131153 A CNB2005800131153 A CN B2005800131153A CN 200580013115 A CN200580013115 A CN 200580013115A CN 100483258 C CN100483258 C CN 100483258C
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70383—Direct write, i.e. pattern is written directly without the use of a mask by one or multiple beams
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7011—Pre-exposure scan; original with original holder alignment; Prealignment, i.e. workpiece with workpiece holder
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7007—Alignment other than original with workpiece
- G03F9/7015—Reference, i.e. alignment of original or workpiece with respect to a reference not on the original or workpiece
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7088—Alignment mark detection, e.g. TTR, TTL, off-axis detection, array detector, video detection
Abstract
A reference glass board (8B) whereupon a reference pattern (P) to be an exposure position reference is previously formed is arranged on a lower side of a glass board (8A), and is transferred in an arrow A direction by a transfer means (4). The reference pattern (P) is illuminated from the lower part of the transfer means (4) by the illuminating means (6), and an image of the reference pattern (P) is picked up by an image pickup means (5) arranged on an upper part of the transfer means (4). An optical system control means (7) detects a reference position previously set to the reference pattern (P) of which the image is picked up by the image pickup means (5), and controls irradiation start or irradiation stop of laser beams, having the reference position as a reference. Then, a pixel of a black matrix to be a reference of a functional pattern formed by being laminated on the glass board (8A) is exposed at a prescribed position on the glass board (8A). Thus, alignment accuracy of the functional pattern is improved and cost increase of an exposure apparatus is suppressed.
Description
Technical field
The present invention relates in the exposing patterns formation method that is exposed the formation function pattern that directly exposes on the body, specifically, be exposed the reference position that function pattern on the body, that become benchmark sets by being pre-formed with the filming apparatus shot detection in above-mentioned, with this reference position as benchmark to light beam begin the irradiation or stop the irradiation controlling, improve the registration accuracy of function pattern, manage to suppress its cost of exposure device simultaneously and rise.
Background technology
The exposing patterns formation method of existing exposure device, use has been pre-formed the mask pattern this mask suitable with the function pattern on glass substrate, the aforementioned mask pattern duplicated to be exposed to be exposed on the body, wherein have and adopt for example stepping (Stepper) device, micro mirror projection (Mirror Projection) device or closely connect the method that (Proximity) device carries out.But in these existing exposing patterns formation methods, under the situation with the stacked formation of multilayer function pattern, the registration accuracy of each interlayer function pattern just is a problem.Especially it forms TFT that large-scale LCD is used or chromatic color filter under the situation of used large-scale mask, requires the arrangement of mask pattern to have higher absolute dimension precision, so the mask cost raises.In addition, in order to obtain above-mentioned registration accuracy, need the function pattern and the mask pattern of bottom to aim between the two, this aligning especially is difficult to accomplish for large-scale mask.
On the other hand, there be a kind of electron beam or laser beam of being to use without mask that the pattern of cad data directly is depicted in the exposing patterns formation method that is exposed on the body.The exposure device that this exposing patterns formation method is used has LASER Light Source; Make the exposure optical system of this LASER Light Source institute emitted laser bundle shuttle-scanning; And to carry the conveyer that the state that is exposed body transports, the limit is according to the emission state of cad data control LASER Light Source, the limit makes the laser beam shuttle-scanning, simultaneously be exposed body transporting on the direction of quadrature mutually, so that be exposed the pattern (reference example such as patent documentation 1) that forms the cad data suitable on the body with two-dimensional approach with the function pattern with the laser beam flying direction.
Patent documentation 1: Ri Bente Open 2001-144415 communique
Summary of the invention
But in this existing exposing patterns formation method of directly describing formula, require the arranged in patterns of cad data to have higher absolute dimension precision this point and use the situation of the exposure device of using mask same, form in this manufacturing process of function pattern with many exposure devices in addition, when having trueness error to exist between exposure device, there is the problem of the registration accuracy variation of function pattern.Thereby, need high-precision exposure device in order to dispose this type of problem, cause the exposure device cost to rise.
In addition, must make the function pattern of bottom and the pattern of cad data aim at this point between the two and use the situation of other exposure device of using mask same in advance, exist and the described same problem of preamble.
Therefore, the present invention is directed to the problems referred to above, its purpose is to provide a kind of exposing patterns formation method that the exposure device cost raises of managing to suppress in the registration accuracy that improves the function pattern.
In order to achieve the above object, exposing patterns formation method of the present invention, utilize exposure optical system to make light beam with respect to being exposed swept-volume, be exposed on the body at this function pattern is directly exposed, wherein be pre-formed the reference substrate that constitutes by transparency carrier of the reference pattern that becomes the exposure position benchmark in the described downside configuration that is exposed body, on prescribed direction, transport described body and the reference substrate of being exposed by conveyer, throw light on from the downside of described conveyer reference pattern by lighting device to described reference substrate, utilization is taken described reference pattern at the filming apparatus of the downside configuration of described conveyer, detect predefined reference position on the described reference pattern that described filming apparatus takes by the optical system control device, with this reference position be benchmark to described light beam begin irradiation or stop irradiation controlling, at the described assigned position that is exposed on the body the 1st function pattern is exposed.
Utilize this method, copy to be pre-formed, the 1st function pattern is exposed being exposed on the body in reference pattern reference substrate, that become the exposure position benchmark.Form the 1st function pattern at the inchoate assigned position that is exposed on the body whatever thus.
And described reference substrate is a transparency carrier, and described lighting device and described filming apparatus are disposed at the below of described conveyer, and the below of this conveyer is taken the described reference pattern that described reference substrate forms certainly.By like this, with the lighting device that disposes below the conveyer the formed reference pattern of transparent reference substrate is thrown light on, take from the below with the filming apparatus of conveyer below configuration.
In addition, also utilize filming apparatus that described described the 1st function pattern that is exposed assigned position exposure formation on the body is taken, detect predefined reference position on described the 1st function pattern that described filming apparatus takes by described optical system control device, with this reference position be benchmark to described light beam begin irradiation or stop irradiation controlling, again other function pattern is exposed at the described assigned position that is exposed on the body.Copy thus to be exposed the 1st function pattern that forms on the body, form other function pattern at the described assigned position that is exposed on the body.
According to the 1st aspect of the present invention, by be formed at predefined reference position on the reference pattern on the reference substrate, that become benchmark with the filming apparatus shot detection, with this reference position be benchmark to light beam begin irradiation or stop irradiation controlling, at the described assigned position that is exposed on the body the 1st function pattern is exposed, thereby can form the 1st function pattern accurately at the inchoate assigned position that is exposed body whatever.In addition, the said reference substrate can use repeatedly, can reduce the cost of reference substrate.
In addition, by using transparency carrier as reference substrate, from the below of conveyer to the said reference substrate on formed reference pattern throw light on and take, thereby whether transparent body is all can become the function pattern of benchmark being exposed the body assigned position no matter be exposed.
In addition, according to the 2nd aspect of the present invention, take being exposed the 1st function pattern that the assigned position exposure forms on the body by also utilizing filming apparatus, detect the predefined reference position of the 1st function pattern, again with this reference position be benchmark to light beam begin irradiation or stop irradiation controlling, at the described assigned position that is exposed on the body other function pattern is exposed, be exposed the 1st function pattern on the body, that become benchmark thereby can copy to be formed at, form other function pattern at assigned position.Thereby under the situation that multilayer function pattern lamination forms, the registration accuracy of each layer function pattern also increases.By like this, using many exposure devices to form under the situation of lamination pattern, also can eliminate owing to trueness error between exposure device causes the problem of function pattern registration accuracy variation, and can suppress the cost rising of exposure device.
Description of drawings
Fig. 1 is the synoptic diagram of the embodiment of the suitable exposure device of expression exposing patterns formation method of the present invention.
Fig. 2 is the formation of explanation photoswitch and the stereographic map of action.
The key diagram that Fig. 3 concerns between the two for the camera site of expression scanning position of laser beam and filming apparatus.
Fig. 4 is the block diagram of disposal system first half during the inside of presentation video handling part constitutes.
Fig. 5 is the block diagram of disposal system latter half during the inside of presentation video handling part constitutes.
Fig. 6 is the key diagram of the formed reference map case of expression reference glass substrate.
Fig. 7 is illustrated in the key diagram that concerns with respect to the reference pattern that moves on the direction of laser beam flying direction quadrature and laser beam flying track between the two.
Fig. 8 is the process flow diagram of the step of explanation pattern formation method of the present invention.
Fig. 9 carries out the key diagram of the state of 2 hex value processing to the output of ring buffer memory for expression.
Figure 10 is the image of the predefined original bench mark of expression reference pattern position and the key diagram of look-up table thereof.
Figure 11 is for representing according to the key diagram of reference pattern with the state of the exposing patterns of the pixel of formation black dot matrix.
Figure 12 is the image of expression reference position, the predefined end of reference pattern and the key diagram of look-up table thereof.
The key diagram of the state that Figure 13 revises the scanning position of laser beam for expression.
Figure 14 is formed at the key diagram of the exposing patterns example of the chromatic color filter on the pixel column of black dot matrix for expression.
Figure 15 is the key diagram of other configuration example of expression filming apparatus.
Label declaration
1 exposure device, 3 exposure optical systems, 4 conveyers, 5 filming apparatus, 6 lighting devices, 7 optical system control devices, 8A glass substrate (being exposed body), 8B reference glass substrate (reference substrate), 21 black dot matrix, 22 pixels (the 1st function pattern), P reference pattern
Embodiment
Describe embodiments of the present invention with reference to the accompanying drawings in detail.
Fig. 1 is the synoptic diagram of the embodiment of the suitable exposure device of explanation exposing patterns formation method of the present invention.This exposure device 1 directly exposes to the function pattern being exposed on the body, has LASER Light Source 2, exposure optical system 3, conveyer 4, filming apparatus 5, lighting device 6 and optical system control device 7.In addition, the above-mentioned functions pattern means the pattern of the component part that carrying out target action originally that product has is required, for instance, for chromatic color filter, be the pattern of the pattern of pixels of black dot matrix or redness, blueness, green color filter, and for semiconductor device, be wiring pattern or various electrode patterns etc.Below in the explanation, explanation be to be the example that is exposed body with the glass substrate that chromatic color filter is used.
Above-mentioned LASER Light Source 2 emission light beams are the LASER Light Source that generate for example 355nm ultraviolet ray, are output as 4W or above height output total solids locked mode.
The place ahead of the light beam exit direction of above-mentioned LASER Light Source 2 is provided with exposure optical system 3.This exposure optical system 3 makes the laser beam shuttle-scanning on glass substrate 8A as light beam, has photoswitch 9, light-deflection apparatus the 10, the 1st catoptron 11, polygonal mirror 12, f θ lens 13 and the 2nd catoptron 14 nearby successively from the laser beam exit direction.
Above-mentioned photoswitch 9 can and stop irradiating state to the irradiating state of laser beam and switch, for example it constitutes as shown in Figure 2, with the 1st and the 2nd polarizer 15A, 15B separate configuration is to make that (the polarization axle p of polarizer 15A is set at vertical direction among this Fig. 2 for the polarization axle p mutually orthogonal of each polarizer 15A, 15B, the polarization axle p of polarizer 15B then is set at horizontal direction), electrooptic modulator 16 is disposed between the 1st and the 2nd polarizer 15A, the 15B.In case above-mentioned electrooptic modulator 16 impressed voltages just move, the plane of polarization that makes polarized light (rectilinearly polarized light) is to count the nsec high speed rotating of (nanosecond).For instance, when impressed voltage is zero, have a for example rectilinearly polarized light of vertical direction plane of polarization by what the 1st polarizer 15A optionally saw through among Fig. 2 (a), former state ground sees through above-mentioned electrooptic modulator 16, arrives the 2nd polarizer 15B.The 2nd polarizer 15B can't see through so have the above-mentioned rectilinearly polarized light of vertical direction plane of polarization owing to be configured to make the rectilinearly polarized light with horizontal direction plane of polarization optionally to see through, and laser beam becomes and stops irradiating state at this moment.On the other hand, shown in Fig. 2 (b), when electrooptic modulator 16 being added voltage and the plane of polarization of the rectilinearly polarized light of this electrooptic modulator 16 of incident is revolved when turning 90 degrees, then become the rectilinearly polarized light with horizontal direction plane of polarization during above-mentioned rectilinearly polarized light outgoing electrooptic modulator 16 with vertical direction plane of polarization, this rectilinearly polarized light sees through the 2nd polarizer 15B.Laser beam is in irradiating state thus.
Above-mentioned light-deflection apparatus 10 with the scanning position of laser beam be adjusted into its direction of scanning mutually the direction of quadrature (on the moving direction of glass substrate 8A with the corresponding to direction of arrow A direction shown in Figure 1) on stagger and scan correct position, for example be acousto-optic element (AO element).
In addition, the polygonal mirror 12 that the 1st catoptron 11 is used to make the direct of travel by the laser beam of light-deflection apparatus 10 to be bent to address later direction is set, be plane mirror.In addition, polygonal mirror 12 makes the laser beam shuttle-scanning, forms the octahedral catoptron in the side of the column-shape rotator of for example octagon.In this case, one of above-mentioned catoptron institute laser light reflected bundle is with the rotation of the polygonal mirror 12 whereabouts scanning direction to one dimension, the moment that moves to next mirror surface at the irradiation position of laser beam gets back to direction, follows the rotation of polygonal mirror 12 to begin whereabouts scanning direction to one dimension once more.
In addition, f θ lens 13 make the sweep velocity of laser beam on glass substrate 8A at the uniform velocity, be configured to make the position basically identical of the mirror surface of focal position and above-mentioned polygonal mirror 12.And the 2nd catoptron 14 is used to reflect the laser beam by f θ lens 13, makes its incident on respect to the direction of glass substrate 8A face approximate vertical, is plane mirror.And, near carry out the laser beam of shuttle-scanning the above-mentioned f θ lens 13 outgoing sides scanning begins the side part, be provided with line array sensor (line sensor) 17 and make itself and direction of scanning quadrature mutually, detect laser beam regulation scanning position and actual scanning position departure between the two, detect the scanning zero hour of laser beam simultaneously.In addition,, can not be arranged at f θ lens 13 1 sides and be arranged at the optional position, for instance, also can be arranged at worktable 18 1 sides that the glass substrate of addressing later transports usefulness as long as this line array sensor 17 can detect the scanning starting point of laser beam.
The below of above-mentioned the 2nd catoptron 14 is provided with conveyer 4.This conveyer 4 with glass substrate 8A mounting on worktable 18, with the direction of the direction of scanning quadrature of above-mentioned laser beam on transport with fixing speed, have make that above-mentioned worktable 18 moves for example transport roller 19 and drive this for example motor that transports roller 19 rotations etc. transport drive division 20.
The top of above-mentioned conveyer 4, rear one side of the above-mentioned laser beam flying position of carriage direction shown in the arrow A is provided with filming apparatus 5.The reference pattern P that 5 pairs of this filming apparatus are formed on the reference glass substrate 8B that addresses later takes with the pixel that is formed at the black dot matrix of conduct the 1st function pattern on the glass substrate 8A, is arranged in for example line array CCD (line CCD) of row for photo-sensitive cell.Here, as shown in Figure 3, the scan period that makes laser beam is that the travelling speed of T, conveyer 4 is V, and the scanning position F distance D between the two of the camera site E of then above-mentioned filming apparatus 5 and above-mentioned laser beam is set at and makes D=nVT (n is an integer).Thus, scanning regularly is consistent so that when the scanning position of exposure starting position arrival laser beam, can begin the scanning of laser beam.In addition, above-mentioned distance D is the smaller the better.By like this, can reduce the displacement error of glass substrate 8A, and the scanning position of laser beam is located more exactly with respect to the target exposure position.In addition, shown in Fig. 1 is the example that three filming apparatus 5 are set, but when the sweep limit of laser beam is narrow than the Flame Image Process zone of a filming apparatus 5, filming apparatus 5 can be one, and above-mentioned sweep limit then can correspondingly be provided with many filming apparatus 5 when wide than the Flame Image Process of a filming apparatus 5 zone.
The below of above-mentioned conveyer 4 is provided with lighting device 6.6 pairs of above-mentioned pixels 22 of this lighting device are thrown light on filming apparatus 5 can be taken.
Being provided with optical system control device 7 is connected with above-mentioned LASER Light Source 2, photoswitch 9, light-deflection apparatus 10, polygonal mirror 12, line array sensor 17, conveyer 4 and filming apparatus 5.This optical system control device 7 detects by captured being formed at the reference pattern p on the reference glass substrate 8B or being formed at predefined reference position on the pixel of the black dot matrix on the glass substrate 8A of filming apparatus 5, with this reference position is reference pin beginning irradiation or stopping irradiation LASER Light Source 2 control laser, make the exit direction deflection of laser beam simultaneously according to the outer voltage that is added on light-deflection apparatus 10 of output control of line array sensor 17, and the rotational speed of control polygonal mirror 12 maintains fixing speed with the sweep velocity of laser beam, and the travelling speed of conveyer 4 being transported glass substrate 8A is controlled to be fixing speed.And comprise: make LASER Light Source 2 luminous light source drive divisions 23; The control laser beam begins the photoswitch controller 24 that shines and stop to shine; The light-deflection apparatus drive division 25A of laser-beam deflection amount in the control light-deflection apparatus 10; The polygonal mirror drive division 25B that control polygonal mirror 12 drives, control conveyer 4 travelling speeds transport controller 26; The illumination light controller 27 that makes lighting device 6 light and extinguish; The A/D transformation component 28 that filming apparatus 5 captured images are carried out the A/D conversion; According to the beginning irradiation position and the image processing part 29 that stops irradiation position of judging laser beam through the view data of A/D conversion; Memory image handling part 29 is handled the beginning irradiation position (below be called the exposure starting position) of the laser beam that obtains and is stopped the data of irradiation position (below be called the end exposure position), stores the storage part 30 of the original bench mark position addressed later and the look-up table of reference position, end etc. simultaneously; Generate the modulating data generation handling part 31 of the modulating data that makes photoswitch 9 conducting/disconnections according to the data of exposure starting position of reading and end exposure position from this storage part 30; And suitably be controlled to be the control part 32 that whole device carries out define objective action.
Fig. 4 and Fig. 5 are the block diagram of presentation video handling part 29 1 configuration examples.As shown in Figure 4, image processing part 29 has for example three ring buffer memory 33A, 33B, 33C that are connected in parallel; With this ring buffer memory 33A, 33B, 33C each for example three linear memory buffer 34A, 34B, 34C that is connected in parallel respectively wherein; With this linear memory buffer 34A, 34B, 34C is connected and with determined threshold, the data of gray shade scale carried out 2 hex value handle the comparator circuit of exporting 35; The look-up table (original bench mark position LUT) of the view data that reference pattern P that obtains with the output data of above-mentioned 9 linear memory buffer 34A, 34B, 34C with from storage part shown in Figure 1 30 or the original bench mark position of stipulating with the pixel of black dot matrix are suitable compares output original bench mark location determination result's original bench mark location determination circuit 36 when two data are consistent; And compare reference position, the end decision circuit 37 of output reference position, end result of determination when two data are consistent with the output data of above-mentioned 9 linear memory buffer 34A, 34B, 34C with from the look-up table (reference position, end LUT) of storage part shown in Figure 1 30 view data suitable that obtain with the reference position, end.
In addition, as shown in Figure 5, image processing part 29 also comprises: import the above-mentioned original bench mark location determination result couple counting circuit 38A that its consistent number of times of the view data suitable with the original bench mark position is counted; Begin pattern or pixel number compares with the output of this counting circuit 38A with from the exposure that storage part shown in Figure 1 30 obtains, the exposure that will allow to begin to expose when two numerical value are consistent begins to allow signal to export to the comparator circuit 39A that modulating data shown in Figure 1 generates handling part 31; Import reference position, the above-mentioned end result of determination couple counting circuit 38B that its consistent number of times of the view data suitable with the reference position, end is counted; Compare with the output of this counting circuit 38B with from end exposure pattern or pixel number that storage part shown in Figure 1 30 obtains, when two numerical value are consistent, the end exposure signal is exported to the comparator circuit 39B of modulating data generation handling part 31 shown in Figure 1; Initial pattern or the pixel counts circuit 40 the quantity of initial pattern or pixel counted according to the output of above-mentioned counting circuit 38A; And will this initial pattern or the output of pixel counts circuit 40 and compare from reference pattern P row or pixel column numbering that storage part shown in Figure 1 30 obtains, when two numerical value are consistent, reference pattern P row or pixel column specification signal are exported to the comparator circuit 41 that modulating data shown in Figure 1 generates handling part 31.In addition, above-mentioned counting circuit 38A, the 38B action of reading of filming apparatus 5 is Once you begin just resetted by its read start signal.And initial pattern or the preassigned regulation exposing patterns of pixel counts circuit 40 end formation are in a single day just resetted by the exposing patterns end signal.
The following describes the exposing patterns formation method that the exposure device 1 that utilizes above-mentioned formation carries out.At first, in case exposure device 1 energized, optical system control device 7 just drives.By like this, LASER Light Source 2 starting emission of lasering beam.Simultaneously, polygonal mirror 12 begins rotation, and laser beam just can scan.But this moment is owing to photoswitch 9 disconnects, so laser beam also can't be shone.
Then, make glass substrate 8A be in upper side with the also inchoate glass substrate 8A of what pattern and formed benchmark shown in Figure 6 reference pattern P, as the overlapping mounting of reference glass substrate 8B of reference substrate on the worktable 18 of conveyer 4.In addition, conveyer 4 transports two sheet glass substrate 8A, 8B with a fixed speed, so the track while scan of laser beam (arrow B) tilts with respect to the moving direction (arrow A) of worktable 18 as shown in Figure 7.So, two sheet glass substrate 8A, 8B are paralleled under the situation of setting with above-mentioned moving direction (arrow A), exposure position takes place shown in Fig. 7 (a) produce situation about being offset at the reference pattern Pa that begins to scan with between the reference pattern Pb that finishes to scan.In this case, shown in Fig. 7 (b), two sheet glass substrate 8A, 8B can be obliquely installed with respect to carriage direction (arrow A direction) integratedly and make the orientation of said reference pattern P and the track while scan of laser beam (arrow B) direction consistent.Because the sweep velocity of laser beam is fast more than the travelling speed of two sheet glass substrate 8A, 8B, thereby above-mentioned side-play amount is quite little but in fact.So, also two sheet glass substrate 8A, 8B can be arranged in parallel with respect to moving direction, and the data determination above-mentioned side-play amount captured according to filming apparatus 5, the light-deflection apparatus 10 of control exposure optical system 3 comes side-play amount is carried out revisal.In addition, the following describes the above-mentioned side-play amount of middle supposition can ignore.
Then, drive and to transport drive division 20 worktable 18 is moved on the arrow A direction in Fig. 1.At this moment, transporting drive division 20 is controlled to be and is kept a fixed speed by the controller 26 that transports of optical system control device 7.
Next, in a single day the reference pattern P that is formed at reference glass substrate 8B arrives the camera site of filming apparatus 5, and filming apparatus 5 just begins to take, and according to the view data of captured reference pattern P exposure starting position and end exposure position is detected.Concrete formation method below with reference to flowchart text exposing patterns shown in Figure 8.
At first, take the image of reference pattern P by filming apparatus 5 at step S1.Shot image data reads among three ring buffer memory 33A, 33B, the 33C of image processing part shown in Figure 4 29 and handles like this.And three up-to-date data are from each ring buffer memory 33A, 33B, 33C output.In this case, for example ring buffer memory 33A output is two data data before, and what ring buffer memory 33B exported is data data before, and what ring buffer memory 33C exported then is up-to-date data.In addition, above-mentioned each data utilize respectively three ring buffer memory 33A, 33B, 33C for example the image configurations of 3 * 3CCD pixel on same time clock (time shaft).Its result can obtain by image format shown in for example Fig. 9 (a).In case being carried out numerical value, handles this image, just corresponding with 3 * 3 numerical value shown in Fig. 9 (b).The image that above-mentioned process numerical value is handled side by side, is handled so carry out 2 hex value by comparator circuit 35 and threshold on same time clock.For instance, set the threshold to " 45 ", Fig. 9 (a) just image shown in Fig. 9 (c), become 2 hex value.
Then, detect original bench mark position and reference position, end at step S2.Specifically, the reference position detect to be in original bench mark location determination circuit 36 above-mentioned 2 hex value data and the original bench mark position that obtains from storage part shown in Figure 1 30 compared with the LUT data and to carry out.
For instance, the original bench mark position is set under the situation in the reference pattern P upper left corner shown in Figure 10 (a), just above-mentioned original bench mark position with LUT shown in Figure 10 (b), this moment the original bench mark position become " 000011011 " with the LUT data.So, above-mentioned 2 hex value data are compared with LUT data " 000011011 " with the said reference position, when two data are consistent, judge that filming apparatus 5 captured view data are the original bench mark position, from original bench mark location determination circuit 36 output original bench mark location determination results.In addition, four of reference pattern P are side by side the time as shown in figure 11, and the reference pattern P upper left corner is just suitable with the original bench mark position.
According to above-mentioned result of determination, in counting circuit 38A shown in Figure 5 to the inferior counting number of above-mentioned unanimity.And this count value begins the pattern numbering with the exposure that obtains from storage part shown in Figure 1 30 in comparator circuit 39A compares, and will expose to beginning to allow signal to export to modulating data generation handling part 31 shown in Figure 1 when two numerical value are consistent.In this case, as shown in figure 11, for example on the direction of scanning of laser beam, stipulate the 1st, the 2nd, the 3rd, the 4th reference pattern P as exposure beginning pattern
1, P
2, P
3, P
4Words, the upper left corner of each reference pattern just becomes the original bench mark position, thus with the line array CCD of this corresponding filming apparatus 5 in original bench mark position in for example " 1000 ", " 2000 ", " 3000 ", " 4000 " are stored in photoswitch controller 24 in the element address.
On the other hand, above-mentioned 2 hex value data are compared with the LUT data with the reference position, end that obtains from storage part shown in Figure 1 30 in reference position, end decision circuit 37.For instance, the reference position, end is set under the situation in the reference pattern P upper right corner shown in Figure 12 (a), just reference position, above-mentioned end with LUT shown in Figure 12 (b), this moment the reference position, end become " 110110000 " with the LUT data.So, above-mentioned 2 hex value data are compared with LUT data " 110110000 " with reference position, above-mentioned end, when two data are consistent, judge that filming apparatus 5 captured view data are the reference position, end, from reference position, end decision circuit 37 output reference position, end result of determination.In addition, described same with preamble, for example four of reference pattern P are side by side the time as shown in figure 11, and each reference pattern P upper right corner is just suitable with the reference position, end.
According to above-mentioned result of determination, in counting circuit 38B shown in Figure 5 to the inferior counting number of above-mentioned unanimity.And this count value is compared with the end exposure pattern numbering that obtains from storage part shown in Figure 1 30 in comparator circuit 39B, when two numerical value are consistent the end exposure signal is exported to modulating data shown in Figure 1 and generates handling part 31.In this case, as shown in figure 11, for example on the direction of scanning of laser beam, stipulate the 1st, the 2nd, the 3rd, the 4th reference pattern P as the end exposure pattern
1, P
2, P
3, P
4Words, the upper right corner of each reference pattern just becomes the reference position, end, thus with the line array CCD of this corresponding filming apparatus 5 in reference position, end in for example " 1990 ", " 2990 ", " 3990 ", " 4990 " are stored in photoswitch controller 24 in the element address.And, in case, just enter step S3 by detecting original bench mark position and reference position, end like this.
Step S3 can detect the exposure position on the glass substrate 8A moving direction.This step as shown in Figure 3, the camera site E distance D between the two of the scanning position F of laser beam and filming apparatus 5 is set at D=nVT, and (n is an integer, V is the translational speed of conveyer 4, T is the scan period of laser beam), so that V is fixing, can count by scan period T and infer above-mentioned exposure position laser beam.
Then, scan edge laser beam in step S4, the limit is adjusted above-mentioned exposure position.Specifically, as shown in figure 13, comparing and detect its side-play amount in the scanning position (element address) of the line array sensor 17 detected current laser beam that f θ lens 13 places are provided with and predetermined reference cell address, controls light-deflection apparatus 10 scanning position of laser beam is adjusted exposure position with reference cell address (reference scan position) is consistent.
Next, in step S5, begin exposure.ON time by photoswitch controller 24 control photoswitches 9 begins exposure.In this case, at first make photoswitch 9 be in conducting state and come scanning laser beam, in case the scanning that detects laser beam by above-mentioned line array sensor 17 just disconnects photoswitch 9 zero hour immediately.At this moment, in the middle of generating handling part 31, reads modulating data the element address " 1000 " of the pairing filming apparatus 5 in the 1st original bench mark position Figure 11 for example, and by the scanning zero hour of control part 32 computing laser beam of the time t to the original bench mark position
1In this case, if measure the sweep time t of scanning zero hour of laser beam in advance to the element address " 1 " of filming apparatus 5
0, and make the time clock CLK of line array CCD of the sweep velocity of laser beam and filming apparatus 5 synchronous in advance, then by element address " 1000 " time clock number before being counted above-mentioned moment t
1Just can be easy to as t
1=t
0+ 1000CLK tries to achieve.
The method that the pixel 22 of the black dot matrix 21 shown in Figure 11 (b) is exposed is described below with reference to Figure 11.In addition, the laser beam that is suitable for the here light beam that can use its beam diameter fully to narrow with respect to reference pattern P.
In this case, store the cad data of the interior pixels that thick frame surrounded 22 shown in Figure 11 (b) in the storage part 30.Here, shown in Figure 11 (b), just every ribbon pattern of pixel 22 amplitude limits is specified exposure starting position and end exposure position according to the cad data of reading in the middle of storage part 30 by the sweep length of laser beam, make this exposure starting position corresponding with the element address of the line array CCD of above-mentioned filming apparatus 5 with the end exposure position, the sweep time of management laser beam, expose.Specifically, Figure 11 (b) is middle earlier to L
1Row exposes.In this case, allow exposure from the 1st original bench mark position " 1000 ", at time t
2After begin the exposure.Next, elapsed time t since then
3Exposure is finished in the back.
Then, in step S6, detect the reference position, end.Reference position, end and mentioned abovely carry out equally, management for example the 1st original bench mark position " 1000 " to t sweep time of the laser beam of reference position, the 1st end " 1990 "
4, locate to finish to the 1st reference pattern P in reference position, end " 1990 "
1Exposure actions.In addition, be depicted as L as Figure 11 (b)
1Under the situation of row, just keep stopping exposure status.
Next, in step S7, judge the scanning that whether finishes laser beam.Here, if the judgement negating is just returned step S2 and is repeated above-mentioned action.Then, among the step S2 shown in Figure 11 (a), in case detect for example the 2nd original bench mark position " 2000 " and reference position, the 2nd end " 2990 ", just enter step S5 through step S3, S4.In this case, with the t that passes through from the 2nd original bench mark position " 2000 " equally mentioned above
2After begin the exposure, pass through t since then
3Exposure is finished in the back.Then, locate to finish in reference position, end " 2990 " to the 2nd reference pattern P
2The L that carries out
1The row exposure.
Above-mentioned steps S2～S6 repeats till the single pass of laser beam finishes.By like this, in case end is to the L of the 1st reference pattern row
1The row exposure actions just is sure judgement in step S7.Enter step S8 then.
In step S8, judge by control part 32 whether the exposure to the exposing patterns of stipulating zone (being the 1st reference pattern row) here finishes fully.Here,, repeat the action of step S2～S6, carry out L among Figure 11 (b) if step S2 is then returned in the judgement negating
2The exposure actions of row.For instance, from the 1st original bench mark position " 1000 " process t
5After begin the exposure, pass through t since then
6Exposure is finished in the back, locates in reference position, the 1st end " 1990 " to finish the 1st reference pattern P
1Exposure actions.
Next repeat L equally
3, L
4... exposure actions, in case finish exposure, in step S8, be sure judgement just to the 1st reference pattern row, enter step S9.At this moment, the exposing patterns of this black dot matrix 21 shown in Figure 11 (b) bend is listed as on the pairing glass substrate 8A is exposed at the 1st reference pattern.
Then, in step S9, whether finish fully for the forming of exposing patterns of the reference pattern row of carriage direction by control part 32 judgements.Here, if step S1 is just returned in the judgement negating, repeat the action of step S1～S8, execution copies each reference pattern row that the exposing patterns of the pixel 22 of black dot matrix 21 is exposed on glass substrate 8A to exposure actions preassigned the 2nd, 3... reference pattern row.By like this, in step S10, if sure judgement, just being all over forms exposing patterns to glass substrate 8A.
Then, with mentioned above be the exposing patterns that benchmark forms redness or blue or green chromatic color filter equally with the pixel 22 of the black dot matrix 21 of glass substrate 8A.The formation method of the exposing patterns of following brief description chromatic color filter.In addition, the laser beam that is suitable for here can be used the essentially identical light beam of width of its beam diameter and pixel 22.
At first, take the image of the pixel 22 of black dot matrix 21 among the step S1 of Fig. 8 by filming apparatus.Then, in step S2, detect above-mentioned pixel 22 predefined original bench mark positions and reference position, end.Form under the situation of the exposing patterns of this band shape shown in Figure 14 bend, for example can set " 1 " and number as the exposure starting pixel among Fig. 5.Thereby, just will allow from the 1st pixel 22 in this case by comparer 39A
1The original bench mark position set, upper left end work the exposure that begins to expose and begin to allow signal to export to photoswitch controller 24.
On the other hand, for example can set " 6 " as end exposure pixel number shown in Figure 5.In this case, just will be in the 6th pixel 22 by comparer 39B
6The place, reference position, end that sets, the upper right end end exposure signal that finishes exposure export to photoswitch controller 24.Then, with mentioned above in step S3, detect the 1st pixel column equally after, the scanning position to laser beam in step S4 is adjusted.Then, in step S5 according to from the cad data of the exposing patterns of the chromatic color filter read in the middle of the storage part 30 by the sweep time of the above-mentioned original bench mark of control part 32 computings position to the laser beam of the starting position of exposing.In addition, the original bench mark position is consistent with the exposure starting position among Figure 14.Then, in step S6 according to the sweep time of cad data computing exposure starting position to the laser beam of end exposure position.In addition, the end exposure position is consistent with the reference position, end among Figure 14.
Then, whether the single pass of judging laser beam in step S7 finishes repeated execution of steps S1～S6 under unclosed situation.Next, under the situation that single pass finishes, enter step S8, judge whether the exposure to the 1st pixel column finishes fully.Under the situation for Figure 14, because the exposure of the 1st pixel column single pass with laser beam is finished, so in step S8, be sure judgement, so enter step S9.Then, whether judgement finishes fully to the formation of the exposing patterns of the determined pixel row of carriage direction.Here, if sure judgement then finishes to form for example exposing patterns of the chromatic color filter of redness for glass substrate 8A.
Like this, according to exposing patterns formation method of the present invention, can be by managing to go up the predefined reference position of reference pattern P that forms by filming apparatus 5 shot detection reference glass substrate 8B, with this reference position be benchmark to light beam begin irradiation or stop irradiation controlling, on the assigned position of glass substrate 8A, form the exposing patterns of the pixel 22 of black dot matrix 21, thereby form the exposing patterns of above-mentioned pixel 22 in the assigned position place of what all inchoate glass substrate 8A high precision.
In addition, with mentioned above same, the pixel 22 specified reference positions of the black dot matrix 21 that go up to form with glass substrate 8A are that benchmark forms exposing patterns, can be on pixel column high precision form the exposing patterns of for example red, blue, green chromatic color filter.By like this, using many exposure devices to form under the situation of each exposing patterns, also can eliminate because the low precision between exposure device causes the problem of exposing patterns registration accuracy variation, and can suppress the exposure device cost and rise.
And, as long as each arrangement pitches of said reference pattern P and pixel 22 is identical, just can uses with a slice reference glass substrate 8B the pixel of arbitrary shape is exposed.
In addition, illustrated in the above-mentioned embodiment is that the example of back lighting is used in the below that lighting device 6 is disposed at conveyer 4, but is not limited thereto, and projection illumination is used in the top that also lighting device 6 can be disposed at conveyer 4.
And, also can manage lighting device and filming apparatus 5 are disposed at the below of conveyer 4 as shown in figure 15, from the below of this conveyer 4 the transparent formed reference pattern P of reference glass substrate 8B is taken.By like this, no matter be exposed the whether transparent function pattern that can become benchmark of body at the assigned position place that is exposed body.
And exposing patterns formation method of the present invention not only is applicable to the large substrates such as chromatic color filter of LCD, also can be applied to the exposure of the pattern of semiconductor etc.
Claims (2)
1. an exposing patterns formation method utilizes exposure optical system to make light beam with respect to being exposed swept-volume, is exposed on the body at this function pattern is directly exposed, it is characterized in that,
Be pre-formed the reference substrate that constitutes by transparency carrier of the reference pattern that becomes the exposure position benchmark in the described downside configuration that is exposed body, on prescribed direction, transported described body and the reference substrate of being exposed by conveyer,
Throw light on from the downside of described conveyer reference pattern by lighting device to described reference substrate,
Utilization is taken described reference pattern at the filming apparatus of the downside configuration of described conveyer,
Detect predefined reference position on the described reference pattern that described filming apparatus takes by the optical system control device, with this reference position be benchmark to described light beam begin irradiation or stop irradiation controlling, at the described assigned position that is exposed on the body the 1st function pattern is exposed.
2. exposing patterns formation method as claimed in claim 1, it is characterized in that, also utilize filming apparatus that described described the 1st function pattern that is exposed assigned position exposure formation on the body is taken, detect predefined reference position on described the 1st function pattern that described filming apparatus takes by described optical system control device, again with this reference position be benchmark to described light beam begin irradiation or stop irradiation controlling, at the described assigned position that is exposed on the body other function pattern is exposed.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004134441A JP4253707B2 (en) | 2004-04-28 | 2004-04-28 | Exposure pattern forming method |
| JP134441/2004 | 2004-04-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1947064A CN1947064A (en) | 2007-04-11 |
| CN100483258C true CN100483258C (en) | 2009-04-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005800131153A Active CN100483258C (en) | 2004-04-28 | 2005-04-28 | Exposure pattern forming method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP4253707B2 (en) |
| KR (1) | KR101094468B1 (en) |
| CN (1) | CN100483258C (en) |
| TW (1) | TWI380134B (en) |
| WO (1) | WO2005106591A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5344730B2 (en) * | 2006-05-22 | 2013-11-20 | 株式会社ブイ・テクノロジー | Exposure equipment |
| JP5319175B2 (en) * | 2008-06-17 | 2013-10-16 | 日立造船株式会社 | Pattern drawing method and apparatus |
| CN102725680B (en) * | 2010-01-21 | 2015-02-11 | 夏普株式会社 | Substrate, method for exposure of substrate to light, and photo-alignment treatment method |
| JP5538049B2 (en) * | 2010-04-22 | 2014-07-02 | 日東電工株式会社 | Method for aligning photomask and substrate and method for manufacturing printed circuit board |
| JP5704315B2 (en) * | 2011-01-07 | 2015-04-22 | 株式会社ブイ・テクノロジー | Exposure equipment |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6010623A (en) * | 1983-06-29 | 1985-01-19 | Fujitsu Ltd | Photorepeater |
| JPS62124999A (en) * | 1985-11-27 | 1987-06-06 | 株式会社ニコン | Automatic drawing device |
| JP3046697B2 (en) * | 1993-11-08 | 2000-05-29 | シャープ株式会社 | Exposure equipment |
| JPH09171106A (en) * | 1995-10-19 | 1997-06-30 | Fuji Photo Film Co Ltd | Manufacture of color filter |
| JP2004012903A (en) * | 2002-06-07 | 2004-01-15 | Fuji Photo Film Co Ltd | Aligner |
-
2004
- 2004-04-28 JP JP2004134441A patent/JP4253707B2/en not_active Expired - Lifetime
-
2005
- 2005-04-28 KR KR1020067022507A patent/KR101094468B1/en active IP Right Grant
- 2005-04-28 TW TW94113745A patent/TWI380134B/en active
- 2005-04-28 WO PCT/JP2005/008115 patent/WO2005106591A1/en active Application Filing
- 2005-04-28 CN CNB2005800131153A patent/CN100483258C/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN1947064A (en) | 2007-04-11 |
| JP4253707B2 (en) | 2009-04-15 |
| KR101094468B1 (en) | 2011-12-19 |
| TWI380134B (en) | 2012-12-21 |
| KR20070001251A (en) | 2007-01-03 |
| TW200606595A (en) | 2006-02-16 |
| WO2005106591A1 (en) | 2005-11-10 |
| JP2005316167A (en) | 2005-11-10 |
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