TWI394007B - Exposing apparatus - Google Patents

Description

Exposure device

The present invention relates to an exposure apparatus for directly exposing a functional pattern on an object to be exposed, and a method of forming the pattern. More specifically, the present invention relates to an exposure apparatus that detects a reference position set by a photographing mechanism to detect a functional pattern on which the exposed body is preliminarily formed, and starts the irradiation of the control beam based on the reference position. Or the irradiation is stopped, so as to improve the coincidence accuracy of the functional pattern and suppress the cost of the exposure device.

In the prior exposure apparatus, a mask pattern equivalent to a functional pattern formed on a glass substrate is used, and the mask pattern is transferred and exposed on the object to be exposed, for example, a stepper is provided. , Mirror Projection, Proximity and other devices. However, in the case of these conventional exposure apparatuses, in the case where a multi-layered functional pattern is formed by lamination, the accuracy of the coincidence functional pattern between the layers causes a problem. In particular, for the large-sized photomasks used for the formation of large-size liquid crystal display TFTs and color filters, the arrangement of the mask patterns requires absolute dimensional accuracy, and the mask price is extremely expensive. In order to obtain the above-mentioned coincidence precision, it is necessary to align with the functional pattern and the reticle pattern of the bottom layer, and it is particularly difficult to align for a large reticle.

On the other hand, there is also an exposure apparatus that directly draws a CAD data pattern on an object to be exposed using an electron beam and a laser beam without using a photomask. The exposure apparatus includes a laser light source for reciprocally scanning an exposure optical system of a laser beam emitted from the laser light source; and a transport mechanism for carrying the state of the exposed object to control the laser light source according to the CAD data. The emission state is reciprocally scanned while the object to be exposed is conveyed to a direction perpendicular to the scanning direction of the laser beam, and a CAD data pattern equivalent to the functional pattern is formed in two dimensions (for example, JP-A-2001-144415).

However, in such a direct-drawing conventional exposure apparatus, the dimensional accuracy of the CAD data pattern is absolutely required to be highly precise, which is the same as the exposure apparatus using the reticle, and is formed into a functional pattern by using a plurality of exposure apparatuses. In the manufacturing process, if the accuracy between the exposure devices is uneven, the coincidence accuracy of the functional pattern is deteriorated. Therefore, in order to solve such a problem, it is necessary to have a high-precision exposure device and increase the cost.

In addition, it is necessary to align the underlying functional pattern and CAD data pattern in advance, which is the same as other exposure devices that use a reticle. There are also the above problems.

Therefore, the present invention has been made in order to cope with this problem, and to provide an image precision which can improve the pattern of the recombination function while suppressing the cost of the exposure apparatus.

In order to achieve the above object, a first invention is an exposure apparatus that exposes a laser beam to a body opposite to an object to be exposed by an exposure optical system, and directly exposes a functional pattern on the object to be exposed. The body is disposed on the same side of the exposure optical system, and is in the photographing position on the front side of the laser beam scanning position along the direction in which the object is to be exposed, and the function of the exposure device formed on the glass substrate is taken as a reference. a photographing mechanism of the pattern; an illuminating mechanism configured to illuminate at least one direction of the object to be exposed in the vertical direction, and an illuminating mechanism for photographing the photographing mechanism; and detecting the image taken by the photographing mechanism The optical system control mechanism that controls the start of irradiation of the laser beam or the stop of the irradiation of the laser beam based on the reference position set in advance.

According to this configuration, the illuminating mechanism provided in at least one direction of the vertical direction of the object to be exposed is used to illuminate the functional pattern previously formed on the object to be exposed, and the beam is scanned in the direction in which the object is to be transported. The photographing mechanism that is the photographing position in front of the position picks up the functional pattern as the reference, and detects the reference position preset by the optical system control unit as the reference, and controls the reference by the reference. The beam irradiation at the position of the reference reciprocal scanning starts or the irradiation stops. It is possible to perform high-precision exposure of a predetermined functional pattern at a predetermined position on the reference position. In the case where a functional pattern of a plurality of layers is formed, the accuracy of overlapping the functional patterns of the layers can also be improved. Accordingly, when a multi-layer exposure apparatus is used to form a laminate pattern, the problem of lowering the accuracy of the pattern pattern due to the difference in precision between the exposure apparatuses can be eliminated, and the cost of the exposure apparatus can be suppressed. Further, since the photographic apparatus is disposed on the same side of the exposure optical system, the exposure optical system and the photographic mechanism can be integrally formed, and the mechanical stability of the portion can be improved, the cost can be reduced, and the assembly apparatus can be easily manufactured.

Further, the illumination means is disposed on the same side of the photographing means as the object to be exposed. The functional image pre-formed on the exposed object is illuminated by the illumination mechanism from the same side of the photographing mechanism, and the functional image based on the reflection illumination is taken by the photographing mechanism. When the opaque film is formed on the reference functional pattern, the reference functional pattern can also be obtained.

Further, the exposed system is a transparent substrate, and the illumination mechanism is disposed on the opposite side of the object to be exposed. Thereby, the illuminating mechanism on the opposite side of the photographing mechanism illuminates the functional pattern previously formed on the transparent exposing body as a reference, and the photographing mechanism takes the functional pattern as a reference by the irradiation. Thereby, the comparison of the images obtained by the photographing means is improved, and the accuracy of image data acquisition is also improved, so that high-precision exposure is realized.

Further, the illumination means is disposed on both sides of the object to be exposed in the vertical direction, and can be used interchangeably. Therefore, the illumination means disposed on both sides of the upper and lower sides of the object to be exposed are exchanged to illuminate the functional pattern previously formed on the object to be exposed, and the photographing mechanism picks up by illumination or reflection illumination. This functional graph is the benchmark. The film can be handled by the same exposure device regardless of whether the film to be exposed is transparent or opaque, regardless of whether the film formed on the functional pattern as a reference is transparent or opaque.

Further, according to a second embodiment of the present invention, the exposure light beam is directly irradiated to the transparent object to be exposed by the exposure optical system, and the exposure position of the functional pattern on the object to be exposed is directly exposed, and the light is disposed on the exposed object. The exposure body is on the opposite side of the exposure optical system, and is in the exposure direction of the object to be exposed and is a photographing position in front of the light beam scanning, and is photographed in advance in the object transport direction and in front of the light beam scanning as a photographing position for ingestion. An imaging mechanism that is formed in advance in a functional pattern as a reference in the exposure position of the object to be exposed is disposed on at least one side in the vertical direction of the object to be exposed, and is used to illuminate the functional pattern as a reference. The illumination mechanism capable of photographing the photographing mechanism; and detecting a preset reference position on the functional pattern taken as the reference by the photographing mechanism, and controlling the beam irradiation start or the irradiation stop based on the reference position Optical system control mechanism.

According to the above configuration, the reference functional pattern formed in advance in the exposure position of the object to be exposed is illuminated by the illumination means provided on at least one side in the vertical direction of the transparent object to be exposed, and the beam is scanned in the direction in which the object is to be exposed. The photographing mechanism in front of the position is a photographing position, and the reference functional pattern is captured from the transparent exposure substrate from below, and the optical system control mechanism is used to detect the reference preset by the photographing mechanism on the reference functional graph. The position by which the irradiation of the light beam reciprocally scanned based on the reference position is started or the irradiation is stopped. Thereby, the accuracy of the functional pattern superimposed on the object to be exposed as a reference is superimposed on the predetermined functional pattern. In the case where a transparent film is formed on the reference functional pattern, the reference functional pattern can be taken and the reference position can be detected. Therefore, even if the reference functional pattern is covered by the opaque film, the overlapping of the predetermined patterns of the respective layers can be performed with high precision.

Furthermore, the illumination mechanism is disposed on the same side of the photographing mechanism as the object to be exposed. Therefore, the illuminating mechanism is used to illuminate the functional pattern pre-formed on the exposed object from the same side of the photographic mechanism, and the reference functional pattern is captured by the photographic mechanism by the reflected illumination. Therefore, when an opaque film is formed on the reference functional pattern, the reference functional pattern can still be obtained.

Furthermore, the illumination mechanism is disposed on the opposite side of the photographing mechanism for the object to be exposed. Therefore, the illumination mechanism is used to illuminate the functional pattern previously formed on the transparent exposed object from the opposite side of the photographing mechanism, and the reference functional pattern is captured by the photographing mechanism through the illumination. Therefore, the comparison of the images obtained by the photographing means can be improved, and the accuracy of obtaining the image data can be improved, so that high-precision exposure can be realized.

Further, the illumination means is disposed on both sides of the object to be exposed in the vertical direction, and can be used interchangeably. Therefore, the illumination means disposed on both sides in the vertical direction of the object to be exposed are exchanged, and the functional pattern previously formed on the object to be exposed is illuminated, and the photographing mechanism picks up by illumination or reflection illumination. A functional pattern as a benchmark. The film can be handled by the same exposure device regardless of whether the film to be exposed is transparent or opaque, regardless of whether the film formed on the functional pattern as a reference is transparent or opaque.

Fig. 1 is a conceptual diagram of a first embodiment of an exposure apparatus of the present invention. The exposure apparatus 1 directly exposes a functional pattern on the object to be exposed, and has a laser light source 2, an exposure optical system 3, a transport mechanism 4, a photographing mechanism 5, an illumination mechanism 6, and an optical system control mechanism 7, The functional pattern is a pattern in which the product is necessary for the purpose of achieving the original purpose, such as a black matrix pixel pattern of a color filter, and a filter pattern of red, cyan, and green colors. Among the semiconductor components, there are wiring patterns and various electrode patterns. In the following embodiments, a glass substrate for a color filter is used as an object to be exposed.

The laser source 2 is a beam of emitted light, for example, a high-output, fully fixed mode-locked laser source that produces an output of 355 nm of ultraviolet light above 4 watts.

An exposure optical system 3 is provided in front of the beam emission direction of the laser light source 2. The exposure optical system 3 is configured to reciprocally scan a laser beam as a light beam on a glass substrate 8, and an optical switch 9, an optical deflecting mechanism 10, a first mirror 11, and a polygon mirror 12 are provided at a front end of the laser beam emitting direction. The fθ lens 13 and the second mirror 14 are provided.

The optical switch 9 is used to switch between the laser beam irradiation and the irradiation stop state. For example, as shown in Fig. 2, the first and second polarizing elements 15A, 15B are disposed so that the polarization axes 9 of the polarizing elements 15A, 15B are orthogonal to each other (the polarization axis P of the polarizing element 15A is set to be vertical in the figure). In the direction, the polarization axis P of the polarizing element 15B is set in the horizontal direction). The electro-optical modulator 16 is disposed between the first and second polarizing elements 15A and 15B. When the electro-optical scheduler 16 is pressurized, the polarized surface of the polarized light (linearly polarized light) is rotated at a high speed of several nsec. For example, when the applied voltage is zero, the linear polarized light having a polarizing surface, such as a vertical direction, which is selectively transmitted through the first polarizing element 15A in the same figure (a), is transmitted through the electrical optical modulator 16 to reach the second polarized light. Element 15B. The second polarizing element 15B is disposed so as to selectively transmit linearly polarized light having a horizontally-polarized surface, so that linearly polarized light having a vertical deflecting surface is not transmitted, and the laser beam is in a stopped state. On the other hand, as shown in FIG. (b), the device is pressed against the electrical optical modulator 16, and the linear polarization deflecting surface incident on the electrical optical modulator 16 is rotated. At 90°, the linear polarized light having the vertical deflecting surface is linearly polarized. When the electro-optical dispatcher 16 emits, it has a horizontally-polarized surface, and the linearly polarized light passes through the second polarizing element 15B, and the laser beam is irradiated.

The optical deflecting mechanism 10 is configured to adjust the scanning position of the laser beam to be orthogonal to the scanning direction (the moving direction of the glass substrate 8 coincides with the direction of the arrow A shown in FIG. 1) so as to scan the correct position. For example, an acoustic optical element (AO element).

Further, the first mirror 11 is a flat mirror which is used to bend the laser beam passing through the light deflecting mechanism 10 in the direction in which the polygon mirror 12 is disposed in the direction described later. Further, the polygon mirror 12 is used to reciprocally scan a laser beam, for example, eight mirrors formed on the side of a regular octagonal columnar body. At this time, the laser beam reflected by one of the mirrors is scanned in one direction after the rotation of the polygon mirror 12, and the laser beam irradiation position is moved to the next mirror moment to return to the complex direction, again with The rotation of the polygon mirror 12 begins to scan in one dimension.

Further, the fθ lens 13 is configured to make the laser beam scanning speed equal to that on the glass substrate 8, and the focus position thereof is disposed at a position approximately coincident with the mirror position of the polygon mirror 12. As for the second mirror 14, the laser beam passing through the fθ lens 13 is incident on a plane perpendicular to the surface of the glass substrate 8, and belongs to a plane mirror. Further, on the surface of the exit side of the fθ lens, the portion of the laser beam scanning start side of the reciprocating scanning is arranged, and the line sensor 17 is orthogonal to the scanning direction to detect the predetermined scanning position and the actual scanning position of the laser beam. The offset is simultaneously detected at the start of the laser beam scanning. In addition, the line sensor 17 may be provided not only on the side of the fθ lens 13 but also as long as the laser beam scanning start point can be detected. For example, it may be provided on the side of the glass substrate transporting station 18 to be described later. .

Below the second mirror 14, a transport mechanism 4 is provided. The transport mechanism 4 is configured to carry the glass substrate 8 on the platform 18 and transport it at a predetermined speed in a direction orthogonal to the scanning direction of the laser beam. For example, the transport roller 19 for the mobile station 18, for example, the slewing drive transport roller 13 The motor or the like transports the drive unit 20.

An imaging mechanism 5 is provided in front of the scanning mechanism 4 in front of the scanning position of the laser beam in the conveying direction indicated by the arrow A. The photographing mechanism 5 is a black matrix pixel used as a reference functional pattern in the exposure position formed on the glass substrate 8, and is, for example, a linear CCD in which the light receiving elements are arranged in a line. As shown in FIG. 3, the distance D between the photographing position E of the photographing mechanism 5 and the scanning position F of the laser beam is set to an integral multiple (n times the pitch P) of the transport direction of the pixels 22 of the black matrix 21. ). Scanning is started when the glass substrate 8 is transported to the center of the pixel 22 in accordance with the scanning position of the laser beam. The smaller the distance D, the better. Therefore, the movement error of the glass substrate 8 can be reduced, and the position of the laser beam scanning position on the pixel 22 can be correctly determined. In addition, FIG. 1 shows an example in which three cameras are provided. If the scanning range of the laser beam is smaller than that of the image processing unit 5, one of the photographing mechanisms 5 is sufficient, and the scanning range is wider than that of the photographing mechanism. 5 One image processing area, you can set up multiple cameras to purchase 5 as needed.

An illumination mechanism 6 is provided below the transport mechanism 4. This illumination mechanism 6 is used to illuminate the pixels 22 to take pictures of the photographing mechanism 5. The optical system control unit 7 includes a laser light source 2, an optical switch 9, an optical deflecting mechanism 10, a polygon mirror 12, and a line sensor 17, and is connected to the transport mechanism 4 and the photographing mechanism 5. The optical system control unit 7 detects the reference position of the pictorial image set in advance by the photographing unit 5, and controls the laser beam irradiation start or illumination of the laser light source 2 based on the reference position. Stopping, while controlling the voltage applied to the light deflecting mechanism 10 according to the output of the line sensor 17, and deflecting the emission direction of the laser beam, controlling the rotation speed of the polygon mirror 12 to maintain the scanning speed of the laser beam at a set value, and controlling The speed at which the transport mechanism 4 transports the glass substrate 8 is at a set value. And an optical switch controller 24 for igniting the laser light source 2, for controlling the start of the laser beam irradiation and stopping the illumination, and for controlling the optical deflecting mechanism of the laser beam bias vector of the optical deflecting mechanism 10. The driving unit 25A, the polygon driving unit 25B for controlling the driving of the polygon mirror 12, the carrying controller 26 for controlling the conveying speed of the transport mechanism 4, and the lighting controller for turning on and off the light of the operating lighting unit 6. An image processing unit that determines the laser beam irradiation start position and the irradiation stop position based on the A/D-converted image data by the A/D conversion unit 28 that performs the A/D conversion on the image captured by the image capturing unit 5 29, for storing data of the laser beam irradiation position (hereinafter referred to as an exposure start position) and the irradiation stop position (hereinafter referred to as an exposure end position) processed by the image processing unit 29, and memorizing the exposure start position and the exposure end position described later. The memory unit 30 of the observation stage or the like creates the modulation data creation processing of the modulation data of the ON/OFF optical switch 9 based on the exposure start position and the exposure end position data read by the production memory unit 30. 31, and controls the entire apparatus suitable for setting by the control unit 32 of the operation object.

4 and 5 show an example of a block diagram of the image processing unit 29. As shown in FIG. 4, the image processing unit 29 includes, for example, three parallel ring buffer memories 33A, 33B, and 33C connected to the ring buffer memories 33A, 33B, and 33C, for example, three line buffer memories. 34A, 34B, 34C, connected to the line buffer memory 34A, 34B, 34C for comparing the predetermined threshold value to the gray level data binary output and output comparison loop 35; from the above nine line buffer memory 34A, The output data of 34B and 34C is compared with the image data observation stage (LUT for exposure start position) corresponding to the first reference position from the memory unit 30 shown in Fig. 1, and the output is started when the two data match. The exposure start position determination circuit 36 of the position determination result; and the output data from the above nine line buffer memories 34A, 34B, and 34C and the second reference position determined from the memory unit 30 shown in Fig. 1 to determine the exposure end position. The image data observation stage (the LUT for the end position of the exposure) is compared with the exposure end position determination circuit 37 that outputs the result of the determination of the end position of the exposure when the two data match.

Further, as shown in FIG. 5, the image processing unit 29 includes a counting circuit 38A that calculates the number of coincidences of the image data corresponding to the first reference position by inputting the result of the determination of the exposure start position, and compares the output of the comparison circuit 38A with that shown in FIG. The exposure start image number obtained from the memory unit 30 outputs an exposure start signal to the comparison circuit 39A of the modulation data generation processing unit 31 shown in Fig. 1 when the two values match; and inputs the exposure end position determination result to calculate the second equivalent. The count circuit 38B of the image data matching number of the reference position; the output of the comparison count circuit 38B and the exposure end pixel number obtained from the memory unit 30 shown in Fig. 1, and the end of the exposure signal is output as shown in Fig. 1 The comparison circuit 39B of the modulation data generation processing unit 31; the first pixel count circuit 40 for calculating the first pixel number based on the output of the count circuit 38A; and the output from the first pixel count circuit 40 and the first The exposure pixel sequence number obtained by the memory unit 30 is shown in the figure. When the two values match, the exposure pixel sequence designation signal is output to the comparison data generation processing unit 31 shown in FIG. Road 41. Further, the counting circuits 38A and 38B are set at the start of the reading operation of the photographing unit 5, that is, according to the reading start signal. Further, the first pixel count back 40 is re-set when the predetermined exposure pattern is formed in advance, that is, according to the exposure pattern end signal.

Next, the operation and pattern forming method of the exposure apparatus 1 having such a configuration will be described. First, power is supplied to the exposure device 1, and the optical system control mechanism 7 is driven. The laser beam is emitted by the laser light source 2 being activated. At the same time, the polygon mirror 12 starts to rotate to scan the laser beam. However, at this time, the optical switch 9 is still in the OFF state, so that the laser beam has not been irradiated.

Next, the glass substrate 8 is mounted on the platform 18 of the transport mechanism 4. Further, since the transport mechanism 4 transports the glass substrate 8 at a constant speed, as shown in Fig. 6, the scanning trajectory (arrow B) of the laser beam is oblique with respect to the moving direction (arrow A) of the station 18. Therefore, when the glass substrate 8 is disposed in parallel to the moving direction (arrow A), as shown in (a), the exposure position may be shifted from the scanning start pixel 22a of the black matrix 21 and the scanning end pixel 22b. In this case, as shown in (b), the glass substrate 8 is inclined in the conveyance direction (arrow A direction) so that the arrangement direction of the pixels 22 coincides with the scanning trajectory (arrow B) of the laser beam. However, in fact, since the scanning speed of the laser beam is much faster than the conveying speed of the glass substrate 8, the above-mentioned offset is not too large. Therefore, the glass substrate 8 is disposed in parallel to the moving direction, and the offset amount is measured by the data taken by the photographing mechanism 5, and the light deflecting mechanism 10 of the exposure optical system 3 is controlled to correct the offset amount. Further, in the following description, the offset is considered to be negligible.

Next, the station 18 is moved by the conveyance drive unit 20 in the direction of the arrow A in the first drawing. At this time, the conveyance controller 26 of the optical system control mechanism 7 controls the constant speed.

Next, when the black matrix 21 formed on the glass substrate 8 reaches the photographing position of the photographing mechanism 5, the photographing mechanism 5 starts photographing, and detects the exposure start position and the exposure end position based on the image data of the photographed black matrix 21. The method of forming the pattern will be described hereinafter with reference to the flowchart shown in FIG.

First, in step S1, the image of the pixel 22 of the black matrix 21 is acquired by the photographing unit 5. The image data thus obtained is sent to the three ring buffer memories 33A, 33B, and 33C of the image processing operation 29 shown in FIG. Then, the latest three data are output from the respective ring buffer memories 33A, 33B, and 33C. At this time, for example, the first two data are output from the ring buffer memory 33A, the previous data is output from the ring buffer memory 33B, and the latest data is output from the ring buffer memory 33C. Further, each of the data is composed of three line buffer memories 34A, 34B, and 34C, and for example, a 3×3 CCD pixel image is placed on the same time axis. The result is as shown in Fig. 8(a). If this image is digitized, it corresponds to the 3 × 3 value shown in the same figure (b). These numerical images are juxtaposed on the same time axis, and the comparison loop 35 is numerically compared with the threshold value. For example, when the threshold value is 〝45〞, the image of the same figure (a) can be binarized as in the same figure (c).

Next, in step S2, the start position of the exposure and the end position of the exposure end can be detected. Specifically, the detection of the reference position is obtained by comparing the binarized data with the data of the LUT obtained from the memory unit 30 shown in FIG. 1 by the exposure start position determining circuit 36.

For example, when the first reference position specifying the exposure start position is set to the upper left corner of the pixel 22 of the black matrix 21 shown in FIG. 9(a), the LUT for the start of exposure is as shown in the same figure (b). The data for starting the LUT is 〝000011011〞. The result of comparing the binarized data described above with the data of the exposure start LUT 〝 000011011 ,, when the two data match, the image data acquired by the photographing unit 5 is determined to belong to the first reference position, and the exposure position determining circuit 36 is determined. The start position determination result is output. Further, when six pixels 22 are juxtaposed as shown in Fig. 10, the upper left corner of each pixel 22 is the first reference position.

Based on the above determination result, the counting circuit 38A shown in Fig. 5 calculates the above-mentioned number of coincidences. Then, the counted number is compared with the exposure start pixel number obtained by the memory unit 30 shown in FIG. 1, and when the values match, the output start signal is processed in the modulated data shown in FIG. Part 31. At this time, as shown in FIG. 10, when the left upper end corners of the first pixel 221 and the fourth pixel 224 are determined to be the first reference position in the scanning direction of the laser beam, the photographing mechanism 5 corresponding to the first reference position is displayed. The address of the component on the CCD, such as 〝1000〞, 〝4000〞, is memorized by the optical switch controller 24.

On the other hand, the above-described binarized data is compared with the LUT data of the exposure end position obtained by the memory unit 30 shown in Fig. 1, for example, in the exposure end determination circuit 37, for example, the second reference position specifying the exposure end address is set. In the upper right corner of the pixel 22 of the black matrix 21 shown in Fig. 11(a), the LUT is the same as the one shown in the figure (b), and the data of the LUT is 〝110110000〞. The result of comparing the binarized data described above with the data of the LUT of the exposure end position 〝110110000〞, when the two data match, the image data acquired by the photographing unit 5 is determined to belong to the reference position at the end of the exposure, and the position at the end of the exposure is determined. The decision circuit 37 outputs the final position determination result. Further, similarly to the above case, for example, when six pixels 22 are juxtaposed as shown in Fig. 10, the upper right corner of each pixel 22 is the second reference position.

Based on the above determination result, the counting circuit 38B shown in Fig. 5 calculates the above-mentioned number of coincidences. Therefore, the counted number is compared with the exposure end pixel number obtained by the memory unit 30 shown in FIG. 1 when the comparison circuit 39B is identical. When the two values are identical, the output end-of-exposure signal is processed in the modulated data shown in FIG. Part 31. At this time, as shown in the figure, for example, in the laser beam scanning direction, when the right upper end corners of the first pixel 221 and the fourth pixel 224 are determined to be the second reference position, the photographing mechanism 5 corresponding to the second reference position is The component address on the line CCD, for example 〝1900〞, 〝4900〞 is memorized by the optical switch controller 22. Then, as described above, after the exposure start position and the reference position of the exposure end position are detected, the process proceeds to step S3.

In step S3, the exposure position in the moving direction of the glass substrate 8 is detected. As shown in FIG. 3, the distance between the laser beam scanning position F and the photographing position E of the photographing mechanism 5 is set to an integral multiple (n times) of the arrangement pitch P in the moving direction of the pixel 22, so the mine is calculated. The beam scanning period is used to know the exposure position. For example, as shown in Fig. 12, when the distance D between the laser beam scanning position and the photographing position of the photographing mechanism 5 is set to, for example, three times the pitch P of the pixel 22, the end portion of the pixel 22 is detected in step S2. After the first and second reference positions (refer to the same figure (a)), when the glass substrate 8 moves and the center line of the pixel reaches the photographing position of the photographing mechanism 5 (refer to the same figure (b)), the laser beam is scanned. The timing is the same. Thus, when the laser beam is scanned at the period T, the transport speed of the glass substrate 8 is controlled to shift the pitch of the pixels 22 in synchronization with the period T of the laser beam. From the next 1T, the pixel 22 moves to the position shown in Figure (c). After 2T, the pixel 22 moves at the same position as (d), and after 3T, as shown in the figure (e), the center line of the drawing speed 22 reaches the scanning position of the laser beam. This will detect the exposure position.

Next, in step S4, the exposure position is adjusted while scanning with the laser beam. Specifically, as shown in Fig. 13, the adjustment of the exposure position is performed by comparing the current laser beam scanning position (element address) detected by the line sensor 17 provided in the fθ lens with the predetermined reference element address. The amount of light deflecting mechanism 10 causes the laser beam scanning position to coincide with the reference element address (reference scanning position).

Next, in step S5, exposure is started, and the operation of the optical switch 9 is controlled by the optical switch controller 24. At this time, the optical switch 9 is first turned ON and scanned by the laser beam, and the boundary sensor 17 detects the scanning start timing of the laser beam and immediately turns off the optical switch 9. At this time, the modulation data creation processing unit 31 can read, for example, the component address 〝1000〞 of the imaging unit 5 corresponding to the exposure start position of FIG. 10, and the control unit 32 calculates the start time from the laser beam scanning start to the exposure start. The time t1 of the position. At this time, the scanning time t0 from the scanning start time of the laser beam to the component address 〝1 of the photographing mechanism 5 is measured in advance, and the scanning speed of the laser beam is synchronized with the CCD time axis CLK of the photographing mechanism 5, and then calculation is performed. The number of time axes up to the component address 〝1000 can easily find the scan start time t1=t0+1000CLK. The exposure is started by the optical switch 90N after the laser beam scanning start time to t1.

Next, the exposure end position is detected in step S6. As in the above case, for example, the exposure end time t2 = t0 + 1900 CLK at the component address 〝 1900 求 is obtained. The exposure is terminated by turning off the optical switch 9 after the start of the laser beam scanning to t2.

Next, in step S7, it is judged whether or not one of the laser beams has been traversed. If it is judged as 〝NO〞, the above operation is repeated by returning to S2. Then, in S2, as shown in Fig. 10, for example, the second exposure start position 〝4000 〞 and the second exposure end position 〝4900 检 are detected, then S4 proceeds to S5, as in the case described above, from the component address 〝4000. 〞 Starts exposure, and the exposure ends at component address 〝4900〞.

Further, in step S7, if it is judged as YESYES, the process returns to S1 and the new exposure position detecting operation is performed. The above actions are then repeated and the exposure pattern is formed in the desired area.

As described above, according to the exposure apparatus and the pattern forming method of the present invention, the image of the pixel 22 of the black matrix 21 formed in advance on the glass substrate 8 obtained by the imaging unit 5 is detected, and the reference position set in advance is detected. This is a reference for controlling the start of irradiation of the laser beam and the stop of the irradiation, thereby forming an exposure pattern, so that the exposure accuracy of the pixel 22 can be improved.

Further, since the exposure pattern is formed based on the reference position set in advance on the pixel 22, the problem of deterioration of the functional pattern-type longitude due to the difference in accuracy between the exposure devices can be eliminated, and therefore, it is applied to a process of forming a laminated pattern using the plurality of exposure devices 1. It still ensures a high degree of coincidence. Thereby, the cost of the exposure apparatus 1 can be suppressed.

Further, by arranging the illumination mechanism 5 on the same side of the exposure optical system 3, the two can be integrally formed, so that the mechanical stability of the portion can be improved, the cost can be reduced, and the assembly apparatus can be easily manufactured.

Here, by arranging the illumination unit 6 on the opposite side of the photographing mechanism 5 with the transparent glass substrate 8, it is possible to improve the comparison of the image acquired by the photographing unit 5 and the image data acquisition accuracy. Therefore, high-precision exposure can be achieved.

Next, a second embodiment of the exposure apparatus of the present invention will be described. Only differences from the first embodiment will be described here.

In the exposure apparatus 1 of the second embodiment shown in Fig. 14, the imaging unit 5 and the illumination unit 6 are disposed below the transport mechanism 4, and the reticle is formed on the glass substrate 8 by reflection illumination on the glass substrate 8. The image of the pixel 22 of the black matrix 21 of the surface.

With this configuration, the pixel 22 of the black matrix 21 previously formed on the upper surface of the glass substrate 8 is imaged by the imaging unit 5 by the illumination illumination from the lower side, and is detected by the optical system control unit 7 in advance. The reference position of 22 controls the start of exposure and the end of exposure, and exposes a predetermined functional pattern such as red, cyan, and green color filters to the position corresponding to the pixel 22.

According to the second embodiment, as in the first embodiment, the predetermined functional image can be formed at a predetermined position with high precision with respect to the reference position. When the pattern of the plurality of layers is formed on the pixel 22, the coincidence precision of each layer pattern can also be improved. The attraction imaging mechanism 5 and the illumination mechanism 6 are disposed on the same side of the exposure optical system 3, and the exposure optical system 3 and each of the mechanisms can be integrally formed. Therefore, the mechanical stability can be improved, the cost can be reduced, and the assembly can be easily performed, and the space on the lower side of the glass substrate 8 can be used for the driving mechanical system of the transport mechanism 4, which is advantageous for design.

Next, a third embodiment of the exposure apparatus of the present invention will be described. Here, only a part different from the first embodiment will be described.

In the exposure apparatus 1 of the third embodiment shown in Fig. 15, the imaging unit 5 is disposed above the transport mechanism 6, and the illumination units 6a and 6b are disposed on the upper and lower sides of the transport mechanism 4, and can be used interchangeably.

With this configuration, if the substrate to be used is opaque and the transmission illumination cannot be used, the upper illumination unit 6a is turned on, and the imaging mechanism 5 obtains the reference functional pattern formed on the upper surface of the plate, and the optical system control unit 7 detects the setting on the reference. The reference position on the functional pattern controls the start of exposure and the end of exposure, and forms a predetermined exposure pattern at a predetermined position for the reference position. On the other hand, if the substrate to be used is transparent and the transmission illumination is used, the lower illumination unit 6b can be turned on, and the reference function pattern of the high contrast can be captured by the imaging unit 5 by the transmission illumination.

Thus, according to the third embodiment, the substrate to be used is a transparent body or a non-transparent body, and the illumination mechanisms 6a and 6b can be switched between the illumination illumination and the reflection illumination according to the substrate properties, thereby improving the usability.

Next, a fourth embodiment of the exposure apparatus of the present invention will be described. Here, only a part different from the first embodiment will be described.

In the exposure apparatus 1 of the fourth embodiment shown in Fig. 16, the imaging unit 5 and the illumination unit 6 are disposed below the transport mechanism 4, and are formed on the surface of the glass substrate 8 through the transparent glass substrate 8 from below. The pixel 22 of the black matrix 21 is.

With this configuration, the black matrix 21 previously formed on the surface of the glass substrate 8 is illuminated from below by the illumination mechanism through the transparent glass substrate 8, and the pixel of the black matrix 21 is taken by the photographing mechanism 5 from below the glass substrate 8 through the glass substrate 8. In the 22 image, the optical system control unit 7 detects the reference position set on the pixel 22 to control the exposure start and the end of the exposure, and exposes a color filter such as red, cyan, and green at a position corresponding to the pixel 22. Wait for the established functional graphics.

As described above, according to the fourth embodiment, as in the first embodiment, it is possible to form a predetermined functional pattern with high precision at a predetermined position with respect to the reference position. When the pattern of the plurality of layers is formed on the pixel 22, the coincidence precision of each layer pattern can also be improved. Further, when an opaque film is formed on the pixel 22 as a reference, the reference pixel 22 can be photographed from below by the transparent glass substrate 8, and the reference position can be detected by the opaque film. The coincidence of the predetermined functional patterns of the layers can still be performed with high precision.

Next, a fifth embodiment of the exposure apparatus of the present invention will be described. Here, only a part different from the first embodiment will be described.

In the exposure apparatus 1 of the fifth embodiment shown in Fig. 17, the imaging unit 5 is disposed below the transport mechanism 4, and the illumination unit 6 is disposed above the transport mechanism 4, and is taken through the transparent glass substrate 8 from below. The pixel 22 image of the black matrix 21 formed in advance on the surface of the glass substrate 8.

With this configuration, the pixel 22 of the black matrix 21 formed on the upper surface of the glass substrate 8 is taken by the imaging unit 5 through the glass substrate 8 through the illumination, and the optical system control unit 7 detects the reference position set on the pixel 22 by the optical system control unit 7. The exposure start and the end of the exposure are controlled, and at a position corresponding to the pixel 22, a predetermined functional pattern such as a red, cyan, or green color filter is exposed.

As described above, according to the fifth embodiment, as in the first embodiment, it is possible to form a predetermined functional pattern with high precision at a predetermined position with respect to the reference position. When the pattern of the plurality of layers is formed on the pixel 22, the coincidence precision of each layer pattern can also be improved. Further, since the illumination is used, the comparison of the images obtained by the photographing means 5 is improved, and the accuracy of obtaining the image data is also improved, so that high-precision exposure can be realized. In addition, since the illumination mechanism 6 having a small space is disposed on the same side of the exposure optical system 3, the problem that the installation spaces of the illumination mechanism 6 and the exposure optical system 3 interfere with each other is not caused.

Further, the exposure apparatus of the present invention is not limited to a large substrate such as a color filter of a liquid crystal display, and can be applied to an exposure apparatus such as a semiconductor.

1. . . Exposure device

2. . . Laser source

3. . . Exposure optics

4. . . Transport mechanism

5. . . Photography agency

6. . . Back illumination mechanism

7. . . Optical control mechanism

8. . . glass substrate

9. . . light switch

10. . . Polarizing mechanism

11. . . First mirror

12. . . Polygon mirror

13. . . Fθ lens

14. . . Second mirror

15A. . . First polarizing element

15C. . . Second polarizing element

16. . . Electrical optical modulator

17. . . Line sensor

18. . . Platform

19. . . Carrying roller

20. . . Handling drive

twenty one. . . Black matrix

twenty two. . . Pixel

twenty three. . . Light source drive unit

twenty four. . . Optical switch controller

25A. . . Light deflection mechanism drive unit

25B. . . Polygonal drive

26. . . Handling controller

27. . . Back light controller

28. . . A/D conversion unit

29. . . Image processing department

30. . . Memory department

31. . . Modulated data processing unit

32. . . Control department

33A, 33B, 33C. . . Ring buffer memory

35. . . Comparison loop

34A, 34B, 34C. . . Line buffer memory

36. . . Exposure start position determination loop

37. . . Exposure end position determination loop

38A. . . Counting loop

39A. . . Comparison loop

38B. . . Counting loop

39B. . . Comparison loop

40. . . Previous pixel count loop

22a. . . Scan start pixel

22b. . . Scanning end pixel

42. . . defect

Fig. 1 is a conceptual view showing a first embodiment of an exposure apparatus of the present invention.

Fig. 2 is a perspective view showing the configuration and operation of the optical switch.

Fig. 3 is an explanatory view showing the relationship between the scanning position of the laser beam and the photographing position of the photographing mechanism.

Fig. 4 is a block diagram showing the first half of the processing system in the internal configuration of the image processing unit.

Fig. 5 is a block diagram showing the latter half of the processing system in the internal configuration of the image processing unit.

Fig. 6 is an explanatory view showing the relationship between the black matrix which is orthogonally moved in the scanning direction of the laser beam and the scanning track of the laser beam.

Figure 7 is a flow chart showing the sequence of the pattern forming method of the present invention.

Fig. 8 is an explanatory diagram showing a method of binarizing the output of the ring buffer memory.

Fig. 9 is an explanatory view showing an image and an observation table which are set in advance at the exposure start position of the black matrix pixel.

Fig. 10 is an explanatory view showing a relationship between a reference position set in advance on a black matrix pixel and an imaging mechanism element.

Fig. 11 is an explanatory view showing an image and an observation table which are set in advance at the exposure end position of the black matrix pixel.

Fig. 12 is an explanatory view showing a method of detecting an exposure position on the pixel in the glass substrate transport direction.

Fig. 13 is an explanatory view showing a method of correcting the scanning position of the laser beam.

Figures 14 through 17 are conceptual diagrams showing the main parts of the second, third, fourth and fifth embodiments of the present invention, respectively.

1. . . Exposure device

2. . . Laser source

3. . . Exposure optics

4. . . Transport mechanism

5. . . Photography agency

6. . . Back illumination mechanism

7. . . Optical control mechanism

8. . . glass substrate

9. . . light switch

10. . . Polarizing mechanism

11. . . First mirror

12. . . Polygon mirror

13. . . Fθ lens

14. . . Second mirror

17. . . Line sensor

18. . . Platform

19. . . Carrying roller

20. . . Handling drive

twenty three. . . Light source drive unit

twenty four. . . Optical switch controller

25A. . . Light deflection mechanism drive unit

25B. . . Polygonal drive

26. . . Handling controller

27. . . Back light controller

28. . . A/D conversion unit

29. . . Image processing department

30. . . Memory department

31. . . Modulated data processing unit

32. . . Control department

Claims (8)

An exposure apparatus for scanning a light beam against an object to be exposed by an exposure optical system, and directly exposing a functional pattern of a necessary component of the function of the exposed product to an exposure position on the exposed object The exposure optical system is provided with a light deflecting mechanism for shifting the scanning position of the light beam emitted from the light source to a direction orthogonal to the scanning direction when the transporting mechanism transports the exposed object at a predetermined speed. The scanning unit is provided with a linear array in which a plurality of light receiving elements are arranged in a line, and the exposed object is disposed on the same side of the exposure optical system, and is in the direction in which the exposed object is conveyed. a photographing mechanism that captures a functional pattern formed in advance in an exposure position of the object to be exposed, in front of the beam scanning position, and is disposed in at least one direction in the vertical direction of the object to be illuminated. a functional pattern that serves as a reference, and an illumination mechanism that allows the photographing mechanism to photograph; and detects the functional pattern taken by the photographing institution as a reference The reference position is set in advance, and the irradiation start or the irradiation stop of the light beam is controlled based on the reference position, and the reference position of the graphic image set in advance as the pixel image captured by the imaging means is detected, and the reference is used. The position is used as a reference to control the laser beam irradiation or the illumination stop, and the voltage applied to the light deflection mechanism is controlled according to the output of the line sensor, so that the emission direction of the laser beam is deflected, and the rotation speed of the polygon mirror is controlled. The optical system control mechanism that maintains the scanning speed of the laser beam at a set value and controls the speed at which the transport mechanism transports the exposed object to the set value. The exposure apparatus of claim 1, wherein the illumination mechanism is disposed on the same side of the photographing mechanism as the object to be exposed. The exposure apparatus of claim 1, wherein the object to be exposed is a transparent substrate, and the illumination mechanism is disposed on the opposite side of the photographing mechanism to the exposed system. The exposure apparatus of claim 1, wherein the illumination means is disposed on both sides of the object in the vertical direction, and the user can be alternated. An exposure apparatus for performing a relative scanning beam on a transparent exposed object by an exposure optical system, and directly exposing the exposed body to a functional pattern of a necessary component of the function of the exposed product to an exposure position, The exposure optical system is provided with a light deflecting mechanism for shifting the scanning position of the light beam emitted from the light source in a direction orthogonal to the scanning direction when the transporting mechanism transports the exposed object at a predetermined speed, so that the scanning is correct And a position in which a plurality of light-receiving elements are arranged in a line, and the object to be exposed is disposed on the opposite side of the exposure optical system, and the light beam is conveyed in the object to be exposed a photographing mechanism that captures a functional image in front of the exposure position of the object to be exposed in front of the scanning position, and is disposed in at least one direction of the vertical direction of the object to be exposed, and illuminates the a functional pattern of the reference, and an illumination mechanism that enables the photographing mechanism to photograph; and detecting the functional pattern taken as a reference by the photographing mechanism a reference position that is set in advance, and the irradiation start or the irradiation stop of the light beam is controlled based on the reference position, and the reference position of the graphic image set in advance as a pixel image captured by the imaging unit is detected, and the reference is used. The position is used as a reference to control the laser beam irradiation or the illumination stop, and the voltage applied to the light deflection mechanism is controlled according to the output of the line sensor, so that the emission direction of the laser beam is deflected, and the rotation speed of the polygon mirror is controlled. The optical system control mechanism that maintains the scanning speed of the laser beam at a set value and controls the speed at which the transport mechanism transports the exposed object to the set value. The exposure apparatus of claim 5, wherein the illumination mechanism is disposed on the same side of the photographing mechanism as the object to be exposed. The exposure apparatus of claim 5, wherein the illumination mechanism is disposed on an opposite side of the photographing mechanism to the object to be exposed. The exposure apparatus of claim 5, wherein the illumination means is disposed on both sides of the object to be exposed in the up-and-down direction to alternate the user.