JP4613098B2 - Exposure equipment - Google Patents

Description

  The present invention relates to an exposure apparatus that directly exposes an exposure pattern on an object to be exposed without using a mask. More specifically, the exposure is intended to improve the overlay accuracy of an exposure pattern with respect to a reference pattern formed on the object to be exposed. It concerns the device.

  A conventional exposure apparatus uses a mask in which a mask pattern corresponding to an exposure pattern is previously formed on a glass substrate, and transfers and exposes the mask pattern onto an object to be exposed. For example, a stepper or a micromirror projection (Micromirror projection) There are Projection and Proximity devices. However, in these conventional exposure apparatuses, when a plurality of patterns are stacked and formed, the overlay accuracy of the exposure patterns between the layers becomes a problem. In particular, in the case of a large mask used for forming a TFT or a color filter for a large liquid crystal display, high absolute dimensional accuracy is required for the arrangement of the mask pattern, and the cost of the mask has increased. Further, in order to obtain the above overlay accuracy, alignment between the reference pattern of the underlayer and the mask pattern is necessary, and this alignment is particularly difficult in a large mask.

On the other hand, there is an exposure apparatus that directly exposes a pattern of CAD data stored in a storage unit in advance on an object to be exposed using an electron beam or a laser beam without using a mask. This type of exposure apparatus includes a laser light source, an exposure optical system that reciprocally scans a laser beam emitted from the laser light source, and a transport unit that transports the object to be exposed, based on CAD data. While controlling the emission state of the laser light source, the laser beam is reciprocally scanned and the object to be exposed is transported in a direction orthogonal to the scanning direction of the laser beam, and a CAD data pattern corresponding to the exposure pattern is formed on the object to be exposed. It is formed two-dimensionally (see, for example, Patent Document 1).
JP 2001-144415 A

  However, in such a direct exposure type conventional exposure apparatus, a high absolute dimensional accuracy is required for the pattern arrangement of CAD data, similar to the exposure apparatus using a mask. Further, in a manufacturing process in which a pattern is formed using a plurality of exposure apparatuses, there is a problem that the overlay accuracy of the exposure pattern is deteriorated if there is a variation in accuracy between the exposure apparatuses. In order to cope with such a problem, a highly accurate exposure apparatus is required, and the cost of the exposure apparatus has increased.

  Further, the point that the alignment of the exposure pattern of the underlayer and the CAD data pattern has to be taken in advance is the same as in other exposure apparatuses using a mask, and the alignment accuracy cannot be improved as described above. There was a problem.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an exposure apparatus that addresses such a problem and improves the overlay accuracy of an exposure pattern with respect to a reference pattern formed on an object to be exposed.

In order to achieve the above object, an exposure apparatus according to a first aspect of the present invention irradiates exposure light emitted from a light source onto an object to be exposed that is transported at a predetermined speed by a transporting means, on the object to be exposed. An exposure apparatus that exposes an image of an exposure pattern, wherein a plurality of modulation elements that reflect exposure light from the light source, apply intensity modulation to the exposure light, and exit are orthogonal to the transport direction of the object to be exposed Light modulation means arranged in a direction and a plurality of light receiving elements for receiving light from the object to be exposed in a direction orthogonal to the conveying direction of the object to be exposed, corresponding to the plurality of modulation elements of the light modulation means lined with arranging comprises in the front-rear and the light modulating means in the transport direction, wherein the imaging means for imaging the conveying direction front side of the exposure position on the object to be exposed, said conveyor and said light modulating means and the imaging means Said light disposed between said means A projection lens that projects an image of each modulation element of the adjusting means onto the object to be exposed, and projects an image of a reference pattern formed on the object to be exposed onto the surface of the light receiving element of the imaging means; each modulation element of the light modulating means is driven directly by the binary image data obtained in correspondence with the respective light receiving elements of the image captured by means for controlling the exposure of an exposure pattern onto the reference pattern And a control means.

With such a configuration, the object to be exposed is conveyed by the conveying means at a predetermined speed, and is exposed to correspond to the plurality of modulation elements of the light modulation means arranged in a direction orthogonal to the conveying direction of the object to be exposed. while arranged in a direction orthogonal to the conveying direction of the body, it receives the light from the object to be exposed by a plurality of light receiving elements of the image pickup means disposed side by side in the front-rear with the light modulating means in the conveyance direction through the projection lens Then, the front side in the transport direction of the exposure position on the object to be exposed is imaged, and binarized image data corresponding to each of the light receiving elements is obtained by the control unit, and each modulation of the light modulation unit is performed by the binarized image data The element is directly driven and controlled, the exposure light from the light source is reflected by the modulation element, the exposure light is intensity-modulated and emitted, and the intensity-modulated exposure light is projected onto the object to be exposed by the projection lens. The exposure pattern on the reference pattern formed on the object to be exposed To expose the emissions.

Also, the imaging means, the toward the conveying direction of the subject to be exposed are those located towards after the light modulating means across the optical axis of the projection lens. Thus, across the optical axis of the projection lens toward the conveying direction of the object to be exposed in the arranged imaging means towards after the light modulating means, for imaging the conveying direction front side of the exposure position of the object to be exposed.

An exposure apparatus according to a second aspect of the invention irradiates an exposure object emitted from a light source onto an object to be exposed conveyed at a predetermined speed by a conveying unit, and forms an image of an exposure pattern on the object to be exposed. An exposure apparatus that exposes light that reflects exposure light from the light source, and in which a plurality of modulation elements that are emitted by applying intensity modulation to the exposure light are arranged side by side in a direction perpendicular to the transport direction of the object to be exposed The modulation means and a plurality of light receiving elements that receive light from the object to be exposed are arranged side by side in a direction perpendicular to the transport direction of the object to be exposed, corresponding to the plurality of modulation elements of the light modulation means, imaging means for imaging the exposed position and the same position on the exposed object, wherein said light modulating means and the imaging means is disposed between the conveying means, the object to be exposed to an image of each modulating component of the light modulating means And projected onto the object to be exposed. A projection lens for projecting an image of the reference pattern on the surface of the light receiving elements of the image pickup means, said light modulating means by binary image data obtained in correspondence with the respective light receiving elements of the image captured by the image pickup means each modulation element is driven directly, and a control means for controlling the exposure of an exposure pattern onto the reference pattern is one having a.

With such a configuration, the object to be exposed is conveyed at a predetermined speed by the conveying means, and is associated with the plurality of modulation elements of the light modulation means arranged in a direction orthogonal to the conveying direction of the object to be exposed. Receiving light from the object to be exposed via the projection lens with a plurality of light receiving elements of the imaging means arranged side by side in a direction orthogonal to the conveyance direction of the body, and imaging the same position as the exposure position on the object to be exposed; Binarized image data corresponding to each light receiving element is obtained by the control means, each modulation element of the light modulation means is directly driven and controlled by the binary image data, and the exposure light from the light source is reflected by the modulation element. Then, the exposure light is emitted after being modulated in intensity, the exposure light whose intensity is modulated by the projection lens is projected onto the object to be exposed, and the exposure pattern is exposed on the reference pattern formed on the object to be exposed.

The light modulating means is disposed on an optical path branched from the optical path of the imaging means in the middle of the optical path of the imaging means extending upward through the projection lens. In the middle of the optical path of the imaging means extending upward through the light projection lens, exposure is performed at the same position as the imaging position by the light modulation means disposed on the optical path branched from the optical path of the imaging means.
Further, each modulation element of the light modulation means and each light receiving element of the imaging means are arranged in a one-to-one correspondence in the transport direction of the object to be exposed. Thus, the binary image data obtained corresponding to each light receiving element directly drives each modulation element arranged in one-to-one correspondence with each light receiving element in the conveyance direction of the object to be exposed, An exposure pattern is exposed on the reference pattern.

  Further, the modulation element of the light modulation means is a mirror element that is tilted by being controlled by the control means. Thereby, intensity modulation is applied to the exposure light incident from the light source by the modulation element of the light modulation means comprising the mirror element tilted under the control of the control means.

  The modulation element of the light modulation means includes a plurality of ribbon-like reflection mirrors arranged with their reflection surfaces arranged in the same plane, and is controlled by the control means so that the plurality of reflection mirrors are retracted every other mirror. It is a mirror element that forms a diffraction grating with a step on the surface. As a result, a plurality of ribbon-like reflecting mirrors are arranged with their reflecting surfaces arranged in the same plane, and controlled by the control means, the plurality of reflecting mirrors recedes every other mirror to create a step on the surface. Intensity modulation is applied to exposure light incident from a light source by a modulation element of a light modulation means comprising a mirror element to be formed.

According to the first aspect of the present invention, the light modulation units arranged in the direction orthogonal to the conveyance direction of the object to be exposed are arranged in the direction orthogonal to the conveyance direction of the object to be exposed, corresponding to the plurality of modulation elements. with arranging Te, images the transport direction front side of the exposure position on the object to be exposed by a plurality of light receiving elements of the image pickup means which is arranged in the front-rear with the light modulating means in the conveyance direction, corresponding to each light-receiving element a plurality of modulation elements of the light modulating means is driven and controlled directly injected giving intensity modulation the exposure light by reflecting exposure light from a light source at the modulating element by binary image data was collected using, the By exposing the exposure pattern onto the reference pattern formed on the exposed body, the overlay accuracy of the exposure pattern with respect to the reference pattern can be improved. Therefore, even when a plurality of patterns are stacked, the accuracy of overlaying the patterns of each layer is increased. Thereby, even when a laminated pattern is formed using a plurality of exposure apparatuses, it is possible to eliminate the problem of deterioration of the overlay accuracy of the pattern of each layer due to the difference in accuracy between the exposure apparatuses. Cost increase can be suppressed.

Further, according to the invention of claim 2, the imaging means toward the conveying direction of the object to be exposed, by having assumed arranged towards after the optical modulation means across the optical axis of the projection lens, the light modulation Even when the projection lens for the means and the imaging means are shared, the imaging means can image the front side in the transport direction of the exposure position on the object to be exposed by the light modulation means. Therefore, it is possible to expose the exposure pattern to the subject to be exposed to form the reference pattern on the optical modulation means based on the binary image data of the image captured by the imaging means.

Further, according to the invention of claim 3, the direction orthogonal to the conveyance direction of the object to be exposed is associated with the plurality of modulation elements of the light modulation means arranged side by side in the direction orthogonal to the conveyance direction of the object to be exposed. A plurality of imaging elements of the imaging means arranged side by side are used to image the same position as the exposure position by the light modulation means, and each modulation element of the light modulation means is directly used by binary image data obtained corresponding to each light receiving element. Drive control is performed , the exposure light from the light source is reflected by the modulation element, the exposure light is intensity-modulated and emitted , and the exposure pattern is exposed on the reference pattern formed on the object to be exposed. Thus, the overlay accuracy of the exposure pattern with respect to the reference pattern can be improved. Therefore, even when a plurality of patterns are stacked, the accuracy of overlaying the patterns of each layer is increased. Thereby, even when a laminated pattern is formed using a plurality of exposure apparatuses, it is possible to eliminate the problem of deterioration of the overlay accuracy of the pattern of each layer due to the difference in accuracy between the exposure apparatuses. Cost increase can be suppressed. Further, by imaging the same position as the exposure position, imaging and exposure can be executed in real time, and the exposure speed can be improved.

According to the invention of claim 4, the light modulating means is disposed on the optical path branched from the optical path of the imaging means in the middle of the optical path of the imaging means extending upward through the projection lens. The exposure can be performed at the same position as the imaging position. Therefore, the overlay accuracy of the exposure pattern can be further improved.
Furthermore, according to the fifth aspect of the invention, each modulation element of the light modulation means and each light receiving element of the imaging means are arranged in a one-to-one correspondence in the transport direction of the object to be exposed. Even if each modulation element is directly driven by the binarized image data obtained corresponding to the element, the exposure pattern can be accurately exposed on the reference pattern.

Furthermore, according to the invention according to claim 6, by which a mirror element is tilted is controlled by the modulation element control means of the light modulating means, the intensity in the exposure light mirror element is tilted to enter from the light source modulation Can be given.

According to the seventh aspect of the present invention, the plurality of ribbon-like reflecting mirrors are arranged with the reflecting surfaces arranged in the same plane, and the plurality of reflecting mirrors are controlled by the controlling means. By using mirror elements that recede every other line, the plurality of ribbon-like reflecting mirrors can be controlled to recede every other line, thereby forming a step on the surface and forming a diffraction grating. Accordingly, the reflected light can be dispersed by the diffraction grating, and intensity modulation can be applied to the exposure light input from the light source.

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
FIG. 1 is a conceptual view showing a first embodiment of an exposure apparatus according to the present invention. The exposure apparatus irradiates exposure light onto an object to be exposed and directly exposes an image of an exposure pattern on the object to be exposed. The light source 1, the micromirror device 2, the imaging means 3, , A projection lens 4, a conveying means 5, an illumination light source 6, and a control means 7. In the following description, a case where a color filter substrate 8 made of a transparent glass substrate is used as an object to be exposed will be described.

The light source 1 emits ultraviolet light (UV) as exposure light, and is, for example, a xenon lamp or an ultraviolet laser light source. Then, the micromirror device 2 described later is irradiated with exposure light from an oblique direction.

  A micromirror device 2 is provided in front of the light source 1 in the irradiation direction of the exposure light. The micromirror device 2 irradiates a color filter substrate 8 coated with a photosensitive colorant with exposure light to expose a color filter pattern of a predetermined color, reflects the exposure light from the light source 1, A direction perpendicular to the conveyance direction (the direction of arrow A shown in FIG. 1) of the color filter substrate 8 is a mirror element 9 (see FIG. 2) as a plurality of modulation elements that are emitted by applying on / off intensity modulation to the exposure light. Are arranged side by side to serve as light modulation means. In addition, a filter 10 that cuts visible light is disposed on the front surface of the micromirror device 2, and the visible light component contained in the exposure light of the light source 1 is cut so that the visible light is mirror element 9 of the micromirror device 2. Is prevented from entering.

  Specifically, as shown in FIG. 2A, the micromirror device 2 has a plurality of mirror elements 9 pivotally supported so as to be arranged in a line. As shown in FIG. 3A, the mirror element 9 forms a yoke 13 pivotally supported by a pair of hinges 12 on a semiconductor substrate 11 and reflects exposure light on the upper surface of the yoke 13. A reflection plate 14 is formed. Then, as shown in FIG. 2B, a pair of electrodes 15 is provided opposite to the lower surface of the yoke 13 and the upper surface of the semiconductor substrate 11, and a voltage is applied to the pair of electrodes 15, thereby providing a gap between the electrodes 15. An electrostatic attraction force or a repulsive force is generated so that the yoke 13 tilts in the direction of the arrow about the hinge 12 and the reflecting plate 14 tilts. In this case, in the exposure-on state, as shown in FIG. 4A, the reflecting plate 14 of the mirror element 9 is tilted so that the reflected light passes through the projection lens 4, and in the exposure-off state, FIG. As shown, the reflected light is inclined so as not to pass through the projection lens 4. In the following description, the driving state of the mirror element 9 as shown in FIG. 4A is referred to as ON driving, and the driving state of the mirror element 9 as shown in FIG. The plurality of mirror elements 9 are individually tilted under the control of the control means 7 described later.

As shown in FIG. 1, toward the transport direction of the color filter substrate 8 (arrow A direction), towards of the micro mirror device 2 across the optical axis of the projection lens 4 will be described later, it is provided imaging means 3 It has been. The image pickup means 3 picks up an image of a position (image pickup position) P2 on the color filter substrate 8 on the front side in the transport direction of the exposure position P1, and receives light from the color filter substrate 8 as shown in FIG. while arranged in a direction orthogonal a plurality of light receiving elements 16 in the conveying direction by one-to-one correspondence with the plurality of mirror elements 9 of the micro-mirror device 2 (arrow a direction), the micro-mirror device 2 in the conveying direction is the example line CCD which includes in the front-rear with. As shown in FIG. 1, a filter 17 that cuts off ultraviolet rays is disposed on the front surface of the imaging unit 3, and ultraviolet leakage light contained in the exposure light of the light source 1 is received by the light receiving element 16 of the imaging unit 3. Is prevented from entering.

Further, as shown in FIG. 2 (a), the exposure position P1 by the imaging position P2 and the micromirror device 2 of the image pickup means 3, they are separated by distance D. Therefore, as shown in the figure, if the micromirror device 2 is driven after a lapse of a predetermined time since the imaging means 3 images the pixel 19 (reference pattern) of the black matrix 18 at the imaging position P2, the pixel 19 An exposure pattern can be formed accurately. In the figure, the numbers given in the respective light receiving elements 16 of the image pickup means 3 exemplify binary image data of the pixel image picked up by the image pickup means 3, and based on this, the micromirror device 2 is driven directly . For example, in the case of the first embodiment, the mirror element 9 of the micromirror device 2 corresponding to the light receiving element 16 indicating “1” of the imaging means 3 is turned on (white display in the figure), and “0 The mirror element 9 corresponding to the light receiving element 16 indicating "" is driven off (shown by hatching in the drawing).

  As shown in FIG. 1, one projection lens 4 is disposed below the micromirror device 2 and the imaging means 3. The projection lens 4 projects an image of each mirror element 9 of the micromirror device 2 onto the color filter substrate 8 and captures an image of the pixel 19 of the black matrix 18 formed on the color filter substrate 8. This is projected onto the surface of the light receiving element 16 of the means 3, and a telecentric optical system is configured by combining a plurality of lenses. In this way, by making the projection lens 4 common to the micromirror device 2 and the imaging means 3, the optical configuration is simplified. In addition, since the micromirror device 2 and the image pickup means 3 are arranged at close positions, the alignment accuracy of each mirror element 9 of the micromirror device 2 and each light receiving element 16 of the image pickup means 3 can be improved.

  A conveying means 5 is provided below the projection lens 4. The transport means 5 is configured to place the color filter substrate 8 on the stage 5a and transport it in the direction of arrow A. A transport motor (not shown) is controlled by the control means 7 so as to move the stage 5a. It has become. The transport means 5 is provided with a position detection sensor and a speed sensor (not shown) such as an encoder and a linear sensor, and the output is fed back to the control means 7 to enable position control and speed control. Yes.

An illumination light source 6 is provided below the stage 5a of the conveying means 5. The illumination light source 6 illuminates the imaging position of the imaging means 3 and enables the pixels 19 of the black matrix 18 formed on the color filter substrate 8 made of a transparent glass substrate to be imaged with transmitted light. Back lighting. Thereby, the contrast of the image of the pixel 19 becomes clear and imaging accuracy is improved. In this case, the stage 5 a corresponding to the exposure region of the color filter substrate 8 is provided with an opening (not shown) that penetrates the illumination filter so that the illumination light can be irradiated to the back surface of the color filter substrate 8. Note that the illumination light source 6 is not limited to the one that is disposed below the stage 5a and used as the backside illumination, but may be disposed above the stage 5a for epi-illumination. When the illumination light contains an ultraviolet component, an ultraviolet cut filter (not shown) is arranged in front of the illumination light source 6 so that the photosensitive colorant applied on the color filter substrate 8 is exposed. It may be prevented.

The light source 1, the micro-mirror device 2, the control unit 7 by connecting is provided in the imaging unit 3及beauty conveyance means 5. The control unit 7 is adapted to control so that the entire device is suitably driven, by the imaging means 3, the image pixels 19 of the black matrix 18 obtained in correspondence with each light receiving element 16 2 The image detection circuit 20 that detects the reference position set in advance for the pixel 19, the exposure light source control unit 21 that turns the light source 1 on and off, and the image data and the reference position are output. Using the memory 22 for storing data such as a corresponding lookup table, the distance D between the imaging position P2 and the exposure position P1, and the transport speed V of the color filter substrate 8, an image is taken by the imaging means 3. A calculation unit 23 for calculating an exposure timing time t from when the micromirror device 2 is driven to exposure, and the micromirror device based on the image data. A micromirror control circuit 24 that tilts the mirror element 9 of the second stage, a stage control unit 25 that moves the stage 5a of the transport means 5 in the direction of arrow A at a predetermined speed, and a control unit 26 that controls the entire apparatus in an integrated manner. I have.

FIG. 5 is a block diagram illustrating a configuration example of the image detection circuit 20. As shown in the figure, the image detection circuit 20 includes, for example, three ring buffer memories 27A, 27B, 27C connected in parallel, and, for example, three lines connected in parallel for each of the ring buffer memories 27A, 27B, 27C. A buffer circuit 28A, 28B, 28C; a comparison circuit 29 connected to the line buffer memories 28A, 28B, 28C and compared with a predetermined threshold value, and binarized and output gray level data; and the nine lines A look-up table (hereinafter referred to as binary image data) corresponding to a reference position that defines the output data of the buffer memories 28A, 28B, and 28C and the upper left corner of the leftmost pixel 19 of the black matrix 18 obtained from the memory 22 shown in FIG. , “LUT”), and when both data match And a judging circuit 30 for outputting a location determination result.

  The image detection circuit 20 receives the reference position determination result and counts the number of detections of the reference position, thereby counting the pixel column count number n, and the output of the pixel column counting circuit 31. And a comparison circuit 32 that outputs an exposure permission signal to the control unit 26 when both numerical values coincide with each other by comparing the pixel column number k to be exposed stored in advance in the memory 22 shown in FIG. It has. The pixel column counting circuit 31 is reset by an exposure end signal when the exposure for the last pixel column of the designated number is completed.

Next, the operation of the exposure apparatus of the first embodiment configured as described above will be described with reference to the flowchart of FIG.
First, when the power of the exposure apparatus is turned on, the control means 7 shown in FIG. 1 is activated and the exposure light source controller 21 turns on the light source 1. At the same time, the image pickup unit 3 is activated and becomes ready for image pickup. Next, when the color filter substrate 8 coated with a photosensitive colorant is placed on the stage 5 a of the transport unit 5 and a switch (not shown) is operated, the transport unit 5 is operated by the stage control unit of the control unit 7. 25, the color filter substrate 8 is conveyed in the direction of arrow A at a constant speed. Then, when the color filter substrate 8 reaches the imaging position P2 of the imaging means 3, an exposure operation is executed according to the following procedure.

First, in step S <b> 1, an image of the pixel 19 of the black matrix 18 formed in advance on the color filter substrate 8 by the imaging unit 3 is acquired. The image acquired by the imaging unit 3 is image processing in the image detecting circuit 20, image data binarized in correspondence with the light receiving element 16 is obtained. The binarized image data is stored in the memory 22 via the control unit 26. At the same time, the upper Symbol image, three ring buffer memory 27A of the image detection circuit 20 shown in FIG. 5, 27B, is processed captured by the 27C. The latest three data are output from the ring buffer memories 27A, 27B, and 27C. In this case, for example, the previous data is output from the ring buffer memory 27A, the previous data is output from the ring buffer memory 27B, and the latest data is output from the ring buffer memory 27C. Further, for each of these data, for example, 3 × 3 CCD pixel images are arranged on the same clock (time axis) by three line buffer memories 28A, 28B, and 28C. The result is obtained as a gray level image as shown in FIG. When this image is digitized, for example, it corresponds to a numerical value of 3 × 3 as shown in FIG. Since these digitized images are arranged on the same clock, they are compared with the threshold value by the comparison circuit 29 and binarized. For example, if the threshold value is “45”, the image in FIG. 10A is binarized as shown in FIG.

  In step S2, the reference position indicating the left corner of the leftmost pixel 19 of the black matrix 18 is detected. Specifically, the reference position is detected by comparing the binarized data with the LUT data obtained from the memory 22 shown in FIG.

  For example, when the reference position is set at the upper left corner of the left end pixel 19 of the black matrix 18 as shown in FIG. 8A, the LUT is as shown in FIG. The LUT data at this time is “000011011”. Therefore, the binarized data is compared with the data “000011011” of the LUT, and when the two data coincide with each other, it is determined that the image data acquired by the imaging unit 3 is the reference position. A reference position determination result is output. Then, the reference position detection time t 1 is stored in the memory 22.

  In step S3, the pixel row count circuit 31 shown in FIG. 5 counts the number of detections of the reference position based on the reference position determination result by the determination circuit 30, and the pixel column count number n is counted. Then, the counted pixel column count number n is compared with the pixel column number k to be exposed and stored in advance in the memory 22 shown in FIG. Is determined. Here, when the determination is “NO”, the process returns to step S1 and steps S1 to S3 are repeated. On the other hand, if both numerical values match and the determination is “YES”, the process proceeds to step S4.

In step S 4, an exposure permission signal is output from the comparison circuit 32 to the control unit 26. In this case, for example, when every two pixel column numbers k are designated such as “1”, “4”, “7”..., The pixel column count number n counted by the pixel column counting circuit 31. When “1”, “4”, “7”... Are output, an exposure permission signal is output (see the exposure permission period I shown in FIG. 9), and exposure can be performed for T time. Here, the time T is calculated and set by the calculation unit 23 using the conveyance speed V of the color filter substrate 8 and the width d of the pixel 19 in the conveyance direction stored in the memory 22 in advance. When the pixel column count number n is “2”, “3”, “5”,... And does not match the designated pixel column number k (when “NO” is determined in step S3), exposure is performed. The exposure is stopped (see the exposure stop period II shown in FIG. 9).

In step S5, it is determined whether or not the color filter substrate 8 is transported at a predetermined speed and, for example, the reference position of the designated first pixel row L1 is set to the exposure position P1. This determination is based on the transport speed V and the distance D between the imaging position P2 and the exposure position P1, and the calculation unit 23 calculates the time t during which the color filter substrate 8 is transported by the distance D. This is performed by determining whether or not the time t has elapsed since the reference position of the pixel row L1 was detected (detection time t1). Here, the detection time t1 time of the reference position t has passed, that is, the reference position of the first pixel column L1 is determined to have been set to the exposure position P1 ( "YES" determination Priority determination), the process proceeds to step S6.

In step S6, the micromirror control circuit 24 is controlled based on an exposure permission signal input from the comparison circuit 32 of the image detection circuit 20 via the control unit 26, and exposure is executed. Specifically, the micromirror control circuit 24 is turned on during the exposure permission period I shown in FIG. 9, and binarized image data read from the memory 22, for example, each light receiving element 16 as shown in FIG. The micromirror device 2 is directly driven by the image data “001111111111001111111111001111...” Obtained correspondingly . In this case, "1" by tilting the mirror elements 9-3～9-12,9-15～9-24 and 9-27 ... the micromirror device 2 shown in FIG correspondingly turning on the drive. Thereby, the exposure light incident from the light source 1 is reflected by the mirror elements 9-3 to 9-12, 9-15 to 9-24 and 9-27... To the projection lens 4 side, and passes through the projection lens 4. It reaches the color filter substrate 8 and the photosensitive colorant on the pixel 19 corresponding to the exposure position P1 is exposed (indicated by an exposure region Q1 in FIG. 5B).

In step S7, it is determined whether or not the exposure permission period I has ended. This determination is made by measuring the time T by the control unit 26. Here, if the exposure permission period I has not yet ended, “NO” determination is made, and the routine proceeds to step S8. In step S8, the imaging unit 3 captures an image of the portion of the pixel 19 that follows the exposure area Q1. Then, returning to step S6, the binarized image data of the image acquired by the imaging means 3 after time t from the imaging time, for example , “001111111111001111111111001111... Obtained corresponding to each light receiving element 16 as shown in FIG. Is read from the memory 22 and the micromirror device 2 is directly driven. In this case, "1" is mirrored elements 9-3～9-12,9-15～9-24 and 9-27 ... is tilting the micromirror device 2 shown in FIG correspondingly (a) on the drive Then, exposure is performed on the area on the pixel 19 following the exposure area Q1. The operations in steps S6 to S8 are continuously executed until the time T elapses. As a result, the photosensitive colorant in the region Q2 following the exposure region Q1 on the pixel 19 is exposed.

If it is determined in step S7 that the time T has elapsed and the exposure permission period I has ended, “YES” determination is made, and the flow proceeds to step S9.
In step S9, the exposure permission signal of the comparison circuit 32 is turned off, and the micromirror control circuit 24 is turned off. As a result, the mirror element 9 of the micromirror device 2 is turned off, and the exposure light incident from the light source 1 is reflected in a direction different from that of the projection lens 4 to stop the exposure.

  In step S10, it is determined whether or not the pixel column count number n counted in step S3 is the last specified pixel column number k. If the determination is “YES”, the exposure for all the designated pixel columns is completed. On the other hand, when it becomes "NO" determination, it returns to step S1 and step S1-S10 is repeated.

When the width in the direction orthogonal to the arrow A of the exposure area by the micromirror device 2 is narrower than the width of the color filter substrate 8 in the same direction, the stage 5a is moved in the transport direction (arrow A direction) when step S10 ends. The step S1 to S10 may be re-executed by performing step movement in a direction orthogonal to the predetermined distance, and exposure may be performed on an area adjacent to the already exposed area. Further, a plurality of the micromirror devices 2 and the image pickup means 3 may be arranged in a direction perpendicular to the transport direction so that the entire width of the color filter substrate 8 can be exposed at one time.

FIG. 10 is a schematic side view showing a second embodiment of the exposure apparatus according to the present invention. In this exposure apparatus, a plurality of mirror elements 9 that are emitted by applying intensity modulation to exposure light incident from the light source 1 are arranged side by side in a direction orthogonal to the transport direction of the color filter substrate 8 (direction of arrow A shown in the figure). The micromirror device 2 and the plurality of light receiving elements 16 that receive light from the color filter substrate 8 are made to correspond to the plurality of mirror elements 9 of the micromirror device 2 on a one-to-one basis, and the transport direction of the color filter substrate 8 Are arranged side by side in a direction orthogonal to the image pickup means 3 for picking up an image at the same position as the exposure position P1 on the color filter substrate 8, and arranged between the micromirror device 2, the image pickup means 3 and the transport means 5. , an image of each mirror element 9 of the micro-mirror device 2 as well as projected on the color filter substrate 8 was formed on the color filter substrate 8 black An image of the pixels 19 of the matrix 18 and the projection lens 4 for projecting the plane of the light receiving element 16 of the imaging unit 3, binarization obtained corresponding to the respective light receiving elements 16 of the image captured by the imaging means 3 each mirror element 9 of the micromirror device 2 is directly driven by the image data, and a control unit 7 for controlling the exposure of an exposure pattern onto the pixel 19 becomes provided with.

  In this case, the micromirror device 2 is branched from the optical path R1 by a UV cold mirror 33 that reflects ultraviolet light and transmits visible light in the middle of the optical path R1 of the imaging means 3 that extends upward through the projection lens 4. It is arranged on the optical path R2, and imaging and exposure can be executed in real time. The illumination light source 6 is disposed below the projection lens 4 on an optical path R3 branched from the optical path R1 of the imaging means 3 by the half mirror 34. Here, in FIG. 10, the code | symbol 35 shows a mirror. In FIG. 10, for convenience of explanation, the optical path R1 of the imaging means 3 and the optical path R2 of the micromirror device 2 are shown separately in the projection lens 4, but both optical paths match in the same part. Yes.

  In the above description, the case of the mirror element 9 of the micromirror device 2 in which the modulation element of the light modulation means is controlled and tilted by the control means 7 is described. However, the present invention is not limited to this. The reflecting surface may be arranged in the same plane, and may be a mirror element that is controlled by the control means 7 and that the plurality of reflecting mirrors recedes every other mirror to form a step on the surface to form a diffraction grating. Thereby, the reflected light is dispersed by the diffraction grating, and the intensity modulation can be applied to the exposure light input from the light source 1.

  Further, the exposure apparatus of the present invention is not limited to the one applied to the exposure to a large substrate such as a color filter of a liquid crystal display, and can be applied to the exposure of a semiconductor or the like.

1 is a conceptual diagram showing a first embodiment of an exposure apparatus according to the present invention. In the said 1st Embodiment, it is plane explanatory drawing which shows arrangement | positioning of a micromirror device and an imaging means. It is explanatory drawing which shows the structure of the mirror element which comprises the said micromirror device, (a) is a center longitudinal cross-sectional view, (b) is a center cross-sectional view. It is a side view explaining the tilt of the mirror element of the said micromirror device, (a) shows an ON drive state, (b) is an OFF drive state. It is a block diagram which shows the internal structure of an image process part. It is a flowchart explaining the operation | movement of the said 1st Embodiment. It is explanatory drawing which shows the method of binarizing the output of a ring buffer memory. It is explanatory drawing which shows the image of the reference position preset to the pixel of the black matrix on a color filter board | substrate, and its lookup table. It is explanatory drawing which shows exposure of the color filter pattern with respect to the pixel of the black matrix on a color filter board | substrate. It is a side view which shows schematic structure of 2nd Embodiment of the exposure apparatus by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Light source 2 ... Micromirror device (light modulation means)
DESCRIPTION OF SYMBOLS 3 ... Imaging means 4 ... Projection lens 5 ... Conveyance means 7 ... Control means 8 ... Color filter substrate (exposed body)
9 ... Mirror element (modulation element)
16 ... light receiving element 18 ... black matrix 19 ... pixel (reference pattern)
P1 ... exposure position P2 ... imaging position

Claims (7)

An exposure apparatus that irradiates an exposure object emitted from a light source to an object to be exposed conveyed at a predetermined speed by a conveying unit to expose an image of an exposure pattern on the object to be exposed,
A light modulation unit that arranges a plurality of modulation elements that reflect exposure light from the light source and emits the exposure light with intensity modulation and arranged in a direction orthogonal to a conveyance direction of the object to be exposed;
A plurality of light receiving elements that receive light from the object to be exposed are arranged side by side in a direction orthogonal to the transport direction of the object to be exposed in correspondence with the plurality of modulation elements of the light modulator , and in the transport direction provided by the front-rear and the light modulating means, and imaging means for imaging the conveying direction front side of the exposure position on said object to be exposed,
A reference which is disposed between the light modulation means and the imaging means and the conveying means, projects an image of each modulation element of the light modulation means onto the object to be exposed, and is formed on the object to be exposed A projection lens that projects an image of the pattern onto the surface of the light receiving element of the imaging means;
Each modulation element of the light modulating means is driven directly by the binary image data obtained in correspondence with the respective light receiving elements of the image captured by the imaging means, the exposure of an exposure pattern onto the reference pattern Control means for controlling;
An exposure apparatus comprising: Said imaging means, said toward the conveying direction of the subject to be exposed, the exposure apparatus according to claim 1, characterized in that disposed towards after sandwiched therebetween said light modulating means the optical axis of the projection lens. An exposure apparatus that irradiates an exposure object emitted from a light source to an object to be exposed conveyed at a predetermined speed by a conveying unit to expose an image of an exposure pattern on the object to be exposed,
A light modulation unit that arranges a plurality of modulation elements that reflect exposure light from the light source and emits the exposure light with intensity modulation and arranged in a direction orthogonal to a conveyance direction of the object to be exposed;
A plurality of light receiving elements that receive light from the object to be exposed are arranged side by side in a direction orthogonal to the transport direction of the object to be exposed, corresponding to the plurality of modulation elements of the light modulation unit, and on the object to be exposed Imaging means for imaging the same position as the exposure position;
Is disposed between the conveying means and said light modulating means and the imaging means and for projecting an image of each modulation element of the light modulating means on said object to be exposed, it is formed on該被exposed object reference A projection lens that projects an image of the pattern onto the surface of the light receiving element of the imaging means;
Each modulation element of the light modulating means is driven directly by the binary image data obtained in correspondence with the respective light receiving elements of the image captured by the imaging means, the exposure of an exposure pattern onto the reference pattern Control means for controlling;
An exposure apparatus comprising:   The said light modulation means is arrange | positioned in the middle of the optical path of the said imaging means extended upwards through the said projection lens on the optical path branched from the optical path of this imaging means. Exposure device. 5. Each modulation element of the light modulation means and each light receiving element of the imaging means are arranged in a one-to-one correspondence in the transport direction of the object to be exposed. 2. The exposure apparatus according to item 1. 6. The exposure apparatus according to claim 1 , wherein the modulation element of the light modulation unit is a mirror element that is tilted by being controlled by the control unit. The modulation element of the light modulation means has a plurality of ribbon-like reflection mirrors arranged with their reflection surfaces arranged in the same plane, and is controlled by the control means so that the plurality of reflection mirrors recedes every other surface to the surface. 6. The exposure apparatus according to claim 1 , wherein the exposure apparatus is a mirror element that forms a diffraction grating with a step.

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