CN100481371C - Substrate placing stage - Google Patents
Substrate placing stage Download PDFInfo
- Publication number
- CN100481371C CN100481371C CNB2005101249756A CN200510124975A CN100481371C CN 100481371 C CN100481371 C CN 100481371C CN B2005101249756 A CNB2005101249756 A CN B2005101249756A CN 200510124975 A CN200510124975 A CN 200510124975A CN 100481371 C CN100481371 C CN 100481371C
- Authority
- CN
- China
- Prior art keywords
- substrate
- placing stage
- pins
- severing
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
To provide a substrate placing stage wherein pins overlap on a cut scheduled line when supporting a large sized substrate where a plurality of substrates are subjected to multiple patterning. A plurality of fixed pins 3 are mounted on a support plate. The fixed pins 3 are disposed at positions, as viewed in a flat plane, which overlap on an outer peripheral edge L1 located outside the effective area of the large-sized substrate placed on the substrate placing stage, and are also disposed at positions which overlap on a cut scheduled line L2 where the large-sized substrate is subjected to two-face patterning. In contrast, a movable pin 5 is inserted into a through hole formed in the support plate, and the movable pins 5 are disposed at positions which overlap on cut scheduled lines L3, L4 where the large-sized substrate is further subjected to patterning. The lateral movable pins 5 are mounted in common on a coupled plate located below the support plate, hereby elevates the lateral movable pins 5 simultaneously by driving a cylinder unit.
Description
Technical field
The present invention relates to a kind of substrate placing stage of bearing glass substrate when the glass substrate that is used for display panels is implemented various the processing.
Background technology
In order to be set to implement various processing under the level at glass substrate, up to the present use substrate placing stage.(patent documentation 1-3)
Existing substrate placing stage all is to form a plurality of through holes in the mesa thickness direction, in these a plurality of through holes, insert anchor,, a plurality of anchors are risen simultaneously by pressure cylinder assembly etc., supporting substrate, thus this anchor is descended base plate carrying on table top.
On the aforesaid substrate plummer, falling under the state of anchor, make above the following direct contact platform of glass substrate.For this reason, under the situation different of the temperature on platform with the temperature of glass substrate, on glass baseplate surface, form film in produce uneven baneful influence.
In order to address the above problem, on substrate placing stage, load onto pin, carrying on this pin under the state of glass substrate, carry out various processing for example drying under reduced pressure handle and to get final product, but since the pin upper end run into glass substrate below, will residual pin vestige on this part.
Summary of the invention
In order to improve the production efficiency of display panels, after implementing general processing on the big glass substrate, carry out severing by the size of each display panels, be the inactive area of not using along this severing part partly as the effective coverage.In order to solve above-mentioned problem, thereby utilize this point to make the present invention.
Substrate placing stage of the present invention, be that to carry out the large substrate of the large-size glass substrate etc. of repeatedly severing in the operation be the substrate placing stage of prerequisite to be carried on the back, structure is as follows: be included in a plurality of steady pins that plummer is provided with above, the a plurality of movable pins that move with the liftable that can insert in the through hole that is formed on the thickness direction on the platform, the said fixing pin be configured in when overlooking and the effective coverage of the large substrate of carrying outside the equitant position of outer peripheral edges on, above-mentioned movable pin be configured in when overlooking and the equitant position of severing preset lines of large substrate on.
Utilize such structure, just can be in the effective coverage of glass substrate etc. the vestige of residual pin.
At this, be several with the large substrate severing, because of the difference of the size of target liquid crystal panel etc. is different, but the size of original large substrate is fixed.Therefore, the outer peripheral edges (inactive area) of at first utilizing the steady pin support to support, on the other hand, the severing preset lines is because of the intercepting quantity of large substrate or the difference difference of intercepting shape, so for this part, movable pin is risen, supports with movable pin.
By a plurality of movable pins with vertical or horizontal arrangement is a unit, and each unit carries out lifting moving with an elevating mechanism, simplifies the internal structure of an organization thus.
In addition, because the certain intercepting of above-mentioned large substrate is more than 2, so certain severing preset lines that has 2 of interceptings.Therefore, also can with 2 severing preset lines overlaid position of intercepting on dispose steady pin.
According to the present invention, owing to only support the substrate outer peripheral edges and the severing preset lines part of glass substrate etc. by steady pin or movable pin, so even under the situation of residual pin vestige, can not produce any adverse influence yet.
In addition, according to the present invention, because of the number of severing changes the position that changes the severing preset lines, thereby movable pin is when the severing preset lines departs from, also can be simply by this movable pin being retreated and making and the new outstanding support substrate of the equitant movable pin in position of severing preset lines.
Description of drawings
Fig. 1 is the vertical view of substrate placing stage of the present invention.
Fig. 2 is the amplification view along the major part of the A-A line of Fig. 1.
Fig. 3 (a) to (c) is the figure identical with Fig. 1 of another embodiment of expression.
[description of symbols]
1 base
2 support plates
3 steady pins
4 through holes
5 movable pins
6 webs
7 guide rods
8 pressure cylinder assemblies
The L1 outer peripheral edges
L2 is 2 severing preset lines with the large substrate intercepting
L3-L14 carries out the two sides and intercepts severing preset lines when above
The W large substrate
Embodiment
Below, embodiments of the invention are described with reference to the accompanying drawings.Fig. 1 is the vertical view of substrate placing stage of the present invention.Fig. 2 is the amplification view along the major part of the A-A line of Fig. 1.
This substrate placing stage for example is to use coating in the operation that resist liquid on the large-size glass substrate etc. carries out drying under reduced pressure.
Substrate placing stage is that relatively thinner substrate placing stage is installed on base 1, and a plurality of steady pins 3 are installed on this support plate 2.The head-down position of this steady pin 3 is on the equitant position of outer peripheral edges L1 that is configured in and is carried on outside the effective coverage of the large substrate W on this substrate placing stage, in addition, also be configured in and be on 2 the equitant position of severing preset lines L2 with large substrate intercepting.
On the other hand, form a plurality of through holes 4, insert movable pin 5 in each through hole 4 at above-mentioned support plate 2 upper edge thickness directions.Each movable pin 5 be configured in the severing preset lines L3 that large substrate is further intercepted, the equitant position of L4 on.
In the present embodiment, the movable pin 5 of transverse direction is installed on the connecting plate 6 of support plate 2 belows jointly, this connecting plate 6 is installed on the guide rod 7 that connects base 1, by driving the pressure cylinder assembly 8 that is provided with guide rod 7 below base 1, makes movable pin 5 liftings simultaneously of transverse direction.
And movable pin 5 extreme position thereon is highly identical with said fixing pin 3, supports large substrate W with level, and movable pin 5 descends a little from upper limit position on the other hand, and this movable pin 5 just has nothing to do with the support of substrate thus.
Fig. 3 (a) to (c) is the figure identical with Fig. 1 of another embodiment of expression, (a) embodiment shown in represents to intercept 8 example, steady pin 3 is configured in original position in this embodiment, and movable pin 5 is configured on the severing preset lines L5 that further intercepts with large substrate, the equitant position of L6.
In addition, (b) embodiment shown in is 12 a example of intercepting, though with movable pin 5 be configured in severing preset lines L7, the equitant position of L8, L9 on, the configuration quantity and the allocation position thereof of steady pin 3 and movable pin 5 are identical with the example shown in (a).
In addition, (c) embodiment shown in is 24 a example of intercepting, with severing preset lines L10, L11, L12, the equitant position of L13, L14 on configuration movable pin 5.
Claims (3)
1, a kind of substrate placing stage is characterized in that:
To severing in the operation of back is that the large substrate of a plurality of large-size glass substrate carries, wherein, this substrate placing stage comprises: a plurality of steady pins that are provided with on plummer, be formed on a plurality of movable pins that the liftable in the through hole of the thickness direction on the platform moves with insertion, the said fixing pin be configured in when overlooking and the effective coverage of the large substrate of carrying outside the equitant position of outer peripheral edges on, above-mentioned movable pin be configured in when overlooking and the equitant position of severing preset lines of large substrate on.
2, substrate placing stage according to claim 1 is characterized in that, above-mentioned a plurality of movable pins are with vertical or transversely arranged, and these vertical or transversely arranged a plurality of movable pins carry out lifting moving by 1 elevating mechanism.
3, substrate placing stage according to claim 1 and 2 is characterized in that, steady pin also is configured in and be on 2 the equitant position of severing preset lines with the intercepting of above-mentioned large substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004290898A JP2006108265A (en) | 2004-10-04 | 2004-10-04 | Substrate placing stage |
| JP2004290898 | 2004-10-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1790660A CN1790660A (en) | 2006-06-21 |
| CN100481371C true CN100481371C (en) | 2009-04-22 |
Family
ID=36377654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101249756A Active CN100481371C (en) | 2004-10-04 | 2005-10-04 | Substrate placing stage |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2006108265A (en) |
| KR (1) | KR20060052002A (en) |
| CN (1) | CN100481371C (en) |
| TW (1) | TW200629459A (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2011007616A1 (en) * | 2009-07-13 | 2011-01-20 | シャープ株式会社 | Support device and drying device provided with said support device |
| CN103443913B (en) * | 2011-04-13 | 2016-01-20 | 夏普株式会社 | Baseplate support device and drying device |
| CN107526196A (en) * | 2017-09-27 | 2017-12-29 | 武汉华星光电技术有限公司 | Glass base-board load-bearing device and detection device |
| CN108447800B (en) * | 2018-01-31 | 2019-12-10 | 北京铂阳顶荣光伏科技有限公司 | Method for manufacturing thin film battery |
| KR102399627B1 (en) | 2020-09-16 | 2022-05-19 | 양영제 | Equipment for exclusive use of steam room cleaning |
-
2004
- 2004-10-04 JP JP2004290898A patent/JP2006108265A/en active Pending
-
2005
- 2005-10-03 TW TW094134492A patent/TW200629459A/en unknown
- 2005-10-04 CN CNB2005101249756A patent/CN100481371C/en active Active
- 2005-10-04 KR KR1020050092958A patent/KR20060052002A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TW200629459A (en) | 2006-08-16 |
| JP2006108265A (en) | 2006-04-20 |
| KR20060052002A (en) | 2006-05-19 |
| CN1790660A (en) | 2006-06-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230627 Address after: Kanagawa, Japan Patentee after: Process Equipment Business Division Preparation Co.,Ltd. Patentee after: TAZMO CO.,LTD. Address before: Kawasaki, Japan Patentee before: TOKYO OHKA KOGYO CO.,LTD. Patentee before: TAZMO CO.,LTD. Effective date of registration: 20230627 Address after: Ibaraki Patentee after: Ameco Technology Co.,Ltd. Patentee after: TAZMO CO.,LTD. Address before: Kanagawa, Japan Patentee before: Process Equipment Business Division Preparation Co.,Ltd. Patentee before: TAZMO CO.,LTD. |
|
| TR01 | Transfer of patent right |