CN100481371C - Substrate placing stage - Google Patents
Substrate placing stage Download PDFInfo
- Publication number
- CN100481371C CN100481371C CNB2005101249756A CN200510124975A CN100481371C CN 100481371 C CN100481371 C CN 100481371C CN B2005101249756 A CNB2005101249756 A CN B2005101249756A CN 200510124975 A CN200510124975 A CN 200510124975A CN 100481371 C CN100481371 C CN 100481371C
- Authority
- CN
- China
- Prior art keywords
- substrate
- placing stage
- pins
- severing
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/062—Easels, stands or shelves, e.g. castor-shelves, supporting means on vehicles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004290898 | 2004-10-04 | ||
JP2004290898A JP2006108265A (en) | 2004-10-04 | 2004-10-04 | Substrate placing stage |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1790660A CN1790660A (en) | 2006-06-21 |
CN100481371C true CN100481371C (en) | 2009-04-22 |
Family
ID=36377654
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101249756A Active CN100481371C (en) | 2004-10-04 | 2005-10-04 | Substrate placing stage |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2006108265A (en) |
KR (1) | KR20060052002A (en) |
CN (1) | CN100481371C (en) |
TW (1) | TW200629459A (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011007616A1 (en) * | 2009-07-13 | 2011-01-20 | シャープ株式会社 | Support device and drying device provided with said support device |
WO2012141082A1 (en) * | 2011-04-13 | 2012-10-18 | シャープ株式会社 | Substrate support device, and drying device |
CN107526196A (en) * | 2017-09-27 | 2017-12-29 | 武汉华星光电技术有限公司 | Glass base-board load-bearing device and detection device |
CN108447800B (en) * | 2018-01-31 | 2019-12-10 | 北京铂阳顶荣光伏科技有限公司 | Method for manufacturing thin film battery |
KR102399627B1 (en) | 2020-09-16 | 2022-05-19 | 양영제 | Equipment for exclusive use of steam room cleaning |
-
2004
- 2004-10-04 JP JP2004290898A patent/JP2006108265A/en active Pending
-
2005
- 2005-10-03 TW TW094134492A patent/TW200629459A/en unknown
- 2005-10-04 KR KR1020050092958A patent/KR20060052002A/en not_active Application Discontinuation
- 2005-10-04 CN CNB2005101249756A patent/CN100481371C/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN1790660A (en) | 2006-06-21 |
KR20060052002A (en) | 2006-05-19 |
JP2006108265A (en) | 2006-04-20 |
TW200629459A (en) | 2006-08-16 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20230627 Address after: Kanagawa, Japan Patentee after: Process Equipment Business Division Preparation Co.,Ltd. Patentee after: TAZMO CO.,LTD. Address before: Kawasaki, Japan Patentee before: TOKYO OHKA KOGYO CO.,LTD. Patentee before: TAZMO CO.,LTD. Effective date of registration: 20230627 Address after: Ibaraki Patentee after: Ameco Technology Co.,Ltd. Patentee after: TAZMO CO.,LTD. Address before: Kanagawa, Japan Patentee before: Process Equipment Business Division Preparation Co.,Ltd. Patentee before: TAZMO CO.,LTD. |
|
TR01 | Transfer of patent right |