CN102593029A - Carrying device of semiconductor wafer - Google Patents
Carrying device of semiconductor wafer Download PDFInfo
- Publication number
- CN102593029A CN102593029A CN2011100014621A CN201110001462A CN102593029A CN 102593029 A CN102593029 A CN 102593029A CN 2011100014621 A CN2011100014621 A CN 2011100014621A CN 201110001462 A CN201110001462 A CN 201110001462A CN 102593029 A CN102593029 A CN 102593029A
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- wafer
- wall
- bogey
- semiconductor crystal
- crystal wafer
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention relates to a carrying device of a semiconductor wafer. The carrying device comprises a first wall, a second wall and support columns, wherein the first wall and the second wall are opposite to each other as well as the support columns are used to connect the first wall and the second wall. Besides, the carrying device also includes a plurality of division plates that are arranged between the support columns and are parallel to each other; a placement slot that is used for carrying a wafer is formed between each two adjacent division plates; and spacing between each two adjacent division plates is greater than 12.68 millimeters. The above-mentioned carrying device of the semiconductor wafer is redeigned and manufactured; and the spacing between each two adjacent division plates is from 12.60 milimeters to 12.88 milimeters; therefore, even when an ultra-thin wafer is placed, there is enough space to accommodate natural sagging of the wafer and for taking and placing of the wafer by a mechanical arm and it is not easy to generate a damaged wafer, so that production efficiency is improved and cost increase caused by the damage wafer can be avoided.
Description
[technical field]
The device that the present invention relates to use in the semiconductor fabrication relates in particular to a kind of bogey of semiconductor crystal wafer.
[background technology]
The bogey of semiconductor crystal wafer is commonly referred to brilliant boat, is the device that typically is used for storing wafer (wafer).Brilliant boat contains a plurality of wafer standing grooves (slot), and each standing groove can supply to place a slice wafer.
Traditional brilliant boat has 25 standing grooves, and the height of each standing groove (pitch) is about 6mm.Yet traditional brilliant boat is when being used for placing the wafer that approaches (or size is bigger), and wafer is owing to receive gravitational influence, and center meeting nature is sagging, causes being prone to that when getting sheet and film releasing wiping takes place and bumps, and then produce fragmentation.
A solution is that the dividing plate between standing groove excision is half the, makes that adjacent two are combined into one after dividing plate is excised in 25 original standing grooves, finally forms 12 standing grooves.But easy like this because dividing plate excises not exclusively, cause when film releasing wafer to produce with the residual part of dividing plate and collide, or an end rides on the residual dividing plate, when mechanical arm is got sheet, produces collision because of position deviation, causes fragmentation at last.
[summary of the invention]
In order to solve traditional brilliant boat is prone to produce fragmentation when placing thin wafer problem, be necessary to provide a kind of bogey of semiconductor crystal wafer.
A kind of bogey of semiconductor crystal wafer; Comprise the first wall and second wall that are oppositely arranged; And the support column that connects the said first wall and second wall; Also comprise some demarcation strips that are parallel to each other between the support column that are arranged on, be formed for carrying the standing groove of wafer between the two adjacent demarcation strips, the spacing between the said adjacent separator plates is greater than 12.68 millimeters.
Preferably, the spacing between the said adjacent separator plates is 12.68 millimeters to 12.88 millimeters.
Preferably, the spacing between the said adjacent demarcation strip is 12.78 millimeters.
Preferably, the structure that is formed in one of said support column and demarcation strip.
Preferably, said demarcation strip is the U-shaped structure.
Preferably, the outside of said first wall is provided with handle.
Preferably, also comprise a pair of foot rest that is parallel to each other, said foot rest connects the said first wall and second wall.
Preferably, the demarcation strip opening part both sides of said U-shaped structure also are provided with opposed side panel, and said opposed side panel is parallel to support column.
The bogey of the above-mentioned semiconductor crystal wafer that manufactures and designs again; Spacing between the two adjacent demarcation strips is greater than 12.68 millimeters; Even when placing extra-thin wafer, also there are enough spaces to hold the sagging naturally of wafer and supply mechanical arm the picking and placeing of wafer, be difficult for producing fragmentation; Improve production efficiency, avoided fragmentation to cause the increase of cost.
[description of drawings]
Fig. 1 is the front view of the bogey of semiconductor crystal wafer among the embodiment;
Fig. 2 is the left view of Fig. 1;
Fig. 3 is the upward view of Fig. 1;
Fig. 4 is the vertical view of Fig. 1.
[embodiment]
For make the object of the invention, feature and advantage can be more obviously understandable, does detailed explanation below in conjunction with the accompanying drawing specific embodiments of the invention.
Fig. 1 is the front view (sketch map) of the bogey of semiconductor crystal wafer among the embodiment, and Fig. 2 is the left view (sketch map) of Fig. 1, and Fig. 3 is the upward view (sketch map) of Fig. 1, and Fig. 4 is the vertical view (sketch map) of Fig. 1.The bogey 10 of semiconductor crystal wafer comprises the first wall 12 and second wall 14 that is oppositely arranged, and the support column 13 that connects the first wall 12 and second wall 14, also comprises a plurality of and support column 13 integrated demarcation strips 16.Be parallel to each other between a plurality of demarcation strips 16, and be formed for placing respectively the standing groove of wafer between the two adjacent demarcation strips 16.In this execution mode, the spacing between the two adjacent demarcation strips 16 is 12.68 millimeters to 12.88 millimeters, and the height (pitch) that is to say standing groove is 12.68 millimeters to 12.88 millimeters.In a preferred embodiment, the spacing between the two adjacent demarcation strips 16 is 12.78 millimeters.
In the present embodiment, the outside of first wall 12 (one side of oriented wafer sheet was defined as the inboard when bogey of semiconductor crystal wafer 10 was carried wafers) is provided with handle 122, can mention and the bogey 10 of mobile semiconductor crystal wafer through handle 122.When the bogey of semiconductor crystal wafer 10 was upright, what land was second wall 14.Second wall 14 comprise base plate 142 and with base plate 142 connection inclined 143.
In the present embodiment, U-shaped flange open place also is provided with opposed side panel (each one of both sides) 17, and opposed side panel 17 is parallel to support column 13, and the part of standing groove is formed on the opposed side panel 17, therefore can play the restriction to the wafer of putting into.Two opposed side panels 17 intersect with first wall 12, second wall 14; See from Fig. 1; The bogey 10 of semiconductor crystal wafer is similar to tetragonal in the plane; Offer perforation 172 (i.e. 4 perforation 172 altogether) near its four intersection points the opposed side panel 17; To bore a hole after can the bogey 10 of two semiconductor crystal wafers being provided with in opposite directions and 172 aim at and fixing (through connector), by rewinder the wafers in the bogey 10 of a semiconductor crystal wafer transferred in another then.
Second wall 14 offers a breach 146, is used to be provided with the wafer transducer.When the wafer transducer was depressed, the equipment of getting sheet or load that cooperates with the bogey 10 of semiconductor crystal wafer just can run goods.
In the present embodiment, the bogey 10 of semiconductor crystal wafer comprises a pair of foot rest that is parallel to each other 15, and foot rest 15 connects the first wall 12 and second wall 14.When bogey 10 horizontal positioned of semiconductor crystal wafer, foot rest 15 can play the effect of supporting whole device.
The transmission course of wafer in the bogey 10 of semiconductor crystal wafer is:
The operator is placed on wafer in the bogey 10 of semiconductor crystal wafer, and the bogey 10 that this semiconductor crystal wafer of wafer will be housed places on the corresponding position of the equipment that need get sheet.
Getting the wafer lower horizontal that the mechanical arm (blade) of sheet gets from needs puts in the bogey 10 of semiconductor crystal wafer.
Mechanical arm raises, and wafer is lifted.
Wafer is taken out in the withdrawal of mechanical arm level.
The bogey of above-mentioned semiconductor crystal wafer designs again and makes, and the spacing between the two adjacent demarcation strips is 12.68 millimeters to 12.88 millimeters.Spacing between the two adjacent demarcation strips is greater than 12.68 millimeters; Even can guarantee when placing extra-thin wafer; Also there are enough spaces to hold the sagging naturally of wafer and confession mechanical arm picking and placeing to wafer; Be difficult for producing fragmentation, improved production efficiency, avoided fragmentation to cause the increase of cost.
The above embodiment has only expressed several kinds of execution modes of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art under the prerequisite that does not break away from the present invention's design, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with accompanying claims.
Claims (8)
1. the bogey of a semiconductor crystal wafer; Comprise the first wall and second wall that are oppositely arranged; And the support column that connects the said first wall and second wall, also comprise some demarcation strips that are parallel to each other between the support column that are arranged on, be formed for carrying the standing groove of wafer between the two adjacent demarcation strips; It is characterized in that the spacing between said adjacent two demarcation strips is greater than 12.68 millimeters.
2. the bogey of semiconductor crystal wafer according to claim 1 is characterized in that, the spacing between said adjacent two demarcation strips is 12.68 millimeters to 12.88 millimeters.
3. the bogey of semiconductor crystal wafer according to claim 2 is characterized in that, the spacing between said adjacent two demarcation strips is 12.78 millimeters.
4. according to the bogey of any described semiconductor crystal wafer of claim 1-3, it is characterized in that the structure that said support column and demarcation strip are formed in one.
5. the bogey of semiconductor crystal wafer according to claim 4 is characterized in that, said demarcation strip is the U-shaped structure.
6. the bogey of semiconductor crystal wafer according to claim 5 is characterized in that, the outside of said first wall is provided with handle.
7. the bogey of semiconductor crystal wafer according to claim 6 is characterized in that, also comprises a pair of foot rest that is parallel to each other, and said foot rest connects the said first wall and second wall.
8. the bogey of semiconductor crystal wafer according to claim 5 is characterized in that, the demarcation strip opening part both sides of said U-shaped structure also are provided with opposed side panel, and said opposed side panel is parallel to support column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110001462.1A CN102593029B (en) | 2011-01-06 | 2011-01-06 | Carrying device of semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110001462.1A CN102593029B (en) | 2011-01-06 | 2011-01-06 | Carrying device of semiconductor wafer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102593029A true CN102593029A (en) | 2012-07-18 |
| CN102593029B CN102593029B (en) | 2015-05-06 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110001462.1A Active CN102593029B (en) | 2011-01-06 | 2011-01-06 | Carrying device of semiconductor wafer |
Country Status (1)
| Country | Link |
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| CN (1) | CN102593029B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104658956A (en) * | 2013-11-18 | 2015-05-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Support structure for wafer transfer system |
| CN107658258A (en) * | 2016-07-25 | 2018-02-02 | 上海新昇半导体科技有限公司 | A kind of wafer holder picks and places sheet devices |
| CN109256331A (en) * | 2018-09-21 | 2019-01-22 | 吉林华微电子股份有限公司 | A kind of method that ultra-thin chip back metal sputters and ultra-thin IGBT product |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1128233A (en) * | 1994-07-15 | 1996-08-07 | 氟器皿有限公司 | Wafer shipper and package |
| JPH09199579A (en) * | 1996-01-23 | 1997-07-31 | Nec Kyushu Ltd | Semiconductor wafer carrier |
| CN1553876A (en) * | 2001-07-12 | 2004-12-08 | 诚实公司 | Thin wafer carrier |
| CN101494184A (en) * | 2008-01-21 | 2009-07-29 | 采钰科技股份有限公司 | Wafer bearing device |
-
2011
- 2011-01-06 CN CN201110001462.1A patent/CN102593029B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1128233A (en) * | 1994-07-15 | 1996-08-07 | 氟器皿有限公司 | Wafer shipper and package |
| JPH09199579A (en) * | 1996-01-23 | 1997-07-31 | Nec Kyushu Ltd | Semiconductor wafer carrier |
| CN1553876A (en) * | 2001-07-12 | 2004-12-08 | 诚实公司 | Thin wafer carrier |
| CN101494184A (en) * | 2008-01-21 | 2009-07-29 | 采钰科技股份有限公司 | Wafer bearing device |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104658956A (en) * | 2013-11-18 | 2015-05-27 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Support structure for wafer transfer system |
| CN107658258A (en) * | 2016-07-25 | 2018-02-02 | 上海新昇半导体科技有限公司 | A kind of wafer holder picks and places sheet devices |
| CN107658258B (en) * | 2016-07-25 | 2019-08-30 | 上海新昇半导体科技有限公司 | A kind of pick-and-place sheet devices of wafer holder |
| CN109256331A (en) * | 2018-09-21 | 2019-01-22 | 吉林华微电子股份有限公司 | A kind of method that ultra-thin chip back metal sputters and ultra-thin IGBT product |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102593029B (en) | 2015-05-06 |
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Free format text: FORMER OWNER: WUXI HUARUN SHANGHUA TECHNOLOGY CO., LTD. Effective date: 20140411 Owner name: WUXI HUARUN SHANGHUA TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: WUXI CSMC SEMICONDUCTOR CO., LTD. Effective date: 20140411 |
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Effective date of registration: 20140411 Address after: 214028 Xinzhou Road, Wuxi national hi tech Industrial Development Zone, Jiangsu, China, No. 8 Applicant after: Wuxi Huarun Shanghua Technology Co., Ltd. Address before: 214028 Wuxi provincial high tech Industrial Development Zone, Hanjiang Road, No. 5, Jiangsu, China Applicant before: Wuxi CSMC Semiconductor Co., Ltd. Applicant before: Wuxi Huarun Shanghua Technology Co., Ltd. |
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