CN203445104U - Wafer support - Google Patents
Wafer support Download PDFInfo
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- CN203445104U CN203445104U CN201320557970.2U CN201320557970U CN203445104U CN 203445104 U CN203445104 U CN 203445104U CN 201320557970 U CN201320557970 U CN 201320557970U CN 203445104 U CN203445104 U CN 203445104U
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- wafer
- wafer support
- side wall
- front side
- brilliant boat
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Abstract
The utility model discloses a wafer support which is used for placing a wafer in coordination with a wafer boat and a transport box. The wafer boat is provided with multiple inserting grooves. The wafer support comprises a front side wall and a rear side wall. Multiple separating plates, which are protruded and parallel arranged, are arranged between the front side wall and the rear side wall. Multiple through grooves are formed by separation of the separating plates between the front side wall and the rear side wall. The through grooves and the inserting grooves are coplanar and corresponding in a one-to-one way. Therefore, edge parts of two sides of the wafer is contacted with the wafer boat, and the wafer is also supported by the wafer support from the bottom part and the side surfaces so that problems of fragmentation or bending of the wafer with thickness of being less than 15mil in the transport process can be reduced.
Description
Technical field
The utility model relates to integrated circuit and manufactures field, relates in particular to a kind of wafer support.
Background technology
In semiconductor integrated circuit manufacturing process, wafer current (wafer) has the transportation of two kinds and the mode of depositing according to the difference of its thickness: 1) wafer is vertically placed on brilliant boat, more brilliant boat is put into transport case (Shipping box); 2) stacked wafer is placed in box, between adjacent wafer, uses the article such as flexible smooths such as nonwoven fabrics to separate.Because the mode wafer of the first transportation and storing wafer is vertically placed on brilliant boat, wafer main part does not contact other things, can avoid producing pollution or defect.The mode of the second transportation and storing wafer is placed stacked wafer the generation that more easily causes pollution and wafer defect, and uses the running stores such as nonwoven fabrics to increase production cost.The wafer that thickness is more than or equal to 15mil adopts the mode of the first transportation and storing wafer conventionally, and the wafer that thickness is less than 15mil is used the second to transport and the mode of storing wafer conventionally.
As depicted in figs. 1 and 2, Fig. 1 and Fig. 2 are the structural representation of brilliant boat, described brilliant boat comprises front side wall 101, rear wall 102, left side wall 103 and right side wall 104, and on left side wall 103 and right side wall 104, hollow out has the number of symmetrical slot 105(slot to be generally 25), for placing wafer; Left side wall and right side wall bottom are also formed with the draw-in groove 106 of corresponding number, as shown in Figure 2.Like this, shown in Fig. 3, the wafer 100 of placing is within it supported by slot 105 and draw-in groove 106.Because wafer 100 is vertically placed on brilliant boat, the marginal portion of the both sides that wafer 100 and brilliant boat contact point are wafer, in the situation that wafer thickness is excessively thin, easily in transportation, produce that wafer breaks or crooked problem, the mode of therefore existing the first transportation and storing wafer not suitable thicknesses is less than the wafer of 15mil.
Utility model content
The utility model provides a kind of wafer support, is less than in the situation of 15mil, uses existing transport case and brilliant boat in transportation, easily to produce that wafer breaks or crooked problem to solve wafer thickness.
For addressing the above problem, the utility model provides a kind of wafer support, for supporting the use placement wafer with brilliant boat and transport case, described brilliant boat is provided with a plurality of slots, described wafer support comprises bottom surface, front side wall and rear wall, and both sides, described bottom surface have bar shaped connecting rod that described front side wall is connected with rear wall, is provided with a plurality of parallel dividing plates on described connecting rod, described dividing plate is separated out a plurality of grooves between front side wall and rear wall, and described groove is coplanar with described slot and corresponding one by one.
Optionally, described dividing plate is trapezoidal.
Optionally, described dividing plate only comprises trapezoidal edge part.
Optionally, the corner of described dividing plate is arranged to fillet.
Optionally, the radius of described fillet is 4.5-5.5mm.
Optionally, described front side wall both sides are provided with two vertical flanks and front side wall top is provided with a lateral flanks.
Optionally, in described lateral flanks, be provided with recess, described recess engages with transport case inwall.
Optionally, described notch width is 9-11mm.
Optionally, described rear wall height is 130-138mm, and width is 130-138mm.
Optionally, the number of described groove is 25.
Optionally, the material of described wafer support is PP plastics, PEEK resin or PFA resin.。
Compared with prior art, the wafer support that the utility model provides, support the use placement wafer with brilliant boat and transport case, wafer contacts with brilliant boat except the marginal portion of both sides like this, also be subject to wafer support from the support of bottom and side, can reduce wafer that thickness is less than 15mil chipping or crooked problem in transportation.In addition, wafer support can directly support the use with existing brilliant boat and transport case, without brilliant boat and transport case are made to transformation, convenient and practical.
Accompanying drawing explanation
Fig. 1 is the structural representation in existing brilliant boat front;
Fig. 2 is the structural representation at the existing brilliant boat back side;
Fig. 3 is that existing brilliant boat is at the schematic diagram of storing wafer;
Fig. 4 is the structural representation of the wafer support of the embodiment of the present application;
Fig. 5 is the end view of the wafer support of the embodiment of the present application;
Fig. 6 is the attached view of the wafer support of the embodiment of the present application;
Fig. 7 is the bottom view of the wafer support of the embodiment of the present application;
Fig. 8 is the front view of the wafer support of the embodiment of the present application;
Fig. 9 is the rearview of the wafer support of the embodiment of the present application;
Figure 10 is that the wafer support of the embodiment of the present application coordinates brilliant boat at the schematic diagram of storing wafer.
Embodiment
Core concept of the present utility model is, a kind of wafer support is provided, for supporting the use placement wafer with brilliant boat and transport case, described brilliant boat is provided with a plurality of slots, described wafer support comprises bottom surface, front side wall and rear wall, and both sides, described bottom surface have bar shaped connecting rod that described front side wall is connected with rear wall, is provided with a plurality of parallel dividing plates on described connecting rod, described dividing plate is separated out a plurality of grooves between front side wall and rear wall, and described groove is coplanar with described slot and corresponding one by one.Like this, when being placed in transport case, fixed by brilliant boat and wafer support wafer, wafer is also subject to the support of wafer support except be subject to the support of brilliant boat in edge part at wafer mid portion, the wafer that is less than like this 15mil can not break or crooked problem when transportation.
Below in conjunction with the drawings and specific embodiments, the wafer support the utility model proposes is described in further detail.According to the following describes and claims, advantage of the present utility model and feature will be clearer.
With reference to accompanying drawing 4 to Fig. 9, the structural representation of the wafer support that Fig. 4 is the present embodiment, Fig. 5 to Fig. 9 is respectively the end view of the wafer support of the present embodiment, attached view, bottom view, front view and rearview.Described wafer support is for supporting the use placement wafer with brilliant boat and transport case, and described brilliant boat is provided with a plurality of slots.Described wafer support comprises bottom surface 201, front side wall 202 and rear wall 203, both sides, described bottom surface have bar shaped connecting rod that described front side wall 202 is connected with rear wall 203, on described connecting rod, be provided with a plurality of parallel dividing plates 204, described dividing plate 204 is separated out a plurality of grooves 205 between front side wall 202 and rear wall 203, and described groove 205 is coplanar with described slot and corresponding one by one.Conventionally in semiconductor production, the slot of brilliant boat is 25, and the groove number being separated out by dividing plate in this enforcement is 25, and the number of dividing plate is 26.
The present embodiment, specifically for the transportation of 8 cun of wafers with deposit, is understandable that those skilled in the art can adjust to be applicable to according to common practise the wafer of other size to the size indicating in each accompanying drawing.Described dividing plate is trapezoidal, and preferably dividing plate is set to only there is trapezoidal side along part, to reduce the contact area of dividing plate and wafer, thereby avoids the damage to crystal column surface.Meanwhile, damage wafer when avoiding placing, the corner of dividing plate is arranged to fillet, and the radius of described fillet is 4.5-5.5mm, preferably elects 5mm in the present embodiment as.Distance between adjacent two dividing plates, the width of groove, is at least greater than 3 times to wafer thickness, with the described groove of smooth insertion that guarantees that wafer can be injury-free, preferably, in the present embodiment, it is identical with the width of existing brilliant boat slot (slot) that the width of groove is set to, and is 1.6mm.Near the groove spacing of front side wall 202 grooves and close rear wall 203 and existing brilliant boat, being provided with slot zone length of field identical, is 152.4mm in the present embodiment.Described length of connecting rod is 181.1mm ± 0.5mm.
With reference to Fig. 4 to 8, described front side wall 202 is highly half of wafer support height, and in front side wall 202 both sides, is provided with two vertical flanks 208; Front side wall 202 tops are provided with a lateral flanks 207, and the front side wall 101 of brilliant boat is positioned in described lateral flanks 207 and by described vertical flank 208 and fixes so in use.Preferably, be also provided with recess 206 in described lateral flanks, described recess 206 can engage with transport case inwall, guarantees that the position of wafer support placement is accurate.Concrete, for recess 206 width described in the transport case of 8 cun of wafers, be 9-11mm, in this enforcement, be preferably 10mm.
With reference to Fig. 4 to 7 and Fig. 9, described rear wall 203 is highly 130-138mm, and width is that in this example of 130-138mm, preferably rear wall 203 is highly for 135mm, and width is 135mm.Between described rear wall 203 and the close dividing plate of rear wall 203, have spacing, the rear wall 102 of brilliant boat is positioned in this spacing in use.On described rear wall 203, be also provided with foot rest 207, the overall length of wafer support can be just in time positioned in transport case, for the transport case of 8 cun of conventional at present wafers, the total length of wafer support is 231mm.In order to prevent wafer support, when placing and between transport case and brilliant boat, wear and tear and produce pollutant, the part that wafer support contacts with brilliant boat with transport case can be carried out fillet processing, and for example fillet all can be made in the angle of four angles of front side wall 202 and rear wall 203 and described lateral flanks, vertical flank, foot rest.
It is identical with the material of brilliant boat and transport case that the material of described wafer support is preferably, materials such as conventional PP plastics, PEEK resin, PFA resin.
During use, first wafer support bottom surface is put into transport case down, recess on front side wall 202 engages with transport case inwall, then wafer is put into the slot of brilliant boat, afterwards brilliant boat is positioned on described wafer support, due to the groove of wafer support and the slot of brilliant boat is coplanar and corresponding one by one, wafer 100 inserts in described groove and slot simultaneously like this, wafer contacts with brilliant boat except the marginal portion of both sides, also be subject to wafer support from the support of bottom and wafer side, as shown in figure 10, like this stressed can reduce wafer that thickness is less than 15mil chipping or crooked problem in transportation.
In sum, the utility model provides a kind of wafer support, for supporting the use placement wafer with brilliant boat and transport case, described brilliant boat is provided with a plurality of slots, described wafer support comprises bottom surface, front side wall 202 and rear wall 203, both sides, described bottom surface have bar shaped connecting rod that described front side wall 202 is connected with rear wall 203, on described connecting rod, be provided with a plurality of parallel dividing plates, described dividing plate is separated out a plurality of grooves between front side wall 202 and rear wall 203, and described groove is coplanar with described slot and corresponding one by one.Like this, wafer, except the marginal portion of both sides contacts with brilliant boat, is also subject to wafer support from the support of bottom, can reduce wafer that thickness is less than 15mil chipping or crooked problem in transportation.
Obviously, those skilled in the art can carry out various changes and modification and not depart from spirit and scope of the present utility model the utility model.Like this, if within of the present utility model these are revised and modification belongs to the scope of the utility model claim and equivalent technologies thereof, the utility model is also intended to comprise these changes and modification interior.
Claims (11)
1. a wafer support, for supporting the use placement wafer with brilliant boat and transport case, described brilliant boat is provided with a plurality of slots, it is characterized in that, described wafer support comprises bottom surface, front side wall and rear wall, and both sides, described bottom surface have bar shaped connecting rod that described front side wall is connected with rear wall, is provided with a plurality of parallel dividing plates on described connecting rod, described dividing plate is separated out a plurality of grooves between front side wall and rear wall, and described groove is coplanar with described slot and corresponding one by one.
2. wafer support as claimed in claim 1, is characterized in that, described dividing plate is trapezoidal.
3. wafer support as claimed in claim 2, is characterized in that, described dividing plate only comprises trapezoidal edge part.
4. wafer support as claimed in claim 2, is characterized in that, the corner of described dividing plate is arranged to fillet.
5. wafer support as claimed in claim 4, is characterized in that, the radius of described fillet is 4.5-5.5mm.
6. wafer support as claimed in claim 1, is characterized in that, described front side wall both sides are provided with two vertical flanks; Front side wall top is provided with a lateral flanks.
7. wafer support as claimed in claim 6, is characterized in that, in described lateral flanks, is provided with recess, and described recess engages with transport case inwall.
8. wafer support as claimed in claim 7, is characterized in that, described notch width is 9-11mm.
9. wafer support as claimed in claim 1, is characterized in that, described rear wall height is 130-138mm, and width is 130-138mm.
10. wafer support as claimed in claim 1, is characterized in that, the number of described groove is 25.
11. wafer supports as claimed in claim 1, is characterized in that, the material of described wafer support is PP plastics, PEEK resin or PFA resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320557970.2U CN203445104U (en) | 2013-09-09 | 2013-09-09 | Wafer support |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320557970.2U CN203445104U (en) | 2013-09-09 | 2013-09-09 | Wafer support |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203445104U true CN203445104U (en) | 2014-02-19 |
Family
ID=50096129
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320557970.2U Expired - Fee Related CN203445104U (en) | 2013-09-09 | 2013-09-09 | Wafer support |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203445104U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111354664A (en) * | 2018-12-20 | 2020-06-30 | 中芯集成电路（宁波）有限公司 | Wafer cassette and semiconductor device including the same |
| CN111883471A (en) * | 2020-08-24 | 2020-11-03 | 台州市老林装饰有限公司 | Wafer discharging box height adjusting type placing table seat mechanism |
| CN111892419A (en) * | 2020-08-03 | 2020-11-06 | 福赛特(唐山)新材料有限公司 | High-shock-resistance silicon carbide boat and preparation method thereof |
-
2013
- 2013-09-09 CN CN201320557970.2U patent/CN203445104U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111354664A (en) * | 2018-12-20 | 2020-06-30 | 中芯集成电路（宁波）有限公司 | Wafer cassette and semiconductor device including the same |
| CN111892419A (en) * | 2020-08-03 | 2020-11-06 | 福赛特(唐山)新材料有限公司 | High-shock-resistance silicon carbide boat and preparation method thereof |
| CN111883471A (en) * | 2020-08-24 | 2020-11-03 | 台州市老林装饰有限公司 | Wafer discharging box height adjusting type placing table seat mechanism |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140219 Termination date: 20190909 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |