CN100472766C - 铝-碳化硅质复合体 - Google Patents

铝-碳化硅质复合体 Download PDF

Info

Publication number
CN100472766C
CN100472766C CNB2005800212860A CN200580021286A CN100472766C CN 100472766 C CN100472766 C CN 100472766C CN B2005800212860 A CNB2005800212860 A CN B2005800212860A CN 200580021286 A CN200580021286 A CN 200580021286A CN 100472766 C CN100472766 C CN 100472766C
Authority
CN
China
Prior art keywords
aluminum
silicon carbide
carbide composite
heat dissipation
aluminium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB2005800212860A
Other languages
English (en)
Chinese (zh)
Other versions
CN1977378A (zh
Inventor
岩元豪
广津留秀树
平原和典
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denki Kagaku Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denki Kagaku Kogyo KK filed Critical Denki Kagaku Kogyo KK
Publication of CN1977378A publication Critical patent/CN1977378A/zh
Application granted granted Critical
Publication of CN100472766C publication Critical patent/CN100472766C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/515—Other specific metals
    • C04B41/5155—Aluminium
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/68—Shapes or dispositions thereof
    • H10W70/6875—Shapes or dispositions thereof being on a metallic substrate, e.g. insulated metal substrates [IMS]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2111/00—Mortars, concrete or artificial stone or mixtures to prepare them, characterised by specific function, property or use
    • C04B2111/00474—Uses not provided for elsewhere in C04B2111/00
    • C04B2111/00844—Uses not provided for elsewhere in C04B2111/00 for electronic applications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09018—Rigid curved substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12007—Component of composite having metal continuous phase interengaged with nonmetal continuous phase
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249955—Void-containing component partially impregnated with adjacent component
    • Y10T428/249956—Void-containing component is inorganic
    • Y10T428/249957—Inorganic impregnant
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249971—Preformed hollow element-containing
    • Y10T428/249974—Metal- or silicon-containing element
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249986—Void-containing component contains also a solid fiber or solid particle
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/24999—Inorganic
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/26—Web or sheet containing structurally defined element or component, the element or component having a specified physical dimension

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Manufacture Of Alloys Or Alloy Compounds (AREA)
  • Ceramic Products (AREA)
CNB2005800212860A 2004-09-14 2005-09-07 铝-碳化硅质复合体 Expired - Lifetime CN100472766C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP266144/2004 2004-09-14
JP2004266144 2004-09-14

Publications (2)

Publication Number Publication Date
CN1977378A CN1977378A (zh) 2007-06-06
CN100472766C true CN100472766C (zh) 2009-03-25

Family

ID=36059931

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005800212860A Expired - Lifetime CN100472766C (zh) 2004-09-14 2005-09-07 铝-碳化硅质复合体

Country Status (7)

Country Link
US (1) US7838107B2 (https=)
EP (1) EP1796164B1 (https=)
JP (1) JP4761157B2 (https=)
KR (1) KR101021450B1 (https=)
CN (1) CN100472766C (https=)
TW (1) TW200618697A (https=)
WO (1) WO2006030676A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796920A (zh) * 2014-08-06 2017-05-31 电化株式会社 散热部件及其制造方法

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB9506197D0 (en) 1995-03-27 1995-05-17 Hoffmann La Roche Inhibition of tau-tau association.
CN101427367B (zh) * 2006-04-26 2010-06-02 电气化学工业株式会社 铝-碳化硅复合体和使用该复合体的散热零件
CN101438401B (zh) * 2006-05-09 2013-08-28 电气化学工业株式会社 铝-碳化硅质复合体及其加工方法
JP2010024077A (ja) * 2008-07-17 2010-02-04 Denki Kagaku Kogyo Kk アルミニウム−炭化珪素質複合体及びその製造方法
WO2010140541A1 (ja) * 2009-06-02 2010-12-09 電気化学工業株式会社 アルミニウム－黒鉛質複合体、それを用いた放熱部品及びｌｅｄ発光部材
JP5602566B2 (ja) * 2010-09-30 2014-10-08 日本ファインセラミックス株式会社 アルミニウム−炭化珪素質複合体からなる伝熱部材
JP5662834B2 (ja) * 2011-02-22 2015-02-04 電気化学工業株式会社 アルミニウム−炭化珪素質複合体の製造方法
CN103433491B (zh) * 2013-09-18 2015-05-13 湖南航天工业总公司 一种碳化硅igbt基板骨架真空压力渗铝装置及双面覆铝方法
CN103658659A (zh) * 2013-12-05 2014-03-26 湖南航天诚远精密机械有限公司 双面覆铝铝碳化硅igbt基板的近净成形方法
WO2016002943A1 (ja) * 2014-07-04 2016-01-07 電気化学工業株式会社 放熱部品及びその製造方法
JP6839981B2 (ja) * 2014-07-24 2021-03-10 デンカ株式会社 複合体及びその製造方法
US11296008B2 (en) * 2014-07-31 2022-04-05 Denka Company Limited Aluminum-silicon carbide composite and production method therefor
JP6623173B2 (ja) * 2014-12-18 2019-12-18 デンカ株式会社 炭化珪素質複合体の製造方法
CN104617204B (zh) * 2015-01-16 2017-07-14 隆科电子(惠阳)有限公司 一种碳化硅基电路板及其制备方法
CN106145952B (zh) * 2015-03-23 2019-06-11 隆科电子(惠阳)有限公司 高绝缘碳化硅陶瓷基板与碳化硅基电路板及其制备方法
CN109309066B (zh) * 2017-07-27 2020-10-20 比亚迪股份有限公司 一种陶瓷覆铝铜板及其制备方法、散热元件和igbt模组
US20210269697A1 (en) * 2018-07-13 2021-09-02 Denka Company Limited Metal-silicon carbide-based composite material, and method for producing metal-silicon carbide-based composite material
JP2022013968A (ja) * 2018-11-14 2022-01-19 デンカ株式会社 放熱基板を収容するパッケージおよび梱包箱
JP7116689B2 (ja) * 2019-01-30 2022-08-10 デンカ株式会社 放熱部材およびその製造方法
CN112552079B (zh) * 2019-09-26 2023-09-12 航天特种材料及工艺技术研究所 一种金属化陶瓷基复合材料及曲面金属化的方法
CN115315804B (zh) * 2020-03-31 2025-12-12 电化株式会社 搭载元件的基板以及搭载元件的基板的制造方法
EP3958302A1 (de) * 2020-08-17 2022-02-23 Infineon Technologies AG Bodenplatte für ein halbleitermodul und verfahren zum herstellen einer bodenplatte
KR20230095158A (ko) 2021-12-21 2023-06-29 삼성디스플레이 주식회사 표시 장치 및 이의 제조 방법
CN114603315B (zh) * 2022-02-28 2023-03-24 江南大学 一种金属基陶瓷复合材料基板拱形表面的车削成形方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0368789B1 (en) * 1988-11-10 1994-08-17 Lanxide Technology Company, Lp. A method of thermo-forming a novel metal matrix composite body
CN1201256A (zh) * 1997-02-14 1998-12-09 日本碍子株式会社 用于半导体散热器的复合材料及其制造方法
US6447894B1 (en) * 1998-11-12 2002-09-10 Denki Kagaku Kogyo Kabushiki Kaisha Silicon carbide composite, method for producing it and heat dissipation device employing it

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5119864A (en) 1988-11-10 1992-06-09 Lanxide Technology Company, Lp Method of forming a metal matrix composite through the use of a gating means
US5465481A (en) * 1993-10-04 1995-11-14 Motorola, Inc. Method for fabricating a semiconductor package
JP3496816B2 (ja) * 1999-06-25 2004-02-16 電気化学工業株式会社 金属−セラミックス複合体とそれを用いた放熱部品
JP2001291809A (ja) 2000-04-07 2001-10-19 Denki Kagaku Kogyo Kk 放熱部品
JP2004022964A (ja) * 2002-06-19 2004-01-22 Hitachi Metals Ltd Ａｌ−ＳｉＣ系複合体およびそれを用いた放熱部品、半導体モジュール装置
JP3792180B2 (ja) * 2002-07-10 2006-07-05 電気化学工業株式会社 放熱部品の製造方法
JP3913130B2 (ja) 2002-07-16 2007-05-09 電気化学工業株式会社 アルミニウム−炭化珪素質板状複合体
US20040246682A1 (en) * 2003-06-09 2004-12-09 Sumitomo Metal (Smi) Eectronics Devices Inc. Apparatus and package for high frequency usages and their manufacturing method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0368789B1 (en) * 1988-11-10 1994-08-17 Lanxide Technology Company, Lp. A method of thermo-forming a novel metal matrix composite body
CN1201256A (zh) * 1997-02-14 1998-12-09 日本碍子株式会社 用于半导体散热器的复合材料及其制造方法
US6447894B1 (en) * 1998-11-12 2002-09-10 Denki Kagaku Kogyo Kabushiki Kaisha Silicon carbide composite, method for producing it and heat dissipation device employing it

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106796920A (zh) * 2014-08-06 2017-05-31 电化株式会社 散热部件及其制造方法
CN106796920B (zh) * 2014-08-06 2019-09-24 电化株式会社 散热部件及其制造方法

Also Published As

Publication number Publication date
WO2006030676A1 (ja) 2006-03-23
KR101021450B1 (ko) 2011-03-15
KR20070064293A (ko) 2007-06-20
CN1977378A (zh) 2007-06-06
JP4761157B2 (ja) 2011-08-31
EP1796164A4 (en) 2011-11-09
US20070248829A1 (en) 2007-10-25
EP1796164A1 (en) 2007-06-13
TW200618697A (en) 2006-06-01
TWI357788B (https=) 2012-02-01
US7838107B2 (en) 2010-11-23
JPWO2006030676A1 (ja) 2008-05-15
EP1796164B1 (en) 2020-01-01

Similar Documents

Publication Publication Date Title
CN100472766C (zh) 铝-碳化硅质复合体
EP1973157B1 (en) Aluminum/silicon carbide composite and heat dissipation device employing the same
KR101344152B1 (ko) 알루미늄-탄화규소질 복합체 및 그것을 사용한 방열 부품
EP2017886A1 (en) Aluminum-silicon carbide composite body and method for processing the same
EP3121847B1 (en) Aluminium-silicon carbide composite, and power-module base plate
CN113474885B (zh) 散热构件及其制造方法
CN106796925B (zh) 铝-碳化硅质复合体及其制造方法
JP3907620B2 (ja) セラミックス回路基板一体型アルミニウム−炭化珪素質複合体及びその製造方法
JP7050978B1 (ja) 成形体及びその製造方法
JP4864593B2 (ja) アルミニウム−炭化珪素質複合体の製造方法
JP2020123713A (ja) 放熱部材およびその製造方法
JP5662834B2 (ja) アルミニウム−炭化珪素質複合体の製造方法
JP4127379B2 (ja) アルミニウム−炭化珪素複合体の製造方法
JP2004055577A (ja) アルミニウム−炭化珪素質板状複合体
JP3732193B2 (ja) アルミニウム−炭化珪素質複合体及びその製造方法
EP4411810A1 (en) Heat dissipation member

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CX01 Expiry of patent term
CX01 Expiry of patent term

Granted publication date: 20090325