CN100463761C - Lead-free solder - Google Patents
Lead-free solder Download PDFInfo
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- CN100463761C CN100463761C CNB2005100175702A CN200510017570A CN100463761C CN 100463761 C CN100463761 C CN 100463761C CN B2005100175702 A CNB2005100175702 A CN B2005100175702A CN 200510017570 A CN200510017570 A CN 200510017570A CN 100463761 C CN100463761 C CN 100463761C
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- lead
- gallium
- silver
- tin
- copper
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Abstract
A non-lead solder (SnGaAgCuBiSb series) contains Sn (80-96 wt.%), Ga (0.1-6), Ag (0.1-5), Cu (0.1-2), Bi (0-5) and Sb (0-3). It includes 3 alloy series base on SnAgCu alloy. Its advantages are no environmental pollution, lower smelting point and high strength.
Description
Technical field
The present invention relates to welding material, particularly a kind of lead-free brazing used when being suitable for household electrical appliances, computer industry soldering.
Background technology
Present swift and violent rising along with household electrical appliances and computer requirements amount, automobile, motorcycle, drinking-water conveying, lighting etc. are also flourish, tin-lead solder HLSn63Pb, HLSn40Pb are particularly important in these industries, for pursuing brazing manufacturability and Technological Economy, user Chang Youxian selects high plumbous low tin solder for use.And plumbous bigger for human health damage, and contaminated environment, force people worldwide to forbid plumbous use.Therefore, the use lead-free brazing carries out household electrical appliances, the electronic equipment manufacturing becomes of crucial importance, Japan realized the assembling of standardization leadless electronic in 2003, the Europe mandatory requirement from July 1st, 2006 the electronics product be necessary for unleaded electronic product, the electronics and IT products that China is drafted in the state key supervision catalogue of putting on market from July 1st, 2006 can not be leaded.SAC alloy melting point height, intensity and the wetability of using is relatively poor at present, requirement from soft pricker industry, the fusing point of unleaded cored solder is low, as far as possible near 183 ℃ of the eutectic temperatures of 63/37 leypewter, the serial SnAg3.5Cu0.7 alloy of present Sn-Ag (Cu) eutectic temperature is 217 ℃, fusing point still is higher, and intensity, wetability are relatively poor, also need to improve further.
Summary of the invention
Purpose of the present invention is just at above-mentioned condition and special development a kind of harmless to human body and environment, not leaded and can make the lead-free brazing that fusing point descends, wetability is good, intensity is high.
The present invention is based on the characteristic principle of following each element and selects as the interpolation material of solder.
1, the effect of gallium Ga: Ga at high temperature can form solid solution and alloy with many metals, Ga can with Sn, Zn, Bi, etc. form a series of acolites, be used to the warning system of some low temperature control of scolder, cold welding agent, sealing agent and manufacturing, self-extinguishing and signal, gallium is free from environmental pollution, though to people, animal is not indispensable element, but a small amount of absorption of per os is also harmless to human body, and gallium is abundanter in natural quantum of output, the fusing point of gallium has only 29.8 ℃, and is very favourable to reducing alloy melting point.In this invention, the adding of gallium can make lead-free brazing reduce fusing point, raising intensity and the reliability of alloy significantly.
2, the effect of silver-colored Ag: silver can play the effect that reduces fusing point, 221 ℃ of the eutectic temperatures of silver content 3.5%, and tensile strength is also higher for this reason.
3, the effect of copper Cu: copper can play the effect that reduces fusing point, and the SnAgCu eutectic temperature is 217 ℃ during copper content 0.7% left and right sides.
4, the effect of antimony Sb: antimony can improve intensity and improve wetability.
5, the effect of bismuth Bi: bismuth can reduce fusing point, improves wetability, improves intensity.
Alloy series proportioning of the present invention is as follows:
Lead-free brazing: be the SnGaAgCuBiSb series alloy, it comprises that the feedstock production of following weight ratio forms, wherein tin 80.0～96.0%, gallium 0.1～6%, silver 0.1～5%, copper 0.1～2%, bismuth 0～5%, antimony 0～3%; This series alloy adds on the basis of tin, silver, copper alloy can reduce alloy melting point significantly, improve the element gallium of intensity and reliability, compound interpolation can improve intensity and improve the element antimony of wetability, and can reduce fusing point, improves wetability, improves the element bismuth of intensity.
Lead-free brazing of the present invention is also formed by the feedstock production of following weight ratio, wherein tin 84.0～96.0%, gallium 0.1～6%, silver 0.1～5%, copper 0.1～2%, antimony 0.1～3%; This series alloy has added and can reduce alloy melting point significantly on the basis of tin, silver, copper alloy, improves the element gallium of intensity and reliability and can improve intensity and improve the element antimony of wetability.
Lead-free brazing of the present invention is yet formed by the feedstock production of following weight ratio, wherein tin 84.0～96.0%, gallium 0.1～6%, silver 0.1～5%, copper 0.1～2%, bismuth 0.1～5%; This series alloy has added the element gallium that can reduce alloy melting point significantly, improve intensity and reliability, and has further added and can reduce alloy melting point, improve wetability, improve the element bismuth of intensity on the basis of tin, silver, copper alloy.
Lead-free brazing of the present invention is also formed by the feedstock production of following weight ratio, wherein tin 84.0～96.0%, gallium 0.1～6%, silver 0.1～5%, copper 0.1～2%, bismuth 0.1～5%, antimony 0.1～3%; This series alloy adds on the basis of tin, silver, copper alloy can reduce alloy melting point significantly, improve the element gallium of intensity and reliability, compound interpolation can improve intensity and improve the element antimony of wetability, and can reduce fusing point, improves wetability, improves the element bismuth of intensity.
The specific embodiment
Embodiment 1
The concrete weight proportion of present embodiment is: 94.3% tin, 1% gallium, 2% silver, 0.7% copper, 1% antimony, 1% bismuth are formed.
Embodiment 2
The concrete weight proportion of present embodiment is: 92.8% tin, 2% gallium, 3.5% silver, 0.7% copper, 1% antimony are formed.
Embodiment 3
The concrete weight proportion of present embodiment is: 92.3% tin, 1.5% gallium, 2.5% silver, 0.7% copper, 3% bismuth are formed.
Claims (4)
1. lead-free brazing, it is characterized in that: the SnGaAgCuBiSb series alloy mainly comprises the raw material of following four kinds of weight ratios, wherein: tin 80.0～96.0%, gallium 1～6%, silver 0.1～5%, copper 0.1～2%, and at least a in the raw material bismuth 0.1～5% of following two kinds of weight ratios and the antimony 0.1～3%.
2. lead-free brazing according to claim 1 is characterized in that: the SnGaAgCuSb series alloy is that the feedstock production by the following weight ratio forms, wherein tin 84.0～96.0%, gallium 1～6%, silver 0.1～5%, copper 0.1～2%, antimony 0.1～3%.
3. lead-free brazing according to claim 1 is characterized in that: the SnGaAgCuBi series alloy is that the feedstock production by the following weight ratio forms, wherein tin 84.0～96.0%, gallium 1～6%, silver 0.1～5%, copper 0.1～2%, bismuth 0.1～5%.
4. lead-free brazing according to claim 1, it is characterized in that: the SnGaAgCuBi series alloy is that the feedstock production by the following weight ratio forms, wherein tin 84.0～96.0%, gallium 1～6%, silver 0.1～5%, copper 0.1～2%, bismuth 0.1～5%, antimony 0.1～3%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100175702A CN100463761C (en) | 2005-05-13 | 2005-05-13 | Lead-free solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100175702A CN100463761C (en) | 2005-05-13 | 2005-05-13 | Lead-free solder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1695876A CN1695876A (en) | 2005-11-16 |
| CN100463761C true CN100463761C (en) | 2009-02-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100175702A Expired - Fee Related CN100463761C (en) | 2005-05-13 | 2005-05-13 | Lead-free solder |
Country Status (1)
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| CN (1) | CN100463761C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528314A (en) * | 2010-12-31 | 2012-07-04 | 北京有色金属与稀土应用研究所 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101879668B (en) * | 2010-06-01 | 2012-05-30 | 贵研铂业股份有限公司 | Gallium brazing solder and application thereof |
| CN102969641A (en) * | 2012-11-26 | 2013-03-13 | 大连通发新材料开发有限公司 | Connecting method for cable joint of electric copper-clad aluminum conductor welding machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09327790A (en) * | 1996-06-12 | 1997-12-22 | Uchihashi Estec Co Ltd | Lead-free solder alloy |
| CN1252842A (en) * | 1997-04-22 | 2000-05-10 | 伊科索尔德国际股份有限公司 | Lead-free solder |
| CN1445048A (en) * | 2002-03-20 | 2003-10-01 | 田村化研株式会社 | Solder without lead and paste solder composite |
| CN1475327A (en) * | 2003-06-28 | 2004-02-18 | 亚通电子有限公司 | Antioxidation leadless welding material |
-
2005
- 2005-05-13 CN CNB2005100175702A patent/CN100463761C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09327790A (en) * | 1996-06-12 | 1997-12-22 | Uchihashi Estec Co Ltd | Lead-free solder alloy |
| CN1252842A (en) * | 1997-04-22 | 2000-05-10 | 伊科索尔德国际股份有限公司 | Lead-free solder |
| CN1445048A (en) * | 2002-03-20 | 2003-10-01 | 田村化研株式会社 | Solder without lead and paste solder composite |
| CN1475327A (en) * | 2003-06-28 | 2004-02-18 | 亚通电子有限公司 | Antioxidation leadless welding material |
Non-Patent Citations (6)
| Title |
|---|
| Sn-Ag-Sb+M系无铅焊料的基本性能研究. 吴安如，戴晓元.湖南工程学院学报，第14卷第3期. 2004 |
| Sn-Ag-Sb+M系无铅焊料的基本性能研究. 吴安如，戴晓元.湖南工程学院学报，第14卷第3期. 2004 * |
| 微电子互连锡基无铅焊料的发展. 刘静，张富文.稀有金属快报，第24卷第4期. 2005 |
| 微电子互连锡基无铅焊料的发展. 刘静，张富文.稀有金属快报，第24卷第4期. 2005 * |
| 无铅焊料在清华大学的研究与发展. 马莒生，陈国海.电子元件与材料，第23卷第11期. 2004 |
| 无铅焊料在清华大学的研究与发展. 马莒生，陈国海.电子元件与材料，第23卷第11期. 2004 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102528314A (en) * | 2010-12-31 | 2012-07-04 | 北京有色金属与稀土应用研究所 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
| CN102528314B (en) * | 2010-12-31 | 2014-08-06 | 北京有色金属与稀土应用研究所 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1695876A (en) | 2005-11-16 |
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Granted publication date: 20090225 Termination date: 20120513 |