CN102528314B - Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof - Google Patents
Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof Download PDFInfo
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- CN102528314B CN102528314B CN201010623783.0A CN201010623783A CN102528314B CN 102528314 B CN102528314 B CN 102528314B CN 201010623783 A CN201010623783 A CN 201010623783A CN 102528314 B CN102528314 B CN 102528314B
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- 229910000990 Ni alloy Inorganic materials 0.000 title claims abstract description 42
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 title claims abstract description 24
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 21
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title claims abstract description 16
- 239000004332 silver Substances 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 title abstract description 6
- 229910001316 Ag alloy Inorganic materials 0.000 title abstract 5
- 229910001245 Sb alloy Inorganic materials 0.000 title abstract 5
- 229910001128 Sn alloy Inorganic materials 0.000 title abstract 5
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 33
- 239000000956 alloy Substances 0.000 claims abstract description 33
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- 238000005096 rolling process Methods 0.000 claims abstract description 24
- 229910052787 antimony Inorganic materials 0.000 claims abstract description 19
- 238000000137 annealing Methods 0.000 claims abstract description 17
- 239000000463 material Substances 0.000 claims abstract description 17
- 239000000047 product Substances 0.000 claims abstract description 15
- 229910052718 tin Inorganic materials 0.000 claims abstract description 15
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000010439 graphite Substances 0.000 claims abstract description 14
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 14
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 13
- 238000005266 casting Methods 0.000 claims abstract description 12
- 239000011265 semifinished product Substances 0.000 claims abstract description 12
- 229910052709 silver Inorganic materials 0.000 claims abstract description 10
- 238000003756 stirring Methods 0.000 claims abstract description 7
- 238000005097 cold rolling Methods 0.000 claims abstract description 4
- 238000010438 heat treatment Methods 0.000 claims abstract description 4
- 238000005098 hot rolling Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 18
- 238000005219 brazing Methods 0.000 claims description 13
- 238000009966 trimming Methods 0.000 claims description 10
- 238000003801 milling Methods 0.000 claims description 6
- 238000010792 warming Methods 0.000 claims description 6
- 238000007689 inspection Methods 0.000 claims description 5
- 239000002994 raw material Substances 0.000 claims description 5
- 239000003350 kerosene Substances 0.000 claims description 3
- 230000014759 maintenance of location Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 10
- 229910052751 metal Inorganic materials 0.000 abstract description 10
- 238000004806 packaging method and process Methods 0.000 abstract description 9
- 238000007599 discharging Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 abstract 3
- 239000002893 slag Substances 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 12
- 239000010931 gold Substances 0.000 description 10
- 239000000203 mixture Substances 0.000 description 10
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 8
- 229910052737 gold Inorganic materials 0.000 description 8
- 238000003860 storage Methods 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- 229910007637 SnAg Inorganic materials 0.000 description 5
- 239000012535 impurity Substances 0.000 description 4
- 229910006414 SnNi Inorganic materials 0.000 description 3
- 229910000905 alloy phase Inorganic materials 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000003723 Smelting Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910002059 quaternary alloy Inorganic materials 0.000 description 2
- 238000005070 sampling Methods 0.000 description 2
- 229910017937 Ag-Ni Inorganic materials 0.000 description 1
- 229910017984 Ag—Ni Inorganic materials 0.000 description 1
- 241000607479 Yersinia pestis Species 0.000 description 1
- MBLUWALPEKUVHJ-UHFFFAOYSA-N [Se].[C] Chemical compound [Se].[C] MBLUWALPEKUVHJ-UHFFFAOYSA-N 0.000 description 1
- 238000005275 alloying Methods 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000005088 metallography Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910021652 non-ferrous alloy Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Abstract
Tin, antimony, silver and nickel alloy consists of components including, by mass percent, from 8 to 11% of antimony, from 3 to 20% of silver, from 1 to 2.5% of nickel and the balance tin. Tin, antimony, silver and nickel alloy foil-shaped solder is used for hermetical packaging welding materials of integrated circuits. A preparation method of the tin, antimony, silver and nickel alloy foil-shaped solder includes selecting high-purity tin, antimony, silver and nickel, calculating required quantities according to the proportion ranges, and preparing the materials; respectively preparing intermediate alloy SnAg50 and SnNi10; crushing an obtained SNAg50 intermediate alloy plate and an obtained SnNi10 intermediate alloy plate by a rolling mill for standby application; placing a tin ingot in a crucible, heating the crucible to reach the temperature ranging from 400 DEG C to 450 DEG C, adding the intermediate alloy SnAg50 and SnNi10 and metal antimony into the crucible, sufficiently stirring the intermediate alloy SnAg50 and SnNi10 and the metal antimony by the aid of a graphite rod after the intermediate alloy SnAg50 and SnNi10 and the metal antimony are completely melted, and discharging slag; immediately casting after the intermediate alloy SnAg50 and SnNi10 and the metal antimony are uniformly stirred by the aid of the graphite bar at the temperature of 450 DEG C, and obtaining a casting ingot; breaking and rolling the obtained ingot, realizing repeated hot rolling for the ingot until the size of the ingot is changed from 30mm to 6mm, then realizing repeated cold rolling for the ingot until the size of the ingot is changed to 0.8mm, cutting edges of the ingot, cutting off edge cracks of the ingot; annealing and obtaining a semi-finished product belt; and continuing fine rolling, rolling the semi-finished product belt until the size of the semi-finished product belt is changed from 0.8mm to 0.12mm or 0.10mm, obtaining a finished product, and cutting edges of the finished product. Performances of the tin, antimony, silver and nickel alloy are comparable to those of AuSn20 alloy, and are greatly superior to those of SnAgCu3-0.5 and SnAu10.
Description
Technical field
The present invention relates to a kind of Sn-Sb-Ag-Ni alloy state foil-shaped brazing material and preparation method thereof, belong to non-ferrous alloy scolder field,, be mainly used in the air-tight packaging of highly reliable integrated circuit.
Background technology
Air-tight packaging scolder is to ensure the highly reliable critical material of integrated circuit, not only requires scolder to have good performance of technical process and welding performance, and especially, after 175 DEG C/96h high temperature storage, the leakage rate of integrated circuit is less than 1 × 10
-7-5 × 10
-8atmospheric pressure centimetre
3/ second, the reliability of guarantee integrated circuit like this.
Consult existing patent documentation, the most close with the present invention is gold-ashbury metal for highly reliable integrated circuit air-tight packaging scolder, and its chemical composition (mass percent) is Au, 80%; All the other are Sn and impurity, and the trade mark is AuSn20, and gold-ashbury metal has good encapsulation performance, are the generic encapsulation scolders of external highly reliable integrated circuit, become a useful person but be difficult for processing, do not introduce its processing technology abroad.More noticeable is that gold-ashbury metal contains 80% gold, expensive, and 1,000,000 integrated circuits of every encapsulation need gold 40-43 kilogram.Although gold-ashbury metal is expensive, because it has good encapsulation performance, high-grade military use product both domestic and external is still being used.But in order to strive using no or little gold, doing a lot of work aspect the gold of province Jin Dynasty, within domestic 1976, develop SAC scolder (SnAgCu3-0.5) both at home and abroad, its chemical composition (percentage by weight) is: Ag, 3% later; Cu, 0.5%; All the other are Sn and impurity.Few golden Sillim's scolder (SnAu10), its chemical composition (percentage by weight) is Au, 10%; All the other are Sn and impurity.A large amount of production practices show, these two kinds of alloys are not desirable air-tight packaging scolders.At high temperature storage aspect of performance, in non-oxidizability and circuit presentation quality, all do not replace gold-ashbury metal.Because the high temperature storage limiting temperature of these two kinds of alloys is 150 DEG C, both do not reached the requirement of 175 DEG C of high temperature screening temperature, do not reach TEXAS instrument company of U.S. storage temperature (60～160 DEG C) scope, therefore can only use on general dual-use product yet.Crucial military use product is still being used AuSn20 alloy.
Summary of the invention
The object of this invention is to provide a kind of tin-antimony-Yin-nickel alloy, make a kind of tin-antimony-Yin-nickel alloy state foil-shaped brazing material with it, use this solder encapsulated integrated circuit on encapsulation performance can with AuSn20 alloy phase ratio, and be greatly better than SnAgCu3-0.5 and SnAu10.
Another object of the present invention is to provide the preparation method of a kind of tin-antimony-Yin-nickel alloy state foil-shaped brazing material.
For realizing upper object, the present invention takes following design:
A kind of tin-antimony-Yin-nickel alloy, its one-tenth is grouped into and mass percent is: antimony, 8-11%%; Silver, 3-20%; Nickel, 1-2.5%; Tin, surplus.
Described tin-antimony-Yin-nickel alloy preferably becomes to be grouped into and mass percent is: Sb, 10 ± 1%; Ag, 4.5 ± 0.5%; Ni, 2 ± 0.5%; Sn: surplus.
A kind of tin-antimony-Yin-nickel alloy state foil-shaped brazing material, it is made by above-mentioned tin-antimony-Yin-nickel alloy.
A purposes for above-mentioned tin-antimony-Yin-nickel alloy state foil-shaped brazing material, it is mainly used in the air-tight packaging scolder of integrated circuit.
A preparation method for tin-antimony-Yin-nickel alloy state foil-shaped brazing material, its method step is as follows:
A) select high purity tin, antimony, silver and nickel, calculate each required weight by the ratio range of above-mentioned tin-antimony-Yin-nickel alloy, weigh and get the raw materials ready;
B) first prepare respectively intermediate alloy SnAg50 and SnNi10;
C) SnAg50 with milling train, upper step being obtained and the grating of SnNi10 intermediate alloy plate, for the batching of tin-antimony-Yin-nickel alloy state foil-shaped brazing material, stand-by; By the proportional quantity calculating, tin slab is put into graphite crucible again, be warming up to the temperature (250 ± 10 DEG C of left and right) producing behind molten bath, continue to be warming up to 400 DEG C-450 DEG C, add intermediate alloy SnAg50, SnNi10 and metallic antimony, after fusing, fully stir deslagging completely with graphite rod; Make temperature at 450 DEG C, after stirring with graphite rod, casting, obtains tin-antimony-Yin-nickel alloy scolder ingot casting immediately;
D) by the tin-antimony-Yin-nickel alloy scolder ingot split rolling method obtaining, first it is hot-rolled down to 6mm repeatedly by 30mm, is more repeatedly cold-rolled to 0.8mm, trimming, cuts away raw edges;
E) annealing, 180～200 DEG C are incubated 30 minutes, the oven door opening of annealing 10～15 minutes, the kerosene volatilization that strip surface is adhered to, obtains tin-antimony-Yin-nickel alloy state foil-shaped brazing material semi-finished product band;
F) semi-finished product band is continued to finish rolling, be rolled to trimming after 0.12mm or 0.10mm finished product by 0.8mm, inspection.
The detailed process that described tin-antimony-Yin-nickel alloy scolder ingot split rolling method is hot-rolled down to 6mm by 30mm is: tin-antimony-Yin-nickel alloy scolder ingot is put into box-annealing furnace, be incubated 1 hour hot rolling cogging at 180～200 DEG C; Temperature retention time ends, take out rapidly alloy pig, in two passages of Φ 310 mill milling, put back to box-annealing furnace and continue heating 20 minutes, take out again two passages of rapid rolling, so repeatedly, these semi-finished product tin-antimony-Yin-nickel alloy scolder plate is rolled to 6mm by 30mm, then annealing, 180～200 DEG C are incubated 30 minutes; Next cold rolling, be rolled to 0.8mm by 6mm, trimming, cuts away raw edges.
Then proceeding to down rolling process one, does not anneal in centre, and Direct Rolling, to 0.8mm, is not also annealed before finished product.
The present invention is directed to prior art defect (although gold-ashbury metal has good encapsulation performance, contain 80% gold, expensive; Though SnAgCu3-0.5, SnAu10 alloy are economized gold, cash equivalent, high temperature storage performance is bad), start with from Principles of Metallography and phasor, utilize element roles in tin such as antimony, silver, nickel, selected through series, Composition Design, invents tin-antimony-Yin-nickel quaternary alloy.This new alloy has solved the high temperature storage temperature problem of highly reliable integrated circuit air-tight packaging scolder, the performance assessment criteria of Ministry of Electronics Industry's standard laid down by the ministries or commissions of the Central Government 1 class circuit and the requirement of " seven is special " circuit are met, the integrated circuit that uses the present invention encapsulation on encapsulation performance can with AuSn20 alloy phase ratio, and be greatly better than SnAgCu3-0.5 and SnAu10 alloy.
Advantage of the present invention is:
(1) solved the high temperature storage temperature problem of highly reliable integrated circuit air-tight packaging scolder, the performance assessment criteria of Ministry of Electronics Industry's standard laid down by the ministries or commissions of the Central Government 1 class circuit and the requirement of " seven is special " circuit are met, the integrated circuit that uses the present invention encapsulation on encapsulation performance can with AuSn20 alloy phase ratio, and be greatly better than SnAgCu3-0.5 and SnAu10 alloy.
(2) the present invention as a kind of novel without gold solder being that country has saved a large amount of gold aspect integrated antenna package, have obvious economic results in society.
Detailed description of the invention
The present invention, in order to meet the requirement of highly reliable integrated circuit to air-tight packaging scolder, taking tin as base, adopts multielement alloying composition quaternary alloy, is doing following work aspect Composition Design and control:
1. raw material is selected
1. the selection of antimony content: in order to carry as much as possible heavy alloyed fusing point, heat endurance and fatigue strength, prevent the oxidation of liquid solder, avoids " tin pest " phenomenon and be conducive to processing becoming a useful person, ensure the reliability after scolder encapsulation, antimony content is chosen between 8-11% simultaneously.
2. the selection of nickel content: in order to put forward heavy alloyed heat-resisting oxidation-resistance ability, do not cause alloy to have good mobility simultaneously in the time of encapsulation, nickel content is chosen between 1-2.5%.
3. the selection of silver content: under the prerequisite of substantially determining at antimony and nickel content, considering that Ag adds in tin can improve heat-resisting oxidation-resistance ability, and silver content is chosen in 3-20%.
2. melting
1) select raw material: tin, 99.999%; Silver, 99.9%; Antimony, 99.999%; Nickel: 99.95%-99.99%;
Calculate each required weight by proportioning, weigh and get the raw materials ready;
2) smelting equipment: carbon selenium rod electric furnace, 10Kg intermediate frequency furnace, 10Kg vacuum medium frequency induction furnace,
High purity graphite crucible, high purity graphite mould or pig mold, require to adjust die size as agreed.
Before melting, need first the instrument of body of heater and use thoroughly to be cleaned out, in order to avoid impurity is brought in product.
B, crucible before use, are used low-temperature bake, until moisture is all toasted out.
C, mould, before each use, toast with electric furnace pan, or cylinder iron piece baking, spatter in order to avoid collapse when casting.
D, mould will be placed on asbestos board, in order to avoid at when casting melt leakage, flow to ground and cause to collapse and spatter.
3) smelting technology
A, first founding intermediate alloy: SnAg
50: Ag:50%; Sn: surplus;
SnNi
10: Ni:10%; Sn: surplus;
Founding SnAg
50intermediate alloy: after batching inspection is errorless, the furnace charge preparing is put into crucible → mechanical pump and be evacuated to 8 × 10
-2more than torr → and starting thyristor intermediate frequency electric source (ZG-0.01 vacuum drying oven power is in 40kw～50kw left and right) → furnace charge all after fusing, to be cast in graphite mo(u)ld, specification is not limit → after cooling 30 minutes, is come out of the stove.
Chemical analysis is done in sampling, confirms composition.With Φ 310 milling trains by SnAg
50the grating of intermediate alloy plate, for the batching of tin-antimony-Yin of the present invention-nickel alloy scolder.
Founding SnNi
10intermediate alloy: with founding SnAg
50the technique of intermediate alloy is identical.
B, founding tin-antimony-Yin-nickel alloy scolder scolder ingot
Batching: according to the nominal composition of tin-antimony-Yin-nickel alloy scolder, get its moderate position and calculate charge ratio, weigh.
Tin-antimony-Yin-nickel alloy scolder nominal composition: Sb:10 ± 1%; Ag:4.5 ± 0.5%; Ni:2 ± 0.5%; Sn: surplus (preferred version).
After batching inspection is errorless, tin slab is put into graphite crucible, be warming up to about 250 DEG C and produce behind molten baths, continue to be warming up to 400 DEG C-450 DEG C, add intermediate alloy SnAg
50, SnNi
10and metallic antimony.After fine melt, fully stir with graphite rod, after confirming that material melts completely, deslagging.Make temperature at 450 DEG C, after stirring with graphite rod, casting immediately.
Attention: will notice when casting that flow quantity size is moderate, prevents cold shut.Notice that feeding prevents darker shrinkage cavity.The demoulding, sampling chemical analysis.
When alloy cast ingot chemical composition meets standard-required and surface without large defect, in note, identify, proceed to next process.
3. split rolling method
1) equipment: Φ 310 milling trains, box-annealing furnace
2) cogging: 1. hot rolling cogging: tin-antimony-Yin-nickel alloy scolder plate is put into box-annealing furnace, 180～200 DEG C of insulations 1 hour.Temperature retention time ends, take out rapidly alloy pig, in two passages of Φ 310 mill milling, put back to box-annealing furnace and continue heating 20 minutes, take out again two passages of rapid rolling, so repeatedly, tin-antimony-Yin-nickel alloy scolder plate is rolled to 6mm by 30mm, then annealing, 180～200 DEG C are incubated 30 minutes.Next cold rolling, be rolled to 0.8mm by 6mm, trimming, cuts away raw edges.Annealing before finished product, 180～200 DEG C are incubated 30 minutes.Then the oven door opening of annealing is about 10 minutes, and the kerosene that strip surface is adhered to vapors away.
2. the ingot casting of the depanning of just casting being proceeded to next process immediately and be rolled, does not anneal in centre, and Direct Rolling is to 0.8mm.Before finished product, do not anneal.Proceed to next process.
Points for attention: pass reduction is controlled at 5～12%, keep semi-finished product straight and clean in the operation of rolling.
4. finish rolling (finished product rolling)
1) equipment: Φ 154 × 300mm bis-roller finishing mills
2) technique: semi-finished product band by ≠ be rolled to ≠ 0.12mm of 0.8mm or ≠ 0.10mm finished product.
Points for attention: pass reduction is controlled at 5～12%, keep semi-finished product straight and clean in the operation of rolling.Finished size should meet the standard-required of different-thickness specification.Reach after the specification of standard-required, make mark and proceed to next procedure.
5. trimming and inspection
1, equipment: J70150 type paper and foil cutter
2, operation
Require: based on contract specification requirement cuts out the width dish rolling of band.
1. preparation: require to be ready to as agreed cutter, note cutter and the cleaning of health around, in case leftover bits and pieces batch mixing.After trial cut, confirm that width dimensions gets final product trimming in the margin of tolerance.The whether flexible also wipe surfaces such as pre-operational check pressure roller, reel, tension force.
2. operation: cut the both sides of finish rolling band according to circle shear operational procedure, finished product rolls tightly to be put well.
3. note: trimming should be smooth, smooth, without burr, in shear history, inspector observes product surface situation at any time, and checks dimensional tolerance, finds that defective work is shut down to remove.
4. check: shear after complete discharging, inspector to surface quality and the reinspection of size situation end to end, determines that on qualified postscript, mark proceeds to next procedure again.
The chemical analysis results of following table for obtaining in one group of embodiment:
Various proportionings for tin-antimony-Yin-nickel alloy will not enumerate, all at antimony, 8-11%; Silver, 3-20%; Nickel, 1-2.5%; Tin, the tin-antimony-Yin-nickel alloy under the various proportionings in the scope of surplus all can be realized the present invention.
Claims (2)
1. a preparation method for tin-antimony-Yin-nickel alloy state foil-shaped brazing material, wherein, the one-tenth of tin-antimony-Yin-nickel alloy is grouped into and mass percent is: antimony, 8-11%; Silver, 3-20%; Nickel, 1-2.5%; Tin, surplus;
It is characterized in that method step is as follows:
A) select high purity tin, antimony, silver and nickel, calculate each required weight by the ratio range of described tin-antimony-Yin-nickel alloy, weigh and get the raw materials ready;
B) first prepare respectively intermediate alloy SnAg50 and SnNi10;
C) SnAg50 with milling train, upper step being obtained and the grating of SnNi10 intermediate alloy plate, for the batching of tin-antimony-Yin-nickel alloy state foil-shaped brazing material, stand-by; By the proportional quantity calculating, tin slab is put into graphite crucible again, be warming up to after 250 DEG C, continue to be warming up to 400 DEG C-450 DEG C, add intermediate alloy SnAg50, SnNi10 and metallic antimony, after fusing, fully stir deslagging completely with graphite rod; Make temperature at 450 DEG C, after stirring with graphite rod, casting, obtains tin-antimony-Yin-nickel alloy scolder ingot casting immediately;
D) by the tin-antimony-Yin-nickel alloy scolder ingot split rolling method obtaining, first it is hot-rolled down to 6mm by 30mm, then is cold-rolled to 0.8mm, trimming, cuts away raw edges;
E) annealing, 180～200 DEG C are incubated 30 minutes, the oven door opening of annealing 10～15 minutes, the kerosene volatilization that strip surface is adhered to, obtains tin-antimony-Yin-nickel alloy state foil-shaped brazing material semi-finished product band;
F) semi-finished product band is continued to finish rolling, be rolled to trimming after 0.12mm or 0.10mm finished product by 0.8mm, inspection.
2. the preparation method of tin-antimony-Yin-nickel alloy state foil-shaped brazing material according to claim 1, it is characterized in that: the detailed process that tin-antimony-Yin-nickel alloy scolder ingot split rolling method is hot-rolled down to 6mm by 30mm is: tin-antimony-Yin-nickel alloy scolder ingot is put into box-annealing furnace, be incubated 1 hour hot rolling cogging at 180～200 DEG C; Temperature retention time ends, and takes out rapidly alloy pig, two passages of rolling, put back to box-annealing furnace and continue heating 20 minutes, then take out two passages of rapid rolling, so repeatedly, these semi-finished product tin-antimony-Yin-nickel alloy scolder plate is rolled to 6mm by 30mm, then annealing, 180～200 DEG C are incubated 30 minutes; Next cold rolling, be rolled to 0.8mm by 6mm, trimming, cuts away raw edges.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201010623783.0A CN102528314B (en) | 2010-12-31 | 2010-12-31 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
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|---|---|---|---|
| CN201010623783.0A CN102528314B (en) | 2010-12-31 | 2010-12-31 | Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof |
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| CN102528314B true CN102528314B (en) | 2014-08-06 |
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| CN104002058B (en) * | 2013-02-25 | 2017-04-05 | 北京有色金属与稀土应用研究所 | A kind of Sn Zn Ag Ni alloy lead-free solders and preparation method thereof |
| CN104722963A (en) * | 2013-12-18 | 2015-06-24 | 上海大华新型钎焊材料厂（普通合伙） | Preparation method of silver-copper-phosphorus solder soldering lug |
| JP6516013B2 (en) * | 2015-09-17 | 2019-05-22 | 富士電機株式会社 | Solder material for semiconductor devices |
| CN106624434A (en) * | 2016-11-30 | 2017-05-10 | 安徽华众焊业有限公司 | Tin antimony solder alloy |
| CN106825983B (en) * | 2017-03-10 | 2020-05-05 | 南京达迈科技实业有限公司 | SnAgSbNi series lead-free soldering tin alloy and preparation method and application thereof |
| CN108941973A (en) * | 2018-08-15 | 2018-12-07 | 深圳市荟艺珠宝实业有限公司 | A kind of gold solder and its preparation method and application |
| CN109750239B (en) * | 2019-03-14 | 2020-10-30 | 无锡市东杨新材料股份有限公司 | Preparation process of 0.01-0.05 mm ultrathin N6 pure nickel foil |
| CN113385851B (en) * | 2021-05-28 | 2022-11-11 | 中国科学院上海硅酸盐研究所苏州研究院 | High-temperature-resistant corrosion-resistant solder for silicon carbide ceramic connection and preparation method and application thereof |
| CN113514311A (en) * | 2021-06-01 | 2021-10-19 | 先导薄膜材料有限公司 | Display method of pure tin metallographic phase |
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| CN85100866A (en) * | 1985-04-01 | 1986-01-10 | 国营八七八厂 | Hermetic packaging method for integrated circuit |
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