CN100463293C - Electronic device and its module of circuit signal connection end - Google Patents
Electronic device and its module of circuit signal connection end Download PDFInfo
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- CN100463293C CN100463293C CNB2007101643802A CN200710164380A CN100463293C CN 100463293 C CN100463293 C CN 100463293C CN B2007101643802 A CNB2007101643802 A CN B2007101643802A CN 200710164380 A CN200710164380 A CN 200710164380A CN 100463293 C CN100463293 C CN 100463293C
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Abstract
The present invention discloses the circuit signal connecting-terminal module of an electronic device. The circuit signal connecting-terminal module includes a plurality of signal lines connected with the circuit signal. The circuit device includes a first conductive terminal composed of a plurality of conductive loops and each first conductive terminal is provided with a first conductive bump and a second conductive bump. Each signal line is provided with a first signal terminal and each first signal terminal is further provided with a first conductive gasket and a second conductive gasket. Wherein, the first conductive bump is coupled with the first conductive gasket; the second conductive bump is connected with the first conductive bump in series and correspondingly coupled with the second conductive gasket, so that the circuit device is connected with the circuit signal connecting-terminal module signal.
Description
Technical field
The present invention relates to a kind of module of circuit signal connection end and use the electronic installation of this module; Particularly, the present invention relates to a kind of design of electronic device circuit signal connection end, help circuit signal connection end modularization and with the engaging of circuit arrangement.
Background technology
Along with market to the increasing day by day of flat display apparatus resolution requirement, the signal line of flat display apparatus circuit signal connection end its that density is set is also more and more closeer.Especially in flat display apparatus COG (Chip onGlass) technology, the circuit arrangement that is used for drive signal is directly deciding in circuit signal connection end conductive projection (Bump) by the conducting resinl as anisotropic conductive (to call ACF glue in the following text) etc.Yet more and more littler along with the signal line spacing, the bonding capacity of ACF glue and the bonding accurcy of board differ and reach the requirement of lateral isolation surely in this narrow and small spacings, also remote-effects engaging between conductive projection and signal line.
Fig. 1 a and Fig. 1 b are depicted as the schematic diagram that circuit arrangement and flat display apparatus circuit signal connection end couple.As shown in Figure 1a, circuit arrangement 40 is provided with conductive projection 41, and the circuit signal connection end of flat display apparatus then is laid with signal line 20, has conductive pad 31 formation module of circuit signal connection end 30 on the signal line 20 and couples with conductive projection 41.Shown in Fig. 1 b, conductive pad 31 on the signal line 20 has the spacing 32 that reaches the required minimum of lateral isolation to each other, yet be subject to the insulating capacity of ACF glue, the distance of spacing 32 can't endlessly be dwindled, and spacing 32 hour can influence the binder removal ability of ACF glue when pressing very much.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of electronic installation and module of circuit signal connection end thereof, horizontal spacing in the time of can increasing conductive projection and engage with signal line to be adapting to the transversely limited insulating capacity of conducting resinl, and further increases the transmission of the bonding area of circuit arrangement and signal line in order to circuit signal.
Another object of the present invention is to provide a kind of electronic installation and module of circuit signal connection end thereof, can under the situation that needn't upgrade board and bonding accurcy thereof, carry out the pressing of circuit arrangement at more fine and closely woven signal line is set on the flat display apparatus.
Another object of the present invention is to provide a kind of electronic installation and module of circuit signal connection end thereof, the design that connects a conductive projection on the script single signal line road is changed into a plurality of conductive projections are arranged on the single signal line road; So its area of each conductive projection on the single signal line road just can dwindle, and just can increase each conductive projection spacing each other between signal line under the constant situation of single line pressing area.
For achieving the above object, the invention provides a kind of module of circuit signal connection end of electronic installation, wherein, electronic installation has module of circuit signal connection end, for linking to each other with the circuit arrangement signal.Module of circuit signal connection end comprises a plurality of signal lines, and each signal line has first signal end, and circuit arrangement then has a plurality of galvanic circles, and each galvanic circle has first conducting end, for coupling with first signal end.Wherein, first signal end further comprises first conductive pad and second conductive pad, and first conductive pad is coupled to first signal end, and second conductive pad is one another in series every a gap and first conductive pad and is adjacent near first conductive pad; First conducting end then further comprises first conductive projection and second conductive projection, first conductive projection and first conductive pad couple, second conductive projection then is one another in series with first conductive projection and corresponding second conductive pad that is coupled to, and circuit arrangement is linked to each other with the module of circuit signal connection end signal.
And, for achieving the above object, the present invention also provides a kind of electronic installation, comprise: a module of circuit signal connection end, this module of circuit signal connection end comprises a plurality of signal lines, each signal line has one first signal end, and this first signal end further comprises: one first conductive pad is coupled to this first signal end; And one second conductive pad, be adjacent near this first conductive pad apart from a gap and couple, and this first conductive pad and this second conductive pad are one another in series with this first signal end; And a circuit arrangement, having a plurality of galvanic circles, each galvanic circle has one first conducting end, comprises: one first conductive projection is coupled to this first conducting end; And one second conductive projection, be one another in series with this first conductive projection and be coupled to this first conducting end, second conductive pad is corresponding couples with this first conductive pad and this respectively for this first conductive projection and this second conductive projection, and this circuit arrangement is linked to each other with this module of circuit signal connection end signal.
The present invention provides a kind of explanation of electronic device circuit signal connection end module manufacture method simultaneously.At first, form a plurality of signal lines, make each signal line have first signal end.Secondly, couple first conductive pad and second conductive pad, and second conductive pad is adjacent near first conductive pad apart from a gap in first signal end.Then, form circuit arrangement and have first conducting end, and first conducting end is coupled to first conductive pad.Wherein, coupling the first conducting end step further is contained in first conducting end and forms first conductive projection and second conductive projection, wherein first conductive projection and second conductive projection are one another in series and are coupled to first conducting end, and first conductive projection and second conductive projection make circuit arrangement link to each other with the module of circuit signal connection end signal respectively with first conductive pad and second conductive pad is corresponding couples.
Adopt electronic installation of the present invention and module of circuit signal connection end thereof, horizontal spacing in the time of can increasing conductive projection and engage with signal line to be adapting to the transversely limited insulating capacity of conducting resinl, and further increases the transmission of the bonding area of circuit arrangement and signal line in order to circuit signal.And can under the situation that needn't upgrade board and bonding accurcy thereof,, more fine and closely woven signal line carry out the pressing of circuit arrangement at being set on the flat display apparatus.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Description of drawings
Fig. 1 a is depicted as the end view of the module of circuit signal connection end of prior art;
Fig. 1 b is depicted as the vertical view of the module of circuit signal connection end of prior art;
Fig. 2 a is depicted as the combination stereogram of electronic device circuit signal connection end module of the present invention one preferred embodiment;
Fig. 2 b is the end view of preferred embodiment shown in Fig. 2 a;
Fig. 2 c is the vertical view of preferred embodiment shown in Fig. 2 a and Fig. 2 b;
Fig. 2 d is depicted as another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Fig. 2 e is depicted as another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Fig. 3 a is the end view of another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Fig. 3 b is the vertical view of preferred embodiment shown in Fig. 3 a;
Fig. 3 c is depicted as another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Fig. 4 a is depicted as the combination stereogram of electronic device circuit signal connection end module of the present invention one preferred embodiment;
Fig. 4 b is depicted as the combination stereogram of another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Fig. 4 c is depicted as the combination stereogram of another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Figure 5 shows that when circuit arrangement 400 and module of circuit signal connection end 300 couple pressing area between conductive pad and conducting resinl and the relation table that forms impedance magnitude;
Fig. 6 a is depicted as another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Fig. 6 b is depicted as another preferred embodiment of electronic device circuit signal connection end module of the present invention;
Figure 7 shows that the single signal line road couples the execution mode of single conductive pad, with the preferred embodiment shown in Fig. 6 a and Fig. 6 b, the comparison sheet of the board that causes during to pressing restriction;
Figure 8 shows that electronic device circuit signal connection end module step of manufacturing flow chart of the present invention;
Figure 9 shows that electronic device circuit signal connection end module step of manufacturing flow chart of the present invention;
Figure 10 is an electronic device circuit signal connection end module step of manufacturing flow chart of the present invention.
Wherein, Reference numeral:
[prior art]
20: signal line 30: module of circuit signal connection end
31: conductive pad 32: spacing
40: circuit arrangement 41: conductive projection
[the present invention]
100: electronic device circuit signal connection end 200: signal line
301: gap 302: spacing
320: the second conductive pads of 310: the first conductive pads
410: 411: the first conducting end in galvanic circle
420: the first conductive projections of 412: the second conducting end
440: the three conductive projections of 430: the second conductive projections
500: 501: the first metal gaskets of metal gasket
520: internal wiring 600: conducting resinl
Embodiment
The invention provides a kind of electronic device circuit signal connection end module and manufacture method thereof, can increase the horizontal spacing of conductive projection (Bump) when engaging adapting to, and further increase of the transmission of the bonding area of circuit arrangement and signal line in order to circuit signal as anisotropic conductive (to call ACF glue in the following text) or the transversely limited insulating capacity of other conducting resinl with signal line.Electronic device circuit signal connection end module of the present invention is preferable can be under the situation that needn't upgrade board and bonding accurcy thereof, at being set on the flat display apparatus, more fine and closely woven signal line carries out the pressing of circuit arrangement, with the signal transmission quality of keeping the flat display apparatus circuit signal connection end and save production cost.
Module of circuit signal connection end of the present invention and use the electronic installation of this module is preferably the design that will connect a conductive projection on the script single signal line road and changes into a plurality of conductive projections are arranged on the single signal line road; So its area of each conductive projection on the single signal line road just can dwindle, and just can increase each conductive projection spacing each other between signal line under the constant situation of single line pressing area.Use the preferable slimming and the high-resolution flat display apparatus of comprising of electronic installation of module of circuit signal connection end of the present invention, yet in different embodiment, module of circuit signal connection end of the present invention also can be applicable to other when driving circuit device (Driver IC) when being coupled to circuit signal connection end, needs to consider the electronic installation of the lateral isolation ability of conducting resinl between each signal line.
Fig. 2 a is depicted as a preferred embodiment of electronic device circuit signal connection end module of the present invention.Shown in the preferred embodiment of Fig. 2 a, electronic installation has circuit signal connection end 100 and is laid with a plurality of signal lines 200, on those signal lines 200 and be provided with module of circuit signal connection end 300 for coupling with circuit arrangement 400.In the embodiment shown in Fig. 2 a, circuit arrangement 400 is preferably drive IC and links to each other with module of circuit signal connection end 300 signals; Simultaneously by the aforesaid relation that couples, module of circuit signal connection end 300 circuit arrangement 400 of drive IC etc. freely receives circuit external signals and information and is shown on the electronic installation.Shown in the end view of Fig. 2 b, circuit arrangement 400 is preferable to be coupled to module of circuit signal connection end 300 by the conducting resinl 600 as ACF glue etc., thereby turning circuit signal connection end module 300 links to each other its signal with circuit arrangement 400.In this preferred embodiment, each signal line 200 has first signal end 201 and secondary signal end 202.Circuit arrangement 400 has a plurality of galvanic circles 410, its comprise first conducting end 411 and second conducting end 412 respectively with first signal end 201 and secondary signal end 202 corresponding coupling, and circuit arrangement 400 is linked to each other with module of circuit signal connection end 300 signals.Yet in other different embodiment, the secondary signal end 202 and first signal end 201 also alternative are arranged on another sheet material such as the flexible circuit board.Shown in the preferred embodiment of Fig. 2 b, because first conducting end 411 and second conducting end 412 link to each other with first signal end 201 and secondary signal end 202 signals respectively, therefore, when the circuit signal that 202 receptions of secondary signal end come from the outside, circuit signal can be through circuit arrangement 400 from 201 outputs of first signal end; Simultaneously, by the control of opening to circuit arrangement 400, but the transmission of control circuit signal and it is reflected on the dot structure.
Shown in the preferred embodiment of Fig. 2 b and Fig. 2 c, first signal end 201 is provided with first conductive pad 310 and second conductive pad 320.In the embodiment shown in Fig. 2 b and Fig. 2 c, first conductive pad 310 is preferable to be coupled to 320 distances of first signal end, 201, the second conductive pads, one gap 301 and to be adjacent near first conductive pad 310 and with first signal end 201 and to couple.In this preferred embodiment, first conductive pad 310 on the same signal line 200 and second conductive pad 320 press from both sides a gap 301 each other and are provided with, preferable can be between 5 μ m to 150 μ m.Shown in the preferred embodiment of Fig. 2 b and Fig. 2 c, first conductive pad 310 and second conductive pad 320 are one another in series and link to each other with circuit arrangement 400 signals, and each first signal end 201 further comprises first bonding station 210 for forming or couple first conductive pad 310.Shown in Fig. 2 c, those first bonding station, 210 preferable same horizontal level and those first conductive pad, 310 preferable those first bonding stations 210 that are coupled to side by side of being positioned on the adjacent signals circuit 200.Shown in the preferred embodiment of Fig. 2 c, (please consult Fig. 1 b simultaneously), the set-up mode that connects a conductive pad 31 when module of circuit signal connection end 300 on by script single signal line road 200, change to and be provided with first conductive pad 310 and second conductive pad 320 on the single signal line road 200 simultaneously, under the constant situation of single line pressing area, the spacing 302 that adjacent first conductive pad 310 and adjacent second conductive pad are 320 will increase to some extent, can be further by as after explanation obtain to confirm.At this, please consult Fig. 1 b earlier, because the lateral margin of conductive pad 31 to the edge of adjacent signals circuit 20 must keep insulation, so conductive pad 31 lateral margins have a minimum spacing A that keeps insulation required to preferable between adjacent signals circuit 20 edges.Shown in Fig. 1 b, signal line 20 itself has live width C, and be coupled to conductive pad 31 on the signal line 20 preferable have one protrude in outside signal line 20 edges flange partly, its width is B.Hold, can learn that the minimum distance of 20 in adjacent signals circuit is essentially A+B; Under the design condition of the minimum distance that does not change 20 in adjacent signals circuit, the minimum distance of 200 in adjacent signals circuit is similarly A+B in Fig. 2 c illustrated embodiment as can be known.
Owing to have the required minimum pressing area of smooth turning circuit signal between conductive pad on the single signal line road and conducting resinl, for example work as the pressing area and reach 700 μ m
2The time, impedance can meet 5 ohm requirement, thus on the single signal line road, be divided into the requirement that two first conductive pad 310 and second conductive pad, 320 its area summations must reach minimum pressing area, in order to the conducting of circuit signal.Therefore, shown in the preferred embodiment of Fig. 2 c, the area that is provided with of first conductive pad 310 and second conductive pad 320 all is half of conductive pad 31, with second conductive pad 320 is example, the width that can know second conductive pad 320 by inference is B+C/2, and its width of flange part that second conductive pad 320 protrudes in outside signal line 200 edges is 1/2[(B+C/2)-C].
Shown in Fig. 2 c, the spacing 302 of adjacent two second conductive pads 320 for the distance (A+B) of 200 in adjacent signals circuit deduct adjacent both sides second conductive pad 320 protrude in outside signal line 200 edges apart from 1/2[(B+C/2)-C], therefore through (A+B)-2{1/2[(B+C/2)-C] } the tentative calculation process, can draw spacing 302 and change to A+C/2 in fact.Therefore, shown in the preferred embodiment of Fig. 2 c, the distance (being spacing 302) of 320 required maintenance insulation of 310 of those first conductive pads and those second conductive pads will increase to A+C/2 by original spacing A, thereby in transversely spacings that increased C/2 of first horizontal level 210 more, and make between conductive pad and signal line, and well-to-do insulation distance and circuit arrangement 400 pressings are arranged between the adjacent conductive pad.In addition, because first conducting end 411 of circuit arrangement 400 couples with signal line 200 by first conductive pad 310 and second conductive pad 320 simultaneously, therefore will help conducting and the transmission of circuit signal in circuit signal connection end.
Shown in the preferred embodiment of Fig. 2 d, first conductive pad 310 and second conductive pad 320 also can borrow its lateral margin position and signal line 200 to couple, and first conductive pad 310 on the same signal line 200 and second conductive pad 320 preferable each other about the staggered both sides that are divided into signal line 200, to adapt to different boards and bonding accurcy thereof.Yet in the scope that allow in circuit signal connection end pressing zone, those first conductive pads on the adjacent signals circuit 200 are staggered front to back setting 310 preferable also comprising each other, and those second conductive pads 320 on the adjacent signals circuit 200 are staggered front to back setting each other, and conductive pad to the distance between signal line is more increased.In addition, in other different embodiment, conductive pad is designed to longilineal necessity, also longilineal conductive pad can be cut into first conductive pad 310 and second conductive pad 320, shown in Fig. 2 e as if having according to different demands.In this preferred embodiment, first conductive pad 310 and second conductive pad 320 couple with signal line 200 apart from a gap 301 each other, and those second conductive pads 320 on the adjacent signals circuit 200 are staggered front to back setting each other with those first conductive pads 310 on the adjacent signals circuit 200, so, can avoid longilineal conductive pad and conductive projection that the problem that binder removal is bad and conductive pad ruptures takes place easily.
Fig. 3 a is depicted as another preferred embodiment of electronic device circuit signal connection end module of the present invention.Shown in Fig. 3 a, under the consideration that increases circuit signal conduction and horizontal spacing, module of circuit signal connection end 300 preferable the 3rd conductive pad 330 and first conductive pad 310 and second conductive pad, 320 each first signal end 201 that are arranged at co-linear with one another of comprising in addition.Shown in Fig. 3 a and Fig. 3 b, those the 3rd conductive pad 330 those first signal ends 201 that are coupled to side by side parallel to each other that the 3rd conductive pad 330 is preferable and adjacent.Yet in other different embodiment, the 3rd conductive pad is respectively coupled to those first signal ends 201 330 preferable also comprising with those adjacent the 3rd conductive pad 330 arrangements interlaced with each other.In the embodiment shown in Fig. 3 a and Fig. 3 b, the 3rd conductive pad 310 preferable distances one gap 301 is adjacent near second conductive pad 320 and couples with first signal end 201.Shown in the preferred embodiment of Fig. 3 a and Fig. 3 b, the 3rd conductive pad 330 is one another in series with first conductive pad 310 and second conductive pad 320 and links to each other with circuit arrangement 400 signals, and those the 3rd conductive pad 330 preferable being arranged side by side.
Shown in the preferred embodiment of Fig. 3 b, (please consult Fig. 1 b simultaneously), the set-up mode that connects a conductive pad 31 when module of circuit signal connection end 300 on by script single signal line road 200, change to and be provided with first conductive pad 310, second conductive pad 320 and the 3rd conductive pad 330 on the single signal line road 200 simultaneously, under the constant situation of single line pressing area, spacing 302 between aforementioned conductive pad will increase to some extent, can be further by as after explanation obtain to confirm.At this, equally please consult Fig. 1 b earlier, as previously mentioned, the minimum distance of 20 in adjacent signals circuit is essentially A+B as can be known; Under the design condition of the minimum distance that does not change 20 in adjacent signals circuit, the minimum distance of 200 in adjacent signals circuit is A+B in Fig. 3 b illustrated embodiment as can be known.
Owing to have the required minimum pressing area of smooth turning circuit signal between conductive pad on the single signal line road and conducting resinl, so on the single signal line road, be divided into the requirement that first conductive pad 310, second conductive pad 320 and the 3rd conductive pad 330 its area summations of three must reach minimum pressing area, in order to the conducting of circuit signal.Therefore, shown in the preferred embodiment of Fig. 3 b, the area that is provided with of first conductive pad 310, second conductive pad 320 and the 3rd conductive pad 330 all is 1/3rd of a conductive pad 31, with second conductive pad 320 is example, the width that can know second conductive pad 320 by inference is (2B+C)/3, and its width of flange part that second conductive pad 320 protrudes in outside signal line 200 edges is 1/2[(2B/3+C/3)-C].
Shown in Fig. 3 b, the spacing 302 of adjacent two second conductive pads 320 for the distance (A+B) of 200 in adjacent signals circuit deduct adjacent both sides second conductive pad 320 protrude in outside signal line 200 edges apart from 1/2[(2B/3+C/3)-C], therefore through (A+B)-2{1/2[(2B/3+C/3)-C] } the tentative calculation process, can draw spacing 302 and be A+B/3+2C/3.Therefore, shown in the preferred embodiment of Fig. 3 b, the distance (being spacing 302) of 320 required maintenance insulation of 310 of those first conductive pads and those second conductive pads will increase to A+B/3+2C/3 by original spacing A, thereby in the horizontal spacings that increased B/3+2C/3 more, and make between conductive pad and signal line, and well-to-do insulation distance and circuit arrangement 400 pressings are arranged between the adjacent conductive pad.In addition, because first conducting end 411 of circuit arrangement 400 borrows first conductive pad 310, second conductive pad 320 and the 3rd conductive pad 330 to couple with signal line 200 simultaneously, therefore will help conducting and the transmission of circuit signal in circuit signal connection end.Shown in the preferred embodiment of Fig. 3 c, first conductive pad 310, second conductive pad 320 and the 3rd conductive pad 330 also can borrow its lateral margin position and signal line 200 to couple, and preferable staggered 200 the both sides of being divided into about each other of first conductive pad 310 on the same signal line 200, second conductive pad 320 and the 3rd conductive pad 330 are to adapt to different boards and bonding accurcy thereof.
Fig. 4 a to Fig. 4 c is depicted as the preferred embodiment of the circuit arrangement 400 that is coupled to electronic device circuit signal connection end module.Shown in Fig. 4 a, first conducting end, 411 preferable first conductive projection 420 and second conductive projections 430 of being provided with of circuit arrangement 400.First conductive projection 420 is coupled to first conducting end 411, and second conductive projection 430 and first conductive projection 420 are one another in series and are coupled to first conducting end 411, and respectively with first conductive pad 310 and second conductive pad, 320 corresponding coupling, circuit arrangement 400 is linked to each other with module of circuit signal connection end 300 signals.Shown in the preferred embodiment of Fig. 4 a, first conducting end 411 of circuit arrangement 400 further comprises metal gasket 500, the first conductive projections 420 and second conductive projection, 430 co-linear with one another coupling form on the metal gasket 500.Yet in other different embodiment, shown in Fig. 4 b, first conducting end, 411 preferable first metal gasket 501 and second metal gaskets 502 of also comprising, wherein first metal gasket 501 and second metal gasket 502 borrow the outside line 510 that is arranged at first conducting end, 411 top layers to be coupled to each other, and first conductive projection 420 and 430 of second conductive projections are formed separately on first metal gasket 501 and second metal gasket 502.In addition, shown in the preferred embodiment of Fig. 4 c, first metal gasket 501 is preferable to couple by the internal wiring 520 and second metal gasket 502 that is arranged at first conducting end, 411 internal layers, thereby circuit arrangement 400 can link to each other with circuit signal link block 300 signals by first conductive projection 420 and second conductive projection 430.
Figure 5 shows that when circuit arrangement 400 and module of circuit signal connection end 300 couple pressing area between conductive pad and conducting resinl and the relation table that forms impedance magnitude.Shown in the relation table of Fig. 5, gauge outfit laterally be pressing area (μ m between conductive pad and conducting resinl
2), vertically then for forming the size of resistance value (ohm).By the relation table of Fig. 5 as can be known, when the pressing area reaches about 650 μ m
2, the big young pathbreaker of resistance value is between 4.8 ohm to 6.2 ohm, and its mean value is 5.34 ohm; When the pressing area reaches to 700 μ m
2, then resistance value all can be less than circuit signal 5 ohm of the impedances of conducting smoothly, and its mean value is 3 ohm.Relation table by earlier figures 5 couples on the single signal line road under the situation of single conductive pad as can be known, and thin pin must be at 700 μ m apart from the minimum pressing area of conducting resinl
2Below just can meet the requirement of 5 ohm of impedances, so the conductive projection after the cutting and during the conducting resinl pressing, the summation of its pressing area also must reach the requirement of aforementioned pressing area at least.Therefore, meeting before this under the summary spare, electronic device circuit signal connection end module of the present invention can further have following design and configuration mode, and will further specify as after.
Fig. 6 a and Fig. 6 b are depicted as a preferred embodiment of electronic device circuit signal link block of the present invention and circuit arrangement pressing.Be depicted as first conducting end 411 of circuit arrangement 400 as Fig. 6 a, it is provided with staggered first conductive projection 420 of each interval and second conductive projection 430; Then the module of circuit signal connection end 300 that is coupled on first signal end 201 shown in Fig. 6 b, have first conductive pad 310 and 320 arrangements interlaced with each other of second conductive pad, supply first conductive projection 420 and the 430 corresponding pressings of second conductive projection with first conducting end 411.At this, the table one of please further consulting Fig. 7 and being illustrated, it couples the execution mode of single conductive pad for the single signal line road, with the preferred embodiment shown in Fig. 6 a and Fig. 6 b, the comparison sheet of the board that causes during to pressing restriction.The board restriction of this place speech, refer to board when pressing circuit arrangement and module of circuit signal connection end, reach minimum lateral insulation distance (being directions X nargin) and allowable deviation value (being precision) between conductive pad and signal line between the adjacent conductive pad of required consideration.Shown in the table one of Fig. 7, when the distance of 200 of signal lines is 19 μ m, the set-up mode that conductive pad and conductive projection is divided into two as Fig. 6 a and Fig. 6 b, can increase the directions X nargin of board when pressing circuit arrangement 400 and module of circuit signal connection end 300,200 have the about 3000 μ m of a signal conduction area between this moment first conductive pad 310 and second conductive pad 320 and signal line
2Similarly, as shown in Table 1, when the distance of 200 of signal lines is reduced to 17 μ m, this kind can carry out the pressing of circuit arrangement at more fine and closely woven signal line is set on the flat display apparatus with the set-up mode that conductive pad and conductive projection are divided into two under the situation that needn't upgrade board and bonding accurcy thereof.Further be reduced to 15 μ m as for distance, then as shown in Table 1, will mean that the precision that can continue to use old board carries out the production of high-resolution flat display apparatus, with effective reduction production cost when 200 of signal lines.
Shown in the preferred embodiment of Fig. 6 a and Fig. 6 b, those first conductive pads 310 and those second conductive pads 320 on the adjacent signals circuit 200 are staggered front to back setting each other, and those first conductive projections 420 and those second conductive projections 430 corresponds to each other with those first conductive pads 310 and those second conductive pads 320 and couple.Yet in other different embodiment, those first conductive pads 310 on the adjacent signals circuit 200 also can be positioned at same horizontal level, and those first conductive projections 420 couple side by side with those first conductive pads 310.Shown in Fig. 6 a and Fig. 6 b, first conductive pad 310 on the same signal line 200 and second conductive pad 320 press from both sides a gap 301 each other and are provided with, and the width in gap 301 is according to different design and pressing area, and is preferable between 5 μ m to 150 μ m.
And in other preferred embodiment, those second conductive pads 320 on the adjacent signals circuit 200 also comprise with adjacent signals circuit 200 on those first conductive pads 310 be staggered front to back setting each other, and those second conductive projections 430 and those first conductive projections 420 corresponds to each other with those second conductive pads 320 and those first conductive pads 310 and couples (seeing also Fig. 2 d).In addition, under the consideration that increases horizontal spacing and circuit signal conduction, module of circuit signal connection end 300 preferable the 3rd conductive pad 330 and first conductive pad 310 and second conductive pad, 320 each first signal end 201 that are arranged at co-linear with one another of comprising in addition, wherein first conducting end 411 further comprises the 3rd conductive projection 440 and second conductive projection, 430 each first conducting end 411 that are arranged at co-linear with one another, and those the 3rd conductive projections 440 correspond to each other with those the 3rd conductive pads 330 and couple (seeing also Fig. 3 a and Fig. 3 b).
Figure 8 shows that electronic device circuit signal connection end step of manufacturing flow chart of the present invention.Step 910 comprises a plurality of signal lines of formation, makes each signal line have first signal end.Step 930 is contained in first signal end and couples first conductive pad and second conductive pad, and second conductive pad is adjacent near first conductive pad apart from a gap.Step 950 comprises formation one circuit arrangement and has first conducting end, and first conducting end is coupled to first conductive pad.As shown in Figure 9, wherein couple the first conducting end step and further comprise and carry out step 951, form first conductive projection; And carry out step 953, form second conductive projection and first conductive projection and be one another in series and be coupled to first conducting end.Wherein, aforesaid first conducting end couples step and is preferably further to be contained between first conducting end and first signal end and is coated with conducting resinl, and make first conductive projection and second conductive projection respectively with first conductive pad and second conductive pad is corresponding couples, so conducting resinl is turning circuit device and module of circuit signal connection end, and circuit arrangement is linked to each other with the module of circuit signal connection end signal.
With the embodiment shown in Fig. 4 a, because first conducting end 411 further comprises metal gasket 500, therefore aforesaid first conducting end couples step and further is contained in formation first conductive projection 420 and second conductive projection, 430 co-linear with one another coupling on the metal gasket 500, and correspondence couples first conductive projection 420 and second conductive projection, 430 to first conductive pads 310 and second conductive pad 320.In other better embodiment, shown in the embodiment that is illustrated with Fig. 4 b, because first conducting end 411 comprises first metal gasket 501 and second metal gasket 502 in addition, and the top layer of first conducting end 411 is provided with outside line 510, further comprise respectively first metal gasket 501 and second metal gasket 502 are coupled with outside line 510 so aforesaid first conducting end couples step, and correspondence couples first conductive projection 420 and second conductive projection 430 on first metal gasket 501 and second metal gasket 502.Therefore in addition, shown in the better embodiment of Fig. 4 c, the internal layer of first conducting end 411 is provided with internal wiring 520, and aforesaid first conducting end couples step and also comprises respectively first metal gasket 501 and second metal gasket 502 are coupled with internal wiring 520.
When the module of circuit signal connection end that is implemented on shown in Fig. 2 b and Fig. 2 c, aforesaid first conducting end couples step 950 and further comprises and couple those first conductive projections side by side to those first conductive pads, and couples those second conductive projections side by side to those second conductive pads.In addition, preferable after carry out step 930 as shown in figure 10 when the embodiment that is implemented on shown in Fig. 3 b and Fig. 3 c, then carry out step 931, it is co-linear with one another to couple the 3rd conductive pad and first conductive pad and second conductive pad in first signal end; And carry out step 933, form the 3rd conductive projection and second conductive projection is co-linear with one another in first conducting end; Carry out step 935 at last, correspondence couples those the 3rd conductive projections and those the 3rd conductive pads.In addition, with regard to the elongated shape conductive pad embodiment shown in Fig. 2 d, aforesaid first conducting end couples step 950 and further comprises those second conductive pads on adjacent this signal line and those first conductive pads on the adjacent signals circuit are staggered front to back setting each other.At last, when the embodiment that desires to be implemented on shown in Fig. 5 a and Fig. 5 b, aforesaid first conducting end couples step 950 and item further comprises those first conductive pads on adjacent this signal line are staggered front to back setting each other, and those second conductive pads on adjacent this signal line are staggered front to back setting each other.
Certainly; the present invention also can have other various embodiments; under the situation that does not deviate from spirit of the present invention and essence thereof; those of ordinary skill in the art work as can make various corresponding changes and distortion according to the present invention, but these corresponding changes and distortion all should belong to the protection range of the appended claim of the present invention.
Claims (21)
1. a module of circuit signal connection end supplies to link to each other with a circuit arrangement signal, it is characterized in that this module of circuit signal connection end comprises:
A plurality of signal lines, each signal line have one first signal end, and wherein this first signal end further comprises:
One first conductive pad is coupled to this first signal end; And
One second conductive pad, be arranged on this first signal end with this first conductive pad conllinear, and couple with this first signal end simultaneously, in addition, have a gap between this second conductive pad and this first conductive pad, and have a signal conduction area between 700 μ m between this first conductive pad and this second conductive pad and this signal line
2To 3000 μ m
2, and this first conductive pad and this second conductive pad are one another in series and link to each other with this circuit arrangement signal.
2. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that, each this first signal end further comprises one first bonding station for coupling this first conductive pad, those first bonding stations on wherein adjacent this signal line are positioned at same horizontal level, and those first conductive pads are coupled to those first bonding stations side by side.
3. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that those first conductive pads on adjacent this signal line are staggered front to back setting each other.
4. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that those second conductive pads on adjacent this signal line are staggered front to back setting each other.
5. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that those second conductive pads on adjacent this signal line and those first conductive pads on adjacent this signal line are staggered front to back setting each other.
6. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that, other comprises one the 3rd conductive pad and this first conductive pad and this second conductive pad each this first signal end that is arranged at co-linear with one another, the 3rd conductive pad and adjacent those the 3rd conductive pads those first signal ends that is coupled to interlaced with each other.
7. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that, other comprises one the 3rd conductive pad and this first conductive pad and this second conductive pad each this first signal end that is arranged at co-linear with one another, and the 3rd conductive pad and adjacent those the 3rd conductive pads are coupled to those first signal ends each other side by side.
8. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that, those signal lines further comprise a secondary signal end and link to each other with this circuit arrangement and this first signal end signal, when the signal of these secondary signal termination receipts from the outside, this signal is exported from this first signal end through this circuit arrangement.
9. according to the module of circuit signal connection end shown in the claim 1, it is characterized in that this gap is between 5 μ m to 150 μ m.
10. an electronic installation is characterized in that, comprises:
One module of circuit signal connection end, this module of circuit signal connection end comprises a plurality of signal lines, and each signal line has one first signal end, and this first signal end further comprises:
One first conductive pad is coupled to this first signal end; And
One second conductive pad is adjacent near this first conductive pad apart from a gap and couples with this first signal end, and this first conductive pad and this second conductive pad are one another in series; And
One circuit arrangement has a plurality of galvanic circles, and each galvanic circle has one first conducting end, comprises:
One first conductive projection is coupled to this first conducting end; And
One second conductive projection, be one another in series with this first conductive projection and be coupled to this first conducting end, second conductive pad is corresponding couples with this first conductive pad and this respectively for this first conductive projection and this second conductive projection, and this circuit arrangement is linked to each other with this module of circuit signal connection end signal.
11. the electronic installation according to shown in the claim 10 is characterized in that, this first conducting end further comprises a metal gasket, and this first conductive projection and co-linear with one another the coupling of this second conductive projection form on this metal gasket.
12. according to the electronic installation shown in the claim 10, it is characterized in that, this first conducting end comprises one first metal gasket and one second metal gasket in addition, this first metal gasket and this second metal gasket borrow an outside line that is arranged at this first conducting end top layer to be coupled to each other, and this first conductive projection and this second conductive projection then are formed separately on this first metal gasket and this second metal gasket.
13. according to the electronic installation shown in the claim 10, it is characterized in that, this first conducting end comprises one first metal gasket and one second metal gasket in addition, this first metal gasket borrows the internal wiring and this second metal gasket that are arranged at this first conducting end internal layer to couple, and this first conductive projection and this second conductive projection then are formed separately on this first metal gasket and this second metal gasket.
14. the electronic installation according to shown in the claim 10 is characterized in that, those first conductive pads on adjacent this signal line are positioned at same horizontal level, and those first conductive projections and those first conductive pads couple side by side.
15. the electronic installation according to shown in the claim 10 is characterized in that, those first conductive pads on adjacent this signal line are staggered front to back setting each other, and those first conductive projections and those first conductive pads correspond to each other and couple.
16. the electronic installation according to shown in the claim 10 is characterized in that, those second conductive pads on adjacent this signal line are staggered front to back setting each other, and those second conductive projections and those second conductive pads correspond to each other and couple.
17. according to the electronic installation shown in the claim 10, it is characterized in that, those second conductive pads on adjacent this signal line and those first conductive pads on adjacent this signal line are staggered front to back setting each other, and those second conductive projections and those first conductive projections and those second conductive pads and those first conductive pads correspond to each other and couple.
18. according to the electronic installation shown in the claim 10, it is characterized in that, other comprises one the 3rd conductive pad and this first conductive pad and this second conductive pad each this first signal end that is arranged at co-linear with one another, this first conducting end further comprises one the 3rd conductive projection and this second conductive projection is co-linear with one another is arranged at each this first conducting end, and those the 3rd conductive projections and those the 3rd conductive pads correspond to each other and couple.
19. according to the electronic installation shown in the claim 10, it is characterized in that, this module of circuit signal connection end comprises a secondary signal end in addition, this galvanic circle comprises one second conducting end in addition and links to each other with this first conducting end signal and couple with this secondary signal end, when the signal that these secondary signal termination receipts come from the outside, this signal is exported from this first signal end through this second conducting end and this first conducting end.
20. the electronic installation according to shown in the claim 10 is characterized in that, this gap is between 5 μ m to 150 μ m.
21. the electronic installation according to shown in the claim 10 is characterized in that, further comprises a conducting resinl between this first signal end and this first conducting end, for this circuit arrangement of conducting and this module of circuit signal connection end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101643802A CN100463293C (en) | 2007-10-30 | 2007-10-30 | Electronic device and its module of circuit signal connection end |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2007101643802A CN100463293C (en) | 2007-10-30 | 2007-10-30 | Electronic device and its module of circuit signal connection end |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101174736A CN101174736A (en) | 2008-05-07 |
| CN100463293C true CN100463293C (en) | 2009-02-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2007101643802A Expired - Fee Related CN100463293C (en) | 2007-10-30 | 2007-10-30 | Electronic device and its module of circuit signal connection end |
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| Country | Link |
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| CN (1) | CN100463293C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103296491B (en) | 2012-09-05 | 2016-03-30 | 上海天马微电子有限公司 | The electric connection structure of conductive pad and there is the touch screen of this structure |
| TWI708229B (en) * | 2018-09-28 | 2020-10-21 | 友達光電股份有限公司 | Display device |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7211738B2 (en) * | 2003-10-02 | 2007-05-01 | Au Optronics Corp. | Bonding pad structure for a display device and fabrication method thereof |
| CN101047157A (en) * | 2006-03-28 | 2007-10-03 | 统宝光电股份有限公司 | Conducting pad system and its making method |
-
2007
- 2007-10-30 CN CNB2007101643802A patent/CN100463293C/en not_active Expired - Fee Related
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7211738B2 (en) * | 2003-10-02 | 2007-05-01 | Au Optronics Corp. | Bonding pad structure for a display device and fabrication method thereof |
| CN101047157A (en) * | 2006-03-28 | 2007-10-03 | 统宝光电股份有限公司 | Conducting pad system and its making method |
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| Publication number | Publication date |
|---|---|
| CN101174736A (en) | 2008-05-07 |
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