CN201153348Y

CN201153348Y - Interconnect construction of circuit board

Info

Publication number: CN201153348Y
Application number: CNU200720176824XU
Authority: CN
Inventors: 眭诗菊
Original assignee: ZTE Corp
Current assignee: ZTE Corp
Priority date: 2007-09-12
Filing date: 2007-09-12
Publication date: 2008-11-19
Anticipated expiration: 2017-09-12

Abstract

The utility model discloses a circuit board interconnection structure which comprises a first circuit board, a second circuit board and a third circuit board, wherein, both ends of the third circuit board are respectively combined on the first circuit board and the second circuit board. The interconnection of two or more printed circuit boards (PCB) which are not required to be often disassembled is realized according to the circuit board interconnection structure of the utility model, thereby not only avoiding the use of a connector, improving the reliability and saving the space of the connector on the PCB, but also avoiding problems that the layer number of the PCB is limited and the cost is high. The interconnection structure not only can transmit common signals, but also is suitable for the transmission of high-speed signals.

Description

The circuit board interconnect architecture

Technical field

The utility model relates to a kind of circuit board interconnect architecture, specifically, relates to the interconnected structure of signal between a kind of PCB (printed circuit board (PCB), Printed CircuitBoard) that is used for making electronic instrument, communication, information technoloy equipment.

Background technology

Usually, the signal between the inner two or more PCB of instrument and equipment is realized interconnected with two kinds of structures.A kind of structure is interconnected for adopting cable and connector to realize, another kind of structure is promptly made rigid-flexible in conjunction with PCB for two or more PCB and flexible PCB are made an integral body.

But these two kinds of structures have defective.In first kind of structure, the area that connector accounts for PCB is bigger, and the connection reliability of cable and connector is poor, and especially using under the situation of high speed connector, makes that owing to the cost of connector is higher the cost of connecting structure is higher.In second kind of structure, though interconnect architecture is simply compact, have mounting characteristics preferably, cost is higher, and the area of the number of plies of plate and plate is subjected to the restriction of PCB factory production capacity.

The utility model content

The purpose of this utility model is to provide a kind of circuit board interconnect architecture, it can overcome the problems referred to above of the prior art, makes connection simple and reliable, and can save the space of connector on PCB, and be not subjected to the restriction of the PCB number of plies, cost is low and be suitable for the transmission of high speed signal.

The purpose of this utility model is to provide a kind of circuit board interconnect architecture, and this structure comprises: first circuit board, second circuit board and tertiary circuit plate, the two ends of tertiary circuit plate are incorporated into respectively on first circuit board and the described second circuit board.

Preferably, first circuit board, second circuit board are welded in the tertiary circuit plate by pad array respectively.

Preferably, the pad number in the pad array is more than or equal to the interconnected number of signals between first circuit board and the described second circuit board.

Preferably, be respectively arranged with first pad array and second pad array on first circuit board and the second circuit board, and the tertiary circuit plate is provided with respectively and first pad array and corresponding the 3rd pad array of second pad array and the 4th pad array.

Preferably, first pad array and second pad array are the surface pads array, and the 3rd pad array and the 4th pad array are the via pad array, and being welded to connect by reflow welding or manual welding between first circuit board and second circuit board and the tertiary circuit plate realizes.

Preferably, the first, second, third and the 4th pad array is surperficial stannize pad array, and being welded to connect by thermocompression bonding between first circuit board and second circuit board and the tertiary circuit plate realizes.

Preferably, first circuit board and second circuit board are rigidity PCB, and the tertiary circuit plate is a flexible PCB.

Preferably, the angled setting of first circuit board and second circuit board.

Preferably, first circuit board and second circuit board are in the same plane.

Preferably, on first circuit board, second circuit board and tertiary circuit plate, corresponding positioning hole is set.

Adopt a kind of no pin Welding Structure that flexible board is welded on the rigid plate according to circuit board interconnect architecture of the present utility model, not needing to have realized two or more PCB interconnected of often dismounting.Both avoid the use of connector, improved reliability, saved the space of connector on PCB; Avoided the limited and expensive problem of the PCB number of plies again.This interconnect device not only can transmit normal signal, also is fit to the transmission of high speed signal.

Should be appreciated that above generality is described and the following detailed description is all enumerated and illustrative, purpose is in order to provide further instruction to claimed the utility model.

Description of drawings

Accompanying drawing constitutes the part of this specification, and it helps further to understand the utility model, and these accompanying drawings illustrate embodiment more of the present utility model, and can be used for illustrating principle of the present utility model with specification.In the accompanying drawing:

Fig. 1 is the schematic perspective view according to circuit board interconnect architecture of the present utility model;

Fig. 2 is the plane decomposing schematic representation according to the circuit board interconnect architecture of the utility model first embodiment;

Fig. 3 is the sectional view according to the circuit board interconnect architecture of the utility model first embodiment;

Fig. 4 is the plane decomposing schematic representation according to the circuit board interconnect architecture of the utility model second embodiment;

Fig. 5 is the sectional view according to the circuit board interconnect architecture of the utility model first embodiment;

Fig. 6 shows according to the location hole of the circuit board of circuit board interconnect architecture of the present utility model and the plane graph of the strap that adopted when realizing according to circuit board interconnect architecture of the present utility model; And

Fig. 7 is at be perpendicular to one another schematic diagram when being provided with of first circuit board 10 and second circuit board 20 according to circuit board interconnect architecture of the present utility model.

Embodiment

Below in conjunction with accompanying drawing to exemplary embodiment of the present utility model is described.In the accompanying drawing, identical parts are represented with identical label.

The circuit board interconnect architecture that shows according to the utility model comprises: first circuit board 10, second circuit board 20 and two ends are welded on the tertiary circuit plate 30 on first circuit board 10 and the second circuit board 20 respectively.Preferably, first circuit board 10 and second circuit board 20 are common rigidity PCB.First circuit board 10 and second circuit board 20 can be arranged at (as shown in Figure 1) in the same plane, also can be provided with angledly, and for example, as shown in Figure 8, first circuit board 10 and second circuit board 20 are provided with mutual vertically.

Tertiary circuit plate 30 is flexible PCB preferably, because flexible PCB can bending, so that be suitable for first circuit board 10 and second circuit board 20 not in the situation of same plane or angled setting, thereby can save the space in the equipment.

Circuit board interconnect architecture of the present utility model is not limited to this, for example, and a plurality of flexible PCBs that this circuit board interconnect architecture can comprise a plurality of rigidity PCB and connect these a plurality of rigidity PCB.

Interconnected for realizing, as shown in Figure 2, first circuit board 10 is provided with first pad array 11 at the end regions place of a side, the end regions place in a side of second circuit board 20 is provided with second pad array 21 respectively, and tertiary circuit plate 30 is provided with and first pad array 11 and second pad array, 21 corresponding the 3rd pad array 31 and the 4th pad array 32 at the

zone

31 and 32 places (as shown in Figure 3) at two ends.The size of pad is set as required, and quantity is respectively more than or equal to interconnected number of signals, and the two ends crossover that need guarantee tertiary circuit plate 30 simultaneously is on the respective end of first circuit board 10 and second circuit board 20 time, and corresponding pad overlaps fully.

First circuit board 10 and second circuit board 20 are welded in tertiary circuit plate 30 by the described first, second, third and the

4th pad array

11,21,31,32 respectively, thereby realize that the signal between first circuit board and the second circuit board is interconnected.

Wherein, as shown in Figure 2, first pad array 11 and second pad array 21 can be the surface pads array, and the 3rd pad array 31 and the 4th pad array 32 can be the via pad array.In this case, first circuit board 10 and second circuit board 20 are welded in tertiary circuit plate 30 by reflow welding or manual welding.

Replacedly, as shown in Figure 4, the first, second, third and the

4th pad array

11,21,31,32 is surperficial stannize pad array.In this case, first circuit board 10 and second circuit board 20 are welded in tertiary circuit plate 30 by thermocompression bonding.

Below, accompanying drawings is according to the implementation procedure of circuit board interconnect architecture of the present utility model.

The first step is provided with pad array on tertiary circuit plate 30, first circuit board 10 and second circuit board 20;

In second step, first circuit board 10 and second circuit board 20 and tertiary circuit plate 30 aimed at and implement manual welding or reflow welding.Effect after the welding is seen Fig. 3 and shown in Figure 5.Fig. 3 and Fig. 5 schematically show the structure at the respective pad place between welding back first circuit board 10 and the tertiary circuit plate 30 with the form of sectional view.

First circuit board 10 and second circuit board 20 are accurate with the contraposition of tertiary circuit plate 30 when welding in order to make, as shown in Figure 7, can be on first circuit board 10, second circuit board 20 and tertiary circuit plate 30 the Design Orientation hole, for example, as shown in Figure 7, at the place, end of first circuit board 10 location hole 12 is set.

In addition, as shown in Figure 7,, can also use clamping plate for accurate positioning.These clamping plate are divided into first 50 and second portion 60, when using, the protuberance 61 of second portion 60 is inserted through corresponding location hole on two circuit boards, for example, is inserted through location hole 12 on the first circuit board 10 and the location hole (not shown) on the second circuit board 20.And then be inserted in the hole 51 of first 50, thereby circuit board (as first circuit board 10) is fixed between the first 50 and second portion 60 of clamping plate, and, owing to be provided with recess in the mid portion of first 50, pad array on the described circuit board is exposed to the outside, thereby is convenient to carry out welding operation.

Although the utility model is illustrated with reference to accompanying drawing and preferred embodiment, obviously, for a person skilled in the art, under the prerequisite that does not deviate from spirit and scope of the present utility model, can make various changes and variation to the utility model.Various change of the present utility model, the content that changes by appending claims and equivalent thereof contain.

Claims

1. circuit board interconnect architecture, it comprises:

First circuit board (10);

Second circuit board (20); And

Tertiary circuit plate (30),

It is characterized in that the two ends of described tertiary circuit plate (30) are incorporated into respectively on described first circuit board (10) and the described second circuit board (20).

2. circuit board interconnect architecture according to claim 1 is characterized in that, described first circuit board (10), described second circuit board (20) are welded in described tertiary circuit plate (30) by pad array (11,21,31,32) respectively.

3. circuit board interconnect architecture according to claim 2 is characterized in that, the pad number in the described pad array (11,21,31,32) is more than or equal to the interconnected number of signals between described first circuit board (10) and the described second circuit board (20).

4. circuit board interconnect architecture according to claim 2, it is characterized in that, be respectively arranged with first pad array (11) and second pad array (21) on described first circuit board (10) and the described second circuit board (20), and described tertiary circuit plate (30) is provided with respectively and described first pad array (11) and corresponding the 3rd pad array of described second pad array (21) (31) and the 4th pad array (32).

5. circuit board interconnect architecture according to claim 4, it is characterized in that, described first pad array (11) and described second pad array (21) are the surface pads array, and described the 3rd pad array (31) and described the 4th pad array (32) are the via pad array, and being welded to connect by reflow welding or manual welding between described first circuit board and described second circuit board and the described tertiary circuit plate realizes.

6. circuit board interconnect architecture according to claim 4, it is characterized in that, the described first, second, third and the 4th pad array (11,21,31,32) is surperficial stannize pad array, and being welded to connect by thermocompression bonding between described first circuit board and described second circuit board and the described tertiary circuit plate realizes.

7. according to each described circuit board interconnect architecture in the claim 1 to 6, it is characterized in that described first circuit board (10) and described second circuit board (20) are rigidity PCB, described tertiary circuit plate (30) is a flexible PCB.

8. according to each described circuit board interconnect architecture in the claim 1 to 6, it is characterized in that described first circuit board (10) and the angled setting of described second circuit board (20).

9. according to each described circuit board interconnect architecture in the claim 1 to 6, it is characterized in that described first circuit board (10) is in the same plane with described second circuit board (20).

10. according to each described circuit board interconnect architecture in the claim 1 to 6, it is characterized in that, on described first circuit board (10), described second circuit board (20) and described tertiary circuit plate (30), corresponding positioning hole is set.