CN100456024C - 用于防止光学检查中错误检测的系统和方法 - Google Patents

用于防止光学检查中错误检测的系统和方法 Download PDF

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Publication number
CN100456024C
CN100456024C CNB031225802A CN03122580A CN100456024C CN 100456024 C CN100456024 C CN 100456024C CN B031225802 A CNB031225802 A CN B031225802A CN 03122580 A CN03122580 A CN 03122580A CN 100456024 C CN100456024 C CN 100456024C
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CN
China
Prior art keywords
light image
pattern
suspected
transmitted light
reflected light
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Expired - Fee Related
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CNB031225802A
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English (en)
Chinese (zh)
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CN1472528A (zh
Inventor
崔铉镐
柳根洪
炳铉任
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95684—Patterns showing highly reflecting parts, e.g. metallic elements

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  • Engineering & Computer Science (AREA)
  • Operations Research (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Wire Bonding (AREA)
CNB031225802A 2002-07-29 2003-04-21 用于防止光学检查中错误检测的系统和方法 Expired - Fee Related CN100456024C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2002-0044716A KR100516828B1 (ko) 2002-07-29 2002-07-29 광학적 검사의 과검출 방지 방법 및 이를 수행하기 위한 시스템
KR44716/2002 2002-07-29

Publications (2)

Publication Number Publication Date
CN1472528A CN1472528A (zh) 2004-02-04
CN100456024C true CN100456024C (zh) 2009-01-28

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ID=30439406

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CNB031225802A Expired - Fee Related CN100456024C (zh) 2002-07-29 2003-04-21 用于防止光学检查中错误检测的系统和方法

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Country Link
JP (1) JP4133509B2 (https=)
KR (1) KR100516828B1 (https=)
CN (1) CN100456024C (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102353697B (zh) * 2011-08-31 2015-04-29 上海华虹宏力半导体制造有限公司 在线测评缺陷的方法
CN105865979B (zh) * 2016-03-30 2019-03-12 南京邮电大学 一种测量微液滴电湿效应的装置与方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160450A (ja) * 1989-11-17 1991-07-10 Fujitsu Ltd マスクの欠陥検査方法
JPH04198742A (ja) * 1990-11-28 1992-07-20 Matsushita Electric Ind Co Ltd 配線パターン検査装置
CN1104329A (zh) * 1993-06-25 1995-06-28 松下电器产业株式会社 电子元件的外观检查装置及外观检查方法
JPH10221041A (ja) * 1997-02-10 1998-08-21 Toppan Printing Co Ltd 欠陥検査方法
CN1260876A (zh) * 1997-06-17 2000-07-19 株式会社之技术综合 片材包装检查装置
JP2001208693A (ja) * 2000-01-26 2001-08-03 Dainippon Printing Co Ltd 板状ワークの検査方法及び装置
US6282309B1 (en) * 1998-05-29 2001-08-28 Kla-Tencor Corporation Enhanced sensitivity automated photomask inspection system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563702A (en) * 1991-08-22 1996-10-08 Kla Instruments Corporation Automated photomask inspection apparatus and method
JP3812020B2 (ja) * 1996-11-27 2006-08-23 松下電器産業株式会社 電子部品観察装置及び電子部品観察方法
JP3678007B2 (ja) * 1998-07-10 2005-08-03 松下電器産業株式会社 電子部品実装装置における電子部品認識装置および電子部品認識方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03160450A (ja) * 1989-11-17 1991-07-10 Fujitsu Ltd マスクの欠陥検査方法
JPH04198742A (ja) * 1990-11-28 1992-07-20 Matsushita Electric Ind Co Ltd 配線パターン検査装置
CN1104329A (zh) * 1993-06-25 1995-06-28 松下电器产业株式会社 电子元件的外观检查装置及外观检查方法
JPH10221041A (ja) * 1997-02-10 1998-08-21 Toppan Printing Co Ltd 欠陥検査方法
CN1260876A (zh) * 1997-06-17 2000-07-19 株式会社之技术综合 片材包装检查装置
US6282309B1 (en) * 1998-05-29 2001-08-28 Kla-Tencor Corporation Enhanced sensitivity automated photomask inspection system
JP2001208693A (ja) * 2000-01-26 2001-08-03 Dainippon Printing Co Ltd 板状ワークの検査方法及び装置

Also Published As

Publication number Publication date
JP2004061491A (ja) 2004-02-26
CN1472528A (zh) 2004-02-04
KR100516828B1 (ko) 2005-09-26
JP4133509B2 (ja) 2008-08-13
KR20040011676A (ko) 2004-02-11

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C06 Publication
PB01 Publication
CI01 Publication of corrected invention patent application

Correction item: Inventor

Correct: Bing Xuanren

False: (third inventor) Bing Hyun ho

Number: 5

Volume: 20

CI02 Correction of invention patent application

Correction item: Inventor

Correct: Bing Xuanren

False: (third inventor) Bing Hyun ho

Number: 5

Page: The title page

Volume: 20

COR Change of bibliographic data

Free format text: CORRECT: INVENTOR; FROM: ( THE THIRD INVENTOR ) BING XUANHAO TO: BING XUANREN

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C10 Entry into substantive examination
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C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090128

Termination date: 20130421