CN100446957C - Injection molding device and member used thereof and surface treatment method - Google Patents
Injection molding device and member used thereof and surface treatment method Download PDFInfo
- Publication number
- CN100446957C CN100446957C CNB031532195A CN03153219A CN100446957C CN 100446957 C CN100446957 C CN 100446957C CN B031532195 A CNB031532195 A CN B031532195A CN 03153219 A CN03153219 A CN 03153219A CN 100446957 C CN100446957 C CN 100446957C
- Authority
- CN
- China
- Prior art keywords
- diaphragm
- target
- sputter
- electric power
- constitutes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 12
- 238000004381 surface treatment Methods 0.000 title claims description 7
- 238000001746 injection moulding Methods 0.000 title abstract description 3
- 239000011737 fluorine Substances 0.000 claims abstract description 37
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 37
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 19
- 238000000465 moulding Methods 0.000 claims description 67
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 34
- 239000011159 matrix material Substances 0.000 claims description 30
- 239000007789 gas Substances 0.000 claims description 16
- 238000002156 mixing Methods 0.000 claims description 12
- 230000033228 biological regulation Effects 0.000 claims description 10
- 239000011261 inert gas Substances 0.000 claims description 9
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 230000000737 periodic effect Effects 0.000 claims description 7
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 229910052719 titanium Inorganic materials 0.000 claims description 7
- 229910052721 tungsten Inorganic materials 0.000 claims description 7
- 229920005989 resin Polymers 0.000 abstract description 61
- 239000011347 resin Substances 0.000 abstract description 61
- 239000000463 material Substances 0.000 abstract description 3
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 abstract 1
- 230000001681 protective effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 18
- 238000010586 diagram Methods 0.000 description 17
- 238000002347 injection Methods 0.000 description 11
- 239000007924 injection Substances 0.000 description 11
- 229910052782 aluminium Inorganic materials 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 7
- 230000001629 suppression Effects 0.000 description 7
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 5
- 229910052786 argon Inorganic materials 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 4
- 239000011248 coating agent Substances 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 238000007493 shaping process Methods 0.000 description 4
- 239000010959 steel Substances 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 3
- -1 argon ion Chemical class 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000000460 chlorine Substances 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 125000001153 fluoro group Chemical group F* 0.000 description 2
- 229910052732 germanium Inorganic materials 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 229910052735 hafnium Inorganic materials 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 229910052745 lead Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000001755 magnetron sputter deposition Methods 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 229910052758 niobium Inorganic materials 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- UGFAIRIUMAVXCW-UHFFFAOYSA-N Carbon monoxide Chemical compound [O+]#[C-] UGFAIRIUMAVXCW-UHFFFAOYSA-N 0.000 description 1
- 102100030509 Histidine protein methyltransferase 1 homolog Human genes 0.000 description 1
- 101000990524 Homo sapiens Histidine protein methyltransferase 1 homolog Proteins 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910002091 carbon monoxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000003197 gene knockdown Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- WMIYKQLTONQJES-UHFFFAOYSA-N hexafluoroethane Chemical compound FC(F)(F)C(F)(F)F WMIYKQLTONQJES-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003595 mist Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- ODGAOXROABLFNM-UHFFFAOYSA-N polynoxylin Chemical compound O=C.NC(N)=O ODGAOXROABLFNM-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000013077 target material Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/27—Sprue channels ; Runner channels or runner nozzles
- B29C45/2725—Manifolds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/20—Injection nozzles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/60—Screws
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
- B29C45/58—Details
- B29C45/62—Barrels or cylinders
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/0605—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2705/00—Use of metals, their alloys or their compounds, for preformed parts, e.g. for inserts
- B29K2705/08—Transition metals
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2707/00—Use of elements other than metals for preformed parts, e.g. for inserts
- B29K2707/04—Carbon
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2883/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as mould material
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
Claims (3)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002232705 | 2002-08-09 | ||
JP2002232705 | 2002-08-09 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1488486A CN1488486A (en) | 2004-04-14 |
CN100446957C true CN100446957C (en) | 2008-12-31 |
Family
ID=34179469
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031532195A Expired - Fee Related CN100446957C (en) | 2002-08-09 | 2003-08-08 | Injection molding device and member used thereof and surface treatment method |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR100566147B1 (en) |
CN (1) | CN100446957C (en) |
TW (1) | TWI248861B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5102516B2 (en) * | 2007-03-06 | 2012-12-19 | 株式会社神戸製鋼所 | Mold |
CN102618824A (en) * | 2011-01-28 | 2012-08-01 | 鸿富锦精密工业(深圳)有限公司 | Carbon fiber product capable of resisting fingerprint and preparation method thereof |
CN105729683B (en) * | 2016-03-18 | 2017-12-01 | 宁波双林模具有限公司 | A kind of preparation method in the accurate emulation dermato glyphic pattern face of molding mold cavity |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05169459A (en) * | 1991-12-24 | 1993-07-09 | Sumitomo Electric Ind Ltd | Mold for resin or rubber, part of resin or rubber molding apparatus and method for molding resin or rubber |
CN1166864A (en) * | 1995-11-02 | 1997-12-03 | 奥里翁电气株式会社 | Method of forming diamond-like carbon film (DLC), DLC film formed thereby, use of the same, field emitter array and field emitter cathodes |
JP2001269938A (en) * | 2001-03-22 | 2001-10-02 | Sumitomo Electric Ind Ltd | Die for rubber: method for manufacturing die for rubber and method molding rubber |
US6446933B1 (en) * | 1998-09-03 | 2002-09-10 | Micron Technology, Inc. | Film on a surface of a mold used during semiconductor device fabrication |
-
2003
- 2003-08-01 TW TW92121192A patent/TWI248861B/en not_active IP Right Cessation
- 2003-08-08 KR KR20030054879A patent/KR100566147B1/en not_active IP Right Cessation
- 2003-08-08 CN CNB031532195A patent/CN100446957C/en not_active Expired - Fee Related
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05169459A (en) * | 1991-12-24 | 1993-07-09 | Sumitomo Electric Ind Ltd | Mold for resin or rubber, part of resin or rubber molding apparatus and method for molding resin or rubber |
CN1166864A (en) * | 1995-11-02 | 1997-12-03 | 奥里翁电气株式会社 | Method of forming diamond-like carbon film (DLC), DLC film formed thereby, use of the same, field emitter array and field emitter cathodes |
US6446933B1 (en) * | 1998-09-03 | 2002-09-10 | Micron Technology, Inc. | Film on a surface of a mold used during semiconductor device fabrication |
US20020185584A1 (en) * | 1998-09-03 | 2002-12-12 | Micron Technology, Inc. | Film on a surface of a mold used during semiconductor device fabrication |
US6523803B1 (en) * | 1998-09-03 | 2003-02-25 | Micron Technology, Inc. | Mold apparatus used during semiconductor device fabrication |
US6544466B1 (en) * | 1998-09-03 | 2003-04-08 | Micron Technology | Surface modification method for molds used during semiconductor device fabrication |
JP2001269938A (en) * | 2001-03-22 | 2001-10-02 | Sumitomo Electric Ind Ltd | Die for rubber: method for manufacturing die for rubber and method molding rubber |
Also Published As
Publication number | Publication date |
---|---|
TW200404662A (en) | 2004-04-01 |
CN1488486A (en) | 2004-04-14 |
KR100566147B1 (en) | 2006-03-30 |
KR20040014343A (en) | 2004-02-14 |
TWI248861B (en) | 2006-02-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW482716B (en) | Method and device for forming coating on the inner surfaces of a mold | |
JP5054277B2 (en) | Method for applying an in-mold coating on a surface area of an injection molded substrate | |
JPH10138292A (en) | Manufacture of molded item and molded item manufactured by the same method | |
JP2005521577A (en) | Mold runner for prevention of in-mold coating flow | |
CN109311199A (en) | Mould gate structure | |
CN100446957C (en) | Injection molding device and member used thereof and surface treatment method | |
Alcock et al. | Surface engineering by co-injection moulding | |
CN101443176A (en) | Method for producing a multi-layer part | |
JPH0952262A (en) | Mold for in-mold coating molding method | |
CN108621346A (en) | Mould preparation method, mobile phone pair camera bracket and preparation method thereof | |
JPH0952257A (en) | Mold for in-mold coating molding method and manufacture thereof | |
JP2010234647A (en) | Method for manufacturing in-mold coated article and die used for the same | |
CN209580224U (en) | Prevent the mold coating of plastics sticking to mould | |
TWI344414B (en) | ||
JPH079484A (en) | In-mold decorating injection molding method and decorative film used therefor | |
JP5234640B2 (en) | Ultra-thin light guide plate molding die and molding method | |
JP3400344B2 (en) | Injection molding of plastic products | |
JP2004130775A (en) | Injection molding machine, constituent member for use in the same, and surface treatment method | |
JPH066724B2 (en) | Nozzle for injection molding machine excellent in wear resistance and corrosion resistance and method for manufacturing the same | |
EP1501668B1 (en) | Selectively controlling in-mold coating flow including inlet flow control and removable containment flange | |
CN103240846B (en) | Mould for plastic container | |
JPH11188734A (en) | Mold for molding plastic and production thereof | |
WO2006038617A1 (en) | Metal mold for hollow molding | |
JPH03138126A (en) | Injection molding process for even thin wall hollow molded product | |
JPS6111249A (en) | Decorative coated article having excellent shock resistance and manufacture thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: TOSHIN SEIKO CO., LTD.; APPLICANT Free format text: FORMER OWNER: MAXELL HIGH-TECH CO., LTD.; APPLICANT Effective date: 20080509 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20080509 Address after: Miyagi Prefecture, Japan Applicant after: Co., Ltd. Co-applicant after: Kobe Steel Ltd. Address before: Japan Ibaraki Applicant before: Mike SEER Technology Corporation Co-applicant before: Kobe Steel Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: MACSIL PRESICION TECHNOLOGY CO., LTD. Free format text: FORMER NAME: TOSHIN SEIKO CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: Miyagi Prefecture, Japan Co-patentee after: Kobe Steel Ltd. Patentee after: Mike SEER Precision Technology Co., Ltd. Address before: Miyagi Prefecture, Japan Co-patentee before: Kobe Steel Ltd. Patentee before: Co., Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 Termination date: 20130808 |