JPH079484A - In-mold decorating injection molding method and decorative film used therefor - Google Patents

In-mold decorating injection molding method and decorative film used therefor

Info

Publication number
JPH079484A
JPH079484A JP15088993A JP15088993A JPH079484A JP H079484 A JPH079484 A JP H079484A JP 15088993 A JP15088993 A JP 15088993A JP 15088993 A JP15088993 A JP 15088993A JP H079484 A JPH079484 A JP H079484A
Authority
JP
Japan
Prior art keywords
film
painting
temperature
mold
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15088993A
Other languages
Japanese (ja)
Other versions
JP2725735B2 (en
Inventor
Hiroyuki Atake
浩之 阿竹
Kazuhisa Kobayashi
和久 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dai Nippon Printing Co Ltd
Original Assignee
Dai Nippon Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Application filed by Dai Nippon Printing Co Ltd filed Critical Dai Nippon Printing Co Ltd
Priority to JP15088993A priority Critical patent/JP2725735B2/en
Publication of JPH079484A publication Critical patent/JPH079484A/en
Application granted granted Critical
Publication of JP2725735B2 publication Critical patent/JP2725735B2/en
Anticipated expiration legal-status Critical
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  • Decoration By Transfer Pictures (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PURPOSE:To prevent occurrence of deformation, flow, breakage, and the like in a film by a method wherein in in-mold decorating injection molding by heating a resin to be injected to at least a melting point of a decorative film, a film having a specific ratio of a heat conductivity to a thickness is used as the decorative film, and a mold is cooled to a specific temperature or lower. CONSTITUTION:In in-mold decorating injection molding in a condition of TN>=TM where a temperature of a melt resin to be injected is TN deg.C and a melting point of a decorative film is T. 'C, a film meeting a requirement of kappa/DELTAx>=3.0X10<-2>cal/ sec.cm<2>. deg.C is used as the decorative film where kappa is a heat conductivity (cal/ see.cm<2> deg.C) of a film and DELTAx is a thickness (m) of a film. In molding, a surf ace temperature of a mold is set to a temperature lower than both the heat deforming temperatures of the decorative film and the injection resin. In this manner, a heat transferred from the melt resin to the decorative film can be rapidly released to the mold, whereby the decorative film can be prevented from being excessively increased in temperature even in a molding condition of TN>=TM.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は射出成形同時絵付け方法
及びそれに用いる絵付けフィルムの改良に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an injection molding simultaneous painting method and an improvement of a painting film used therefor.

【0002】[0002]

【従来の技術】射出成形同時絵付け法とは、射出成形の
際に雌雄金型間に挿入した絵付けフィルムをキャビティ
内に射出注入する熔融樹脂と一体化させ、成形体表面に
絵付けをする方法であり、用いる絵付けフィルムの違い
により、ラミネート印刷法又は転写印刷法と呼ばれてい
る。すなわち、ラミネート印刷法においては、基材フィ
ルム及び絵柄層からなる絵付けフィルムの全層が成形体
表面に接着一体化して化粧層となる貼合わせ絵付けフィ
ルム(ラミネートフィルム)が用いられ、転写印刷法に
おいては、成形体表面に一体化した絵付けフィルムのう
ち基材フィルムのみを剥離し、絵柄層等の転写層を成形
体側に残留させ化粧層とする転写アィルムが用いられ
る。
2. Description of the Related Art The simultaneous injection molding painting method is a method in which a painting film inserted between male and female molds at the time of injection molding is integrated with a molten resin to be injected and injected into a cavity to paint on the surface of a molding. This method is called a laminate printing method or a transfer printing method, depending on the painting film used. That is, in the laminate printing method, a laminated painting film (laminate film) is used in which all layers of the painting film consisting of the base film and the picture layer are integrally bonded to the surface of the molded body to form a decorative layer, and transfer printing is performed. In the method, a transfer film is used in which only the base film of the painting film integrated on the surface of the molded body is peeled off, and the transfer layer such as the pattern layer is left on the molded body side to form a decorative layer.

【0003】射出成形同時絵付け方法の一例を転写フィ
ルムを用いる場合について、図1、図2を参照して説明
する(特公平4−42172号公報等も合わせて参照さ
れたい)。この装置60は、雌金型70とこの雌金型7
0の側方に対向配置された雄金型80とを備えている。
雌金型70は、得るべき成形体の外形に対応するキャビ
ティ72が設けられるとともに、その内部に上記キャビ
ティ72に開口する吸気孔74が設けられていて、シリ
ンダ等からなる進退装置75により雄金型80に対して
接近−離隔する方向に進退動せしめられるようになって
いる。また、雄金型80は、上記キャビティ72内に挿
入されるコア部82を有し、その内部に溶融樹脂の注湯
孔(ゲート)84が設けられている。そして、必要に応
じて、上記雌金型70と雄金型80との間に進退可能に
熱盤90が配される。
An example of the simultaneous injection molding painting method using a transfer film will be described with reference to FIGS. 1 and 2 (see also Japanese Patent Publication No. 4-42172). This device 60 includes a female die 70 and the female die 7.
And a male die 80 arranged to face the side of 0.
The female mold 70 is provided with a cavity 72 corresponding to the outer shape of the molded body to be obtained, and an intake hole 74 opening to the cavity 72 is provided therein, and the male metal is moved by the advancing / retreating device 75 including a cylinder or the like. The mold 80 can be moved back and forth in a direction of approaching and separating from the mold 80. Further, the male die 80 has a core portion 82 to be inserted into the cavity 72, and a molten resin pouring hole (gate) 84 is provided therein. Then, if necessary, a heating plate 90 is disposed between the female die 70 and the male die 80 so as to be able to move forward and backward.

【0004】かかる装置60を用いて射出成形と同時に
絵付けを行うには、まず、雌金型70の側方に絵付け用
の転写フィルム100を対向配置し、この転写フィルム
100を必要に応じて上記熱盤90で加熱軟化させ、次
いで、転写フィルム100を雌金型70と熱盤90との
間に挟んでキャビティ72の開口面を閉じ、雌金型70
に設けられた吸気孔74を通じて真空引きを行うととも
に、熱盤90に設けられた通気孔を通じて圧空供給を行
う。
In order to perform painting simultaneously with injection molding using such an apparatus 60, first, a transfer film 100 for painting is placed opposite to the side of the female mold 70, and this transfer film 100 is used as necessary. To heat and soften it on the hot platen 90, then sandwich the transfer film 100 between the female mold 70 and the hot platen 90 to close the opening surface of the cavity 72, and
A vacuum is evacuated through the intake hole 74 provided in the hot plate 90 and compressed air is supplied through the ventilation hole provided in the heating plate 90.

【0005】それにより、転写フィルム100は図1に
示される如くに、キャビティ72の内周面に沿うように
延伸せしめられて密着する。なお、この工程は一般に予
備成形と呼ばれている。続いて、熱盤90を退避させた
もとで、図2に示される如くに、雌金型70を前進させ
ることにより、雄金型80と合体させて型締めを行った
後、雌金型70と雄金型80との間に形成されるキャビ
ティ空間に雄金型80に設けられた注湯孔84を通じて
溶融樹脂を注入充填して射出成形を行う。
As a result, the transfer film 100 is stretched along the inner peripheral surface of the cavity 72 and comes into close contact with it, as shown in FIG. Note that this step is generally called preforming. Subsequently, with the hot platen 90 retracted, as shown in FIG. 2, the female die 70 is moved forward to be merged with the male die 80 to perform mold clamping, and then the female die 70 and Injection molding is performed by injecting and filling molten resin through a pouring hole 84 provided in the male mold 80 into a cavity space formed with the male mold 80.

【0006】それにより、雌金型80内の転写フィルム
100が注入樹脂(成形体P)と一体化して貼り付き、
射出成形完了後に型開きを行なうと、型内から外表面に
転写フィルム100が貼着された成形品が取り出され
る。後工程において、成形体S外表面に一体化した転写
フィルム100のうちの基材フィルムのみを剥離し、絵
柄層等の転写層を成形体S側に残留させて転写層となす
ことにより絵付けが完了する。
As a result, the transfer film 100 in the female die 80 is integrally attached to the injected resin (molded body P),
When the mold is opened after completion of the injection molding, the molded product having the transfer film 100 attached to the outer surface is taken out from the inside of the mold. In a subsequent step, only the base film of the transfer film 100 integrated on the outer surface of the molded body S is peeled off, and a transfer layer such as a pattern layer is left on the molded body S side to form a transfer layer, thereby painting Is completed.

【0007】上記の記載から分かるように、このような
射出成形同時絵付け方法においては転写フィルム100
がキャビティ72の内周面に沿うように延伸せしめられ
て密着し得ること(成形性)がよい成形品を得るための
重要な要件となる。このことは、転写フィルムの代わり
にラミネートフィルムを用いる場合も同様であり、特
に、奥行きの深い金型を用いるような成形においては、
転写フィルムあるいはラミネートフィルムに深い絞りが
なされることから重要な要件となる。
As can be seen from the above description, the transfer film 100 is used in such an injection molding simultaneous painting method.
It is an important requirement for obtaining a molded product that it can be closely adhered by being stretched along the inner peripheral surface of the cavity 72 (moldability). This also applies to the case where a laminate film is used instead of the transfer film, and particularly in the case of using a deep metal mold,
This is an important requirement because the transfer film or laminate film is deeply drawn.

【0008】従来、好ましい成形性が得られるように、
転写フィルム及びラミネートフィルムの基材フィルムと
しては、熱成形性の良い、ポリ塩化ビニル(PVC)、
アクリルニトリル・ブタジエン・スレチン共重合体(A
BS)等が用いられているが、用いられる基材フィルム
と射出樹脂の組み合わせによっては、射出成形時に基材
フィルムの熔融温度あるいは融点TM よりも射出樹脂の
温度TN (後記するように実質的に射出熔融樹脂のノズ
ル温度と同等)が高くなる(TN ≧TM )場合が多く生
じ(表1及び表2参照、例えば、基材フィルムとしてP
VCフィルムを用い、射出樹脂としてABS樹脂を用い
る場合、PVCの融点又は熔融温度TMは約170℃程
度であり、ABS樹脂の通常の成形時のノズル温度TN
は約200〜260℃であり、明らかにTN ≧TM とな
っている)、その場合に、射出熔融樹脂の熱及び圧力に
より、絵付けフィルムに変形、流動、破れ等が生じがち
であった。
Conventionally, in order to obtain preferable moldability,
As the base film of the transfer film and the laminate film, polyvinyl chloride (PVC), which has good thermoformability,
Acrylonitrile / butadiene / thretin copolymer (A
BS) or the like, but depending on the combination of the base film and the injection resin used, the injection resin temperature T N (substantially as described below) rather than the melting temperature or melting point T M of the base film during injection molding. In many cases, the nozzle temperature of the injection-melting resin becomes higher (T N ≧ T M ). (See Tables 1 and 2)
When a VC film is used and an ABS resin is used as the injection resin, the melting point or melting temperature T M of PVC is about 170 ° C., and the nozzle temperature T N during normal molding of the ABS resin is
Is about 200 to 260 ° C., and T N ≧ T M ). In that case, the painting film is apt to be deformed, flowed, or torn due to the heat and pressure of the injected molten resin. It was

【0009】すなわち、射出成形時に絵付きフィルムの
絵柄面に射出樹脂の熱が伝達されるが、その際に金型か
らの冷却が効率よく行われる場合には、射出樹脂が絵付
きフィルムに接触すると同時に樹脂は固化し、絵付きフ
ィルムに変形、流動、破れ等が生じるのを防ぐことがで
きるが、金型からの冷却が不十分な場合あるいは特に絵
付きフィルムが厚く熱伝導率が低い場合には、射出樹脂
の固化が迅速に行われず絵付けフィルム表面との間で樹
脂が動く場合があり、それにより加熱軟化した印刷イン
キが樹脂に押し流される。さらには、金型内の剪断発熱
の大きい場所(広い所から狭い所へ樹脂が流れていくよ
うな箇所)では一度固化した樹脂が再度熔融して流れる
場合があることや発熱量それ自体が大きいこと等から、
ポリ塩化ビニル(PVC)のように熱変形の大きい(成
形性の良い)フィルムを基材フィルムとして用いた絵付
きフィルムの場合に、フィルム自体が変形し流れだす
(熔融する)現象が生じている。
That is, the heat of the injection resin is transferred to the pattern surface of the painting film during the injection molding, but if the cooling from the mold is performed efficiently at that time, the injection resin contacts the painting film. At the same time, the resin solidifies, and it is possible to prevent deformation, flow, breakage, etc. of the painting film, but when cooling from the mold is insufficient or especially when the painting film is thick and has low thermal conductivity. In some cases, the injection resin may not solidify rapidly and the resin may move between the surface of the painting film and the printing ink that has been softened by heating, and the printing ink is washed away by the resin. Furthermore, in a place where the shear heat generation is large in the mold (where the resin flows from a wide place to a narrow place), the resin once solidified may melt and flow again, and the calorific value itself is large. From things such as
In the case of a painted film using a film with large thermal deformation (good moldability) such as polyvinyl chloride (good formability) as a substrate film, the film itself deforms and begins to flow (melt). .

【0010】このような不都合を解消するために、例え
は特公平2−42080号公報に記載のように、Tmk
高い2軸延伸ポリエステルフィルム又は2軸延伸ナイロ
ンフィルムを絵付けフィルム(転写フィルム)の基材フ
ィルムとして用いることが提案されており、この場合に
は表1及び表2に示すように、TN <TM なる条件下で
成形することが可能となる。
In order to eliminate such inconvenience, for example, as disclosed in Japanese Patent Publication No. 2-4080, Tmk
It has been proposed to use a highly biaxially stretched polyester film or a biaxially stretched nylon film as a base film for a painting film (transfer film). In this case, as shown in Tables 1 and 2, T N < It becomes possible to perform molding under the condition of T M.

【0011】また、実公平4−5358号公報に記載の
ように、熱成形性の良好なポリ塩化ビニルの表面にポリ
塩化ビニルより耐熱性の高いナイロン66等のフィルム
を貼合わせたものを転写フィルムの基材フィルムとして
用い、成形時にはその耐熱性の高いフィルム側を射出熔
融樹脂と接する側として用いるようにすることが提案さ
れている。
Further, as described in Japanese Utility Model Publication No. 4-5358, transfer is made by bonding a film of nylon 66 or the like having higher heat resistance than polyvinyl chloride onto the surface of polyvinyl chloride having good thermoformability. It has been proposed to use it as a base film of a film, and to use the film side having high heat resistance during molding as the side in contact with the injection-melting resin.

【0012】[0012]

【発明が解決しようとする課題】上記の各提案は、成形
時に絵付けフィルムに生じがちであった絵付けフィルム
の変形、流動、破れ等の問題はある程度解消するもので
あるが、2軸延伸ポリエステルフィルム又は2軸延伸ナ
イロンフィルムはポリ塩化ビニルに比べ熱成形性に劣
り、成形金型の凹凸の段差が大きい場合、曲率半径の小
さいRを有する場合、絞り比が大きい場合等に、絵付け
フィルムが十分金型形状に沿わない場合があり極端な場
合にはフィルムが破損することも生じている。また、金
型の形状、寸法あるいは射出樹脂の種類等の条件によっ
ては、成形時にTN ≧TM の条件で成形せざるを得ない
場合も生じうる。
The above-mentioned proposals solve the problems such as deformation, flow, and tear of the painting film, which tend to occur in the painting film at the time of molding, to some extent, but the biaxial stretching is performed. A polyester film or a biaxially stretched nylon film is inferior in thermoformability to polyvinyl chloride, and has a large unevenness in the molding die, a small radius of curvature R, a large drawing ratio, etc. There are cases where the film does not follow the shape of the mold sufficiently, and in extreme cases, the film is damaged. Further, depending on conditions such as the shape and size of the mold or the type of injection resin, there may be a case where the molding must be performed under the condition of T N ≧ T M.

【0013】さらに、ポリ塩化ビニルの表面に耐熱性の
高いナイロン66等のフィルムを貼合わせたものにおい
ては、2枚の異種フィルムを貼合わせるためにその製造
工程が繁雑となり材料費も増えることからコスト高とな
りがちであり、また、貼合わせるナイロン等の耐熱性フ
ィルムはポリ塩化ビニルフィルムよりも熱変形性に劣る
ため、ポリ塩化ビニルフィルム本来の良好な熱成形性を
十分生かしきれないものとなっている。この絵付けフィ
ルムにおいても、前記のものと同様に、場合によっては
N ≧TM の条件で成形せざるを得ない場合も生じうる
(表1及び表2参照)。
Further, in the case where a film such as nylon 66 having a high heat resistance is laminated on the surface of polyvinyl chloride, two different films are laminated, so that the manufacturing process is complicated and the material cost is increased. The cost tends to be high, and the heat-resistant film such as the laminated nylon is inferior in heat deformability to the polyvinyl chloride film, so that the good thermoformability inherent in the polyvinyl chloride film cannot be fully utilized. ing. In the case of this painting film, as in the case of the above-mentioned one, in some cases, it may be necessary to form under the condition of T N ≧ T M (see Table 1 and Table 2).

【0014】本発明の目的は、従来の射出成形同時絵付
け方法において用いられる絵付けフィルムが持つ上記の
ような不都合を解消した絵付けフィルム及びその絵付け
フィルムを用いた射出成形同時絵付け方法を開示するこ
とにあり、より具体的には、十分な成形性を持つもので
ありながら、射出する熔融樹脂の温度をTN 〔℃〕、絵
付けフィルムの基材フィルムの融点(又は熔融温度)を
M 〔℃〕としたときに、TN ≧TM なる条件で射出成
形する場合であっても、射出熔融樹脂の熱あるいは圧力
により絵柄あるいはフィルムの変形、流動、破れ等が生
じることのない絵付けフィルム及びそれを用いた射出成
形同時絵付け方法を開示することにある。また、本発明
の他の目的は製造が容易でありかつ材料費も低減できる
絵付けフィルムを開示することにある。
An object of the present invention is to eliminate the above-mentioned disadvantages of the painting film used in the conventional injection molding simultaneous painting method and the injection molding simultaneous painting method using the painting film. More specifically, the temperature of the molten resin to be injected is T N [° C.], the melting point of the base film of the painting film (or the melting temperature) while maintaining sufficient moldability. ) Is T M [° C.], even if injection molding is performed under the condition of T N ≧ T M, the pattern or film may be deformed, flowed, or torn due to heat or pressure of the injection-melting resin. Disclosed is a non-painting film and a simultaneous injection-molding painting method using the same. Another object of the present invention is to disclose a painting film which is easy to manufacture and can reduce the material cost.

【0015】[0015]

【課題を解決するための手段】上記の課題を解決しかつ
目的を達成するために、本発明者らは射出成形同時絵付
け方法について多くの実験と研究を行った。まず、射出
成形同時絵付けにおいて、TN ≧TM の成形条件下で成
形を行わざるを得ない場合を避けることができないこと
を前提とし、TN ≧TM の成形条件下で絵付けフィルム
に変形、流動、破れ等が生じないようにするために、絵
付けフィルムの基材フィルムの厚さΔxを厚くすること
を試みた。それにより、基材フィルムの熱容量が増大し
て温度上昇速度が低下し、かつ基材フィルム自体の強度
も増大することから、フィルムの変形等を解消できるも
のと考えた。しかし、実験からは単に基材フィルムの厚
さΔxを厚くすることでは満足な結果を得られなかっ
た。それは厚さの厚い基材フィルムはそれだけフィルム
表裏間の温度勾配が低くなり同じ熱伝導率であってもも
熱流密度が低下し、フィルム温度はより急速に上昇する
ことに起因すると推定された。
In order to solve the above problems and achieve the object, the present inventors have conducted many experiments and researches on the injection molding simultaneous painting method. First, decorating film in an injection-mold painting, assume that it is impossible to avoid the case where forced to perform molding in the conditions of T N ≧ T M, the molding conditions of T N ≧ T M In order to prevent deformation, flow, breakage, and the like, it was attempted to increase the thickness Δx of the base film of the painting film. As a result, the heat capacity of the base film is increased, the rate of temperature rise is decreased, and the strength of the base film itself is increased, so that it is considered that deformation of the film can be eliminated. However, from the experiments, satisfactory results could not be obtained by simply increasing the thickness Δx of the base film. It was presumed that the thicker base film had a lower temperature gradient between the front and back of the film, lowering the heat flow density even with the same thermal conductivity, and increasing the film temperature more rapidly.

【0016】そこで、さらに実験と論理的考察を継続し
て行った。まず、図3に示すように絵付けフィルムが金
型と射出充填された熔融樹脂との間に挟まれている状態
を単位断面積部分だけ取り出したモデルについて考察し
た。すなわち、絵付けフィルムF内で、(熔融樹脂R)
→(絵付けフィルムF)→(金型C)の方向に移動する
熱流密度QF [cal/cm2.sec] は、絵付けフィルムの熱伝
導率κ、温度勾配∂T/∂x、熔融樹脂温度TN 、金型
温度To 、絵付けフィルム厚みΔxとすると、 QF =κ・∂T/∂x≒κ(TN −To )/Δx ・・・・・・(1)
Therefore, further experiments and logical consideration were continued. First, as shown in FIG. 3, a model in which only a unit cross-section area is taken out of a state in which a painting film is sandwiched between a mold and a molten resin filled by injection is considered. That is, in the painting film F, (melt resin R)
→ (Painting film F) → (Mold C) Heat flow density Q F [cal / cm 2 .sec] is the thermal conductivity κ of the painting film, temperature gradient ∂T / ∂x, melting Assuming that the resin temperature T N , the mold temperature T o , and the painting film thickness Δx, Q F = κ · ∂T / ∂x≈κ (T N −T o ) / Δx (1)

【0017】一方、熔融樹脂から絵付けフィルムに流入
する熱流密度をQIN、絵付けフィルムから金型へ流出す
る熱流密度をQOUT とすると、熔融樹脂、絵付けフィル
ム、金型の3者で、熱伝導率、比熱、温度等の条件も異
なるため、成形途中においては一般に熱平衡状態ではな
く、QIN≠QF ≠QOUT であり、QIN−QOUT の分だけ
の熱量が単位時間当たり絵付けフィルム内に貯えられ温
度が上昇する。この温度上昇ΔTは、絵付けフィルムの
比熱をC[cal/℃.g] 、密度をρ[g/cm3] とすると、 ΔT=(QIN−QOUT )/CρΔx ・・・・・・(2) ここで、フィルムの厚みΔxのフィルム温度への寄与を
見ると式(1) と式(2)とでは逆方向に作用していること
が分かる。
On the other hand, when the heat flow density flowing from the molten resin into the painting film is Q IN and the heat flow density flowing out from the painting film to the mold is Q OUT , the three factors of the molten resin, the painting film and the mold are obtained. Since the conditions such as thermal conductivity, specific heat, and temperature are also different, Q IN ≠ Q F ≠ Q OUT is not generally in the process of molding, and the heat quantity corresponding to Q IN -Q OUT is per unit time. It is stored in the painting film and the temperature rises. This temperature rise ΔT is ΔT = (Q IN −Q OUT ) / CρΔx, where C [cal / ° C.g] is the specific heat of the painting film and ρ [g / cm 3 ] is the density. (2) Looking at the contribution of the film thickness Δx to the film temperature, it can be seen that the equations (1) and (2) act in opposite directions.

【0018】すなわち、今、フィルム厚Δxを小さく
(薄く)する場合について考えると、式(1) より、フィ
ルムに入った熱量は速やかに金型側へ排出され温度低下
方向に向かうが、一方式(2) より、熱容量(CρΔx)
が小さくなるため温度上昇に向かうことが分かる。逆
に、フィルム厚Δxを大きく(厚く)する場合について
考えると、式(1) より、フィルムに入った熱量は停滞し
温度上昇に向かうが、一方式(2) より、熱容量(CρΔ
x)が増加するため温度低下に向かうことが分かる。
That is, considering the case where the film thickness Δx is reduced (thinned) now, according to the formula (1), the amount of heat entering the film is promptly discharged to the mold side in the direction of decreasing the temperature. From (2), the heat capacity (CρΔx)
It can be seen that the value increases as the temperature decreases. On the contrary, considering the case of increasing (thickening) the film thickness Δx, the heat quantity entering the film stagnates and the temperature rises according to the formula (1), but the heat capacity (CρΔ
It can be seen that x) increases and the temperature decreases.

【0019】いずれの場合も、式(1) の効果と式(2) の
効果と、どちらの寄与が大きいかにより、絵付けフィル
ムの温度は決定される。式(1) と式(2) の両者の寄与を
総合的に評価して、温度Tの空間(x,y,z) 分布及び時間
(t) による変化を正確に求めるには、熱伝導方程式 κ/cρ∇2 T=∂T/∂t ・・・・・・(3) を所定の初期条件、境界条件の下に解けばよいが、複雑
な金型形状と熔融樹脂の流入状態について解くことは難
しい。
In either case, the temperature of the painting film is determined by the contribution of the effect of equation (1) and the effect of equation (2), whichever is larger. By comprehensively evaluating the contributions of both equations (1) and (2), the spatial (x, y, z) distribution of temperature T and time
In order to accurately obtain the change due to (t), the heat conduction equation κ / cρ ∇ 2 T = ∂T / ∂t ··· (3) should be solved under given initial conditions and boundary conditions. However, it is difficult to solve the complicated mold shape and the inflow state of the molten resin.

【0020】そこで、本発明者らは、様々なκ、C、
ρ、Δxを持つ樹脂フィルムについて、様々な射出樹脂
の温度TN 、金型温度To で成形を行い、実験的に絵付
けフィルムが変形、流動、流れ等の問題を生じないため
の条件を求めた結果、最初に予想したのとは逆に、両金
型表面温度を絵付けフィルムの熱変形温度〔TD1〕及び
射出樹脂の熱変形温度〔TD2〕のいずれよりも低い温度
に維持した状態で成形する場合には、通常使用される樹
脂フィルム及び通常の射出条件下(すなわち、κ=1×
10-4〜13×10-4〔cal/sec.cm. ℃〕程度、Δx=
10〜500μm程度、C=0.2〜0.6〔cal/℃.g〕、
ρ=0.9〜1.5〔g/cm3 〕、TN =180〜280
℃、T=100〜280℃程度)においては、式(2)
より式(1)の寄与が大きく、フィルム厚Δxはむしろ
従来想定していたものよりも薄い方が射出熔融樹脂によ
る流動等の変形は少なくなることを見い出した。
Therefore, the present inventors have proposed various κ, C,
A resin film having ρ and Δx is molded at various injection resin temperatures T N and mold temperatures T o , and experimentally set conditions for preventing problems such as deformation, flow and flow of the painting film. results obtained, contrary to the expected first, maintaining the molds surface temperature to a temperature lower than either of the painting heat distortion temperature [T D1] and heat distortion temperature of the injected resin film [T D2] When molded in this state, the resin film normally used and the usual injection conditions (ie, κ = 1 ×
About 10 −4 to 13 × 10 −4 [cal / sec.cm. ° C.], Δx =
10 to 500 μm, C = 0.2 to 0.6 [cal / ° C.g],
ρ = 0.9 to 1.5 [g / cm 3 ], T N = 180 to 280
C, T = about 100 to 280 ° C.), the formula (2)
It has been found that the contribution of the equation (1) is larger, and that the film thickness Δx is rather thinner than what is conventionally assumed, the deformation such as the flow due to the injection molten resin is reduced.

【0021】また、その厚みΔxは、フィルムの熱伝導
率κにも依存し、κ/Δxが絵付けフィルムの流動等の
変形を支配するパラメータとなり、一般に、 κ/Δx≧3.0×10-2〔cal/sec.cm2.℃〕 にとれば、TN ≧TM の場合であっても、絵付けフィル
ム及びそれによって付与される絵柄等意匠に問題となる
ように変形等が生じるのを解消できることを知見した。
The thickness Δx also depends on the thermal conductivity κ of the film, and κ / Δx is a parameter that governs deformation such as flow of the painting film. Generally, κ / Δx ≧ 3.0 × 10 At -2 [cal / sec.cm 2. ° C], even if T N ≥T M , deformation or the like occurs, which causes problems in the design such as the painting film and the design given by it. It was found that the problem can be solved.

【0022】本発明は、上記の知見に基づくものであ
り、基本的に、射出する熔融樹脂の温度をTN 〔℃〕、
絵付けフィルムの融点(又は熔融温度)をTM 〔℃〕と
したときに、TN ≧TM なる条件で射出成形同時絵付け
方法において、絵付けフィルムとして、κ/Δx≧3.0
×10-2〔cal/sec.cm2.℃〕(κ:フィルムの熱伝導率
〔cal/sec.cm2.℃〕、Δx:フィルムの厚み〔cm〕)を
満足する絵付けフィルムを選択して用い、かつ、両金型
表面温度を絵付けフィルムの熱変形温度〔TD1〕及び射
出樹脂の熱変形温度〔TD2〕のいずれよりも低い温度に
冷却した状態で成形することを特徴とする射出成形同時
絵付け方法を開示する。
The present invention is based on the above findings, and basically, the temperature of the molten resin to be injected is T N [° C.],
When the melting point (or melting temperature) of the painting film is T M [° C.], in the simultaneous injection molding painting method under the condition of T N ≧ T M , κ / Δx ≧ 3.0 as the painting film.
× 10 -2 [cal / sec.cm 2. ℃] (κ: thermal conductivity of film [cal / sec.cm 2. ℃], Δx: film thickness [cm]) Select a painting film and used, and, characterized in that molding in a state of being cooled to a temperature lower than any of the thermal deformation temperature of the decorating film molds surface temperature [T D1] and thermal deformation temperature of the injected resin [T D2] An injection molding simultaneous painting method is disclosed.

【0023】それにより、絵付けフィルム内に熔融射出
樹脂から入ってくる熱量を速やかに金型側に逃がすこと
ができ、TN ≧TM なる条件で射出成形同時絵付けをす
る場合であっても、絵付けフィルムの過度の温度上昇は
防止され絵付けフィルムの変形、流動、破れ等の発生が
確実に防止される。用いる絵付けフィルムは転写フィル
ムてあってもよくラミネートフィルムであってもよい。
As a result, the amount of heat coming from the molten injection resin into the painting film can be quickly released to the die side, and in the case of simultaneous painting by injection molding under the condition of T N ≧ T M , However, excessive temperature rise of the painting film is prevented, and deformation, flow, breakage, etc. of the painting film are surely prevented. The painting film used may be a transfer film or a laminated film.

【0024】なお、転写フィルムもラミネートフィルム
も共に基材フィルム上に装飾層、転写絵柄層を有してお
り、それらの層は基材フィルムとは異なった融点(又は
熔融温度)TM ’、熱伝導率κ' 、厚みΔx' 、及び熱
変形温度〔TD ' 〕をそれぞれ有している。しかし、通
常基材フィルムに比べてこれらの層は厚み、体積等も小
さいことから、絵付けフィルムとしての上記各値を定め
るに際して、装飾層、転写絵柄層を無視して、基材フィ
ルムのみの値によっも行っても実際上は差し支えない。
しかし、装飾層、転写絵柄層の寄与が無視できない場合
には、これらの層も含めた絵付けシート全体としての、
各値を用いるようにする。
Both the transfer film and the laminated film have a decorative layer and a transfer pattern layer on the base film, and these layers have melting points (or melting temperatures) T M ', different from those of the base film. It has a thermal conductivity κ ′, a thickness Δx ′, and a thermal deformation temperature [T D ′], respectively. However, since these layers are usually smaller in thickness, volume, etc. than the base film, the decorative layer and the transfer pattern layer are ignored and only the base film is used when determining the above values as a painting film. In practice, it does not matter even if it is done according to the value.
However, when the contribution of the decorative layer and the transfer pattern layer cannot be ignored, the entire painting sheet including these layers,
Use each value.

【0025】さらに、本発明において、該絵付けフィル
ムの熱変形温度(ASTM−D−648、18kg/cm2 )を
D としたとき、両金型間に挿入した絵付けフィルム
を、T D ≦TPRE <TM 、なる温度TPRE (℃)に加熱
軟化させた後、真空成形、圧空成形、又は真空圧空成形
により、該絵付けフィルムを雌型表面に沿うよう予備成
形し、しかる後、両金型を閉じ、型締めするようにして
もよく、深絞りを必要とする場合であっても良好な射出
成形同時絵付けを行うことができる。
Further, in the present invention, the painting film
Deformation temperature of aluminum (ASTM-D-648, 18kg / cm2)
TDThen, a painting film inserted between both molds
To T D≤TPRE<TM, Temperature TPREHeated to (℃)
After softening, vacuum forming, pressure forming, or vacuum pressure forming
Pre-form the painting film so that it follows the surface of the female mold.
Shape it, then close both molds and tighten the molds
Good, good injection even when deep drawing is required
Simultaneous molding and painting can be performed.

【0026】本発明はまた、基材フィルム上に絵付け層
を積層してなる射出成形同時絵付け用フィルムであっ
て、該基材フィルムの熱伝導率κ〔cal/sec.cm. ℃〕、
厚みΔx〔μm〕、融点(又は熔融温度)をT
M 〔℃〕、射出する熔融樹脂の温度をT N 〔℃〕とした
とき、TM ≦TN 、κ/Δx≧3.4×10-2〔cal/sec.
cm2.℃〕、の条件を満たす射出成形同時絵付け用フィル
ムをも開示する。このフィルムは単層のフィルムで十分
目的を達成することができることから製造も容易となり
かつ製作コストも低減できる。
The present invention also provides a coating layer on the substrate film.
A film for simultaneous injection molding and painting
The thermal conductivity κ [cal / sec.cm. ° C.] of the base film,
Thickness Δx [μm], melting point (or melting temperature) is T
M[° C], the temperature of the molten resin to be injected is T N[° C]
When TM≤TN, Κ / Δx ≧ 3.4 × 10-2(Cal / sec.
cm2Filling for simultaneous injection molding painting
Will also disclose. A single layer film is sufficient for this film
Because it can achieve the purpose, it is easy to manufacture.
Moreover, the manufacturing cost can be reduced.

【0027】なお、本発明において、射出熔融樹脂温度
N は現象的にみて本来絵付けフィルム近傍の樹脂温度
を利用すべきであるが実用上それは困難であることから
(熱電対をキャビティ中の絵付けフィルムから少し離れ
た所に固定し、そこへ熔融樹脂を射出することにより射
出熔融樹脂温度を測定することは不可能ではないが、成
形後に熱電対を回収することは困難であるうえ熱電対が
埋設された成形品は商品としては不良品となる)、種々
検討した結果、射出成形機のノスル部分で計測した樹脂
温度をTN とすると、計測も容易でありまた絵付けフィ
ルム近傍に到達した直後の樹脂温度とも相関が良いこと
も分かった。従って、本明細書において特に断らないか
ぎり、射出熔融樹脂温度TN としてはノズル部温度を指
すものとする。
In the present invention, the injection molten resin temperature T N should be considered as a phenomenon, and the resin temperature in the vicinity of the painting film should be originally used, but it is difficult in practical use (thermocouple is used in the cavity). It is not impossible to measure the temperature of the injected molten resin by fixing it to a place a little away from the painting film and injecting the molten resin into it, but it is difficult to collect the thermocouple after molding, and the thermoelectric Molded products with a buried pair are defective products.) As a result of various studies, if the resin temperature measured at the nozzle of the injection molding machine is T N , measurement is easy and near the painting film. It was also found that there is a good correlation with the resin temperature immediately after reaching the temperature. Therefore, in the present specification, unless otherwise specified, the injection molten resin temperature T N refers to the nozzle temperature.

【0028】また、絵付けフィルムの熱変形温度TD1
び射出樹脂の熱変形温度TD2としては、ASTM−D−64
8の18.6〔kg/cm2 〕の熱変形温度、ASTM−D−64
8の4.6〔kg/cm2 〕の熱変形温度、ViCat軟化点温度
等で評価できる。本発明の場合には、加熱軟化した樹脂
基材フィルムは金型形状に成形されるため、ASTM−D−
648の18.6〔kg/cm2 〕の熱変形温度を採用するの
が好ましい。
Further, as the heat deformation temperature T D2 of the heat deformation temperature T D1 and injection resin decorating film, ASTM-D-64
No. 8 18.6 [kg / cm 2 ] heat distortion temperature, ASTM-D-64
8 can be evaluated by the heat distortion temperature of 4.6 [kg / cm 2 ] and the ViCat softening point temperature. In the case of the present invention, since the heat-softened resin base material film is formed into a mold shape, ASTM-D-
A heat distortion temperature of 18.6 [kg / cm 2 ] of 648 is preferably adopted.

【0029】また、本発明においてTM 値は対象となる
フィルムの種類に応じて異なったものを用いる。すなわ
ち、一般に、結晶化度の高い樹脂の場合は明確な融点を
持っており、この場合には融点温度をTM とする。非晶
質又は結晶化度の低い樹脂は温度上昇と共に漸次流動性
が増し、明確な液相−固相間の相移転温度を有しない。
この場合には、十分な流動性を持ち明らかに液状となっ
たと見なしうる最低の温度をTM 値とする。通常、熔融
温度と呼称されている温度がこれに当たる。
In the present invention, different T M values are used depending on the type of target film. That is, generally, a resin having a high crystallinity has a clear melting point, and in this case, the melting point temperature is T M. Amorphous or low crystallinity resins gradually increase in fluidity with increasing temperature and do not have a clear liquid-solid phase transition temperature.
In this case, the lowest temperature at which the liquid has sufficient fluidity and can be considered to be obviously liquid is defined as the T M value. Usually, this is what is called the melting temperature.

【0030】本発明において、絵付けフィルムは前記の
ようにラミネートフィルムと転写フィルムの2態様であ
ってよい。ラミネートフィルムは基材フィルム上に、印
刷、塗装、エンボス、金属蒸着等の手法により装飾を付
与したものであり、射出成形と同時に成形品表面に接着
一体化し、そのまま最終形態として使用される。装飾層
を基材フィルム側に設けるか成形品と反対側に設けるか
は任意であるが、普通は装飾層を成形品側に向けてラミ
ネート(貼合わせ)し、基材フィルムを表面保護膜とし
て利用する。転写フィルムは基材フィルムを支持体フィ
ルムとし、この上に再剥離可能な程度の接着力で転写絵
柄層を形成したものであり、転写絵柄層は、印刷、塗
装、蒸着等を用いて形成される。転写フィルムの場合
は、必ず転写層側が射出樹脂側(キャビティ側、あるい
は成形品側でもある)を向くようにして金型間に挿入さ
れる。転写フィルムを成形品表面に射出成形と同時に張
り合わせた後、基材フィルム(又は基材フィルム/離型
層)のみ剥離除去し、成形品表面には転写絵柄層のみが
残される。
In the present invention, the painting film may be of two modes, that is, a laminate film and a transfer film as described above. The laminate film is a film on which a decoration is applied by a method such as printing, painting, embossing, metal vapor deposition, and the like, which is adhered and integrated with the surface of the molded product simultaneously with injection molding, and used as it is as a final form. It is optional whether the decorative layer is provided on the base film side or on the side opposite to the molded product, but normally the decorative layer is laminated (bonded) toward the molded product side and the base film is used as the surface protective film. To use. The transfer film has a base film as a support film, and a transfer pattern layer is formed on the support film with an adhesive force such that it can be peeled off.The transfer pattern layer is formed by printing, painting, vapor deposition or the like. It In the case of a transfer film, it is inserted between the molds so that the transfer layer side always faces the injection resin side (also the cavity side or the molded product side). After the transfer film is bonded to the surface of the molded product at the same time as the injection molding, only the base film (or the base film / release layer) is peeled off to leave only the transfer pattern layer on the surface of the molded product.

【0031】本発明が有効に機能する射出熔融樹脂と絵
柄フィルムの基材フィルムとの組み合わせの代表例を表
1ないし表4に示した(特に、表3及び表4におけるΔ
x参照)。なお、表における樹脂名の略称は以下の通り
である。 PVC ポリ塩化ビニル PS ポリスチレン ABS アクリロニトリル・ブタジエン・スチレン共重合体 AS アクリロニトリル・スチレン共重合体 PP ポリプロピレン PMMA ポリメタアクリル酸メチル NYLON−66 ナイロン−66 PBT ポリブチレンテレフタレート PET ポリエチレンテレフタレート
Representative examples of combinations of the injection-melting resin and the base film of the picture film, which the present invention effectively functions, are shown in Tables 1 to 4 (in particular, Δ in Tables 3 and 4).
x). The abbreviations of resin names in the table are as follows. PVC Polyvinyl chloride PS Polystyrene ABS Acrylonitrile-butadiene-styrene copolymer AS Acrylonitrile-styrene copolymer PP polypropylene PMMA polymethylmethacrylate NYLON-66 nylon-66 PBT polybutylene terephthalate PET polyethylene terephthalate

【0032】本発明において、金型での冷却温度は、金
型内部に冷却水を流す等の方法により所定の温度に保持
することができる。また、金型は効率よく冷却できるよ
う、鉄、ステンレス鋼の鉄合金、銅、黄銅等の銅合金、
等の熱伝導率の高い金属を用いる(必要に応じて表面に
クロム等のメッキを施す)ことが望ましい。設定温度
は、成形が完了し金型を開いて成形品及びこれに接着し
た絵付けフィルムを取り出すことが可能となるよう、絵
付けフィルムの基材フィルム及び射出樹脂の熱変形温度
よりは低い温度に設定する。金型の冷却設定温度を低く
するほど、絵付けフィルムの熱による流動等を押さえる
上では効率的てはあるが、射出樹脂の金型内での過度の
急冷による射出樹脂の金型内への流動不良や、ウエルド
ラインの発生、成形品内部の残留応力等を防ぐため、金
型温度は低くても室温(20℃程度)以上に保つことが
好ましい。
In the present invention, the cooling temperature of the mold can be maintained at a predetermined temperature by flowing cooling water into the mold. In addition, the mold can be cooled efficiently by iron, iron alloy of stainless steel, copper, copper alloy such as brass,
It is desirable to use a metal having a high thermal conductivity such as, for example, (plating the surface with chromium or the like if necessary). The set temperature is lower than the heat distortion temperature of the base film of the painting film and the injection resin so that the molding can be completed and the mold can be opened and the molded product and the painting film adhered to it can be taken out. Set to. Although lowering the mold cooling setting temperature is more effective in suppressing the flow of paint film due to heat, etc., the injection resin will not be cooled into the mold by excessive quenching in the mold. In order to prevent poor flow, generation of weld lines, residual stress inside the molded product, etc., it is preferable to keep the mold temperature at room temperature (about 20 ° C.) or higher.

【0033】本発明の実施に際して、絵付けフィルムの
厚さが極端に薄くなると、フィルムが破れ易くなり、ま
たしわ等の変形もし易くなる。従って、このような問題
が生じない程度のフィルム厚は確保する必要があり、Δ
xの下限値は、フィルムの樹脂の種類、フィルムの取り
扱い方、成形条件(温度、圧力)によって異なるが、通
常、20μm以上は確保することが望まれる。
In the practice of the present invention, if the thickness of the painting film becomes extremely thin, the film is likely to be torn, and wrinkles and other deformations are likely to occur. Therefore, it is necessary to secure a film thickness that does not cause such a problem.
The lower limit of x varies depending on the type of resin in the film, how to handle the film, and molding conditions (temperature, pressure), but normally it is desired to secure at least 20 μm.

【0034】[0034]

【表1】 [Table 1]

【0035】[0035]

【表2】 [Table 2]

【0036】[0036]

【表3】 [Table 3]

【0037】[0037]

【表4】 [Table 4]

【0038】[0038]

【実施例】以下、実施例により本発明を説明する。 〔実施例及び比較例1〕 次のフィルムを用意した。 (a)可塑剤を10重量部添加した半硬質タイプの厚さ
50μm(=0.5×10 -2〔cm〕)のPVCフィルム
(本発明の実施例)。 PVCフィルム:融点(又は熔融温度)TM =170
℃、熱変形温度TD1=70℃、熱伝導率κ=3.4×10
-4〜4.0×10-4〔cal/sec.cm. ℃〕 すなわち、κ/Δx=3.4×10-4〜4.0×10-4/0.
5×10-2=6.9×10-2〜×8.1×10-2>3.0×1
-2〔cal/sec.cm2.℃〕 (b)(a)と同じPVCフィルムであるが、厚さが1
50μm(=1.5×10 -2〔cm〕)のもの(比較例)。
このフィルムは、κ/Δx=2.3×10-2〜2.7×10
-2〔cal/sec.cm2.℃〕であり、その値は3.0×10
-2〔cal/sec.cm2.℃〕より小さい。
EXAMPLES The present invention will be described below with reference to examples. Example and Comparative Example 1 The following films were prepared. (A) Thickness of semi-rigid type containing 10 parts by weight of plasticizer
50 μm (= 0.5 × 10 -2[Cm]) PVC film
(Example of the present invention). PVC film: melting point (or melting temperature) TM= 170
℃, heat distortion temperature TD1= 70 ° C, thermal conductivity κ = 3.4 × 10
-Four~ 4.0 x 10-Four[Cal / sec.cm. ° C] That is, κ / Δx = 3.4 × 10-Four~ 4.0 x 10-Four/ 0.
5 x 10-2= 6.9 x 10-2~ × 8.1 × 10-2> 3.0 × 1
0-2(Cal / sec.cm2. ° C] (b) Same PVC film as (a) but with a thickness of 1
50 μm (= 1.5 × 10 -2[Cm]) (comparative example).
This film has κ / Δx = 2.3 × 10-2~ 2.7 × 10
-2(Cal / sec.cm2. ° C], and the value is 3.0 × 10
-2(Cal / sec.cm2. ° C].

【0039】 (a)(b)のフィルムに以下の順で印刷を施し、転写フィルムとした。 (1)離型層 ウレタン 塗布量3g/m2(dry) (2)剥離層 アクリル 塗布量1g/m2(dry) (3)柄×3色 アクリル、塩酢ビ、塗布量1g/m2(dry) (4)感熱接着層 アクリル 塗布量1g/m2(dry) この転写フィルムを雌金型にキャビティに転写絵柄
層を向けて設置して、転写絵柄層側から加熱後(約10
0℃)、真空圧空成形により金型内面に沿わせて密着さ
せた。
The films of (a) and (b) were printed in the following order to obtain a transfer film. (1) Release layer urethane coating amount 3 g / m 2 (dry) (2) Release layer acrylic coating amount 1 g / m 2 (dry) (3) Pattern × 3 colors acrylic, vinyl chloride, coating amount 1 g / m 2 (Dry) (4) Heat-sensitive adhesive layer Acrylic coating amount 1 g / m 2 (dry) This transfer film was placed in a female mold with the transfer pattern layer facing the cavity, and heated from the transfer pattern layer side (about 10
(0 ° C.), and vacuum pressure molding was performed along the inner surface of the mold so as to adhere them.

【0040】 次に、金型表面温度を40℃に維持し
た状態で、雄型側から、熔融したPS樹脂(スミブライ
トM566)(熱変形温度TD2=70℃)をノズル温度
N 230℃(>TM =170℃(PVCの融点(又は
熔融温度))で射出した。冷却後、成形品を取り出して
観察した。 結果 (a)のフィルムの場合、樹脂注入ゲート部も含めて、
絵柄インキに流動や変形等はなく、良好な転写絵柄を形
成していた。 (b)のフィルムの場合、樹脂注入ゲート付近が円状に
抜けていた。また、成形形状が狭くなっている部分で
は、インキが流れると共にフィルム面もとけていた。
Next, while maintaining the mold surface temperature at 40 ° C., the molten PS resin (Sumibrite M566) (heat deformation temperature T D2 = 70 ° C.) was applied to the nozzle temperature T N 230 ° C. from the male mold side. (> T M = 170 ° C. (melting point (or melting temperature of PVC) of PVC). After cooling, the molded product was taken out and observed. In the case of the film of the result (a), the resin injection gate portion was also included.
The pattern ink did not flow or deform, and a good transferred pattern was formed. In the case of the film (b), the vicinity of the resin injection gate was missing in a circular shape. In addition, in the portion where the molding shape was narrow, the ink flowed and the film surface was damaged.

【0041】〔実施例及び比較例2〕 次のフィルムを用意した。 (a)厚さ100μm(=1.0×10-2〔cm〕)のPM
MAフィルム(本発明の実施例)。 PMMAフィルム:融点(又は熔融温度)TM =160
℃、熱変形温度TD1=68℃、熱伝導率κ=4.0×10
-4〜6.0×10-4〔cal/sec.cm. ℃〕 すなわち、κ/Δx=4.0×10-2〜×6.0×10-2
3.0×10-2〔cal/sec.cm2.℃〕 (b)(a)と同じPMMAフィルムであるが、厚さが
250μm(=2.5×10-2〔cm〕)のもの(比較
例)。このフィルムは、κ/Δx=1.6×10-2〜2.4
×10-2〔cal/sec.cm2.℃〕であり、その値は3.0×1
-2〔cal/sec.cm2.℃〕より小さい。
Example and Comparative Example 2 The following films were prepared. (A) PM with a thickness of 100 μm (= 1.0 × 10 -2 [cm])
MA film (Example of the present invention). PMMA film: melting point (or melting temperature) T M = 160
° C, heat distortion temperature T D1 = 68 ° C, thermal conductivity κ = 4.0 × 10
−4 to 6.0 × 10 −4 [cal / sec.cm. ° C.] That is, κ / Δx = 4.0 × 10 −2 to × 6.0 × 10 −2 >
3.0 × 10 -2 [cal / sec.cm 2. ℃] (b) The same PMMA film as (a), but with a thickness of 250 μm (= 2.5 × 10 -2 [cm]) (Comparative example). This film has κ / Δx = 1.6 × 10 -2 to 2.4
× 10 -2 [cal / sec.cm 2. ℃] and its value is 3.0 × 1
It is smaller than 0 -2 [cal / sec.cm 2. ℃].

【0042】 (a)(b)のフィルムに実施例及び
比較例1の印刷層のうち(3)柄3色のみを形成してラ
ミネートフィルムとし、実施例及び比較例1と同様にし
て射出成形同時絵付けを行い、冷却後、成形品を取り出
して観察した。 結果 (a)のフィルムの場合、樹脂注入ゲート部も含めて、
絵柄インキに流動や変形等はなく、良好な絵柄を形成し
ていた。 (b)のフィルムの場合、樹脂注入ゲート付近のインキ
が流れて、外観上うすく見えていた。
In the same manner as in Example and Comparative Example 1, injection molding was carried out in the same manner as in Example and Comparative Example 1 by forming (3) only three colors of the pattern among the printing layers of Example and Comparative Example 1 on the film of (a) and (b) to form a laminated film. Simultaneous painting was performed, and after cooling, the molded product was taken out and observed. In the case of the film of the result (a), including the resin injection gate part,
The pattern ink did not flow or deform, and a good pattern was formed. In the case of the film of (b), the ink near the resin injection gate flowed, and the appearance was light.

【0043】[0043]

【発明の効果】本発明によれば、十分な成形性を持つも
のでありながら、射出熔融樹脂の熱あるいは圧力により
絵柄あるいはフィルムの変形、流動、破れ等が生じるこ
とのなく、かつ製造が容易でありかつ材料費も低減でき
る絵付けフィルム、及び該絵付けフィルムにより絵付け
された成形品を得ることができる。
EFFECTS OF THE INVENTION According to the present invention, although it has sufficient moldability, the pattern or film is not deformed, flowed, or broken by the heat or pressure of the injection molten resin, and the production is easy. In addition, it is possible to obtain a painting film that can reduce the cost of materials and a molded article painted with the painting film.

【図面の簡単な説明】[Brief description of drawings]

【図1】射出成形同時絵付け方法による成形工程を示す
図。
FIG. 1 is a diagram showing a molding process by an injection molding simultaneous painting method.

【図2】射出成形同時絵付け方法による成形工程を示す
図。
FIG. 2 is a diagram showing a molding process by an injection molding simultaneous painting method.

【図3】絵付けフィルム、金型、射出充填された熔融樹
脂との間の熱の授受を説明する図。
FIG. 3 is a diagram illustrating heat transfer between a painting film, a mold, and a molten resin that is injection-filled.

【符号の説明】[Explanation of symbols]

70…雌金型、72…キャビティ、80…雄金型、84
…ゲート、90…熱盤、100…転写フィルム、P…熔
融樹脂
70 ... Female mold, 72 ... Cavity, 80 ... Male mold, 84
... Gate, 90 ... Hot platen, 100 ... Transfer film, P ... Molten resin

Claims (6)

【特許請求の範囲】[Claims] 【請求項1】 キャビティ空間を形成する雌型と雄型と
を開き、両金型間に少なくとも絵柄層及び基材フィルム
とを持つ絵付けフィルムを挿入し、両金型を絵付けフィ
ルムを間に挟んで閉じ型締めし、ゲートより熔融樹脂を
キャビティ内に射出充填し、冷却固化させることによ
り、射出された樹脂の表面に該絵付けフィルムを接着一
体化させ、しかるのち両金型を開き、表面に絵付けがな
された成形品を得る射出成形同時絵付け方法において、 射出する熔融樹脂の温度をTN 〔℃〕、また、絵付けフ
ィルムの融点(又は熔融温度)をTM 〔℃〕として、T
N ≧TM なる温度TN の熔融樹脂を射出すること、 該絵付けフィルムの熱伝導率κ〔cal/sec.cm2.℃〕、厚
みΔx〔cm〕としたとき、絵付けフィルムとして、κ/
Δx≧3.0×10-2〔cal/sec.cm2.℃〕の条件を満たす
絵付けフィルムを用いること、及び、 該両金型の表面温度を絵付けフィルムの熱変形温度〔T
D1〕及び射出樹脂の熱変形温度〔TD1〕のいずれよりも
低い温度に冷却して成形すること、を特徴とする射出同
時絵付け方法。
1. A female mold and a male mold that form a cavity space are opened, a painting film having at least a picture layer and a base film is inserted between the two dies, and the two dies are placed between the painting films. The mold is closed and clamped, the molten resin is injected and filled into the cavity from the gate, and by cooling and solidifying, the painting film is bonded and integrated on the surface of the injected resin, and then both molds are opened. In the simultaneous injection-molding painting method for obtaining a molded article whose surface is painted, the temperature of the molten resin to be injected is T N [° C], and the melting point (or melting temperature) of the painting film is T M [° C]. ] As T
When a molten resin having a temperature T N of N ≧ T M is injected, and the thermal conductivity κ [cal / sec.cm 2. ° C.] and the thickness Δx [cm] of the painting film are used, the painting film is κ /
The use of a painting film satisfying the condition of Δx ≧ 3.0 × 10 −2 [cal / sec.cm 2. ° C.], and the surface temperature of both molds is set to the heat deformation temperature [T
D1 ] and the heat distortion temperature [T D1 ] of the injection resin, and the molding is performed by cooling to a temperature lower than both of them.
【請求項2】 該絵付けフィルムとして、基材フィルム
上に転写絵柄層を積層してなる転写フィルムを用い、金
型間に絵付けフィルムを挿入する際、転写絵柄層側をキ
ャビティ空間側に向け、両金型間から成形品を取り出し
て後、基材フィルムのみを成形品から剥離除去すること
を特徴とする請求項1記載の射出同時絵付け方法。
2. A transfer film obtained by laminating a transfer pattern layer on a substrate film is used as the decorating film, and when the decorating film is inserted between the molds, the transfer pattern layer side is set to the cavity space side. 2. The injection simultaneous painting method according to claim 1, wherein after the molded product is taken out from between the two molds, only the base film is peeled off from the molded product.
【請求項3】 該絵付けフィルムの熱変形温度をT
D1〔℃〕とするとき、両金型間に挿入する絵付けフィル
ムを、TD1≦TPRE <TM である温度TPRE (℃)に加
熱軟化させて、真空成形、圧空成形、又は真空圧空成形
により、該絵付けフィルムを雌型表面に沿うよう予備成
形し、しかる後、両金型を閉じ、型締めすることを特徴
とする請求項1記載の射出同時絵付け方法。
3. The heat distortion temperature of the painting film is T
When D1 [° C] is set, the painting film to be inserted between both molds is softened by heating to a temperature T PRE (° C) where T D1 ≤ T PRE <T M , and vacuum forming, pressure forming, or vacuum forming is performed. 2. The injection simultaneous painting method according to claim 1, wherein the painting film is preformed along the surface of the female mold by pressure molding, and then both molds are closed and the mold is clamped.
【請求項4】 該絵付けフィルムの熱変形温度〔TD1
が、ASTM−D−648、18.6kg/cm2 での値であるこ
とを特徴とする請求項3記載の射出同時絵付け方法。
4. The heat distortion temperature [T D1 ] of the painting film.
Is a value at ASTM-D-648, 18.6 kg / cm < 2 >, The injection simultaneous painting method according to claim 3, wherein
【請求項5】 前記絵付けフィルムの融点(又は熔融温
度)TM 、熱伝導率κ、厚みΔx、及び熱変形温度〔T
D1〕が、それぞれ絵付けフィルムを構成する基材フィル
ムの融点(又は熔融温度)TM 、熱伝導率κ、厚みΔ
x、及び熱変形温度〔TD1〕がであることを特徴とする
請求項1ないし4いずれか記載の射出同時絵付け方法。
5. The melting point (or melting temperature) T M , the thermal conductivity κ, the thickness Δx, and the heat distortion temperature [T of the painting film.
D1 ] is the melting point (or melting temperature) T M , the thermal conductivity κ, and the thickness Δ of the base film that respectively constitutes the painting film.
5. The simultaneous injection painting method according to claim 1, wherein x and heat distortion temperature [T D1 ] are
【請求項6】 基材フィルム上に転写絵柄層を積層して
なる射出成形同時絵付け用フィルムであって、該基材フ
ィルムの熱伝導率κ〔cal/sec.cm. ℃〕、厚みΔx〔c
m〕、融点(又は熔融温度)をTM 〔℃〕、射出する熔
融樹脂の温度をTN 〔℃〕としたとき、 TN ≧TM 、κ/Δx≧3.0×10-2〔cal/sec.cm2.
℃〕、 の条件を満たすことを特徴とする射出成形同時絵付け用
フィルム。
6. A film for simultaneous injection-molding, comprising a transfer film layer laminated on a base film, wherein the base film has a thermal conductivity κ [cal / sec.cm. ° C.] and a thickness Δx. [C
m], the melting point (or melting temperature) is T M [° C.], and the temperature of the molten resin to be injected is T N [° C.], T N ≧ T M , κ / Δx ≧ 3.0 × 10 −2 [ cal / sec.cm 2
℃], the film for simultaneous injection molding painting, which satisfies the condition of
JP15088993A 1993-06-22 1993-06-22 Injection molding simultaneous painting method and painting film used therefor Expired - Lifetime JP2725735B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
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Application Number Priority Date Filing Date Title
JP15088993A JP2725735B2 (en) 1993-06-22 1993-06-22 Injection molding simultaneous painting method and painting film used therefor

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Publication Number Publication Date
JPH079484A true JPH079484A (en) 1995-01-13
JP2725735B2 JP2725735B2 (en) 1998-03-11

Family

ID=15506602

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Country Status (1)

Country Link
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Cited By (10)

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Publication number Priority date Publication date Assignee Title
WO1997030117A1 (en) * 1996-02-16 1997-08-21 Sumitomo Chemical Company, Limited Acrylic film and moldings made using the same
US6444298B1 (en) 1999-03-05 2002-09-03 Sumitomo Chemical Company, Limited Acrylic resin laminated film
US6844053B2 (en) 2001-12-14 2005-01-18 Sumitomo Chemical Company, Limited Acrylic resin film and injection molded article using the same
US6869687B2 (en) 2000-02-01 2005-03-22 Sumitomo Chemical Company, Limited Recycled plastic products
US6887572B2 (en) 1996-10-30 2005-05-03 Dai Nippon Printing Co., Ltd. Decorative sheet and sheet-decorated molding containing (meth) acrylate polymers
JP2006076276A (en) * 2004-08-10 2006-03-23 Mitsubishi Plastics Ind Ltd Insert molding mold, manufacturing method for insert molded object, and insert molded object
US7101610B2 (en) 2002-12-25 2006-09-05 Honda Motor Co. Ltd. Paint substitute film and method of applying same
WO2009151071A1 (en) 2008-06-10 2009-12-17 株式会社カネカ Fluororesin film and fluororesin-laminated acrylic resin film
WO2011102132A1 (en) 2010-02-17 2011-08-25 株式会社カネカ Fluorine-containing (meth)acrylic (co)polymer and molded body films thereof
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6147162A (en) * 1996-02-16 2000-11-14 Sumitomo Chemical Company, Limited Acrylic film and moldings made using the same
WO1997030117A1 (en) * 1996-02-16 1997-08-21 Sumitomo Chemical Company, Limited Acrylic film and moldings made using the same
US6887572B2 (en) 1996-10-30 2005-05-03 Dai Nippon Printing Co., Ltd. Decorative sheet and sheet-decorated molding containing (meth) acrylate polymers
US6444298B1 (en) 1999-03-05 2002-09-03 Sumitomo Chemical Company, Limited Acrylic resin laminated film
US6869687B2 (en) 2000-02-01 2005-03-22 Sumitomo Chemical Company, Limited Recycled plastic products
US6844053B2 (en) 2001-12-14 2005-01-18 Sumitomo Chemical Company, Limited Acrylic resin film and injection molded article using the same
US7101610B2 (en) 2002-12-25 2006-09-05 Honda Motor Co. Ltd. Paint substitute film and method of applying same
JP2006076276A (en) * 2004-08-10 2006-03-23 Mitsubishi Plastics Ind Ltd Insert molding mold, manufacturing method for insert molded object, and insert molded object
JP4508825B2 (en) * 2004-08-10 2010-07-21 三菱樹脂株式会社 Insert molding die, method of manufacturing insert molded product, and insert molded product
WO2009151071A1 (en) 2008-06-10 2009-12-17 株式会社カネカ Fluororesin film and fluororesin-laminated acrylic resin film
EP2325005A2 (en) 2008-06-10 2011-05-25 Kaneka Corporation Fluororesin-laminated acrylic resin film
WO2011102132A1 (en) 2010-02-17 2011-08-25 株式会社カネカ Fluorine-containing (meth)acrylic (co)polymer and molded body films thereof
US9365016B2 (en) 2010-02-17 2016-06-14 Kaneka Corporation Fluorine-containing (meth) acrylic (co) polymer and molded body films thereof
WO2014157149A1 (en) 2013-03-26 2014-10-02 信越化学工業株式会社 Polycarbonate resin laminate

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