CN100439527C - Gold- silver lead based alloy material containing yttrium - Google Patents
Gold- silver lead based alloy material containing yttrium Download PDFInfo
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- CN100439527C CN100439527C CNB2006100488627A CN200610048862A CN100439527C CN 100439527 C CN100439527 C CN 100439527C CN B2006100488627 A CNB2006100488627 A CN B2006100488627A CN 200610048862 A CN200610048862 A CN 200610048862A CN 100439527 C CN100439527 C CN 100439527C
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Abstract
This invention discloses a Y-containing Au-Ag-Zr alloy material, which is composed of: Au 0-60 wt.%, Zr 0.1-1.5 wt.%, Y 0.01-0.5 wt.%, and Ag; optimally, Au 1-50 wt.%, Zr 0.05-0.8 wt.%, Y 0.02-0.2 wt.%, and Ag. The alloy material can be used as electrical contact material and conductive connecting wire material.
Description
Technical field
The present invention relates to contain the Jin-Yin-zirconium-based alloy material of micro aluminate and they are in contact material field and conduction wire material Application for Field.
Background technology
Gold-silver alloy has good electrical conductivity, thermal conductivity and corrosion resistance nature, and purposes is very extensive, is often used as the conduction wire material of the light load contact material that requires high reliability and semiconductor components and devices, senser element.When gold content is 50-60 weight %, performances such as the resistivity of gold-silver alloy, tensile strength, Young's modulus and hardness reach maximum respectively, afterwards, and along with the reduction of Gold Content, the resistivity of alloy has reduced, but tensile strength, hardness and corrosion resistance nature also decrease.By in the low Au-Ag alloy of Gold Content, adding new constituent element, can improve its tensile strength and hardness, but often cause increasing considerably of resistance alloys rate.Thereby, be the key of improving Au-Ag base alloy over-all properties to the selection of alloy element kind and quantity.
Summary of the invention
The objective of the invention is to overcome the deficiency of existing alloy material, when improving strength of alloy, hardness and erosion resistance, reduce the increasing degree of resistance alloys rate, enable in contact material and conduction wire material field, to replace the higher alloy of Gold Content with the lower Au-Ag alloy of Gold Content, thereby reduce production costs, obtain tangible economic benefit.
The objective of the invention is to realize by the rare earth element yttrium that in the gold-silver alloy alloy, adds a spot of zirconium and trace.Add zirconium amount be that the Au-Ag-Zr ternary alloy phase diagram of measuring according to us is determined, it is lower than the solid solubility limit of zirconium in the Au-Ag alloy.Because the atomic radius of zirconium is bigger, and tangible solution strengthening effect is arranged.When alloy melting, the trace rare-earth element yttrium that is added can form high melting compound with detrimental impurity and the gas in the raw material, and the part of these compounds can float on molten alloy top layer slagging discharges, and has removed impurity; Another part can be distributed in alloy crystal boundary and crystal grain inside with the particulate state disperse, suppresses grain growth effectively.The intensity that comprehensively makes alloy and the corrosion resistance of above-mentioned effect all are improved.
Jin-Yin of the present invention-zirconium base alloy consist of (weight %): Au 0~60, Zr 0.1~1.5 and Y 0.01~0.5, surplus is a silver.Preferential alloying constituent of recommending is (weight %): Au 1~50, Zr 0.05~0.8 and Y 0.02~0.2, and surplus is a silver.
The present invention limits that to contain the zirconium amount be that the reason of 0.1~1.5 weight % is: the Au-Ag-Zr ternary alloy phase diagram of measuring according to us, the solid solubility of zirconium in the Au-Ag alloy increases with the increase of gold content, this solid solubility is less than 0.1 weight % in fine silver, and this solid solubility is brought up to about 1.5 weight % when gold content is 60 weight %.If the zirconium content in the alloy is approaching or surpass its solid solubility limit, make that then the lattice distortion of alloy is excessive, cause the resistance alloys rate significantly to raise.The amount of adding zirconium among the present invention generally strengthens with the increase of gold content, and for example, in gold content was 0 fine silver, the content of zirconium should not surpass 0.1 weight %, and is in the alloy of 50 weight % at gold content, and the content of zirconium should not surpass 1.2 weight %.
It is that the reason of 0.01~0.5 weight % is that the present invention limits the amount of adding the rare earth yttrium: in the present invention, if the rare earth content that is added is excessive, compound between too much friable metal to occur in the alloy, and cause resistivity rising, processing characteristics to worsen and the erosion resistance reduction.
Gold-silver alloy identical with existing Gold Content and Au-Ag-Cu alloy phase commonly used compare, and the alloy that contains zirconium and yttrium involved in the present invention has following advantage:
1. mechanical property such as hardness and tensile strength improves a lot.
2. anti-sulphur corrosion ability strengthens.Show that after the sulfidizing of similarity condition the Au-Ag alloy phase identical with Gold Content compares, the increasing amount of contact resistance is less.
3. according to the raising of a tree name over-all properties, the relatively low Au-Ag-Zr-Y alloy of available part Gold Content replaces higher Au-Ag alloy and the Au-Ag-Cu alloy of Gold Content, thereby has reduced golden consumption, makes the corresponding decline of cost of alloy.
By the amount that zirconium and yttrium in the alloy are added in change to, can adjust the over-all properties of alloy.From the listed alloy of table 1. as can be seen, the over-all properties of Jin-Yin involved in the present invention-zirconium-yittrium alloy can be respectively to be higher than their some Jin-Yin or Jin-Yin-copper alloy close with Gold Content, in actual applications, by substituting, can reduce the consumption of expensive metal gold.
Alloy of the present invention can be used for contact material and conduction wire material.
Embodiment
Embodiment 1: adopt high frequency furnace melting under the vacuum argon filling condition to obtain alloy cast ingot, carry out mechanical workout and thermal treatment.At last under argon shield in 700 ℃ annealing 20 minutes, measure its hardness, tensile strength and resistivity.For carrying out anti-curability test, sample is rolled the sheet material into thick 0.4mm, and the sample to surface finish carries out measuring contact resistance in atmosphere earlier, then sheet material is exposed to (SO in the vulcanized gas
2Concentration is 2ppm, saturated humidity, 25 ℃ of temperature), take out the contact resistance of measuring sample after sulphur corrosion with similarity condition after 10 days.Owing to can form the sulfide film of high resistivity on vulcanized gas interalloy surface, make the contact electricity resistive big, calculate the contact resistance ratio R (contact resistance before R=sulfuration back contact resistance/sulfuration) of sulfuration front and back, R is more near 1, it is slow more that the illustrative material surface forms the speed of sulfide film, stable more in vulcanized gas, the corrosion resistance of material is strong more.The performance that table 1 has been enumerated part alloy of the present invention and gold-silver alloy commonly used and Jin-Yin-copper alloy compares.
Table 1. alloy property relatively
Numbering | Alloying constituent weight % | Hardness HV | Intensity MPa | Resistivity μ Ω cm | Temperature coefficient of resistance 10 -4K -1 | Contact resistance compares R | Remarks |
1 | Ag-10Au | 24 | 150 | 3.6 | 4.5 | 4.8 | |
2 | Ag-10 Au-0.1 Zr- 0.02Y | 31 | 240 | 5.8 | 3.6 | 3.4 | The present invention |
3 | Ag-20Au | 26 | 190 | 6.0 | 2.5 | 3.3 | |
4 | Ag-20 Au-0.2 Zr- 0.04Y | 35 | 280 | 7.0 | 2.2 | 2.7 | The present invention |
5 | Ag-30Au | 28 | 210 | 7.2 | 2.0 | 2.8 | |
6 | Ag-30 Au-0.3 Zr- 0.08Y | 41 | 310 | 7.8 | 1.6 | 2.2 | The present invention |
7 | Ag-40Au | 30 | 230 | 8.5 | 1.5 | 2.2 | |
8 | Ag-40 Au-0.4 Zr- 0.1Y | 60 | 420 | 9.5 | 1.4 | 1.7 | The present invention |
9 | Ag-40 Au-1 Zr- 0.2Y | 120 | 580 | 10.5 | 1.3 | 1.9 | |
10 | Ag-50Au | 33 | 250 | 10.1 | 1.2 | 1.8 | |
11 | Ag-50 Au-30 Cu | 148 | 640 | 13.5 | 1.4 | 2.9 | |
12 | Ag-50 Au-0.5 Zr- 0.15Y | 72 | 460 | 10.8 | 1.1 | 1.4 | The present invention |
13 | Ag-60Au | 34 | 260 | 11.0 | 1.0 | 1.5 | |
14 | Ag-60 Au-5 Cu | 56 | 390 | 12.0 | 0.69 | 2.0 |
Claims (3)
1. Jin-Yin-zirconium-based alloy material that contains yttrium, it is characterized in that the weight percent of this alloy composition is: Au 1~60, Zr 0.1~1.5 and Y 0.01~0.5, surplus is Ag.
2. Jin-Yin-zirconium-based alloy material that contains yttrium as claimed in claim 1, it is characterized in that the weight percent of this alloy composition is: Au 1~50, Zr 0.1~0.8 and Y 0.02~0.2, surplus is Ag.
3. the purposes of an alloy material as claimed in claim 1 or 2 is characterized in that: this alloy is used for contact material or conduction wire material.
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CNB2006100488627A CN100439527C (en) | 2006-11-29 | 2006-11-29 | Gold- silver lead based alloy material containing yttrium |
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CNB2006100488627A CN100439527C (en) | 2006-11-29 | 2006-11-29 | Gold- silver lead based alloy material containing yttrium |
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CN1958819A CN1958819A (en) | 2007-05-09 |
CN100439527C true CN100439527C (en) | 2008-12-03 |
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CNB2006100488627A Expired - Fee Related CN100439527C (en) | 2006-11-29 | 2006-11-29 | Gold- silver lead based alloy material containing yttrium |
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Families Citing this family (3)
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CN101677170B (en) * | 2008-09-18 | 2011-09-14 | 重庆川仪自动化股份有限公司 | Sliding electrical contact material and electrical contact metal composite material |
CN110079695A (en) * | 2019-05-20 | 2019-08-02 | 杭州辰卓科技有限公司 | A kind of this spot silver alloy of the resistance to brittle failure with pearl color and its technique |
CN111020248B (en) * | 2019-12-02 | 2020-12-18 | 上海航天精密机械研究所 | Ag-Zr-Zn intermediate alloy and preparation method and application thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1073292A (en) * | 1991-12-12 | 1993-06-16 | 中国有色金属工业总公司昆明贵金属研究所 | Silver based alloy electric contact material |
JP2004061844A (en) * | 2002-07-29 | 2004-02-26 | Hitachi Metals Ltd | Ag ALLOY FILM FOR DISPLAY DEVICE, Ag ALLOY REFLECTING FILM FOR DISPLAY DEVICE, FLAT PANEL DISPLAY DEVICE AND SPUTTERING TARGET MATERIAL FOR Ag ALLOY FILM DEPOSITION |
JP2004131747A (en) * | 2002-10-08 | 2004-04-30 | Sumitomo Metal Mining Co Ltd | Silver alloy for display device, and display device using electrode film or reflection film formed by using the silver alloy |
WO2005056851A1 (en) * | 2003-12-10 | 2005-06-23 | Tanaka Kikinzoku Kogyo K.K. | Silver alloy excelling in performance of reflectance maintenance |
CN1760391A (en) * | 2005-10-28 | 2006-04-19 | 贵研铂业股份有限公司 | New type alloy material |
-
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Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1073292A (en) * | 1991-12-12 | 1993-06-16 | 中国有色金属工业总公司昆明贵金属研究所 | Silver based alloy electric contact material |
JP2004061844A (en) * | 2002-07-29 | 2004-02-26 | Hitachi Metals Ltd | Ag ALLOY FILM FOR DISPLAY DEVICE, Ag ALLOY REFLECTING FILM FOR DISPLAY DEVICE, FLAT PANEL DISPLAY DEVICE AND SPUTTERING TARGET MATERIAL FOR Ag ALLOY FILM DEPOSITION |
JP2004131747A (en) * | 2002-10-08 | 2004-04-30 | Sumitomo Metal Mining Co Ltd | Silver alloy for display device, and display device using electrode film or reflection film formed by using the silver alloy |
WO2005056851A1 (en) * | 2003-12-10 | 2005-06-23 | Tanaka Kikinzoku Kogyo K.K. | Silver alloy excelling in performance of reflectance maintenance |
CN1760391A (en) * | 2005-10-28 | 2006-04-19 | 贵研铂业股份有限公司 | New type alloy material |
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