CN100438725C - Printing clamp for printing circuit substrate - Google Patents
Printing clamp for printing circuit substrate Download PDFInfo
- Publication number
- CN100438725C CN100438725C CNB2004100575113A CN200410057511A CN100438725C CN 100438725 C CN100438725 C CN 100438725C CN B2004100575113 A CNB2004100575113 A CN B2004100575113A CN 200410057511 A CN200410057511 A CN 200410057511A CN 100438725 C CN100438725 C CN 100438725C
- Authority
- CN
- China
- Prior art keywords
- printing
- tellite
- hole
- anchor clamps
- aforementioned
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
Provided is a printing tool capable of preventing solder resist ink from creeping in the rear of a substrate even in the substrate made of a soft material. In the printing tool, the printed circuit board is retained on a printer bed to perform printing by fixing the printed circuit board to the printer bed. The printing tool (10) is flat and is inserted between the printer bed and the printed circuit board. In the printing tool for the printed circuit board, a non-through hole (11) is provided at a position corresponding to the through hole of the printed circuit board on a surface in contact with the printed circuit board, and a through hole (12) is provided in a region without any through holes.
Description
Technical field
The present invention relates to tellite with the printing anchor clamps, particularly be applicable to the printing anchor clamps that on the flexible printed wiring board of softness, print.
Background technology
In general; tellite all is coated with the scolder etching ink and forms diaphragm except the part that pad etc. need expose. and the coating (opening flat 6-191009 communique with reference to the spy of Japan) of this scolder etching ink is carried out in the printing by silk screen print method etc.
In order to carry out this printing, with carrying out the contraposition of substrate in the pilot hole of contraposition of being located on the print head, substrate is fixed on the print head with vacuum attraction with guide finger insertion substrate, reduce guide finger and afterwards galley and substrate butt are printed.
In this case, the through hole inflow back side one side of substrate is passed in etching ink meeting sometimes owing to the vacuum attraction of print head. and its result produces following problem:
1. the attenuation of the printing ink around the through hole owing to vacuum attraction.
2. flow into the printing ink of the back side one side because when the opposite one side of printing, printed once more thickening unnecessarily.
3. the attraction hole of print head is plugged.
As this countermeasure, under prior art, carry out following processing etc.: between substrate and print head, spread paper or near the attraction hole of the print head the through hole is blocked with belt etc., substrate all becomes insufficient for the fixing of print head in these cases, has produced the in press problem of substrate skew.
So, proposing to open the printing anchor clamps shown in the flat 6-191009 communique just like the spy of Japan. and it is fixed on substrate on the end, is provided with spot-facing on the part of printing, and the printing ink that will ooze out from through hole attracts and removes from spot-facing portion.
This method is effective for the substrate of the hard material that uses ceramic substrate etc.
, in the substrate of the soft material of flexible printed wiring board etc., produced the substrate deflection, the shortcoming that can not print.
Summary of the invention
The present invention considers the problems referred to above and proposes that its purpose is to provide a kind of printing anchor clamps, even the substrate of soft material can prevent that also the scolder etching ink is around arriving substrate back.
To achieve these goals, in the present invention, provide a kind of tellite with printing anchor clamps, for tellite being fixed on enforcement printing on the print engine head aforementioned tellite is remained on the aforementioned print engine head, it is characterized in that, aforementioned printing anchor clamps are tabular, add and insert between aforementioned print engine head and the aforementioned tellite, with face that aforementioned tellite contacts in non-through hole is set on the position corresponding to the through hole of aforementioned tellite, and do not having on the zone of through hole through hole to be set.
The present invention as mentioned above, because it constitutes on the position that is equivalent to through hole on the tellite non-through hole is set, on the zone that does not have through hole on the tellite, through hole is set, so added and inserted between print engine head and the tellite by printing anchor clamps, can adsorb on the fixing printed circuit substrate problem that the printing ink in the printing process of elimination tellite adheres to reliably.
Description of drawings
Fig. 1 is the key diagram of the formation of expression one embodiment of the invention.
Fig. 2 has been to use the key diagram of the printing process of embodiment shown in Figure 1.
Fig. 3 is the vertical view that expression is applicable to print engine head of the present invention.
Fig. 4 is the amplification view of embodiment shown in Figure 1.
Fig. 5 is the printing anchor clamps of expression on the print engine head of the present invention and the vertical view of the relation of goods (tellite).
Embodiment
Fig. 1 is the key diagram of the situation that is provided with of expression printing anchor clamps of the present invention. Fig. 1 represents to insert embodiments of the invention that with cutaway view the mode of promptly printing anchor clamps 10 is with the state of tellite 1 mounting on print engine head 2.
As shown in the drawing, be in following state: ink I is attached near the of through hole TH and blocked through hole TH. again, be provided as the spot-facing portion 11 of non-through hole on the position under the through hole TH in printing anchor clamps 10, thereby forming the printing ink carrier. departing from the position under the through hole TH in printing anchor clamps 10 is provided with through hole 12, is communicated with the suction hole 2a of print engine head 2.
Thus, adsorb tellite 1 if carry out vacuum attraction by print engine head, then adsorb tellite 1. at this moment via the through hole 12 of printing anchor clamps 10, through hole TH directly is not subjected to the attraction of print engine head, printing ink is trapped in the through hole. and at the through hole that only is used for interlayer conduction, such form is also passable.
Again, even be subjected to certain sucking action temporarily, as shown in the drawing, attracted to through hole below and the ink I that flows into tellite 1 below falls into and is trapped in the spot-facing portion 11. at this moment, because can not be subjected to strong attraction, so the printing ink around the through hole can attenuation.
As long as printing anchor clamps 10 have flatness, processability in the 1st printing, there is not the restriction of special material, use for example expoxy glass plate. again, in the 2nd printing, because the face butt after printing ink and the cured printed, so the fluorine-type resin processing of use teflon (registered trade mark) etc. forms about thickness 1mm.
Fig. 2 is illustrated in the state that is carrying out printing on the tellite that is positioned on the printing machine. tellite 1 the state of having inserted printing anchor clamps 10 download place print engine head 2 above. at this moment, the alignment pin 3 of being located at print engine head 2 inserts in the pilot hole of being located at tellite 1 and printing anchor clamps 10, and tellite 1 is positioned over assigned position.
Then, drop-down alignment pin 3 is positioned over galley 4 on the tellite 1, prints by printing squeegee 5 is moved up at illustrated right and left.
The tellite 1 that has carried out printing unloads and similarly carries out the printing of new tellite 1 from print engine head 2.
Fig. 3 is the figure of the state of expression when observing printing anchor clamps 10 from the top. mounting tellite 1 overlappingly on these printing anchor clamps 10, print.
On printing anchor clamps 10, set in advance depressed part 13, assistant space during as taking-up tellite 1. thus, printing anchor clamps 10 are to be accommodated in mode by the formed zone of upper surface of print engine head 2 by mounting, tellite 1. its results at the position of not setting about are controlled in the space that hand can be put into depressed part 13, and the operation of printing also is improved.
Fig. 4 represents the through hole TH of tellite shown in Figure 11 and cross-sectional configuration on every side thereof enlargedly. from this Fig. 4 as can be known, be configured in through hole TH under the diameter of spot-facing portion 11 form bigger than the diameter of through hole TH. for example, diameter is set at about the big 1mm of diameter than through hole TH, and the degree of depth is less than 1mm.
Again, the through hole 12 of printing anchor clamps 10 is in the position identical with the suction hole of print engine head 2, and diameter is more slightly bigger than suction hole. and thus, tellite 1 is absorbed and fixed on the print engine head 2 reliably with printing anchor clamps 10.
Fig. 5 is the vertical view of state of printing anchor clamps 10 that has been illustrated in mounting on the print engine head 2. on its entire upper surface of print engine head, dispose suction hole. block whole suction holes interiorly because comprise the suction hole that is configured in by the periphery of (comprising tellite FPC) the goods P shown in the profile, so the size of printing anchor clamps 10 is as shown in the figure, the unified goods P. that all comprises
Goods among Fig. 5 hypothesis is to have mixed thickness portion with part installation strength and the substrate with flexible thin cable portion, because it is poor that the part shown in the regional A that is surrounded by dotted line and the round B of dotted line has the ladder of cable, so consider and do not damage adsorptivity and through hole is not set thereon.
Claims (3)
1. a tellite remains on aforementioned tellite on the aforementioned print engine head for tellite being fixed on enforcement printing on the print engine head with the printing anchor clamps, it is characterized in that,
Aforementioned printing anchor clamps are tabular, add to insert between aforementioned print engine head and the aforementioned tellite,
With face that aforementioned tellite contacts in the position corresponding to the through hole of aforementioned tellite on non-through hole is set, and do not having on the zone of through hole through hole to be set.
2. tellite as claimed in claim 1 printing anchor clamps,
The equal diameters of aforementioned non-through hole and the through hole of aforementioned tellite or bigger than it.
3. tellite as claimed in claim 1 printing anchor clamps,
The printing anchor clamps of the 2nd printing usefulness are to have carried out tellite after the fluorine-type resin processing with the printing anchor clamps in the aforementioned printing anchor clamps.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003292521A JP2005064251A (en) | 2003-08-12 | 2003-08-12 | Printing tool for printed circuit board |
JP292521/03 | 2003-08-12 | ||
JP292521/2003 | 2003-08-12 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1582096A CN1582096A (en) | 2005-02-16 |
CN100438725C true CN100438725C (en) | 2008-11-26 |
Family
ID=34369841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2004100575113A Expired - Fee Related CN100438725C (en) | 2003-08-12 | 2004-08-12 | Printing clamp for printing circuit substrate |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2005064251A (en) |
CN (1) | CN100438725C (en) |
TW (1) | TW200518657A (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101646303B (en) * | 2008-08-06 | 2013-03-20 | 北大方正集团有限公司 | Jig for plugging holes and process for plugging holes by using same |
CN101820729B (en) * | 2010-04-20 | 2012-03-28 | 深南电路有限公司 | PCB depth-control machining method and device thereof |
JP5892622B2 (en) | 2010-06-15 | 2016-03-23 | エクスポネンシャル テクノロジーズ, インコーポレイテッドExponential Technologies, Inc. | Multi-tube valveless pulse detonation engine |
CN106976303A (en) * | 2017-03-28 | 2017-07-25 | 华勤通讯技术有限公司 | A kind of printing fixture for circuit board, excessively furnace carrier and circuit board printing device |
CN109496071A (en) * | 2018-11-01 | 2019-03-19 | 广州金鹏源康精密电路股份有限公司 | A kind of welding resistance consent component |
CN111741603B (en) * | 2020-07-04 | 2021-05-07 | 吉安满坤科技股份有限公司 | Manufacturing method of new energy intelligent automobile printed circuit board |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0497587A (en) * | 1990-08-16 | 1992-03-30 | Nec Corp | Fixing method for printed board for surface mounting |
JPH0730244A (en) * | 1993-07-14 | 1995-01-31 | Nippon Cement Co Ltd | Bump electrode, and method of forming bump electrode |
JPH11145592A (en) * | 1997-11-11 | 1999-05-28 | Sumitomo Metal Smi Electron Devices Inc | Method for filling through-hole of circuit board |
-
2003
- 2003-08-12 JP JP2003292521A patent/JP2005064251A/en active Pending
-
2004
- 2004-08-05 TW TW093123510A patent/TW200518657A/en unknown
- 2004-08-12 CN CNB2004100575113A patent/CN100438725C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0497587A (en) * | 1990-08-16 | 1992-03-30 | Nec Corp | Fixing method for printed board for surface mounting |
JPH0730244A (en) * | 1993-07-14 | 1995-01-31 | Nippon Cement Co Ltd | Bump electrode, and method of forming bump electrode |
JPH11145592A (en) * | 1997-11-11 | 1999-05-28 | Sumitomo Metal Smi Electron Devices Inc | Method for filling through-hole of circuit board |
Also Published As
Publication number | Publication date |
---|---|
JP2005064251A (en) | 2005-03-10 |
CN1582096A (en) | 2005-02-16 |
TW200518657A (en) | 2005-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081126 Termination date: 20210812 |