CN100430734C

CN100430734C - Combined probe for integrated circuit test

Info

Publication number: CN100430734C
Application number: CNB2006100334027A
Authority: CN
Inventors: 段超毅
Original assignee: Individual
Current assignee: Wuhan Jingyitong Electronic Technology Co Ltd
Priority date: 2006-01-25
Filing date: 2006-01-25
Publication date: 2008-11-05
Anticipated expiration: 2026-01-25
Also published as: CN1808127A

Abstract

The present invention relates to a combined probe for integrated circuit tests, which comprises a single-head probe (1) and a terminal (2), wherein the single-head probe (1) comprises a head (13) and a tail pipe body (12), a spring is arranged in the inner cavity of the pipe body (12), and the head (13) is inserted in the inner cavity of the pipe body (12) and can move relative to the pipe body (12); the upper part of the terminal (2) is hollow, and the inner wall of the terminal (2) is provided with a clamping part. One end of the single-head probe (1) is inserted into the terminal (2) and is clamped by the clamping part, the other end of the single-head probe (1), which is not inserted into the terminal (2), is used for being electrically connected with an integrated circuit to be tested or a test circuit board. Correspondingly, the tail end (21) of the terminal (2) is used for being electrically connected with the circuit board to be tested or the integrated circuit to be tested. Compared with the prior art, the present invention has the technical effect that integrated circuits with small foot distance can be tested, and also has the advantages of low cost, convenient maintenance, low maintenance cost, low impedance, capacitive impedance or inductive reactance generation when in use.

Description

Combined probe for integrated circuit test

Technical field

The present invention relates to the electric performance test or the fault finding parts of semiconductor devices, particularly relate to the probe that is used for testing integrated circuits.

Background technology

Along with SMT, it is the development of Surface Mount Technology surface mounting technology, SIC (semiconductor integrated circuit) (hereinafter to be referred as IC) particularly adopts ball grid array Ball Grid Array to be called for short BGA, the arrangement mode of i.e. encapsulation back I/O pin is that grid array, pin end are the IC of tin ball, just towards high density, the development of little spacing direction, the I/O pin of encapsulation is increased to the hundreds of root gradually from tens, may reach 2,000 in the near future.Thereby, more and more higher to the requirement of integrated circuit testing.The probe that can satisfy high density, closely spaced IC test request in the prior art comprises two kinds, as shown in figure 11 a kind of, form by pipe shaft a, two tip portion b and spring c, two tip portion b that guarantee probe can be along pipe shaft a inwall parallel sliding freely, to guarantee that simultaneously its serviceable life is more than 500,000 times, under the very little situation of pipe shaft a external diameter, the process technology difficulty of probe and equipment requirements are very high and yields is low.Apart from being the probe of 0.5mm, the pipe shaft external diameter has only φ 0.35mm such as testing integrated circuits conductiving point pin, and the needle point diameter has only about φ 0.17mm, and machining tolerance must be controlled in the 0.01mm, and general high-precision automatic machine tool all can not reach technological requirement.And technological parameter has slightly unreasonablely will cause product rejection, and build-up tolerance also must be controlled at below the 0.003mm, thereby cost is high.Another kind as shown in figure 12, by an end have one fixedly pipe shaft d, the movable needle point e of needle point and the spring in the pipe shaft d forms, owing to spring-loaded pipe shaft d one end band needle point, the endoporus shock mount of the other end, whole must employing turning processing is so cost is also quite high.The reason that cost is high, this series products of the first are by existing technology, and machining precision, assembly precision require high, and it two is that to produce the required equipment requirements of this class probe very high, the machine costliness, and a production line is all wanted more than 1,000 ten thousand yuans, so equipment cost is high.More than two kinds of double ended probes have only several companies to do at present in the world.In addition, the test structure made from above-mentioned two kinds of probes is if quality problems need change certain root probe the time, must be taken total apart and could change, and maintenance is inconvenient.

Summary of the invention

The technical problem to be solved in the present invention is to avoid above-mentioned the deficiencies in the prior art part and proposes that a kind of to be used to test pin be the integrated circuit of 0.3mm apart from minimum, and cost combined probe for integrated circuit test low, easy to maintenance.

The present invention solve the technical problem can be by realizing by the following technical solutions:

Design, use a kind of combined probe for integrated circuit test, comprise single head probe and terminal; Described single head probe comprises head and afterbody pipe shaft, and this inner cavity of tube body is equipped with spring, and described head inserts the afterbody inner cavity of tube body and can move by described relatively afterbody pipe shaft; Described terminal upper portion is hollow, and inwall is provided with the clamping section, and any end of described single head probe inserts in the described terminal and by described clamping section to be clamped; The end that the not end of described single head probe inserts described terminal is used for being electrically connected with integrated circuit to be tested or testing circuit board, and correspondingly, the tail end of described terminal then is used for being electrically connected with testing circuit board or integrated circuit to be tested is electrically connected.

Compare with prior art, technique effect of the present invention is:

1, can test pin apart from little integrated circuit;

2, because described combination probe comprises single head probe and terminal two parts, wherein the single head probe is the common single head probe of commercially available unified specification, and the production of common single head probe has had the history in 40 or five ten years, adopt the endoporus and the external diameter of the method processing pipe shaft that stretches, technology is simply ripe, and all parts are standardization all, easily realizes volume production, thereby cost is extremely low, approximately has only a thirtieth of prior art probe cost;

3, the test structure made from combination probe of the present invention is if problem, because the possibility that terminal damages is minimum, so need only transfer to the single head probe of damage, changes new single head probe and gets final product, thereby described combination probe is easy to maintenance in actual applications, and maintenance cost is low;

4, two parts of described combination probe can make up neatly, use more extensive, more convenient; The impedance that presents in the use, capacitive reactance or induction reactance are all very low.

Description of drawings

Fig. 1 is the structural representation of combined probe for integrated circuit test of the present invention;

Fig. 2 is first kind of version synoptic diagram in terminal 2 clamping sections of described combination probe, wherein, and Fig. 2-the 1st, the structural representation of terminal 2, Fig. 2-the 2nd, the A portion enlarged diagram of Fig. 2-1;

Fig. 3 is second kind of version synoptic diagram in terminal 2 clamping sections of described combination probe, wherein, and Fig. 3-the 1st, the structural representation of terminal 2, Fig. 3-the 2nd, the B portion enlarged diagram of Fig. 3-1;

Fig. 4 is the third version synoptic diagram of terminal 2 clamping sections of described combination probe, wherein, and Fig. 4-the 1st, the structural representation of terminal 2, Fig. 4-the 2nd, the C portion enlarged diagram of Fig. 4-1;

Fig. 5 is the used commercially available single head probe head end different shape synoptic diagram of described combination probe;

Fig. 6 is the terminal tail end different shape synoptic diagram of described combination probe;

Fig. 7 is the D portion enlarged diagram of Fig. 1;

Fig. 8 is that described combination probe specifically is applied to the assembling synoptic diagram tested;

Fig. 9 is that the another kind of described combination probe is used the assembling form synoptic diagram;

Figure 10 is the structural representation of the single head probe 1 of described combination probe;

Figure 11 is the structural representation of first kind of form probe of prior art;

Figure 12 is the structural representation of second kind of form probe of prior art;

Embodiment

Be described in further detail below in conjunction with the most preferred embodiment shown in the accompanying drawing.

Combined probe for integrated circuit test of the present invention as shown in Figure 1, comprises single head probe 1 and terminal 2.Single head probe and for example shown in Figure 10, that described single head probe 1 is commercially available unified specification comprises head 13 and afterbody pipe shaft 12, and these pipe shaft 12 inner chambers are equipped with spring, and described head 13 inserts pipe shaft 12 inner chambers and can do axially-movable with respect to described pipe shaft 12; There is capitiform on its head 13 tops, and afterbody pipe shaft 12 1 end band springs do not have capitiform, and processing cost is extremely low.The capitiform on the top 11 of described single head probe 1 can be a different shape as shown in Figure 5.Fig. 2 is to shown in Figure 4 for another example, and described terminal 2 tops are hollow, and inwall is provided with the clamping section, and any end of described single head probe 1 inserts in the described terminal 2 and by described clamping section to be clamped.An end that does not insert described terminal 2 of described single head probe 1 is used for being electrically connected with integrated circuit to be tested or testing circuit board, and correspondingly, 21 of the tail ends of described terminal 2 are used for being electrically connected with testing circuit board or integrated circuit to be tested is electrically connected.The tail end 22 of terminal 2 draws in, can be solid, also can be hollow, and its shape can be different shapes such as tip, round end or tack as shown in Figure 6 according to different installation situation.

To shown in Figure 4, the inwall of described terminal 2 is provided with the clamping section as Fig. 2.Among Fig. 2, described clamping section is the projection 22 at terminal 2 inwalls one place; Among Fig. 3, the clamping section is the projection 22 at radially relative two places of described terminal 2 inwalls, and the clamping section can also be the above projectioies 22 in described terminal 2 inwalls two places; Among Fig. 4, the clamping section is the snap ring 23 that described terminal 2 middle parts are formed by roll extrusion, and terminal 2 is big with the contact area of single head probe 1 like this, and contact resistance is littler, and both are in conjunction with more stable.Being used among Fig. 2 to Fig. 4 clamps the clamping section of single head probe 1 and adopts projection or snap ring, and described terminal 2 can be done forr a short time, can be used for the more closely spaced integrated circuit of test.And, be projection or snap ring because terminal and single head probe contact portion adopt, compact conformation, the terminal 2 of diameter equally can the bigger single head probe 1 of fit diameter; Because the single head probe diameter is big more, it is easy more to process, and cost is low more, so just can reduce the cost of combined probe for integrated circuit test of the present invention.

As shown in Figures 1 to 4, the hollow section lower sidewall porose 24 of described terminal 2.This hole 24 makes the inner chamber of described terminal 2 when electroplating, and gas can be discharged fully in it, guarantees that the endoporus of terminal 2 is electroplated fully.Simultaneously, this through hole 24 can guarantee that the metal fillings that process produces discharges hole depth unanimity in guaranteeing easily.Single head probe 1 contacts with the uniform inwall of the plating of terminal 2, and contact resistance is little, stable performance, and capacitive reactance, the inductance of test process generation simultaneously all can reduce greatly.

As shown in Figure 7, described terminal 2 upper end outer walls have step 25.Combination probe of the present invention use with one of testing scheme as shown in Figure 8, with welding manner test I C.Described terminal 2 is contained on the fixed head 3, and its tail end is welded on the testing circuit board 8, and single head probe 1 passes location-plate 4 and inserts the terminal endoporus, and hold-down mechanism 7 is fixed on the location-plate 4 by screw 6.Hold-down mechanism 7 is when compressing IC 5, and snap-in force is delivered to terminal 2 by IC 5 and single head probe 1 successively.Because the step 25 of terminal so the power that passes on the terminal 2 passes on the location-plate 4 by step 25, passes to hold-down mechanism 7 by screw 6 more again between location-plate 4 and fixed head 3.Like this, compress the snap-in force of IC 5, just become an internal force, snap-in force can not pass on the testing circuit board 8, can not influence the intensity of terminal 2 and testing circuit board 8 welding portions in use, has prolonged serviceable life.In addition, terminal 2 is welded on the testing circuit board 8, and single head probe 1 directly and testing circuit board 8 electrical connections has not been avoided the pad oxidation on the testing circuit board 8 during test, thus make testing circuit board 8 conduct electricity very well the measuring accuracy height.

The another kind of described combination probe is used assembling form as shown in Figure 9, this assembling form is identical with the assembling form of prior art middle probe, promptly by the fixing described combination probe of location-plate, this combination probe one end is electrically connected with integrated circuit, and the other end is electrically connected with testing circuit board.

Claims

1. a combined probe for integrated circuit test comprises single head probe (1); Described single head probe (1) comprises head (13) and afterbody pipe shaft (12), and this pipe shaft (12) inner chamber is equipped with spring, and described head (13) inserts pipe shaft (12) inner chamber and can do axially-movable by described relatively pipe shaft (12); It is characterized in that:

Also comprise terminal (2), described terminal (2) top is hollow, and inwall is provided with the clamping section, and any end of described single head probe (1) inserts in the described terminal (2) and by described clamping section to be clamped;

One end of the described terminal of not insertion (2) of described single head probe (1) is used for directly electrically contacting with integrated circuit to be tested or testing circuit board, correspondingly, the tail end (21) of described terminal (2) then is used for being electrically connected with testing circuit board or integrated circuit to be tested directly electrically contacts.

2. combined probe for integrated circuit test as claimed in claim 1 is characterized in that: described clamping section is the projection (22) at described terminal (2) inwall one place.

3. combined probe for integrated circuit test as claimed in claim 1 is characterized in that: described clamping section is the projection (22) at described terminal (2) inwall two places, and this two projection (22) lays respectively at two radially relative places of terminal (2) inwall.

4. combined probe for integrated circuit test as claimed in claim 1 is characterized in that: described clamping section is the snap ring (23) that described terminal (2) middle part is formed by roll extrusion.

5. combined probe for integrated circuit test as claimed in claim 1 is characterized in that: the hollow section lower sidewall of described terminal (2) porose (24).

6. combined probe for integrated circuit test as claimed in claim 1 is characterized in that: described terminal (2) upper end outer wall has step (25).