CN2563578Y

CN2563578Y - Density plate structure

Info

Publication number: CN2563578Y
Application number: CN 02272439
Authority: CN
Inventors: 陈淑梅
Original assignee: Individual
Current assignee: Individual
Priority date: 2002-08-08
Filing date: 2002-08-08
Publication date: 2003-07-30
Anticipated expiration: 2012-08-08

Abstract

The utility model relates to a density plate structure; a plurality of test holes are arranged on the plate; the utility model is characterized in that the surfaces of the inside of the test holes are provided with conducting layers which can be convenient for a probe structure to splice and be conducted with the conducting layers in order that the probe structure can be spliced to use repeatedly. With the density plate structure provided by the utility model, the probe structure is not required to dismantle and the same test fixture can still be used repeatedly, thereby the manpower, time and material cost are saved. The utility model is used for the test process of the printed circuit board with high-density circuit and is more convenient and simpler.

Description

The density board structure

Technical field

The utility model relates to a kind of the repetition and pegs graft and cost-effective density board structure.

Background technology

General using is tested printed circuit board (PCB) (PCB) factory that machine-readable plate mode is tested, all be first optional a slice from PCB to be measured, read in test machine, test machine can in establish the data of reading plate data and PCB to be measured and compare, if two documents are unsuitable, then repeat abovementioned steps, two documents until reading identically promptly obtain an on-gauge plate, test machine is just with this on-gauge plate afterwards, compare with PCB to be measured, bad PCB then resurveys through maintenance again, and is identical until the comparison data.

Extremely shown in Figure 2 as Fig. 1, general test comprises a probe structure and a density board 3 that is provided with some instrument connections 31 with tool, wherein probe structure comprises probe 1, probe sleeve pipe 2 and lead 4 again, establish compression spring in this probe 1 and make its probe 11 be convenient to the test; One end of probe sleeve pipe 2 is provided with a hypotenuse 21; 4 in lead is cut open and is exposed one section bare wire 41.

During test, prospect hole 31 1 ends of earlier probe sleeve pipe 2 being tested oneself insert, application of force hammer hypotenuse 21 can be supported to arrive in density board 3 probe sleeve pipe 2 again, then probe 1 is inserted in the probe sleeve pipe 2, at last the probe sleeve pipe that bare wire 41 is wire-wrapped in relative hypotenuse 21 in addition end can test.

Because probe 1 and probe sleeve pipe more than 2 are not drawn out easily, when the desire brute force is extracted, then may cause the scratch of probe 1, probe sleeve pipe 2 and instrument connection 31, so manufacturer tests the PCB of some (for example 2000) afterwards, just directly abandoning whole group measurement jig.

Perhaps, directly bare wire 41 is cut off, time-consuming again, the effort remove to cut open lead 4, with new bare wire 41 recombination on probe sleeve pipe 2.

As seen, existing probe structure has following shortcoming:

One, how probe sleeve pipe and probe have not been drawn out easily for using also possible scratch probe, probe sleeve pipe and instrument connection when desiring to extract next time;

Two,, thereby cause manufacturer will put in order the group measurement jig to abandon together owing to be not drawn out easily;

If three cut off bare wire, then need again with a new bare wire recombination on the probe sleeve pipe;

As previously mentioned, thus the waste plenty of time, manpower and material.

The utility model content

The technical problems to be solved in the utility model is, at the above-mentioned defective of prior art, provides a kind of the repetition to peg graft and cost-effective density board structure.

The technical scheme that its technical matters that solves the utility model adopts is: a kind of density board structure, be equipped with some instrument connections on the described plate, it is characterized in that, be provided with conductive layer on the inner surface of instrument connection, can be beneficial to that probe structure is pegged graft and with described conductive layer mutual conduction, make probe structure can repeat to peg graft and use.

The density board structure of utilizing the utility model to provide does not need the dismounting probe structure, still reusable same measurement jig, saves manpower, time and material cost, is used for the test process of the higher printed circuit board (PCB) of current densities, and is more convenient simple and easy.

Description of drawings

The utility model is described in further detail below in conjunction with drawings and Examples, in the accompanying drawing:

Fig. 1 and 2 figure is existing density board and the probe structure synoptic diagram when being used;

Fig. 3 is the synoptic diagram of the utility model embodiment one;

Fig. 4 be the utility model embodiment one medium-density plate tiltedly cut open synoptic diagram;

Fig. 5 is that the side of the utility model embodiment one medium-density plate is cutd open synoptic diagram;

Fig. 6 is the synoptic diagram of the utility model embodiment two;

Fig. 7 is that the side of the utility model embodiment two medium-density plates is cutd open synoptic diagram.

In each Reference numeral of above-mentioned each accompanying drawing:

The 1st, probe, the 11st, probe, the 2nd, the probe sleeve pipe, the 21st, hypotenuse, the 3rd, density board, the 31st, instrument connection, the 32nd, conductive layer, the 33rd, the conducting sleeve, the 4th, lead, the 41st, bare wire, the 5th, lead rod, the 6th, heat-shrinkable T bush.

Embodiment

Embodiment one

To shown in Figure 5, the test among the figure comprises probe structure with tool and is provided with the density board 3 of some instrument connections 31 as Fig. 3, and wherein probe structure comprises probe 1, probe sleeve pipe 2, heat-shrinkable T bush 6 and lead 4, and lead 4 is broken away and exposes one section bare wire 41; Instrument connection 31 inside of density board 3 then are provided with one deck conductive layer 32.

During test, elder generation inserts probe 1 from instrument connection 31 tops on the density board 3, the probe sleeve pipe 2 that again an end is arranged with bare wire 41 is inserted in heat-shrinkable T bush 6, and heat it can not to be come off and form one and overlap tubular (as shown in Figure 3), insert from instrument connection 31 belows of density board 3 then, because probe 1 is to conduct electricity, and instrument connection 31 inner surfaces also are provided with a conductive layer 32, thereby only need make probe sleeve pipe 2 contact to some extent and can test, so be easy to repeat peg graft, need not waste unnecessary cost with instrument connection 31 inner surfaces.

Conductive layer is conductive metal material, and its set-up mode can be screen painting forming the wire mark layer, or forms electrodeposited coating through electroplating, and also can be conducting sleeve and for being inserted in conducting.

Embodiment two

To shown in Figure 7, the test among the figure comprises probe structure with tool and is provided with the density board 3 of some instrument connections 31 as Fig. 6, and wherein probe structure system comprises probe 1, leads rod 5, heat-shrinkable T bush 6 and lead 4, and lead 4 is broken away and exposes one section bare wire 41; And instrument connection 31 inside of density board 3 can be inserted in for conducting sleeve 33, and conducting sleeve 33 can cooperate instrument connection 31 inside to be set to structure wide at the top and narrow at the bottom.

During test, elder generation inserts probe 1 from instrument connection 31 tops on the density board 3, the rod 5 of leading that again an end is welded with lead 4 is inserted in heat-shrinkable T bush 6, and heating can not come off it and forms the cover tubular, insert from instrument connection 31 belows of density board 3 then, because probe 1 is to conduct electricity, and before probe 1 inserts above the instrument connection 31, earlier be inserted in a conducting sleeve 33 wide at the top and narrow at the bottom and (also can be up-narrow and down-wide structure on instrument connection 31 inner surfaces, an or upright sleeve structure etc.), thereby only need insert and partly lead rod 5 and can test, so be easy to repeat grafting, need not waste the excess stock cost.

Because the characteristic of the utility model conductive layer, by probe, probe sleeve pipe and lead the insertion of rod and need not contact, can mutual conduction test; Can be any fixed form and lead rod, probe sleeve and wire-bonds mode; Probe sleeve pipe and lead rod and can be Any shape again, heat-shrinkable T bush is made by insulating material, and is available to prevent short circuit.

The utility model promptly is used for the test process of the higher printed circuit board (PCB) of current densities applicable to the density board with substantive test hole, and is more convenient simple and easy.

In addition, can all stick with probe from the instrument connection top of density board, to lead rod or probe sleeve pipe again, insert from the instrument connection other end of density board, must not contact, only need insert to contact and get final product mutual conduction, and to be tested extracting again after intact gets final product with conductive layer with probe, and need not extract probe above the instrument connection, can wait until test next time and use.

Therefore, the utlity model has following advantages:

(1), can repeat to peg graft and use, saving plenty of time, manpower and material cost;

(2), can make the test process of the higher printed circuit board (PCB) of current densities more convenient simple and easy.

Claims

1, a kind of density board structure is equipped with some instrument connections on the described plate, it is characterized in that, is provided with conductive layer on the inner surface of instrument connection, can be beneficial to that probe structure is pegged graft and with described conductive layer mutual conduction, make probe structure can repeat to peg graft and use.

2, density board structure according to claim 1 is characterized in that, described conductive layer is a wire mark layer.

3, density board structure according to claim 1 is characterized in that, described conductive layer is an electrodeposited coating.

4, density board structure according to claim 1 is characterized in that, described conductive layer is a conducting sleeve.

According to claim 1,2,3 or 4 described density board structures, it is characterized in that 5, the aperture of described instrument connection is the wherein a kind of of up-narrow and down-wide structure, structure wide at the top and narrow at the bottom or upright tube-in-tube structure.

6, density board structure according to claim 1 is characterized in that, described probe structure is made of probe and probe sleeve pipe.

7, density board structure according to claim 1 is characterized in that, described probe structure is made of probe and lead.

8, density board structure according to claim 7 is characterized in that, an end of described lead is connected with one and leads rod.

9, density board structure according to claim 7 is characterized in that, an end of described lead is connected with a probe sleeve pipe.