CN100424872C - 白光发光二极管的光源构造 - Google Patents
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
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Abstract
一种白光发光二极管的光源构造,其具有高调控弹性低制作成本的光源,可被提供用于具有白光光源需求的电子装置,即是使用发光二极管的光源构造来达到电子装置所需的照明需求,而且较已知的传统照明法调控能力增加且体积小;该发光二极管的光源构造包括电路基板、红光发光二极管芯片、绿光发光二极管芯片、蓝光发光二极管芯片、控制集成电路芯片及封装材料。
Description
技术领域
本发明涉及一种光源构造,特别是涉及一种具有高调控弹性低制作成本的光源,可被提供用于具有白光光源需求的电子装置,即为使用发光二极管(LED,light emitting diode)的光源构造来达到电子装置所需的照明需求。
背景技术
如一般使用大众所认知的,白光光源是为电子装置广泛需求的光源装置,与传统RGB三色发光二极管分开发光的方式相比较,体积较小而具有实际应用的优势,其发展潜力可说是具有部分取代传统三色光源的实用价值,尤其在家用扫瞄、传真机、手机、PDA及液晶屏幕等市场,极具竞争力,因此其技术改进方式也为各家制造厂商积极研发的焦点。
请参阅图1所示,其为已知的白光发光二极管1的剖面构造示意图,其中的发光源为蓝光发光二极管芯片12,在实际应用时,所述蓝光发光二极管芯片12装置于混合有黄色萤光粉14的封装材料16内,当蓝光发光二极管芯片12发光时部分蓝光可为黄色萤光粉14吸收而放出黄光,经过蓝光与黄光的混色,可以放出白光。
然而,该已知技术以蓝色发光二极管芯片12配合黄色萤光粉14为其主要特征,但是因为还要取得黄色萤光粉14的原料,白色发光二极管目前并无法做到成本很低,此为其重大缺失,并且这种实施方式白光色温控制范围较窄,如此一来局限了应用效果。
请参阅图2所示,其为已知的红绿蓝(RGB)发光二极管混光方式,用以发出白光,其中三色混光发光二极管2以外部电路控制发光色温,如图中的红光控制器21、绿光控制器22及蓝光控制器23,用以控制红光发光二极管26、绿光发光二极管27及蓝光发光二极管28等等的色温;这一发白光方式较图1的发白光实施例易于控制色温,然而其缺点是为外部控制电路所占空间过大,因而提高了制造成本。
对现今市面上大部分需要光源的电子装置而言,都需要光源轻薄短小且可控制色温的范围大,因此研发出本发明来达到上述需求。
发明内容
本发明的主要目的在于提供一种体积小,具有色温控制能力的白光发光二极管的光源构造,可用于具有光源需求的事务机或电子装置,可以提供低成本高品质的光源效果。
为了达到上述目的,本发明提供一种以三色发光二极管芯片为主要构造的光源构造,配合一控制集成电路IC(integrated circuit)芯片,将各该组件封装在一起。
本发明包括:电路基板,其上设有电路;红光发光二极管芯片,设于该电路基板之上而与该电路的一部分电连接;绿光发光二极管芯片,设于该电路基板之上而与该电路的一部分电连接;蓝光发光二极管芯片,设于该电路基板之上而与该电路的一部分电连接;控制集成电路芯片,设于该电路基板之上而与该电路的一部分电连接,且与该红光发光二极管芯片、绿光发光二极管芯片及蓝光发光二极管芯片电连接;及封装材料,将该电路基板、该红光发光二极管芯片、该绿光发光二极管芯片、该蓝光发光二极管芯片及该控制集成电路芯片封装成为一体。
为了使能更进一步了解本发明的特征及技术内容,请参阅以下有关本发明的详细说明与附图,然而所附图式仅提供参考与说明用,并非用来对本发明加以限制。
附图说明
图1为已知的白光发光二极管剖面示意图;
图2为另一已知的三色混光发光二极管的电路示意图;
图3为本发明白光发光二极管的光源构造的电路示意图;
图4为本发明白光发光二极管的光源构造的上视外观示意图。
其中,附图标记说明如下:
白光发光二极管1 蓝光发光二极管芯片12
黄色萤光粉14 封装材料16
三色混光发光二极管2 红光控制器21
绿光控制器22 蓝光控制器23
红光发光二极管26 绿光发光二极管27
蓝光发光二极管28 发光二极管的光源构造3
红光发光二极管芯片31 绿光发光二极管芯片32
蓝光发光二极管芯片33 控制集成电路芯片34
电性连接点341 电路基板4
电路41 电压驱动脚位42
控制信号脚位43 接地脚位44
预留功能脚位45
具体实施方式
请参阅图3及图4,在此对本发明的构造作一叙述;本发明白光发光二极管的光源构造3包括:电路基板4,其上设有电路41,该电路基板4可用传统的发光二极管基板,所须注意的是其电路的布设须节省空间而能容纳各组件;红光发光二极管芯片31,设于该电路基板4之上而与该电路41的一部分电连接;绿光发光二极管芯片32,设于该电路基板4之上而与该电路41的一部分电连接;蓝光发光二极管芯片33,设于该电路基板4之上而与该电路的一部分电连接;控制集成电路芯片34,设于该电路基板4之上而与该电路41的一部分电连接,且与该红光发光二极管芯片31、绿光发光二极管芯片32及蓝光发光二极管芯片33电连接;及封装材料,将该电路基板4、该红光发光二极管芯片31、该绿光发光二极管芯片32、该蓝光发光二极管芯片33及该控制集成电路芯片34封装成为一体。
其中各组件间的电连接须依靠金属线的连接,使得每一组件功能得以发挥,如电压驱动脚位42代表正极电源,与电路的一部分相连接后通过金属线电连接于蓝光发光二极管芯片33的正极,依此类推,蓝光发光二极管芯片33的负极电连接于控制集成电路芯片34的一个电性连接点341。
本发明的特点与方便之处在于,将传统的发光二极管色温控制器与发光二极管的芯片封装在一起,使得光源体积得以缩小,并且色温控制能力较图1的具有黄色萤光粉14的白光发光二极管1强。
在此须将本发明的其它实施例及其变化作一说明,其中该控制集成电路芯片34可具有七个电性连接点341(R,G,B,Vdd,信号,Gnd,PD),也可为五个电性连接点以上(R,G,B,Vdd,Gnd,...),该控制集成电路芯片可以具有5到9个电性连接点,其中该发光二极管的光源构造3可为四脚位的封装方式(Vdd,信号,PD,Gnd),也可为两脚位以上的封装方式(Vdd,Gnd,...),且发光二极管的光源构造可为二到八脚位的封装方式,且其中该四脚位的封装方式的该四脚位分别为:电压驱动脚位42、控制信号脚位43、接地脚位44及预留功能脚位45,并且该四脚位分别与该电路41的一部分电连接,且其中该四脚位封装可适用于表面黏着技术(SMT)以装设于印刷电路板。另外其中该控制集成电路芯片34可接收该控制信号脚位43的电子信号以调整红光发光二极管芯片31、绿光发光二极管芯片32及蓝光发光二极管芯片33等的色温,且为了监控色温变化状况,可使得该预留功能脚位45电连接于一外部光传感器PD(Photo Diode)(图中未示)以达到监控色温。
Claims (9)
1. 一种白光发光二极管的光源构造,其包括:
电路基板,其上设有电路;
红光发光二极管芯片,设于该电路基板之上而与该电路的一部分电连接;
绿光发光二极管芯片,设于该电路基板之上而与该电路的一部分电连接;
蓝光发光二极管芯片,设于该电路基板之上而与该电路的一部分电连接;
控制集成电路芯片,设于该电路基板之上而与该电路的一部分电连接,且与该红光发光二极管芯片、绿光发光二极管芯片及蓝光发光二极管芯片电连接;及
封装材料,将该电路基板、该红光发光二极管芯片、该绿光发光二极管芯片、该蓝光发光二极管芯片及该控制集成电路芯片封装成为一体。
2. 如权利要求1所述的白光发光二极管的光源构造,其中该控制集成电路芯片具有五到九个电性连接点。
3. 如权利要求2所述的白光发光二极管的光源构造,其中该控制集成电路芯片具有七个电性连接点。
4. 如权利要求1所述的白光发光二极管的光源构造,其中该发光二极管的光源构造为二到八脚位的封装方式。
5. 如权利要求4所述的白光发光二极管的光源构造,其中该发光二极管的光源构造为四脚位的封装方式。
6. 如权利要求5所述的白光发光二极管的光源构造,其中该四脚位的封装方式的该四脚位分别为,电压驱动脚位、控制信号脚位、接地脚位及预留功能脚位,并且该四脚位分别与该电路的一部分电连接。
7. 如权利要求4所述的白光发光二极管的光源构造,其中该二到八脚位封装可适用于表面黏着技术以装设于印刷电路板。
8. 如权利要求6所述的白光发光二极管的光源构造,其中该控制集成电路芯片接收该控制信号脚位的电子信号以调整红光发光二极管芯片、绿光发光二极管芯片及蓝光发光二极管芯片的色温。
9. 如权利要求6所述的白光发光二极管的光源构造,其中该预留功能脚位电连接于一外部光传感器。
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CN1909027B (zh) * | 2005-08-01 | 2011-04-13 | 戴永江 | 发光二极管高分辨率彩色显示器模块 |
CN100438026C (zh) * | 2005-09-16 | 2008-11-26 | 鸿富锦精密工业(深圳)有限公司 | 白光发光二极管及其制造方法 |
CN101336026B (zh) * | 2008-07-11 | 2012-07-04 | 北京巨数数字技术开发有限公司 | 一种集成单线控制装置的led发光元件 |
CN102157505A (zh) * | 2011-01-20 | 2011-08-17 | 日月光半导体制造股份有限公司 | 发光模块 |
CN104576633A (zh) * | 2014-12-06 | 2015-04-29 | 广东聚科照明股份有限公司 | 一种全彩cob光源 |
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CN1209618A (zh) * | 1997-05-15 | 1999-03-03 | 松下电器产业株式会社 | 发光二极管显示设备及其控制方法 |
CN1202776A (zh) * | 1997-06-18 | 1998-12-23 | 三星电子株式会社 | 光学拨号电话中按照明度开/关发光二极管的装置及方法 |
CN2453635Y (zh) * | 2000-11-16 | 2001-10-10 | 吴文峰 | 数控发光二极管调色光源 |
CN2532360Y (zh) * | 2001-12-11 | 2003-01-22 | 张秀珍 | 发光装置 |
CN2678139Y (zh) * | 2003-11-21 | 2005-02-09 | 宏齐科技股份有限公司 | 发光二极管的光源构造 |
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