CN100423186C - Method and device for preventing grain defect of wafer in use for vacuum system - Google Patents
Method and device for preventing grain defect of wafer in use for vacuum system Download PDFInfo
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- CN100423186C CN100423186C CNB2005100309124A CN200510030912A CN100423186C CN 100423186 C CN100423186 C CN 100423186C CN B2005100309124 A CNB2005100309124 A CN B2005100309124A CN 200510030912 A CN200510030912 A CN 200510030912A CN 100423186 C CN100423186 C CN 100423186C
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- valve
- wafer
- particle
- vacuum system
- switch valve
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Abstract
The method includes steps: collecting granules; analysis of counted granules; sending information of analyzed result of counted granules to controller of air pressure valve; the controller selects to drive first or second switch valve, and makes switching between two switch valves. The devices in use for the method is composed of switch valve module including first switch valve, and second switch valve, grading analysis instrument, and controller of air pressure valve. Granules generated from switch valve are monitored in real time. One switch valve is working, and the other is standby. Transferring and controlling information of granules makes automatic or manual switching between two valves so as to guarantee continuous operation of machine unit, and yield of wafer.
Description
Technical field
The present invention relates to prevent in the semiconductor manufacturing method and the device thereof of wafer defect, particularly relate to and be used for method and the device thereof that vacuum system prevents to produce owing to controlled valve grain defect of wafer.
Background technology
Vacuum system is used for that the making of integrated circuit is well-known on the wafer.Vacuum system comprises a center vacuum chamber, and promptly transmission cavity is used for by a technological reaction chamber or load chamber, to another technological reaction chamber.Vacuum system also comprises some subsystems, as microenvironment, to provide wafer to loading and reaction chamber and collect wafer to deliver to next operation.Transmission cavity adds the reaction chamber of surrounding and assembly area concentrating type equipment.Between two vacuum chambers, as between transmission cavity and a technological reaction chamber switch valve assembly being arranged.The switch valve assembly comprises controlled valve, and the right angle opening of elongation is used for two physics accesses between the vacuum chamber, and as when controlled valve is in out state, the manipulator in the transmission cavity takes out wafer and sends another vacuum chamber to from a vacuum chamber.After wafer was sent to a vacuum chamber, controlled valve was closed, and by its isolated two chambeies maintenances vacuum sealing state separately, carried out processing procedure separately.In the manufacturing of even the assembly below inferior micron more and more littler in the semiconductor subassembly size, the control of particle is topmost key point.One of main grain defect problem that causes chip defect in the semiconductor causes owing to the cavity controlled valve damages.Be arranged on the load chamber of reaction cavity and the controlled valve between transmission cavity, transmission cavity and reaction chamber, reaction chamber and the reaction chamber for chip turnover usefulness, because chip turnover reaction cavity is frequent, in case the particle that valve damages or mechanical wear produces takes place may be fallen on chip, will cause the decline and the board of chip qualification rate can utilize time decreased.
Existing device only is provided with a controlled valve between the reaction cavity, the unusual generation possibility of its useful life or machinery is arranged, can't be monitored when unusual as if the generation grain defect.When defect problem that Production Engineer's announcement apparatus engineer produces about controlled valve, the Facilities Engineer has to stop whole board to replace controlled valve, just can be found unusual when perhaps needing to wait until regular survey machine.So will influence the board operating time and can't retrieve the loss that has caused.
Summary of the invention
The purpose of this invention is to provide a kind of new can preventing because the method for the grain defect of wafer that controlled valve occurs and its device.Make it can monitor the particle that controlled valve produces in real time, analyze and according to the amounts of particles analysis result, between two controlled valves, switch immediately when needing, whole board is stopped, guarantee the continuous operation of board and the qualification rate of product.
A kind of device that prevents grain defect of wafer that is used for vacuum system of the present invention comprises:
The switch valve assembly, be used between the adjacent cavity of concentrating type vacuum reaction equipment, it has first controlled valve, its folk prescription is to independent sealed reaction cavity, isolated two different adjacent cavitys when off status, make them respectively under different pressures, can carry out different technology separately simultaneously, when opening state, become the passage of transferring wafer turnover cavity;
The air pressure valve controller is used for the control of controlled valve open/close state;
It is characterized in that, also comprise:
The particle sampling channel, the one end is provided with sampled point in the lower end of controlled valve, and the other end is connected with grain analyser;
Grain analyser, it is long-range to be arranged on the switch valve assembly, links to each other with the particle sampling channel on the one hand, links to each other with the air pressure valve controller on the other hand.
And described switch valve assembly also comprises the second switch valve, constitutes the biswitch valve version with first controlled valve, and the setting of turning upside down of first controlled valve and second switch valve is standby each other.
According to the present invention, first controlled valve is for promoting by cylinder, by the structure of sealing ring sealing.The second switch valve is the structure identical with principle with the first controlled valve mechanical action.First controlled valve is that structure is identical with the second switch valve, and the energy folk prescription is to independent seal chamber.The air pressure valve controller is by electronic signal control, indicates according to signal and selects to drive first or the second switch valve.
Grain analyser also comprises, the pump of particle collector and absorption particle, and this pump links to each other with the sampling channel other end.Grain analyser is met light reflection mode for using spectrum analysis or particle, counts number of particles.
A kind of method that vacuum system prevents grain defect of wafer that is used for of the present invention comprises the steps:
A) gather particle, the particle at vacuum system cavity valve place;
B) grain count analysis;
C) grain count analysis result information is delivered to the air pressure valve controller;
D) the air pressure valve controller is selected driving first or second switch valve, switches between two controlled valves.
Wherein, gathering particle is that monitoring is gathered in real time in real time, the particle that produces in the promptly in running order controlled valve, because action of gravity is deposited to sampled point downwards, the pump that is sampled the passage other end by flexible pipe is drawn.It is that particle to gathering is delivered to particle collector that grain count is analyzed, and whether counting and analysing particulates number unusual, carry out the switching between the controlled valve when particle is unusual, and with number of particles as the whether unusual standard of cavity controlled valve.Switching between two controlled valves can be automatically, also can be manual.
Because two controlled valves can alternation; make controlled valve in running order all the time and particle that controlled valve produces is among the real-time monitoring; the particle of the controlled valve in the work is in normally all the time; therefore board can not shut down because of the problem of controlled valve; and granule number is controlled; thereby can the qualification rate of product not exerted an influence, guarantee the continuous operation of board and the qualification rate of chip.
Description of drawings
Fig. 1 is the reaction cavity schematic diagram that the cavity controlled valve is set.
Fig. 2 is the schematic diagram that the switch valve assembly of prior art is provided with between cavity.
Fig. 3 is the switch valve assembly schematic diagram of prior art.
Fig. 4 is the schematic diagram of an embodiment being provided with between cavity of the switch valve assembly with biswitch valve of the present invention.
Fig. 5 is the device schematic diagram that prevents grain defect of wafer of the present invention.
Fig. 6 is the device operation principle flow chart that prevents grain defect of wafer of the present invention.
The accompanying drawing marking explanation
1 concentrating type equipment
11 transmission cavities
12 mechanical arms
13 load chamber
14 load chamber
15～18 reaction chambers
2 prior art switch valve assemblies
20 plasma reaction chambeies
The cavity controlled valve of 21 prior aries
211 sealing rings
213 pneumatic cylinders
214 compression drying gas accesses/open state
215 compression drying gas access/off status
3 have the switch valve assembly of biswitch valve
30 plasma reaction chambeies
31 first controlled valves of the present invention
311 first controlled valve sealing rings
313 first controlled valve pneumatic cylinders
32 second switch valves of the present invention
321 second switch valve sealing rings
323 second switch valve pneumatic cylinders
326 particle sampled points
33 particle sampling channels
331 particle sampled points
332 flexible pipes
333 little pumps
34 grain analysers
35 air pressure valve controllers
36 indicator valve door switch signals
37 compressed air-driven, first controlled valve
38 compressed air-driven second switch valves
Embodiment
Below in conjunction with accompanying drawing to of the present invention be used for vacuum system prevent grain defect of wafer method and and device be described in detail.
The device that prevents grain defect of wafer of the present invention comprises:
The switch valve assembly, therefore it is to have increased a controlled valve on the basis of a controlled valve of original technology, has first controlled valve and second switch valve, the setting of turning upside down of two valves is standby each other, is arranged between two different cavitys.The effect of controlled valve is, isolated two different adjacent cavitys when controlled valve is in off status make them respectively under different pressures, can carry out different technology separately simultaneously, when controlled valve is in out state, provide the passage of wafer turnover cavity; The effect of biswitch valve is to be taken place when first controlled valve real-time monitors unusual particle, and judge in the time of to influence product percent of pass or need stop the board breaks in production immediately, provide an extra controlled valve to switch immediately, its technology can be proceeded, the time for the treatment of allows down or other maintenance project of arranging in pairs or groups separately, implements in the lump to handle.
The particle sampling channel, the one end is provided with sampled point in the lower end of controlled valve, and the other end is connected with pump in being arranged on grain analyser; When particle produced, because action of gravity is deposited to sampled point downwards, the pump that is sampled the passage other end by flexible pipe was drawn, and is sent to grain analyser.
The air pressure valve controller, it is arranged on the long-range of switch valve assembly, its effect is the electronic signal that receives from grain analyser, selects driving first or second switch valve, reaches by compressed-air actuated promotion and carries out the purpose that chosen controlled valve opens or closes.
Grain analyser, it is long-range that it is arranged on the switch valve assembly, by flexible pipe sampling particle, and its real-time continual result is sent to the particle register, whether unusual as cavity controlled valve standard, its effect is to gather and analysing particulates information with the analysis result of grain count.
Be illustrated in figure 1 as the cavity schematic diagram that is provided with the switch valve assembly.Wherein the switch valve assembly is arranged between adjacent two cavitys, as transmission cavity 11 and reaction chamber 15, also can be arranged at load chamber 13 and transmission cavity 11, between transmission cavity 11 and the reaction chamber 16,17,18 or the like.When controlled valve was in off status, its effect was isolated two different adjacent cavitys, made them respectively under different pressure and process conditions, can carry out different separately technical processs simultaneously.When controlled valve is in out state, be for the transmission of wafer between adjacent cavity, be provided with mechanical arm 12 in the transmission cavity 11, be used for transferring wafer between each cavity.
Be as shown in Figure 2, the example that existing controlled valve is provided with, one of them controlled valve 21 is arranged between adjacent cavity transmission cavity 11 and the plasma reaction chamber 20, isolated transmission cavity and plasma reaction chamber, make two chambeies under different process conditions, carry out different work, mechanical arm 12 transferring wafers in the transmission cavity, and carry out plasma deposition or etching in the plasma reaction chamber.
As shown in Figure 3, by sealing ring 211 sealing, and compression drying gas access/open state 214 and compression drying gas access/off status 215 is arranged between controlled valve 21 and the plasma reaction chamber 20, enter in the pneumatic cylinder 213 with control compression drying gas.By the driving that enters the compression drying gas in the pneumatic cylinder 213 controlled valve is opened or closed.Since only be provided with a controlled valve, unusually can't be monitored if particle takes place.When defect problem that Production Engineer's announcement apparatus engineer produces about controlled valve, the Facilities Engineer has to stop whole board to replace controlled valve, just can be found unusual when perhaps needing to wait until regular survey machine.Not only influence the continuous operation of board, also influence the qualification rate of product, can't retrieve in case cause damage.
Be the embodiment that the cavity of switch valve assembly of the present invention is set as shown in Figure 4, the switch valve assembly 3 that wherein has the biswitch valve is arranged between transmission cavity and the plasma reaction chamber, be on the basis of an original controlled valve, add a same controlled valve, when controlled valve is in off status, its effect is between the isolated adjacent cavity equally, as transmission cavity and reaction chamber, make them can be respectively under different pressures, can carry out different separately technology simultaneously, when controlled valve is in out state, mechanical arm 12 in transmission cavity transferring wafer under vacuum, and deposit of plasma gas phase or plasma etching are carried out in the plasma reaction chamber under certain pressure and temperature and gas atmosphere.Can monitor in real time, prevent grain defect of wafer.
Be the device schematic diagram that prevents grain defect of wafer of the present invention that comprises biswitch valve module among Fig. 4 as shown in Figure 5, it comprises:
Particle sampling channel 33, the one end have sampled point 331 be arranged on the lower end of controlled valve, by flexible pipe 332, be connected with the little pump 333 that is arranged on grain analyser, when defect particles produces, be deposited to sampled point 331 downwards owing to action of gravity, draw particle by pump 333 by flexible pipe 332, be sent to grain analyser 34.
Air pressure valve controller 35, it is arranged on the long-range of controlled valve 31,32, and its effect is the electronic signal 36 that receives from grain analyser 34, reaches by compressed-air actuated promotion and carries out the purpose that chosen controlled valve 31 or 32 opens or closes.
As shown in Figure 5, at first, first controlled valve 31 is started working, and first controlled valve 31 seals by sealing ring for promoting by cylinder, and folk prescription is to the structure of independent seal chamber.Particle sampling channel 33 is drawn the particle of gathering at sampled point 331 places by flexible pipe 332 and pump 333, be transported to the particle collector in the grain analyser 34, the particle data are through the analysis of grain analyser 34, send air pressure valve controller 35 to as control signal with electronic signal, according to the analysis result of particle data, the generation particle carries out two switchings between the valve when unusual.
Wherein the transmittance process of signal as shown in Figure 6, arrive grain analyser 34 by little pump 333 by flexible pipe 332 as the particle of gathering at the sampled point 331 of first controlled valve 31, grain analyser 34 is met light reflection mode for using spectrum analysis or particle, counts number of particles.If the signal of telecommunication 36 that grain analyser 34 spreads out of shows that particle is normal, then " not switching signal " passed to air pressure valve controller 35, continuation is sent compression drying gas and is carried out first controlled valve 31 and open or close by driving 37, the compression drying gas access is in out state, gas promotes the unlatching of first controlled valve in the pneumatic cylinder 313, otherwise close, such first controlled valve 31 is in the state of working on, and switching signal does not make the second switch valve still be in the state of stopping using.If the electronic signal 36 that grain analyser 34 spreads out of shows that particle is unusual, then " switching " signal passes to air pressure valve controller 35, by stopping to drive 37, not sending compression drying gas stops using first controlled valve 31, " switching " signal passes to air pressure valve controller 35 simultaneously, send opening or closing of compression drying gas execution second switch valve 32 by driving 38, when the compression drying gas access is in out state, compression drying gas in the pneumatic cylinder 323 promotes the second switch valve opening, otherwise close, the second switch valve is in running order.At this moment, first controlled valve can be handled or replace, and with standby, and still continuous operation of board can not be affected.
Another aspect of the present invention, the resultant information of grading analysis also can pass through screen display, and the Facilities Engineer carries out the manual switchover between the valve according to the controlled valve switching standards when needing.
Because the particle that controlled valve produces is in real-time monitoring state, therefore can prevent that grain defect from appearring in wafer, product percent of pass is not exerted an influence.
Claims (12)
1. one kind is used for the device that vacuum system prevents grain defect of wafer, comprising:
The switch valve assembly, be used between the adjacent cavity of concentrating type vacuum reaction equipment, described switch valve assembly has first controlled valve, described switch valve assembly folk prescription is to independent sealed reaction cavity, isolated two different adjacent cavitys when off status, make them respectively under different pressures, can carry out different technology separately simultaneously, when opening state, become the passage of transferring wafer turnover cavity;
The air pressure valve controller is used for the control of controlled valve open/close state;
It is characterized in that, also comprise:
The particle sampling channel, the one end is provided with sampled point in the lower end of controlled valve, and the other end is connected with grain analyser;
Grain analyser is arranged on the long-range of switch valve assembly, links to each other with the particle sampling channel on the one hand, links to each other with the air pressure valve controller on the other hand;
Described switch valve assembly also comprises the second switch valve, and itself and first controlled valve constitute the biswitch valve version, and the setting of turning upside down of first controlled valve and second switch valve is standby each other.
2. according to claim 1ly be used for the device that vacuum system prevents grain defect of wafer, it is characterized in that described first controlled valve is for promoting by cylinder, by the structure of sealing ring sealing.
3. according to claim 1ly be used for the device that vacuum system prevents grain defect of wafer, it is characterized in that described second switch valve is for promoting by cylinder, by the structure of sealing ring sealing.
4. according to claim 1ly be used for the device that vacuum system prevents grain defect of wafer, it is characterized in that described first controlled valve is identical with the second switch valve mechanism, can folk prescription to independent seal chamber.
5. according to claim 1ly be used for the device that vacuum system prevents grain defect of wafer, it is characterized in that described air pressure valve controller is by electronic signal control, indicate according to signal and select to drive first or the second switch valve.
6. according to claim 1ly be used for the device that vacuum system prevents grain defect of wafer, it is characterized in that described grain analyser comprises, particle collector and draw the pump of particle, this pump links to each other with the sampling channel other end.
7. according to claim 1ly be used for the device that vacuum system prevents grain defect of wafer, it is characterized in that described grain analyser uses spectrum analysis or particle to meet light reflection mode, counts number of particles.
8. one kind is used for the method that vacuum system prevents grain defect of wafer, comprises the steps:
A) gather particle, the particle of vacuum system cavity valve lower end;
B) grain count analysis;
C) grain count analysis result information is delivered to the air pressure valve controller;
D) the air pressure valve controller is selected driving first or second switch valve, switches between two controlled valves.
9. according to claim 8ly be used for the method that vacuum system prevents grain defect of wafer, it is characterized in that, described collection particle is that monitoring is gathered in real time in real time, it is the particle that produces in the in running order controlled valve, because action of gravity is deposited to sampled point downwards, the pump that is sampled the passage other end by flexible pipe is drawn.
10. according to claim 8ly be used for the method that vacuum system prevents grain defect of wafer, it is characterized in that described grain count analysis is that the particle of gathering is delivered to particle collector, whether counting and analysing particulates number be unusual.
11. according to claim 8ly be used for the method that vacuum system prevents grain defect of wafer, it is characterized in that whether unusual described grain count analysis result as cavity controlled valve standard.
12. according to claim 8ly be used for the method that vacuum system prevents grain defect of wafer, it is characterized in that the switching between described two controlled valves is automatic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100309124A CN100423186C (en) | 2005-10-31 | 2005-10-31 | Method and device for preventing grain defect of wafer in use for vacuum system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100309124A CN100423186C (en) | 2005-10-31 | 2005-10-31 | Method and device for preventing grain defect of wafer in use for vacuum system |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1959928A CN1959928A (en) | 2007-05-09 |
| CN100423186C true CN100423186C (en) | 2008-10-01 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100309124A Expired - Fee Related CN100423186C (en) | 2005-10-31 | 2005-10-31 | Method and device for preventing grain defect of wafer in use for vacuum system |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103276368A (en) * | 2013-04-28 | 2013-09-04 | 上海华力微电子有限公司 | Particle pollution monitoring system and chemical vapor deposition device |
| US11035494B2 (en) * | 2017-06-22 | 2021-06-15 | Fujikin Incorporated | Flow rate control apparatus and flow rate control method for the flow rate control apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0665848U (en) * | 1992-09-04 | 1994-09-16 | アー・フアウ・エル・ゲゼルシヤフト・フユール・フエルブレヌングスクラフトマシイネン・ウント・メッステヒニック・ミト・ベシユレンクテル・ハフツング・プロフエッソル・ドクトル・ドクトル・ハー・ツエー・ハン | Measuring device for determining the atmospheric turbidity of gases |
| JPH07106305A (en) * | 1993-10-06 | 1995-04-21 | Hitachi Ltd | Atom layer etching unit |
| CN1221807A (en) * | 1997-12-30 | 1999-07-07 | 三星电子株式会社 | In-situ monitoring plasma etching apparatus, its in-situ monitoring method, and in-situ cleaning method for removing residues in plasma ething chamber |
| JP2000246029A (en) * | 1999-02-26 | 2000-09-12 | Horiba Ltd | Fine particle separator |
| CN1468444A (en) * | 2000-10-02 | 2004-01-14 | 东京毅力科创株式会社 | Vacuum processing device |
-
2005
- 2005-10-31 CN CNB2005100309124A patent/CN100423186C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0665848U (en) * | 1992-09-04 | 1994-09-16 | アー・フアウ・エル・ゲゼルシヤフト・フユール・フエルブレヌングスクラフトマシイネン・ウント・メッステヒニック・ミト・ベシユレンクテル・ハフツング・プロフエッソル・ドクトル・ドクトル・ハー・ツエー・ハン | Measuring device for determining the atmospheric turbidity of gases |
| JPH07106305A (en) * | 1993-10-06 | 1995-04-21 | Hitachi Ltd | Atom layer etching unit |
| CN1221807A (en) * | 1997-12-30 | 1999-07-07 | 三星电子株式会社 | In-situ monitoring plasma etching apparatus, its in-situ monitoring method, and in-situ cleaning method for removing residues in plasma ething chamber |
| JP2000246029A (en) * | 1999-02-26 | 2000-09-12 | Horiba Ltd | Fine particle separator |
| CN1468444A (en) * | 2000-10-02 | 2004-01-14 | 东京毅力科创株式会社 | Vacuum processing device |
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| CN1959928A (en) | 2007-05-09 |
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Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111123 |
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Effective date of registration: 20111123 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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