CN100422888C - Batch-to-batch control system and method for reaction chamber level - Google Patents
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Abstract
Description
技术领域 technical field
本发明有关于一种批次间控制系统及其方法,且特别是有关于一种反应室层级的批次间控制系统及其方法。The present invention relates to an inter-batch control system and method thereof, and in particular to a reaction chamber-level inter-batch control system and method thereof.
背景技术 Background technique
随着半导体制造产业的发展,其晶片面积日渐增大,而电子元件则日益缩小,精准的过程控制已成为一个必要的技术,达成精准的过程控制必须依靠信息系统,例如工厂营运管制系统(Manufacturing Execution System,MES)即经常应用于生产流程变异性高的半导体制造产业,为提高机台设备的利用率,可利用工厂营运管制系统收集制造现场的各种数据,并进行数据的整理与分析,以提供管理者正确且及时的信息。此外,由于日积月累的磨损或材料的堆积,许多过程产生无法避免的变异,此时可利用批次间控制(Run-to-Run control)调整机台设备的控制参数及过程配方,以消除或减少过程偏移等干扰因素对晶片所造成的影响,目前,批次间控制技术已成为一种提高制造效率及制造质量的重要技术。With the development of the semiconductor manufacturing industry, the chip area is increasing day by day, while the electronic components are shrinking day by day. Accurate process control has become a necessary technology. To achieve accurate process control, information systems must be relied on, such as the factory operation control system (Manufacturing Execution System (MES) is often used in the semiconductor manufacturing industry with high variability in the production process. In order to improve the utilization rate of machine equipment, the factory operation control system can be used to collect various data on the manufacturing site, and organize and analyze the data. To provide managers with correct and timely information. In addition, due to the accumulation of wear and tear over time or the accumulation of materials, many processes have unavoidable variations. At this time, the control parameters of the machine equipment and the process formula can be adjusted by using the control between batches (Run-to-Run control) to eliminate or reduce The impact of disturbance factors such as process drift on the wafer, at present, the batch-to-batch control technology has become an important technology to improve manufacturing efficiency and manufacturing quality.
公知反应室层级的批次间控制(chamber level Run-to-Run control)技术具有以下缺点,即工厂营运管制系统无法依机台设备反应室的状态载入适当的控制参数,并且,机台设备无法自工厂营运管制系统接收额外的控制参数,如此,造成具有多个反应室的机台设备必须使用同一控制参数于所有反应室,并造成该机台设备采用反应室层级的批次间控制技术进行生产作业时,仅能采用并行模式过程(parallel mode process),而无法采用串行模式过程(serial mode process),然而,串行模式过程的产出效率较并行模式过程为高。The known chamber level Run-to-Run control technology has the following disadvantages, that is, the factory operation control system cannot load appropriate control parameters according to the state of the reaction chamber of the machine equipment, and the machine equipment Unable to receive additional control parameters from the plant operation control system, thus causing equipment with multiple reaction chambers to use the same control parameters for all reaction chambers, and causing the equipment to adopt batch-to-batch control technology at the chamber level When performing production operations, only the parallel mode process can be used, but the serial mode process cannot be used. However, the output efficiency of the serial mode process is higher than that of the parallel mode process.
如何使反应室层级的批次间控制技术得以采用串行模式过程,以提高半导体制造的生产率,是目前批次间控制技术的一个发展课题。How to enable the batch-to-batch control technology at the reaction chamber level to adopt a serial mode process to improve the productivity of semiconductor manufacturing is a current development topic for the batch-to-batch control technology.
发明内容 Contents of the invention
本发明的目的就是在提供一种反应室层级的批次间控制系统,克服公知技术无法应用于串行模式过程的问题,以提高半导体制造的生产率。The purpose of the present invention is to provide a batch-to-batch control system at the reaction chamber level, which overcomes the problem that the known technology cannot be applied to the serial mode process, so as to improve the productivity of semiconductor manufacturing.
本发明的再一目的是提供一种反应室层级的批次间控制方法,用以控制一机台设备,使该机台设备得以应用反应室层级的批次间控制技术于一串行模式过程,进而提高半导体制造的生产率。Another object of the present invention is to provide a reaction chamber-level batch-to-batch control method for controlling a machine equipment, so that the machine equipment can apply the reaction chamber-level batch-to-batch control technology in a serial mode process , thereby improving the productivity of semiconductor manufacturing.
本发明提出一种反应室层级的批次间控制系统,其包括:一机台设备以及一信息系统,该机台设备具有多个反应室,该信息系统与该机台设备间具有一第一数据链路,该信息系统对于每一此反应室,计算其反应室控制参数,且依据该多个反应室是否处于可执行状态,自该多个反应室控制参数中筛选出至少一可执行参数,依据该多个反应室是否处于可执行状态,选择至少一可执行配方,通过此第一数据链路传送该可执行参数及该可执行配方至该机台设备。The present invention proposes a reaction chamber-level inter-batch control system, which includes: a machine equipment and an information system, the machine equipment has a plurality of reaction chambers, and there is a first between the information system and the machine equipment Data link, the information system calculates the reaction chamber control parameters for each reaction chamber, and selects at least one executable parameter from the plurality of reaction chamber control parameters according to whether the plurality of reaction chambers are in an executable state , selecting at least one executable formula according to whether the plurality of reaction chambers are in the executable state, and transmitting the executable parameters and the executable formula to the machine equipment through the first data link.
依照本发明的较佳实施例所述的反应室层级的批次间控制系统,其中该信息系统例如是包括一工厂营运管制系统模块及一批次间控制器模块,该工厂营运管制系统模块与此批次间控制器模块间具有一第二数据链路,该工厂营运管制系统模块或此批次间控制器模块包含一参数筛选模块。According to the batch-to-batch control system at the reaction chamber level described in the preferred embodiment of the present invention, the information system, for example, includes a factory operation control system module and a batch-to-batch controller module, the factory operation control system module and There is a second data link between the inter-batch controller modules, and the factory operation control system module or the inter-batch controller module includes a parameter screening module.
本发明提出一种反应室层级的批次间控制方法,用以控制一机台设备,该机台设备具有多个反应室,该控制方法包括:取得该多个反应室的状态信息;对于每一此反应室,计算其反应室控制参数;依据该多个反应室是否处于可执行状态,筛选该多个反应室控制参数而产生至少一可执行参数;依据该多个反应室是否处于可执行状态,选择至少一可执行配方;以及传送该可执行参数及该可执行配方至该机台设备等步骤。The present invention proposes a batch-to-batch control method at the reaction chamber level, which is used to control a machine equipment with multiple reaction chambers. The control method includes: obtaining state information of the multiple reaction chambers; calculating the control parameters of the reaction chambers; according to whether the plurality of reaction chambers are in the executable state, screening the plurality of reaction chamber control parameters to generate at least one executable parameter; according to whether the plurality of reaction chambers are in the executable state state, selecting at least one executable recipe; and sending the executable parameters and the executable recipe to the machine equipment and other steps.
基于所述,本发明的控制系统及其方法对于每一此反应室,计算其反应室控制参数,并且依据该多个反应室是否处于可执行状态,筛选该多个反应室控制参数,选择至少一可执行配方,使不同反应室可以采用不同的控制参数,进而应用反应室层级的批次间控制技术于一串行模式过程。Based on the above, the control system and method of the present invention calculates the reaction chamber control parameters for each reaction chamber, and screens the plurality of reaction chamber control parameters according to whether the plurality of reaction chambers are in an executable state, and selects at least An executable recipe enables different control parameters to be used for different chambers, thereby applying chamber-level batch-to-batch control techniques to a serial mode process.
为让本发明的所述和其他目的、特征和优点能更明显易懂,下文特举较佳实施例,并配合附图,详细说明如下。In order to make the above and other objects, features and advantages of the present invention more comprehensible, preferred embodiments will be described in detail below together with the accompanying drawings.
附图说明 Description of drawings
图1表示本发明的反应室层级的批次间控制系统结构图。Fig. 1 shows the structure diagram of the batch-to-batch control system at the reaction chamber level of the present invention.
图2表示本发明的反应室层级的批次间控制方法流程图。FIG. 2 shows a flowchart of the batch-to-batch control method at the reaction chamber level of the present invention.
图3表示本发明一较佳实施例的系统结构图。Fig. 3 shows a system structure diagram of a preferred embodiment of the present invention.
图4表示本发明另一较佳实施例的系统结构图。Fig. 4 shows a system structure diagram of another preferred embodiment of the present invention.
主要元件符号说明Description of main component symbols
10:机台设备10: machine equipment
11:第一反应室11: The first reaction chamber
12:第二反应室12: The second reaction chamber
20:信息系统20: Information Systems
21:工厂营运管制系统模块21: Factory operation control system module
211:参数筛选单元211: Parameter screening unit
22:批次间控制器模块22: Batch-to-batch controller module
221:参数筛选单元221: Parameter screening unit
31:第一数据链路31: First data link
32:第二数据链路32: Second data link
步骤S2:取得反应室的状态信息的步骤Step S2: The step of obtaining the status information of the reaction chamber
步骤S4:对于每一反应室,计算其最佳化的反应室控制参数的步骤Step S4: For each reaction chamber, the step of calculating its optimal reaction chamber control parameters
步骤S6:依据反应室是否处于可执行状态,筛选反应室控制参数而产生至少一可执行参数的步骤Step S6: A step of screening the control parameters of the reaction chamber to generate at least one executable parameter according to whether the reaction chamber is in the executable state
步骤S8:依据反应室是否处于可执行状态,选择至少一可执行配方的步骤Step S8: A step of selecting at least one executable formula according to whether the reaction chamber is in an executable state
步骤S10:传送上述可执行参数及上述可执行配方至该机台设备的步骤Step S10: The step of transmitting the above-mentioned executable parameters and the above-mentioned executable formula to the machine equipment
具体实施方式 Detailed ways
请参阅图1,图1表示本发明的反应室层级的批次间控制系统结构图,一机台设备10具有一第一反应室11及一第二反应室12,一信息系统20与机台设备10间通过一第一数据链路31相互传递数据,第一数据链路31例如是采用一RS232连接线,并采用半导体设备通信标准(SemiconductorEquipment Communication Standard,SECS)相互传递数据,或例如是采用一以太网路(Ethernet)线路,并采用TCP/IP通信协定及高速SECS信息服务(High-Speed SECS Message Services,HSMS)相互传递数据。Please refer to Fig. 1, Fig. 1 shows the structural diagram of the batch-to-batch control system of the reaction chamber level of the present invention, a
信息系统20于一过程中,通过第一数据链路31取得第一反应室11及第二反应室12的状态信息,并分别计算最佳化的第一反应室控制参数及第二反应室控制参数,接着,信息系统20依据该多个反应室11、12是否处于可执行状态,自上述反应室控制参数中筛选出至少一可执行参数,例如第一反应室11的状态处于可执行状态,而第二反应室12的状态处于不可执行状态,则信息系统20筛选出上述第一反应室控制参数为可执行参数,而上述第二反应室控制参数被滤除,接着,信息系统20同样依据该多个反应室11、12是否处于可执行状态,选择至少一可执行配方,因该信息系统20选择第一反应室11的过程配方为可执行配方,并通过第一数据链路31传送上述可执行参数及上述可执行配方至机台设备10,此时机台设备10利用第一反应室11并以上述可执行参数及上述可执行配方进行加工过程,如此,由于信息系统20具有筛选反应室控制参数的功能,因该可以传送单一反应室的控制参数至机台设备10,使第一反应室11与第二反应室12可以采用不同的控制参数。In a process, the
于一半导体过程中,一生产批(lot)通常包含多个晶片的制造,利用本发明的控制系统,该多个晶片可以选择送入第一反应室11,亦可选择送入第二反应室12,因该可同时利用第一反应室11及第二反应室12进行加工,例如第一片晶片以第一反应室11进行加工,第二片晶片以第二反应室12进行加工,第一片晶片加工完成后,第三片晶片以第一反应室11进行加工,以此类推,亦即采用一串行模式过程进行加工,此外,亦可选择使用同一反应室加工同一生产批的晶片,另一生产批的晶片则使用另一反应室加工,亦即采用一并行模式过程进行加工。In a semiconductor process, a production batch (lot) usually includes the manufacture of a plurality of wafers. Using the control system of the present invention, the plurality of wafers can be selectively sent into the
请参阅图2,图2表示本发明的反应室层级的批次间控制方法流程图,该控制方法系利用一信息系统20控制一机台设备10,其中机台设备10具有一第一反应室11及一第二反应室12,信息系统20与机台设备10间具有一第一数据链路31,首先,信息系统20通过第一数据链路31取得该多个反应室11、12的状态信息步骤S2,并分别计算最佳化的第一反应室控制参数及第二反应室控制参数步骤S4,接着,信息系统20依据该多个反应室11、12是否处于可执行状态,筛选上述第一反应室控制参数及第二反应室控制参数而产生至少一可执行参数步骤S6,接着,同样依据该多个反应室11、12是否处于可执行状态,选择至少一可执行配方步骤S8,最后,信息系统20传送上述可执行参数及上述可执行配方至机台设备10步骤S10。Please refer to FIG. 2. FIG. 2 shows a flow chart of the batch-to-batch control method at the reaction chamber level of the present invention. The control method uses an
请参阅图3,图3表示本发明一较佳实施例的系统结构图,一机台设备10具有一第一反应室11及一第二反应室12,一信息系统20包括一工厂营运管制系统模块21及一批次间控制器模块22,工厂营运管制系统模块21与机台设备10间通过一第一数据链路31相互传递数据,工厂营运管制系统模块21与批次间控制器模块22间具有一第二数据链路32,其中批次间控制器模块22具有一参数筛选单元221,于一过程中,机台设备10通过第一数据链路31传送一请求指令(request)至工厂营运管制系统模块21,该请求指令的内容包括第一反应室11及第二反应室12的状态信息,之后,工厂营运管制系统模块21通过第二数据链路32传送该多个反应室11、12的状态信息至批次间控制器模块22,接着,批次间控制器模块22分别计算最佳化的第一反应室控制参数及第二反应室控制参数,并依据该多个反应室11、12是否处于可执行状态,利用参数筛选单元221筛选出至少一可执行参数,例如第一反应室11的状态处于可执行状态,而第二反应室12的状态处于不可执行状态,则参数筛选单元221筛选出上述第一反应室控制参数为可执行参数,而上述第二反应室控制参数被滤除,接着,批次间控制器模块22通过第二数据链路32传送上述可执行参数至工厂营运管制系统模块21,工厂营运管制系统模块21依据第一反应室11处于可执行状态,选择第一反应室11的配方为可执行配方,并通过第一数据链路31传送上述可执行参数及上述可执行配方至机台设备10,此时机台设备10利用第一反应室11并以上述可执行参数及上述可执行配方进行加工过程。Please refer to Fig. 3, Fig. 3 represents the system structure diagram of a preferred embodiment of the present invention, a
请参阅图4,图4表示本发明另一较佳实施例的系统结构图,一机台设备10具有一第一反应室11及一第二反应室12,一信息系统20包括一工厂营运管制系统模块21及一批次间控制器模块22,工厂营运管制系统模块21与机台设备10间通过一第一数据链路31相互传递数据,工厂营运管制系统模块21与批次间控制器模块22间具有一第二数据链路32,其中工厂营运管制系统模块21具有一参数筛选单元211,于一过程中,机台设备10通过第一数据链路31传送一请求指令至工厂营运管制系统模块21,的后,工厂营运管制系统模块21通过第二数据链路32传送另一请求指令至批次间控制器模块22,该多个请求指令的内容包括第一反应室11及第二反应室12的状态信息,接着,批次间控制器模块22分别计算最佳化的第一反应室控制参数及第二反应室控制参数,并利用第二数据链路32传送上述第一反应室控制参数及上述第二反应室控制参数至工厂营运管制系统模块21,工厂营运管制系统模块21利用参数筛选单元211,依据该多个反应室11、12是否处于可执行状态,筛除处于不可执行状态的反应室的控制参数,而保留至少一可执行参数,例如第一反应室11的状态处于可执行状态,而第二反应室12的状态处于不可执行状态,则参数筛选单元211筛除第二反应室控制参数,而保留第一反应室控制参数为可执行参数,接着,工厂营运管制系统模块21依据第一反应室11处于可执行状态,选择第一反应室11的配方为可执行配方,并通过第一数据链路31传送上述可执行参数及上述可执行配方至机台设备10,此时机台设备10利用第一反应室11并以上述可执行参数及上述可执行配方进行加工过程。Please refer to Fig. 4, Fig. 4 represents the system structure diagram of another preferred embodiment of the present invention, a
综上所述,本发明的控制系统及其方法分别对于第一反应室11及第二反应室12,计算其最佳化的反应室控制参数,并且依据该多个反应室11、12是否处于可执行状态,筛选及传送上述反应室控制参数,因该可以传送单一反应室的控制参数至机台设备10,使第一反应室11与第二反应室12具有不同的控制参数,进而应用反应室层级的批次间控制技术于一串行模式过程。To sum up, the control system and method of the present invention calculate the optimal reaction chamber control parameters for the
本发明虽以优选实施例公开如上,然其并非用以限定本发明,任何本领域技术人员,在不脱离本发明的精神和范围的情况下,可进行更动与修改,因此本发明的保护范围以所提出的权利要求所限定的范围为准。Although the present invention is disclosed as above with preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection of the present invention The scope is as defined by the appended claims.
Claims (9)
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CN101963802B (en) * | 2010-08-25 | 2012-08-15 | 江苏大学 | Virtual measurement method in batch manufacture procedure and system therefor |
CN102456537B (en) * | 2010-10-27 | 2013-11-06 | 沈阳中科博微自动化技术有限公司 | Cluster semiconductor equipment oriented reaction chamber and transfer chamber function invoking method |
CN103236382B (en) * | 2013-05-04 | 2015-06-10 | 四川虹欧显示器件有限公司 | Method for determining process parallel rationalization of manufacturing process of plasma display screen |
CN103236383B (en) * | 2013-05-04 | 2015-08-05 | 四川虹欧显示器件有限公司 | Dynamically determining and optimization method of plasma panel process parameters importance |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5926690A (en) * | 1997-05-28 | 1999-07-20 | Advanced Micro Devices, Inc. | Run-to-run control process for controlling critical dimensions |
US20030014145A1 (en) * | 2001-07-16 | 2003-01-16 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
CN1445662A (en) * | 2002-03-14 | 2003-10-01 | 旺宏电子股份有限公司 | System and method for automatic pre-adjustment of process parameters of ion implantation machine |
US20040173599A1 (en) * | 2003-03-04 | 2004-09-09 | Velichko Sergey A. | Multi-parameter process and control method |
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US5926690A (en) * | 1997-05-28 | 1999-07-20 | Advanced Micro Devices, Inc. | Run-to-run control process for controlling critical dimensions |
US20030014145A1 (en) * | 2001-07-16 | 2003-01-16 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
CN1445662A (en) * | 2002-03-14 | 2003-10-01 | 旺宏电子股份有限公司 | System and method for automatic pre-adjustment of process parameters of ion implantation machine |
US20040173599A1 (en) * | 2003-03-04 | 2004-09-09 | Velichko Sergey A. | Multi-parameter process and control method |
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