CN105280521B - Technique processing control method, system and the semiconductor equipment of semiconductor equipment - Google Patents
Technique processing control method, system and the semiconductor equipment of semiconductor equipment Download PDFInfo
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- CN105280521B CN105280521B CN201410353986.0A CN201410353986A CN105280521B CN 105280521 B CN105280521 B CN 105280521B CN 201410353986 A CN201410353986 A CN 201410353986A CN 105280521 B CN105280521 B CN 105280521B
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Abstract
The invention discloses technique processing control method, system and the semiconductor equipments of a kind of semiconductor equipment.The technique processing control method of semiconductor equipment is the following steps are included: the second driving node that the first driving node and control wafer alignment device of building control manipulator operation operate in input and output configuration file；The second object of the first object of corresponding first driving node of building and corresponding second driving node in driving configuration file；First object and second object independently control the operation of the manipulator and the operation of wafer alignment device according to the message received.Its parallel work-flow for realizing manipulator and wafer alignment device, improves the utilization rate of manipulator and wafer alignment device in technical process, is conducive to the raising of production efficiency.
Description
Technical field
The present invention relates to semiconductors to prepare control field, more particularly to a kind of technique machining control side of semiconductor equipment
Method, system and semiconductor equipment.
Background technique
In the preparation process (such as film thickness measuring, etching, physical vapour deposition (PVD)) of semiconductor, chip to be treated or
Substrate needs to carry out process from being gradually transmitted in atmospheric environment in processing chamber.Chip is transmitted to processing chamber, is led to
Frequently with wafer transmission system, which includes hop and control section.Hop includes film magazine loading device, machinery
Hand (Robot) and wafer alignment device (Aligner), wherein film magazine loading device is for loading film magazine；Manipulator is used for transmission
Chip；Wafer alignment device is used for the center of calibration chip；Control section controls manipulator under preset program and is acted,
Complete the transmission to chip.
Existing chip transmission uses serial scheduling method, and basic transmission process of the single-wafer in Transmission system is such as
Under:
The load of film magazine loading device is equipped with the film magazine of chip, and manipulator takes out chip from film magazine, and is placed into chip
Calibrating installation；Wafer alignment device calibrates chip；Manipulator takes the chip after calibration from wafer alignment device away, puts
Enter into technical module；Technical module carries out process to chip；Manipulator is by the chip being disposed from technical module
It takes out, is placed into sky film magazine；The above process is recycled, until in the film magazine equipped with chip to be processed that film magazine loading device is loaded
Chip be disposed.
For the above method, in the calibration process of chip, manipulator is in the state waited, cannot obtain effective benefit
With lower so as to cause efficiency of transmission；In addition, technical module is during carrying out process, manipulator is also being waited, into
One step reduces efficiency of transmission.
In order to improve yield, people need to allow as far as possible independent between equipment, allow distinct device as far as possible in the same time
Can be with operating alone, still, in the prior art, manipulator and calibrating installation still fall within same device drives node, this
Device drives are controlled by class Dvr_Sorter, and the final operation executed to Date cannot operate simultaneously, can only wait one
A operation finished and then carry out another cannot achieve manipulator and wafer alignment device parallel work-flow.
Summary of the invention
Based on this, the invention proposes technique processing control method, system and the semiconductor equipment of a kind of semiconductor equipment,
The parallel work-flow of manipulator and wafer alignment device can be achieved.
In order to achieve the above object, the present invention adopts the following technical scheme:
A kind of technique processing control method of semiconductor equipment, comprising the following steps:
The first driving node of building control manipulator operation and control wafer alignment dress in input and output configuration file
Set the second driving node of operation；
The first object of corresponding first driving node of building and corresponding second driving in driving configuration file
Second object of node；
First object and second object independently control the behaviour of the manipulator according to the message received
Make the operation with wafer alignment device.
As an embodiment, the driving configuration file is Driver_config.xml file；
The input and output configuration file is IO_config.xml file.
As an embodiment, first object and second object pass through a shared communication channel reception
The message.
As an embodiment, first object and second object according to the message received independently
Control the operation of the manipulator and the operation of wafer alignment device, comprising the following steps:
To by the shared communication channel reception to the message judge；
If the message is the operational order of manipulator, it is sent to first object, by first object control
The operation of the manipulator；
If the message is the operational order of wafer alignment device, it is sent to second object, by described second pair
Operation as controlling the wafer alignment device.
As an embodiment, first object includes the first variable, and second object includes the second variable；
When the message is the operational order of manipulator, it is non-empty that first variable, which is arranged,；
When the message is the operational order of wafer alignment device, it is non-empty that second variable, which is arranged,.
A kind of technique control system for processing of semiconductor equipment, including input and output configuration file, driving configuration file and
Execution module；
The first driving node and control chip school configured with control manipulator operation in the input and output configuration file
Second driving node of standard apparatus operation；
The first object and corresponding described second configured with corresponding first driving node in the driving configuration file
Second object of driving node；
The execution module, it is only for being distinguished using first object and second object according to the message received
The operation of the vertical control manipulator and the operation of wafer alignment device.
As an embodiment, the technique control system for processing of the semiconductor equipment further includes shared communication mould
Block；
First object and second object pass through the shared communication channel reception institute in the shared communication module
State message.
As an embodiment, the execution module includes that judging submodule, the first implementation sub-module and second are held
Row submodule, in which:
The judging submodule, for by the shared communication channel reception to the message judge；
First implementation sub-module, for being sent to described first when the message is the operational order of manipulator
Object, the operation of the manipulator as described in first object control；
Second implementation sub-module, for being sent to institute when the message is the operational order of wafer alignment device
The second object is stated, the operation of the wafer alignment device as described in second object control.
As an embodiment, first object includes the first variable, and second object includes the second variable；
The execution module further includes the first setting submodule and the second setting submodule；
The first setting submodule, for being arranged described first and becoming when the message is the operational order of manipulator
Amount is non-empty；
The second setting submodule, for when the message is the operational order of wafer alignment device, described in setting
Second variable is non-empty.
A kind of semiconductor equipment, for realizing the parallel control to manipulator and wafer alignment device, including described half
The technique control system for processing of conductor device.
The technique processing control method and system of semiconductor equipment of the invention are distinguished by two different control units
The operation for controlling manipulator and wafer alignment device, realizes the parallel work-flow of manipulator and wafer alignment device, improves work
The utilization rate of manipulator and wafer alignment device during skill, reduces the standby time of equipment, is conducive to mentioning for production efficiency
It is high.
Semiconductor equipment of the invention, it is with higher using the technique control system for processing of above-mentioned semiconductor equipment
Utilization rate of equipment and installations can significantly improve working efficiency.
Detailed description of the invention
Fig. 1 is the flow chart of one embodiment of technique processing control method of the invention；
Fig. 2 is the workflow of one embodiment of shared communication channel in processing control method of the invention；
Fig. 3 is the module map of one embodiment of execution module in control system for processing of the invention.
Specific embodiment
With reference to the accompanying drawings of the specification, to the specific embodiment of the technique processing control method in the embodiment of the present invention into
Row explanation.
The present invention provides a kind of technique processing control method of semiconductor equipment, which passes through
Two different driving nodes respectively control manipulator and wafer alignment device, realize manipulator and wafer alignment dress
The parallel work-flow set reduces the unnecessary time loss of technical process, improves production efficiency.
In conjunction with Fig. 1, technique processing control method of the invention the following steps are included:
S100: the first driving node of building control manipulator operation and control chip school in input and output configuration file
Second driving node of standard apparatus operation.
As an embodiment, input and output configuration file is IO_config.xml file.In IO_
In config.xml file, increase corresponding sentence, construct two different driving nodes, controls manipulator respectively and execute pick-and-place
The movement of chip and wafer alignment device execute the calibration actions of chip.
S200: the first object and corresponding second driving node of corresponding first driving node are constructed in driving configuration file
The second object；
As an embodiment, driving configuration file is Driver_config.xml file.In Driver_
The first object and the second object are constructed in config.xml file.Wherein, corresponding first driving node of the first object, drives first
Driving manipulator is operated under the control of dynamic node；Second object corresponds to the second driving node, in the control of the second driving node
The lower driving wafer alignment device of system is operated.
S300: the first object and the second object are according to the message received the independently operation of driving manipulator and chip
The operation of calibrating installation.
In S300, the first object and the second object pass through a shared communication channel reception message.Shared communication channel
It is responsible for being communicated with manipulator and wafer alignment device, including sends message and receive message.I.e. the shared communication channel can
The information such as position and the state from manipulator or wafer alignment device are received, and the information received is sent to the first object
Or second object.
Preferably, as an embodiment, S300 the following steps are included:
S310, to by shared communication channel reception to message judge；
S320 is sent to the first object, by the behaviour of the first object control manipulator if message is the message of manipulator
Make；
S330 is sent to the second object if message is the operational order of wafer alignment device, by the second object control crystalline substance
The operation of calibrator.
It, when it receives a message, can same time control since the first object and the second object are belonging respectively to different driving nodes
The movement of the pick-and-place chip of manipulator processed and the calibration actions of wafer alignment device, realize manipulator and wafer alignment device and
Row operation；I.e. while the first object control manipulator executes the movement for picking and placing chip, the second object can control wafer alignment
Device executes calibration actions, and the two is not interfere with each other, and reaches parallel work-flow truly.
In technique processing control method of the invention, the first object includes the first variable, and the second object includes the second change
Amount；When message is the operational order of manipulator, the first variable of setting is non-empty；When the operation that message is wafer alignment device is ordered
When enabling, the second variable of setting is non-empty.That is:
When the first object and the second object receive the message sent from shared communication channel, first determine whether to receive
Message in respective variable whether be it is empty, if non-empty, which is parsed, controls manipulator and/or chip school
Standard apparatus executes corresponding movement；If it is empty, then message next time is waited.
Since shared communication channel reception, transmission message are a real-time operation process, when shared communication channel exists
When carrying out the transmission of message, the time for receiving message can be postponed.Preferably, as an embodiment, shared communication channel
Including two independent threads, one is used to receive message, and one for sending message.
It referring to fig. 2, is the work flow diagram in shared communication channel.It is receiving from manipulator and wafer alignment device
When message, the message is judged first, if the message of manipulator, then it is first pair corresponding the message to be assigned to manipulator
As；If the message of wafer alignment device, then the message is assigned to corresponding second object of wafer alignment device.
It should be noted that Robot.Result=returns the result the message for meaning that the first object receives in Fig. 2
The non-empty in Robot.Result, the first object driving manipulator of control are operated；Aligner.Result=is returned the result
Mean message that the second object the receives non-empty in Aligner.Result, control the second object driving wafer alignment dress
It sets and is operated.
For specific explanations technique processing control method of the invention, come specifically below by way of a specific embodiment
It is bright.
Embodiment 1
In Driver_config.xml file,
In IO_config.xml file,
It is postponed as can be seen that above-mentioned Driver_config.xml file and IO_config.xml file pass through to match, it is raw
At two different driving nodes, and object corresponding with two driving nodes: the TcpAligner that a node is 2
Object, the TcpRobot object that a node is 7.Wherein, driving node 2 controls the operation of manipulator, and driving node 7 controls crystalline substance
The operation of calibrator is realized especially by following sentence:
In Driver_config.xml file,
<setNodeNum type="method">7</setNodeNum>the driving node 7 of // * setting manipulator
<setNodeNum type="method">2</setNodeNum>the driving node 2 of // * setting calibrating installation
In IO_config.xml file, increase following sentence, control driving node 7 and driving node 2:
<bd>2</Bd>// * reads the file of driving calibrating installation from node 2
<bd>7</Bd>// * reads the file of driving manipulator from node 7
The method and system of parallel work-flow manipulator and calibrating installation of the invention, construct two driving nodes, make
The production efficiency of equipment can be improved with parallel work-flow by obtaining manipulator and wafer alignment device.
Based on the same inventive concept, the embodiment of the present invention provides a kind of technique control system for processing of semiconductor equipment, by
Similar to a kind of aforementioned method in the principle that this system solves the problems, such as, therefore, the implementation of the system can be according to preceding method
Specific steps realize that overlaps will not be repeated.
The technique control system for processing of semiconductor equipment of the invention includes input and output configuration file, driving configuration file
And execution module.
Wherein, the first driving node configured with control manipulator operation in input and output configuration file and control chip school
Second driving node of standard apparatus operation；Drive the first object and correspondence configured with corresponding first driving node in configuration file
Second object of the second driving node；Execution module, for being divided using the first object and the second object according to the message received
The operation of other independent control manipulator and the operation of wafer alignment device.
The technique control system for processing of semiconductor equipment of the invention further includes shared communication module；First object and second
Object passes through the shared communication channel reception message in shared communication module.
Referring to Fig. 3, as an embodiment, above-mentioned execution module includes judging submodule 112, first executes son
Module 114 and the second implementation sub-module 116.Wherein: judging submodule 112, for being arrived by shared communication channel reception
Message is judged；First implementation sub-module 114, for being sent to the first object when the operational order that message is manipulator, by
The operation of first object control manipulator；Second implementation sub-module 116, for being ordered when the operation that message is wafer alignment device
It enables, the second object is sent to, by the operation of the second object control wafer alignment device.
In the technique control system for processing of semiconductor equipment of the invention, the first object includes the first variable, the second object
Including the second variable.
With continued reference to Fig. 3, above-mentioned execution module further includes the first setting submodule 117 and the second setting submodule 118.
Wherein, the first setting submodule 117, for when message is the operational order of manipulator, the first variable of setting to be non-empty；Second
Submodule 118 is set, for when message is the operational order of wafer alignment device, the second variable of setting to be non-empty.
The technique control system for processing of the semiconductor equipment by two different driving nodes control respectively manipulator and
The operation of wafer alignment device realizes the parallel work-flow of manipulator and wafer alignment device, improves manipulator and chip school
The utilization rate of standard apparatus reduces the standby time of equipment, is conducive to the raising of production efficiency.
In addition, the present invention also provides a kind of semiconductor equipment, for realizing to manipulator and wafer alignment device and
Row control.The semiconductor equipment includes the technique control system for processing of above-mentioned semiconductor equipment, equipment utilization with higher
Rate can significantly improve working efficiency.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
Limitations on the scope of the patent of the present invention therefore cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to guarantor of the invention
Protect range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (10)
1. a kind of technique processing control method of semiconductor equipment, which comprises the following steps:
The first driving node of building control manipulator operation and control wafer alignment device behaviour in input and output configuration file
The second driving node made；
The first object and corresponding second driving node of corresponding first driving node of building in driving configuration file
The second object；
First object and second object according to the message received independently control the manipulator operation and
The operation of wafer alignment device；
Wherein, first object corresponds to first driving node, under the control of first driving node described in driving
Manipulator is operated；Second object corresponds to second driving node, drives under the control of second driving node
The wafer alignment device is moved to be operated.
2. the technique processing control method of semiconductor equipment according to claim 1, which is characterized in that
The driving configuration file is Driver_config.xml file；
The input and output configuration file is IO_config.xml file.
3. the technique processing control method of semiconductor equipment according to claim 1, which is characterized in that first object
Pass through message described in a shared communication channel reception with second object.
4. the technique processing control method of semiconductor equipment according to claim 3, which is characterized in that first object
The operation of the manipulator and the behaviour of wafer alignment device are independently controlled according to the message received with second object
Make, comprising the following steps:
To by the shared communication channel reception to the message judge；
If the message is the operational order of manipulator, it is sent to first object, as described in first object control
The operation of manipulator；
If the message is the operational order of wafer alignment device, it is sent to second object, by the second object control
Make the operation of the wafer alignment device.
5. the technique processing control method of semiconductor equipment according to claim 4, which is characterized in that first object
Including the first variable, second object includes the second variable；
When the message is the operational order of manipulator, it is non-empty that first variable, which is arranged,；
When the message is the operational order of wafer alignment device, it is non-empty that second variable, which is arranged,.
6. a kind of technique control system for processing of semiconductor equipment, which is characterized in that match including input and output configuration file, driving
Set file and execution module；
The first driving node and control wafer alignment dress configured with control manipulator operation in the input and output configuration file
Set the second driving node of operation；
The first object and corresponding second driving configured with corresponding first driving node in the driving configuration file
Second object of node；
The execution module, for independently being controlled using first object and second object according to the message received
Make the operation of the manipulator and the operation of wafer alignment device；
Wherein, first object corresponds to first driving node, under the control of first driving node described in driving
Manipulator is operated；Second object corresponds to second driving node, drives under the control of second driving node
The wafer alignment device is moved to be operated.
7. the technique control system for processing of semiconductor equipment according to claim 6, which is characterized in that further include shared logical
Believe module；
First object and second object described in the shared communication channel reception in the shared communication module by disappearing
Breath.
8. the technique control system for processing of semiconductor equipment according to claim 7, which is characterized in that the execution module
Including judging submodule, the first implementation sub-module and the second implementation sub-module, in which:
The judging submodule, for by the shared communication channel reception to the message judge；
First implementation sub-module, for being sent to first object when the message is the operational order of manipulator,
The operation of the manipulator as described in first object control；
Second implementation sub-module, for being sent to described the when the message is the operational order of wafer alignment device
Two objects, the operation of the wafer alignment device as described in second object control.
9. the technique control system for processing of semiconductor equipment according to claim 8, which is characterized in that first object
Including the first variable, second object includes the second variable；
The execution module further includes the first setting submodule and the second setting submodule；
Described first is arranged submodule, is for first variable to be arranged when the message is the operational order of manipulator
Non-empty；
The second setting submodule, for being arranged described second when the message is the operational order of wafer alignment device
Variable is non-empty.
10. a kind of semiconductor equipment, for realizing the parallel control to manipulator and wafer alignment device, which is characterized in that packet
Include the technique control system for processing of semiconductor equipment described in claim 6-9 any one.
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|---|---|---|---|---|
| CN101615025A (en) * | 2008-06-26 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of maintenance control method and system that is used for semiconductor processing equipment |
| CN103399543A (en) * | 2013-07-23 | 2013-11-20 | 清华大学 | Method and system for scheduling multiple robot equipment cooperated for transferring wafers |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6520727B1 (en) * | 2000-04-12 | 2003-02-18 | Asyt Technologies, Inc. | Modular sorter |
| CN101740441B (en) * | 2008-11-04 | 2012-04-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and device for dispatching mechanical hand and plasma processing equipment |
| JP5592863B2 (en) * | 2011-11-02 | 2014-09-17 | 株式会社日立ハイテクノロジーズ | Vacuum processing apparatus and method for conveying object to be processed |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101615025A (en) * | 2008-06-26 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of maintenance control method and system that is used for semiconductor processing equipment |
| CN103399543A (en) * | 2013-07-23 | 2013-11-20 | 清华大学 | Method and system for scheduling multiple robot equipment cooperated for transferring wafers |
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