CN105470102A - Method for enhancing utilization efficiency of reaction chamber - Google Patents
Method for enhancing utilization efficiency of reaction chamber Download PDFInfo
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- CN105470102A CN105470102A CN201410449044.2A CN201410449044A CN105470102A CN 105470102 A CN105470102 A CN 105470102A CN 201410449044 A CN201410449044 A CN 201410449044A CN 105470102 A CN105470102 A CN 105470102A
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Abstract
The invention relates to the field of integrated circuit manufacturing, in particular to a method for enhancing utilization efficiency of reaction chambers. Before carrying out a production process, number of available reaction chambers on a machine for carrying out the production process is obtained through a production process control system, the minimum number of reaction chambers participating in the production process is set in the production process control system, data information is transmitted to a machine automation system, the machine automation system selects idle and available reaction chambers conforming to the minimum number of reaction chambers by utilizing attribute information of the available reaction chambers, number of wafers to be processed in the idle and available reaction chambers is balanced, and the production process is carried out in the idle and available reaction chambers, thereby shortening wafer processing waiting time, and effectively enhancing utilization efficiency of the reaction chambers.
Description
Technical field
The present invention relates to IC manufacturing field, be specifically related to a kind of method improving reative cell service efficiency.
Background technology
In integrated circuit is produced, produce wafer primarily of wafer machine platform, namely a collection of wafer will enter in the reative cell of a wafer machine platform and process; And each wafer machine platform may have several reative cells, and the differential responses room of same wafer machine platform may be the same for the processing mode of same production technology (RECIPE), if processing mode is identical, then any one reative cell that wafer can enter this board processes.
In actual production, it is that in controlling of production process system, (RecipeControlProgram is called for short by process engineers that concrete production technology can carry out process at which reative cell, RCP) be configured in, need to configure multiple reative cell for a production technology.When a wafer to arrive board process time, the reative cell that it enters may process other wafers, so this wafer will wait for reprocessing, so just not only increase the processing time of wafer, the reative cell that also wafer machine platform can be made to have is more idle and some reative cells are busier, reduce the service efficiency of some reative cell, so need the service efficiency that a kind of method can improve each reative cell of wafer machine platform, each reative cell of board can be fully utilized, also the time that wafer etc. is pending can be reduced, thus can enhance productivity the minimizing wafer production time.
Summary of the invention
The invention discloses a kind of method improving reative cell service efficiency, before carrying out an end production process, available number of chambers on the board being obtained carrying out above-mentioned production technology by controlling of production process system, and setting participates in the quantity of the minimal reaction room of above-mentioned production technology in this controlling of production process system, continue above-mentioned data information transfer to board automated system, and this board automated system continues to utilize the attribute information of above-mentioned available reative cell to select to meet the available reative cell of the free time of minimal reaction number of chambers amount, after the available reative cell continuing the balanced above-mentioned free time will process the quantity of wafer, production technology is carried out in the available reative cell of this free time, thus decrease the pending time such as wafer, effectively improve the service efficiency of reative cell.
This invention describes a kind of method improving reative cell service efficiency, be applied to be provided with some reative cells wafer machine platform on, wherein, described method comprises:
Step S1: before carrying out an end production process, in controlling of production process system, the reative cell that described wafer machine platform can be used for carrying out described production technology is set according to the condition of this end production process and the supplemental characteristic of each reative cell, and participates in the minimal reaction number of chambers amount of described production technology according to process requirements setting;
Step S2: when several wafers enter wafer machine platform described in carry out described production technology time, board automated system is according to the reative cell that can be used for carrying out described production technology arranged in controlling of production process system, draw the attribute information of available reative cell, and obtain available number of chambers and described minimal reaction number of chambers amount on this wafer machine platform;
Step S3: number of chambers available on current wafer board and described minimal reaction number of chambers amount are compared by described board automated system;
If when on current wafer board, available number of chambers is greater than described minimal reaction number of chambers amount, described board automated system, according to the attribute information of described available reative cell, current wafer board is selected idle available reative cell carry out described production technology;
Otherwise described board automated system, according to the attribute information of described available reative cell, current wafer board is selected all available reative cells carry out described production technology;
Wherein, the quantity of the available reative cell of described free time is equal with described minimal reaction number of chambers amount.
The method of above-mentioned raising reative cell service efficiency, wherein, described controlling of production process system is connected with board automated system both-way communication, and described board automated system is connected with described wafer machine platform both-way communication;
Wherein, the attribute information of all reative cells on wafer machine platform described in described board automated system real-time reception, and after the attribute information of available reative cell is wherein processed, carry out described production technology to select idle available reative cell on current wafer board.
The method of above-mentioned raising reative cell service efficiency, wherein, the attribute information of described available reative cell comprises:
The numbering of each described available reative cell in wafer machine platform;
The wafer number that each described available reative cell is etc. pending;
The pending wafer such as each is in the processing time of described available reative cell.
The method of above-mentioned raising reative cell service efficiency, wherein, board automated system described in described step S3 selects idle available reative cell to carry out the step of described production technology on current wafer board, is specially:
Described board automated system obtains on described wafer machine platform and needs wafer number to be processed, and show that each available reative cell carries out the technique stand-by period of described production technology according to the attribute information of described available reative cell, to draw idle available reative cell according to this technique stand-by period length;
Wherein, the technique stand-by period of the available reative cell of described free time is less than the technique stand-by period of busy available reative cell.
The method of above-mentioned raising reative cell service efficiency, wherein, according to each described available reative cell, etc. pending wafer number and this wafer obtain the described technique stand-by period of each described available reative cell in the processing time of described available reative cell to described automated machine system.
The method of above-mentioned raising reative cell service efficiency, wherein, described method also comprises: described board automated system is according to described technique stand-by period of available reative cell of carrying out described production technology, and setting enters the quantity of the wafer of this available reative cell;
Wherein, the technique stand-by period of the quantity and this available reative cell that enter the wafer of available reative cell is inversely proportional to.
The method of above-mentioned raising reative cell service efficiency, wherein, the described available reative cell be positioned on a described wafer machine platform is the reative cell of dissimilar reative cell or identical type.
The present invention has following technical advantage:
1, board automated system selects the reative cell of the free time of some to carry out wafer-process according to concrete reative cell situation, thus solves the problem that in wafer machine platform, reative cell use is uneven, improves the service efficiency of reative cell.
2, select multiple stage wafer can be able to be avoided to use at some reative cell with reative cell too frequent, reduce the time that wafer waits for the process of board reative cell, improve the service efficiency of reative cell.
Accompanying drawing explanation
The accompanying drawing forming a part of the present invention is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 is the configuration diagram that the present invention improves reative cell service efficiency method;
Fig. 2 is the flow chart that the present invention improves reative cell service efficiency method.
Embodiment
In conjunction with following specific embodiments and the drawings, the present invention is described in further detail.Implement process of the present invention, condition, experimental technique etc., except the following content mentioned specially, be universal knowledege and the common practise of this area, the present invention is not particularly limited content.
Embodiment one
Fig. 1 is the configuration diagram that the present invention improves reative cell service efficiency method, as shown in Figure 1, a kind of method improving reative cell utilization rate, be applied to be provided with some reative cells 104 (type of this some reative cell may be the same or different) board 103 on, preferably, all reative cells 104 are all identical for the processing mode of same production technology.
Further, as shown in Figure 1, controlling of production process system 101 is connected with wafer machine platform 103 both-way communication by board automated system 102, and is provided with user operation end (not marking in figure) in this controlling of production process system 101; When needs carry out an end production process to a collection of wafer, first need by above-mentioned user operation end, in this controlling of production process system 101, setting needs the production technology of carrying out above-mentioned wafer and the wafer machine platform 103 carrying out this production technology and the minimal reaction number of chambers amount participating in this production technology.
Wherein, the data such as the numbering of the reaction chamber in the kind of production technology and the numbering of all wafer machine platforms and each wafer machine platform that all wafers need to carry out are stored in above-mentioned controlling of production process system 101, above-mentioned user operation end is according to after the kind of process requirements selected production technology in this controlling of production process system 101 and the wafer machine platform carrying out this production technology and the numbering of available reaction chamber that can be used for carrying out this production technology, also can set by carrying out the historical data of above-mentioned production technology or engineering experience data etc. the minimal reaction number of chambers amount participating in this production technology, concrete, this minimal reaction number of chambers amount is meet this batch of wafer to enter the minimum number that wafer machine platform 103 carries out this production technology, and preferably this minimal reaction quantity is greater than 1 (as 2,3,4 or 5 etc.).
Secondly, above-mentioned controlling of production process system 101 is by the kind of above-mentioned selected production technology, the minimal reaction number of chambers amount of the wafer machine platform carrying out this production technology and the numbering of available reaction chamber that can be used for carrying out this production technology and this production technology of participation of setting is sent to board automated system 102 (EAP), board automated system 102 obtains the attribute information of corresponding available reative cell on wafer machine platform 103 according to the numbering of the above-mentioned wafer machine platform 103 carrying out this production technology and the available reaction chamber that can be used for carrying out this production technology, concrete, this attribute information comprises: the numbering of each available reative cell in wafer machine platform, the wafer number that each available reative cell is etc. pending, the pending wafer such as each is in the processing time of available reative cell.
Board automated system 102 obtains the minimal reaction number of chambers amount of available number of chambers and this production technology of participation on current wafer board 103 according to the attribute information of available reative cell, and number of chambers available on current wafer board and minimal reaction number of chambers amount is compared.
If when on wafer machine platform 103, available number of chambers is greater than minimal reaction number of chambers amount, board automated system is according to the attribute information of available reative cell, current wafer board 103 is selected idle available reative cell carry out production technology, the quantity of idle available reative cell is equal with minimal reaction number of chambers amount, concrete, board automated system 102 obtains in this production technology and wafer machine platform 103 needs wafer number to be processed, and show that each available reative cell 104 carries out the technique stand-by period of production technology according to the attribute information of available reative cell, and draw idle available reative cell according to this technique stand-by period length, wherein, the stand-by period of idle available reative cell is less than the stand-by period of busy available reative cell, concrete, according to each available reative cell, etc. pending wafer number and this wafer obtain the technique stand-by period of each available reative cell in the processing time of available reative cell to automated machine system 102, preferably, when the wafer that available reative cell is etc. pending is all identical and when carrying out identical production technology, technique stand-by period of each available reative cell be available reative cell etc. pending wafer number and this wafer at the product in the processing time of available reative cell, when the kind of etc. the pending wafer of available reative cell is different or when carrying out different production technologies, technique stand-by period of available reative cell be often kind etc. pending wafer and this kind of wafer in the sum of products in the processing time of this available reative cell.
When number of chambers available on wafer machine platform 103 is not more than minimal reaction number of chambers amount, board automated system 102, according to the attribute information of available reative cell, current wafer board is selected all available reative cells carry out production technology.
Afterwards, board automated system 102 is according to selecting the technique stand-by period of carrying out the available reative cell of above-mentioned production technology, and setting enters the quantity of the wafer of this available reative cell; Wherein, the technique stand-by period of the quantity and this available reative cell that enter the wafer of available reative cell is inversely proportional to, and namely the technique stand-by period of this available reative cell is longer, and the wafer number entering this available reative cell is fewer; Due to, minimal reaction number of chambers amount is meet this batch of wafer to enter the minimum number that wafer machine platform 103 carries out this production technology, and the available reative cell therefore selected all can be assigned to wafer and carry out above-mentioned production technology.
Finally, board automated system 102 will be selected to carry out the numbering of the available reative cell of above-mentioned production technology and will process wafer number and feed back to wafer machine platform 103, and wafer machine platform 103 carries out above-mentioned production technology according to above-mentioned information.
Embodiment two
A collection of wafer is had in wafer factory, the number of wafer is 100, etching technics will be carried out, the process engineers of one wafer factory operates a production technology control system by user operation end, first, this process engineers selects the production technology of this batch of wafer to be etching technics and selects a wafer machine platform that can carry out etching technics, secondly, this selects the numbering of the available reaction chamber that can be used for carrying out this production technology, i.e. reative cell 1, reative cell 2, reative cell 3, reative cell 4, reative cell 5 is available reative cell, then, it is 3 that empirical data etc. by the historical data or etching technics of carrying out etching technics sets the minimal reaction number of chambers amount participating in this etching technics.
The minimal reaction number of chambers amount of this production technology of participation of the numbering of available reaction chamber and setting is sent to board automated system by controlling of production process system, and this board automated system judges that available number of chambers is greater than minimal reaction number of chambers amount (i.e. 5 > 3).
Now board automated system obtains in this etching technics and this wafer machine platform needs wafer number to be processed; Be total up to 100, and it is pending to show that reative cell 1 has 30 wafer etc. according to the attribute information of available reative cell, it is pending that reative cell 2 has 30 wafer etc., it is pending that reative cell 3 has 50 wafer etc., it is pending that reative cell 4 has 40 wafer etc., it is pending that reative cell 5 has 20 wafer etc., and the above-mentioned pending wafer such as carries out etching technics equally, and is 10 seconds in the processing time of available reative cell.
Then, according to the attribute information of above-mentioned available reative cell, board automated system show that each available reative cell carries out the technique stand-by period of production technology, namely the technique stand-by period of reative cell 1 is 300 seconds, the technique stand-by period of reative cell 2 is 300 seconds, the technique stand-by period of reative cell 3 is 200 seconds, the technique stand-by period of reative cell 4 is 400 seconds, and the technique stand-by period of reative cell 5 is 200 seconds; And draw idle available reative cell according to waiting time length; Wherein, the stand-by period of idle available reative cell is less than the stand-by period of busy available reative cell, finally show that idle available reative cell is available reative cell 1 respectively, available reative cell 2, available reative cell 5 (i.e. reative cell 1, reative cell 2, the negligible amounts of the reative cell 5 pending wafer such as, the time that technique is waited for is shorter.)，
Then, board automated system is according to selecting the technique stand-by period of carrying out the available reative cell of production technology, setting enters the quantity of the wafer of this available reative cell, the technique stand-by period of the quantity and this available reative cell that enter the wafer of available reative cell is inversely proportional to, namely reative cell 1 is by distribution 30 wafer, reative cell 2 distributes 30 wafer, and reative cell 5 distributes 40 wafer.
Finally, board automated system will be selected to carry out the numbering of the available reative cell of above-mentioned production technology and will process wafer number and feed back to wafer machine platform, namely reative cell 1 is by distribution 30 wafer, reative cell 2 distributes 30 wafer, reative cell 5 distributes 40 wafer, and wafer machine platform carries out etching technics according to above-mentioned information.
Embodiment three
A collection of wafer is had in wafer factory, the number of wafer is 200, etching technics will be carried out, the process engineers of one wafer factory operates a production technology control system by user operation end, first, this process engineers selects the production technology of this batch of wafer to be etching technics and selects a wafer machine platform that can carry out etching technics, secondly, this selects the numbering of the available reaction chamber that can be used for carrying out this production technology, i.e. reative cell 1, reative cell 2, reative cell 3, reative cell 4, reative cell 5 is available reative cell, then, it is 5 that empirical data etc. by the historical data or etching technics of carrying out etching technics sets the minimal reaction number of chambers amount participating in this etching technics.
The minimal reaction number of chambers amount of this production technology of participation of the numbering of available reaction chamber and setting is sent to board automated system by controlling of production process system, and this board automated system judges that available number of chambers is not more than minimal reaction number of chambers amount (i.e. 5=5).
Now board automated system obtains in this etching technics and this wafer machine platform needs wafer number to be processed; Be total up to 200, and it is pending to show that reative cell 1 has 40 wafer etc. according to the attribute information of available reative cell, it is pending that reative cell 2 has 30 wafer etc., it is pending that reative cell 3 has 50 wafer etc., it is pending that reative cell 4 has 10 wafer etc., it is pending that reative cell 5 has 20 wafer etc., and the above-mentioned pending wafer such as carries out etching technics equally, and is 10 seconds in the processing time of available reative cell.
Then, board automated system selects all useful reative cells to carry out this etching technics, and show that each available reative cell carries out the technique stand-by period of production technology according to the attribute information of above-mentioned available reative cell, namely the technique stand-by period of reative cell 1 is, 400 seconds, the technique stand-by period of reative cell 2 was 300 seconds, and the technique stand-by period of reative cell 3 is 500 seconds, the technique stand-by period of reative cell 4 is 200 seconds, and the technique stand-by period of reative cell 5 is 100 seconds.
Then, board automated system is according to selecting the technique stand-by period of carrying out the available reative cell of production technology, setting enters the quantity of the wafer of this available reative cell, the technique stand-by period of the quantity and this available reative cell that enter the wafer of available reative cell is inversely proportional to, namely reative cell 1 is by distribution 30 wafer, and reative cell 2 distributes 40 wafer, and reative cell 3 distributes 20 wafer, reative cell 4 distributes 60 wafer, and reative cell 5 distributes 50 wafer.
Finally, board automated system will be selected to carry out the numbering of the available reative cell of above-mentioned production technology and will process wafer number and feed back to wafer machine platform, namely reative cell 1 is by distribution 30 wafer, reative cell 2 distributes 40 wafer, reative cell 3 distributes 20 wafer, reative cell 4 distributes 60 wafer, and reative cell 5 distributes 50 wafer, and wafer machine platform carries out etching technics according to above-mentioned information.
These are only preferred embodiment of the present invention; not thereby embodiments of the present invention and protection range is limited; to those skilled in the art; the equivalent replacement that all utilizations specification of the present invention and diagramatic content are made and the scheme that apparent change obtains should be recognized, all should be included in protection scope of the present invention.
Claims (7)
1. improve a method for reative cell service efficiency, be applied to be provided with some reative cells wafer machine platform on, it is characterized in that, described method comprises:
Step S1: before carrying out an end production process, in controlling of production process system, the reative cell that described wafer machine platform can be used for carrying out described production technology is set according to the condition of this end production process and the supplemental characteristic of each reative cell, and participates in the minimal reaction number of chambers amount of described production technology according to process requirements setting;
Step S2: when several wafers enter wafer machine platform described in carry out described production technology time, board automated system is according to the reative cell that can be used for carrying out described production technology arranged in controlling of production process system, draw the attribute information of available reative cell, and obtain available number of chambers and described minimal reaction number of chambers amount on this wafer machine platform;
Step S3: number of chambers available on current wafer board and described minimal reaction number of chambers amount are compared by described board automated system;
If when on current wafer board, available number of chambers is greater than described minimal reaction number of chambers amount, described board automated system, according to the attribute information of described available reative cell, current wafer board is selected idle available reative cell carry out described production technology;
Otherwise described board automated system, according to the attribute information of described available reative cell, current wafer board is selected all available reative cells carry out described production technology;
Wherein, the quantity of the available reative cell of described free time is equal with described minimal reaction number of chambers amount.
2. the method for claim 1, is characterized in that, described controlling of production process system is connected with board automated system both-way communication, and described board automated system is connected with described wafer machine platform both-way communication;
Wherein, the attribute information of all reative cells on wafer machine platform described in described board automated system real-time reception, and after the attribute information of available reative cell is wherein processed, carry out described production technology to select idle available reative cell on current wafer board.
3. the method for claim 1, is characterized in that, the attribute information of described available reative cell comprises:
The numbering of each described available reative cell in wafer machine platform;
The wafer number that each described available reative cell is etc. pending;
The pending wafer such as each is in the processing time of described available reative cell.
4. the method for claim 1, is characterized in that, board automated system described in described step S3 selects idle available reative cell to carry out the step of described production technology on current wafer board, is specially:
Described board automated system obtains on described wafer machine platform and needs wafer number to be processed, and show that each available reative cell carries out the technique stand-by period of described production technology according to the attribute information of described available reative cell, to draw idle available reative cell according to this technique stand-by period length;
Wherein, the technique stand-by period of the available reative cell of described free time is less than the technique stand-by period of busy available reative cell.
5. method as claimed in claim 4, it is characterized in that, according to each described available reative cell, etc. pending wafer number and this wafer obtain the described technique stand-by period of each described available reative cell in the processing time of described available reative cell to described automated machine system.
6. method as claimed in claim 4, it is characterized in that, described method also comprises: described board automated system, according to described technique stand-by period of available reative cell of carrying out described production technology, sets the quantity entering the wafer of this available reative cell;
Wherein, the technique stand-by period of the quantity and this available reative cell that enter the wafer of available reative cell is inversely proportional to.
7. the method for claim 1, is characterized in that, the described available reative cell be positioned on a described wafer machine platform is the reative cell of dissimilar reative cell or identical type.
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| CN107275248A (en) * | 2016-04-07 | 2017-10-20 | 中芯国际集成电路制造(上海)有限公司 | Board control method and machine control system |
| CN110429057A (en) * | 2019-08-02 | 2019-11-08 | 中电九天智能科技有限公司 | Dry etcher fetches and delivers piece method |
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