CN105470102B - A method of improving reative cell service efficiency - Google Patents
A method of improving reative cell service efficiency Download PDFInfo
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- CN105470102B CN105470102B CN201410449044.2A CN201410449044A CN105470102B CN 105470102 B CN105470102 B CN 105470102B CN 201410449044 A CN201410449044 A CN 201410449044A CN 105470102 B CN105470102 B CN 105470102B
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Abstract
The present invention relates to IC manufacturing fields, more particularly to a kind of method improving reative cell service efficiency, before carrying out an end production process, it obtains carrying out that by controlling of production process system, number of chambers can be used on the board of above-mentioned production technology, and setting participates in the quantity of the minimal reaction room of above-mentioned production technology in the controlling of production process system, continue above-mentioned data information transfer to board automated system, and the attribute information that the board automated system continues with above-mentioned available reative cell selects the idle available reative cell for meeting minimal reaction number of chambers amount, after the available reative cell of continuation balanced above-mentioned free time will handle the quantity of wafer, production technology is carried out in the available reative cell of the free time, to reduce the pending time such as wafer, effectively increase the service efficiency of reative cell.
Description
Technical field
The present invention relates to IC manufacturing fields, and in particular to a method of improving reative cell service efficiency.
Background technology
In integrated circuit production, wafer is mainly produced by wafer machine platform, i.e., a collection of wafer will enter a wafer machine platform
Reative cell in handled；And each wafer machine platform may possess several reative cells, and the difference of the same wafer machine platform
Reative cell may be the same for the processing mode of same production technology (RECIPE), if processing mode is identical, wafer
Any one reative cell that this board can be entered is handled.
In actual production, it is by process engineers in life that specific production technology can carry out processing in which reative cell
It is configured in production. art control system (Recipe Control Program abbreviations, RCP), is needed for a production technology
Configure multiple reative cells.When a wafer, which will arrive board, to be handled, the reative cell that it is entered may handle other
Wafer thus not only increases the processing time of wafer so this wafer will wait for post-processing, can also make wafer machine platform
Some reative cells are more idle and some reative cells is busier, the service efficiency of some reative cells reduced, so needing
A kind of method can improve the service efficiency of each reative cell of wafer machine platform, make each reative cell of board that can obtain fully
Utilization, the pending time such as wafer can also be reduced, so as to improve production efficiency reduce the wafer production time.
Invention content
The invention discloses a kind of methods improving reative cell service efficiency to pass through life before carrying out an end production process
Production. art control system obtains carrying out that number of chambers can be used on the board of above-mentioned production technology, and in the controlling of production process system
Setting participates in the quantity of the minimal reaction room of above-mentioned production technology in system, continues above-mentioned data information transfer is automatic to board
Change system, and the attribute information selection that the board automated system continues with above-mentioned available reative cell meets the minimal reaction number of chambers
The idle available reative cell of amount, after continuing the quantity that balanced above-mentioned idle available reative cell will handle wafer, in this
Production technology is carried out in idle available reative cell, to reduce the pending time such as wafer, effectively increases reative cell
Service efficiency.
This invention describes a kind of methods improving reative cell service efficiency, applied to the wafer for being provided with several reative cells
On board, wherein the method includes：
Step S1：Before carrying out an end production process, in controlling of production process system, according to the item of the end production process
The reative cell that can be used for carrying out the production technology on the wafer machine platform, and root is arranged in the supplemental characteristic of part and each reative cell
The minimal reaction number of chambers amount of the production technology is participated according to process requirements setting；
Step S2：When several wafers, which enter a wafer machine platform, carries out the production technology, board Department of Automation
System obtains available reative cell according to the reative cell that can be used for carrying out the production technology being arranged in controlling of production process system
Attribute information, and obtain and can use number of chambers and the minimal reaction number of chambers amount on the wafer machine platform；
Step S3：The board automated system will can use number of chambers and the minimal reaction on current wafer board
Number of chambers amount is compared；
If can be more than the minimal reaction number of chambers amount with number of chambers on current wafer board, the board automation
System can use the attribute information of reative cell according to, be selected on current wafer board described in idle available reative cell progress
Production technology；
Otherwise, the board automated system can use the attribute information of reative cell according to, on current wafer board
All available reative cells are selected to carry out the production technology；
Wherein, the quantity of the available reative cell of the free time is equal with the minimal reaction number of chambers amount.
The method of above-mentioned raising reative cell service efficiency, wherein the controlling of production process system is automated with board
System bidirectional communication connection, the board automated system are connect with the wafer machine platform both-way communication；
Wherein, on wafer machine platform described in the board automated system real-time reception all reative cells attribute information, and
After handling the attribute information of available reative cell therein, to select idle available reative cell on current wafer board
Carry out the production technology.
The method of above-mentioned raising reative cell service efficiency, wherein described to include with the attribute information of reative cell：
Each number that can use reative cell in wafer machine platform；
It is each described to use the reative cell pending wafer number such as；
The pending wafer such as each is in the processing time with reative cell.
The method of above-mentioned raising reative cell service efficiency, wherein board automated system exists described in the step S3
The step of selecting idle available reative cell to carry out the production technology on current wafer board, specially：
The board automated system obtains wafer number to be treated on the wafer machine platform, and is used according to described
The attribute information of reative cell show that each available reative cell carries out the technique stand-by period of the production technology, with according to the technique
It is waiting for a long time to be so short that out idle available reative cell；
Wherein, the technique stand-by period of the available reative cell of the free time is less than the technique etc. of busy available reative cell
Wait for the time.
The method of above-mentioned raising reative cell service efficiency, wherein the board automated system is according to can described in each
With reative cell etc. pending wafer number and the wafer obtain in the processing time of the reative cell it is each described
The technique stand-by period of reative cell can be used.
The method of above-mentioned raising reative cell service efficiency, wherein the method further includes：The board automated system
According to the technique stand-by period for the available reative cell for carrying out the production technology, it is set into the wafer of the available reative cell
Quantity；
Wherein, into can be inversely proportional with the technique stand-by period of the quantity of the wafer of reative cell and the available reative cell.
The method of above-mentioned raising reative cell service efficiency, wherein described on a wafer machine platform is used
Reative cell is different types of reative cell or the reative cell of same type.
The present invention has following technical advantage：
1, board automated system selects the reative cell of a certain number of free time to carry out crystalline substance according to specific reative cell situation
Circle processing, to solve the problems, such as that reative cell improves the service efficiency of reative cell using unevenness in wafer machine platform.
2, select more can be excessively frequent in certain reative cell uses to avoid wafer with reative cell, reduce wafer waiting
The time of board reative cell processing, improve the service efficiency of reative cell.
Description of the drawings
The attached drawing for constituting the part of the present invention is used to provide further understanding of the present invention, schematic reality of the invention
Example and its explanation are applied for explaining the present invention, is not constituted improper limitations of the present invention.In the accompanying drawings：
Fig. 1 is the configuration diagram that the present invention improves reative cell service efficiency method；
Fig. 2 is the flow chart that the present invention improves reative cell service efficiency method.
Specific implementation mode
In conjunction with following specific examples and attached drawing, the present invention is described in further detail.The process of the implementation present invention,
Condition, experimental method etc. are among the general principles and common general knowledge in the art, this hair in addition to the following content specially referred to
It is bright that content is not particularly limited.
Embodiment one
Fig. 1 is the configuration diagram that the present invention improves reative cell service efficiency method, as shown in Figure 1, a kind of raising is reacted
The method of room utilization rate, applied to the machine for being provided with several reative cells 104 (type of several reative cells may be the same or different)
On platform 103, it is preferred that all reative cells 104 are directed to the processing mode all same of same production technology.
Further, as shown in Figure 1, controlling of production process system 101 passes through board automated system 102 and wafer machine platform
103 both-way communications connect, and user operation terminal (being not marked in figure) is provided in the controlling of production process system 101；Work as needs
When carrying out an end production process to a collection of wafer, it is necessary first to by above-mentioned user operation terminal, in the controlling of production process
Setting needs the production technology carried out to above-mentioned wafer and the wafer machine platform 103 for carrying out the production technology and joins in system 101
With the minimal reaction number of chambers amount of the production technology.
Wherein, the kind that all wafers need the production technology carried out is stored in above-mentioned controlling of production process system 101
The data such as the number of number and the reaction chamber on each wafer machine platform of class and all wafer machine platforms, above-mentioned user behaviour
Make end to select the type of production technology in the controlling of production process system 101 according to process requirements and carry out the production technology
Wafer machine platform and after can be used for carrying out the number of available reaction chamber of the production technology, can also be by carrying out above-mentioned production work
Historical data or engineering experience data of skill etc. participate in the minimal reaction number of chambers amount of the production technology to set；Specifically, this is most
Small number of chambers is to meet this batch of wafer to enter the minimum number that wafer machine platform 103 carries out the production technology, it is preferred this most
Small reaction quantity is more than 1 (such as 2,3,4 or 5).
Secondly, above-mentioned controlling of production process system 101 by the type of above-mentioned selected production technology, carry out the production technology
Wafer machine platform and can be used for carrying out the production technology available reaction chamber number and the participation of the setting production technology
Minimal reaction number of chambers amount be sent to board automated system 102 (EAP), board automated system 102 is then according to above-mentioned progress
The wafer machine platform 103 of the production technology and the number for the available reaction chamber that can be used for carrying out the production technology obtain wafer machine platform
The attribute information that reative cell accordingly can be used on 103, specifically, the attribute information includes：Reative cell each can be used in wafer machine platform
Number；Each available reative cell pending wafer number such as；The pending wafer such as each is in available reative cell
Processing time.
Board automated system 102 is anti-according to that can be used on the attribute information acquisition current wafer board 103 that can use reative cell
Answer number of chambers amount and participate in the production technology minimal reaction number of chambers amount, and will on current wafer board can use number of chambers with most
Small number of chambers is compared.
If on wafer machine platform 103 can with number of chambers be more than the minimal reaction number of chambers amount, board automated system according to
The attribute information that reative cell can be used selects idle available reative cell to carry out production technology on current wafer board 103, idle
Available reative cell quantity it is equal with minimal reaction number of chambers amount；Specifically, board automated system 102 obtains the production technology
Wafer number to be treated on middle wafer machine platform 103, and according to can obtain each available reaction with the attribute information of reative cell
Room 104 carries out the technique stand-by period of production technology, and is so short that out idle available reative cell according to the technique is waiting for a long time；
Wherein, the stand-by period of idle available reative cell is less than the stand-by period of busy available reative cell；Specifically, board is certainly
Dynamicization system 102 is according to the processing of the pending wafer number and the wafer in available reative cell such as of each available reative cell
Time obtains the technique stand-by period of each available reative cell, it is preferred that when etc. the pending wafer of available reative cell is equal
Identical and when carrying out identical production technology, technique stand-by period of each available reative cell is that available reative cell is etc. pending
Product in the processing time of available reative cell of wafer number and the wafer, when the available reative cell pending wafer such as
Type it is different or when carrying out different production technologies, it is that each is etc. pending that can use the technique stand-by period of reative cell
Wafer and this kind of wafer the sum of products of the processing time of reative cell can be used at this.
When on wafer machine platform 103 minimal reaction number of chambers amount can be not more than with number of chambers, board automated system 102
According to the attribute information that can use reative cell, all available reative cells is selected to carry out production technology on current wafer board.
Later, board automated system 102 carries out the technique waiting of the available reative cell of above-mentioned production technology according to selection
Time is set into the quantity of the wafer of the available reative cell；Wherein, available with this into the quantity for the wafer that can use reative cell
The technique stand-by period of reative cell is inversely proportional, i.e. the technique stand-by period of the available reative cell is longer, and reative cell can be used into this
Wafer number it is fewer；Since, minimal reaction number of chambers amount is to meet this batch of wafer and enter wafer machine platform 103 to carry out the production work
The minimum number of skill, therefore the available reative cell selected can be assigned to wafer and carry out above-mentioned production technology.
Finally, selection is carried out number and its institute of the available reative cell of above-mentioned production technology by board automated system 102
It handles wafer number and feeds back to wafer machine platform 103, wafer machine platform 103 carries out above-mentioned production technology according to above- mentioned information.
Embodiment two
There is a collection of wafer in fab, the number of wafer is 100, will perform etching technique, the processing procedure of a fab
Engineer operates a production technology control system by user operation terminal, and first, which selects the life of this batch of wafer
Production. art is etching technics and selects a wafer machine platform that can perform etching technique, and secondly, this, which is selected, can be used for carrying out the life
The number of the available reaction chamber of production. art, i.e. reative cell 1, reative cell 2, reative cell 3, reative cell 4, reative cell 5 are available
Reative cell then participates in the etching by empirical data of historical data or etching technics of technique etc. is performed etching to set
The minimal reaction number of chambers amount of technique is 3.
Controlling of production process system will can use the minimal reaction of the number and the participation of setting of the reaction chamber production technology
Number of chambers amount is sent to board automated system, which judges that available number of chambers is more than minimal reaction room
Quantity (i.e. 5 ＞ 3).
Board automated system obtains in this etching technics wafer number to be treated on the wafer machine platform at this time；In total
It it is 100, and according to that can show that reative cell 1 has 30 wafers etc. pending with the attribute information of reative cell, reative cell 2 has
30 wafers are etc. pending, and reative cell 3 has 50 wafers etc. pending, and reative cell 4 has 40 wafers waiting for
Processing, reative cell 5 have that 20 wafers are etc. pending, and the above-mentioned pending wafer such as equally performs etching technique, and
And in the processing time of available reative cell it is 10 seconds.
Then, board automated system show that each available reative cell carries out according to the attribute information of above-mentioned available reative cell
The technique stand-by period of production technology, i.e. the technique stand-by period of reative cell 1 are 300 seconds, and the technique stand-by period of reative cell 2 is
300 seconds, the technique stand-by period of reative cell 3 was 200 seconds, and the technique stand-by period of reative cell 4 is 400 seconds, the technique of reative cell 5
Stand-by period is 200 seconds；And idle available reative cell is obtained according to waiting time length；Wherein, idle available reaction
The stand-by period of room is less than the stand-by period of busy available reative cell, and finally showing that idle available reative cell is respectively can
With reative cell 1, reative cell 2 can be used, reative cell 5 (i.e. reative cell 1, reative cell 2, the pending wafer such as of reative cell 5 can be used
Negligible amounts, the time that technique waits for are shorter.),
Then, board automated system carries out the technique stand-by period of the available reative cell of production technology according to selection, if
Surely the quantity for entering the wafer of the available reative cell, into the technique of the available reative cell of quantity and this for the wafer that can use reative cell
Stand-by period is inversely proportional, i.e., reative cell 1 will distribute 30 wafers, and reative cell 2 distributes 30 wafers, and reative cell 5 distributes 40 platelets
Circle.
Finally, selection is carried out the number of the available reative cell of above-mentioned production technology and its to be located by board automated system
Reason wafer number feeds back to wafer machine platform, i.e. reative cell 1 will distribute 30 wafers, and reative cell 2 distributes 30 wafers, reative cell 5
40 wafers are distributed, wafer machine platform performs etching technique according to above- mentioned information.
Embodiment three
There is a collection of wafer in fab, the number of wafer is 200, will perform etching technique, the processing procedure of a fab
Engineer operates a production technology control system by user operation terminal, and first, which selects the life of this batch of wafer
Production. art is etching technics and selects a wafer machine platform that can perform etching technique, and secondly, this, which is selected, can be used for carrying out the life
The number of the available reaction chamber of production. art, i.e. reative cell 1, reative cell 2, reative cell 3, reative cell 4, reative cell 5 are available
Reative cell then participates in the etching by empirical data of historical data or etching technics of technique etc. is performed etching to set
The minimal reaction number of chambers amount of technique is 5.
Controlling of production process system will can use the minimal reaction of the number and the participation of setting of the reaction chamber production technology
Number of chambers amount is sent to board automated system, which judges that available number of chambers is not more than minimal reaction
Number of chambers amount (i.e. 5=5).
Board automated system obtains in this etching technics wafer number to be treated on the wafer machine platform at this time；In total
It it is 200, and according to that can show that reative cell 1 has 40 wafers etc. pending with the attribute information of reative cell, reative cell 2 has
30 wafers are etc. pending, and reative cell 3 has 50 wafers etc. pending, and reative cell 4 has 10 wafers waiting for
Processing, reative cell 5 have that 20 wafers are etc. pending, and the above-mentioned pending wafer such as equally performs etching technique, and
And in the processing time of available reative cell it is 10 seconds.
Then, board automated system select it is all can carry out the etching technics with reative cell, and according to it is above-mentioned can
Show that each available reative cell carries out the technique stand-by period of production technology, the i.e. work of reative cell 1 with the attribute information of reative cell
The skill stand-by period is 400 seconds, and the technique stand-by period of reative cell 2 is 300 seconds, and the technique stand-by period of reative cell 3 is 500 seconds,
The technique stand-by period of reative cell 4 is 200 seconds, and the technique stand-by period of reative cell 5 is 100 seconds.
Then, board automated system carries out the technique stand-by period of the available reative cell of production technology according to selection, if
Surely the quantity for entering the wafer of the available reative cell, into the technique of the available reative cell of quantity and this for the wafer that can use reative cell
Stand-by period is inversely proportional, i.e., reative cell 1 will distribute 30 wafers, and reative cell 2 distributes 40 wafers, and reative cell 3 distributes 20 platelets
Circle, reative cell 4 distribute 60 wafers, and reative cell 5 distributes 50 wafers.
Finally, selection is carried out the number of the available reative cell of above-mentioned production technology and its to be located by board automated system
Reason wafer number feeds back to wafer machine platform, i.e. reative cell 1 will distribute 30 wafers, and reative cell 2 distributes 40 wafers, reative cell 3
20 wafers are distributed, reative cell 4 distributes 60 wafers, and reative cell 5 distributes 50 wafers, and wafer machine platform is carried out according to above- mentioned information
Etching technics.
It these are only preferred embodiments of the present invention, be not intended to limit the implementation manners and the protection scope of the present invention, it is right
For those skilled in the art, it should can appreciate that and all be replaced with being equal of being made of description of the invention and diagramatic content
It changes and obviously changes obtained scheme, should all be included within the scope of the present invention.
Claims (7)
1. a kind of method improving reative cell service efficiency, applied to being provided on the wafer machine platform of several reative cells, feature
It is, the method includes：
Step S1：Before carrying out an end production process, in controlling of production process system, according to the condition of the end production process and
The reative cell that can be used for carrying out the production technology on the wafer machine platform is arranged in the supplemental characteristic of each reative cell, and according to work
The setting of skill demand participates in the minimal reaction number of chambers amount of the production technology；
Step S2：When several wafers, which enter a wafer machine platform, carries out the production technology, board automated system root
According to the reative cell that can be used for carrying out the production technology being arranged in controlling of production process system, the attribute of available reative cell is obtained
Information, and obtain and can use number of chambers and the minimal reaction number of chambers amount on the wafer machine platform；
Step S3：The board automated system will can use number of chambers and the minimal reaction number of chambers on current wafer board
Amount is compared；
If can be more than the minimal reaction number of chambers amount with number of chambers on current wafer board, the board automated system
According to the attribute information with reative cell, idle available reative cell is selected to carry out the production on current wafer board
Technique；
Otherwise, the board automated system can use the attribute information of reative cell according to, be selected on current wafer board
All available reative cells carry out the production technology；
Wherein, the quantity of the available reative cell of the free time is equal with the minimal reaction number of chambers amount.
2. the method as described in claim 1, which is characterized in that the controlling of production process system is double with board automated system
It is connected to communication, the board automated system is connect with the wafer machine platform both-way communication；
Wherein, on wafer machine platform described in the board automated system real-time reception all reative cells attribute information, and to it
In available reative cell attribute information handled after, to select idle available reative cell to carry out on current wafer board
The production technology.
3. the method as described in claim 1, which is characterized in that described to include with the attribute information of reative cell：
Each number that can use reative cell in wafer machine platform；
It is each described to use the reative cell pending wafer number such as；
The pending wafer such as each is in the processing time with reative cell.
4. the method as described in claim 1, which is characterized in that board automated system described in the step S3 is current brilliant
The step of selecting idle available reative cell to carry out the production technology on circular knitting machine platform, specially：
The board automated system obtains wafer number to be treated on the wafer machine platform, and according to described with reaction
The attribute information of room show that each available reative cell carries out the technique stand-by period of the production technology, to be waited for according to the technique
Time length obtains idle available reative cell；
Wherein, when the technique stand-by period of the available reative cell of the free time is less than the technique waiting of busy available reative cell
Between.
5. method as claimed in claim 4, which is characterized in that the board automated system is reacted according to each described can use
Room etc. pending wafer number and the wafer the processing time with reative cell obtain it is each it is described can use it is anti-
Answer the technique stand-by period of room.
6. method as claimed in claim 4, which is characterized in that the method further includes：The board automated system according to
The technique stand-by period for carrying out the available reative cell of the production technology is set into the number of the wafer of the available reative cell
Amount；
Wherein, into can be inversely proportional with the technique stand-by period of the quantity of the wafer of reative cell and the available reative cell.
7. the method as described in claim 1, which is characterized in that can use reative cell described on a wafer machine platform
For different types of reative cell or the reative cell of same type.
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| CN107275248B (en) * | 2016-04-07 | 2019-08-27 | 中芯国际集成电路制造(上海)有限公司 | Board control method and machine control system |
| CN110429057B (en) * | 2019-08-02 | 2021-05-18 | 中电九天智能科技有限公司 | Wafer taking and delivering method for dry etching machine |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6470231B1 (en) * | 2000-04-21 | 2002-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for auto dispatching wafer |
| CN101459099A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer kit, monitoring system and method for semi-conductor production process |
| CN102800563A (en) * | 2011-05-26 | 2012-11-28 | 中芯国际集成电路制造(上海)有限公司 | Wafer feeding method and wafer feeding device |
| CN103996644A (en) * | 2014-06-09 | 2014-08-20 | 上海华力微电子有限公司 | Process management method for multi-cavity equipment |
Family Cites Families (1)
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| WO2014040291A1 (en) * | 2012-09-17 | 2014-03-20 | 北京中科信电子装备有限公司 | Method for improving transmission efficiency of wafers in target chamber |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6470231B1 (en) * | 2000-04-21 | 2002-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for auto dispatching wafer |
| CN101459099A (en) * | 2007-12-13 | 2009-06-17 | 中芯国际集成电路制造(上海)有限公司 | Wafer kit, monitoring system and method for semi-conductor production process |
| CN102800563A (en) * | 2011-05-26 | 2012-11-28 | 中芯国际集成电路制造(上海)有限公司 | Wafer feeding method and wafer feeding device |
| CN103996644A (en) * | 2014-06-09 | 2014-08-20 | 上海华力微电子有限公司 | Process management method for multi-cavity equipment |
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