CN105280521A - Technology processing control method and system of semiconductor equipment and semiconductor equipment - Google Patents
Technology processing control method and system of semiconductor equipment and semiconductor equipment Download PDFInfo
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- CN105280521A CN105280521A CN201410353986.0A CN201410353986A CN105280521A CN 105280521 A CN105280521 A CN 105280521A CN 201410353986 A CN201410353986 A CN 201410353986A CN 105280521 A CN105280521 A CN 105280521A
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Abstract
The invention discloses a technology processing control method and system of semiconductor equipment and the semiconductor equipment. The technology processing control method of semiconductor equipment comprises the following steps: a first drive node controlling operation of a manipulator and a second drive node controlling operation of a wafer alignment device are built in an input and output configuration file, a first object corresponding to the first drive node and a second object corresponding to the second drive node are built in a drive configuration file, and the first object and the second object respectively and independently control the operation of the manipulator and the operation of the wafer alignment device according to received information. Through the method, parallel operation of the manipulator and the wafer alignment device are achieved, and the utilization rates of the manipulator and the wafer alignment device in the technology process are improved; and the method is in favor of improving production efficiency.
Description
Technical field
The present invention relates to semiconductor and prepare control field, particularly relate to a kind of processes control method of semiconductor equipment, system and semiconductor equipment.
Background technology
In preparation technology's (as film thickness measuring, etching, physical vapour deposition (PVD) etc.) of semiconductor, wafer to be processed or substrate is needed to need progressively to be sent in processing chamber from atmospheric environment to carry out PROCESS FOR TREATMENT.Wafer is sent to processing chamber, usually adopts wafer transmission system, this system comprises hop and control section.Hop comprises film magazine charger, manipulator (Robot) and wafer alignment device (Aligner), and wherein, film magazine charger is used for adding slide cassette; Manipulator is used for transferring wafer; Wafer alignment device is used for the center of calibration chip; Control section controls manipulator and carries out action under the program preset, and completes the transmission to wafer.
Existing wafer transmission adopts serial scheduling method, and the basic transmitting procedure of single-wafer in transmission system is as follows:
Film magazine charger adds the film magazine carrying wafer, and wafer takes out by manipulator from film magazine, and is placed into wafer alignment device; Wafer alignment device is calibrated wafer; Wafer after calibration is taken away from wafer alignment device by manipulator, puts in technical module; Technical module carries out PROCESS FOR TREATMENT to wafer; The wafer be disposed takes out by manipulator from technical module, is placed into sky film magazine; Circulation said process, until the processing of wafers be equipped with in the film magazine of pending wafer loaded by film magazine charger is complete.
For said method, in the calibration process of wafer, manipulator is in the state of wait, can not be effectively utilized, thus causes efficiency of transmission lower; In addition, technical module is in the process of carrying out PROCESS FOR TREATMENT, and manipulator also in wait, reduce further efficiency of transmission.
In order to improve productive rate, people to need to allow as far as possible between equipment independent, allow distinct device can operating alone at one time as far as possible, but, in prior art, manipulator and calibrating installation still belong to same device drives node, and this device drives is controlled by class Dvr_Sorter, and it finally performs the operation to Date, can not operate simultaneously, can only wait one finish after, then carry out another operation, manipulator and the parallel work-flow of wafer alignment device cannot be realized.
Summary of the invention
Based on this, the present invention proposes a kind of processes control method of semiconductor equipment, system and semiconductor equipment, the parallel work-flow of manipulator and wafer alignment device can be realized.
In order to achieve the above object, the present invention adopts following technical scheme:
A processes control method for semiconductor equipment, comprises the following steps:
The second driving node controlling manual first driving node of machinery and control the operation of wafer alignment device is built in input and output configuration file;
Corresponding first object of described first driving node and the second object of described second driving node of correspondence is built in drive arrangements file;
Described first object and described second object independently control the operation of described manipulator and the operation of wafer alignment device according to the message received.
As a kind of embodiment, described drive arrangements file is Driver_config.xml file;
Described input and output configuration file is IO_config.xml file.
As a kind of embodiment, described first object and described second object are by message described in a common share communication channel reception.
As a kind of embodiment, described first object and described second object independently control the operation of described manipulator and the operation of wafer alignment device according to the message received, and comprise the following steps:
To by described common share communication channel reception to described message judge;
If described message is the operational order of manipulator, then send to described first object, by the operation of manipulator described in described first object control;
If described message is the operational order of wafer alignment device, then send to described second object, by the operation of wafer alignment device described in described second object control.
As a kind of embodiment, described first object comprises the first variable, and described second object comprises the second variable;
When described message is the operational order of manipulator, arranging described first variable is non-NULL;
When described message is the operational order of wafer alignment device, arranging described second variable is non-NULL.
A processes control system for semiconductor equipment, comprises input and output configuration file, drive arrangements file and Executive Module;
The second driving node controlling manual first driving node of machinery and control the operation of wafer alignment device is configured with in described input and output configuration file;
Corresponding first object of described first driving node and the second object of described second driving node of correspondence is configured with in described drive arrangements file;
Described Executive Module, independently controls the operation of described manipulator and the operation of wafer alignment device for utilizing described first object and described second object according to the message received.
As a kind of embodiment, the processes control system of described semiconductor equipment also comprises common share communication module;
Described first object and described second object are by message described in the common share communication channel reception in described common share communication module.
As a kind of embodiment, described Executive Module comprises and judges submodule, the first implementation sub-module and the second implementation sub-module, wherein:
Described judgement submodule, for by described common share communication channel reception to described message judge;
Described first implementation sub-module, for when described message is the operational order of manipulator, sends to described first object, by the operation of manipulator described in described first object control;
Described second implementation sub-module, for when described message is the operational order of wafer alignment device, sends to described second object, by the operation of wafer alignment device described in described second object control.
As a kind of embodiment, described first object comprises the first variable, and described second object comprises the second variable;
Described Executive Module also comprises first and arranges submodule and second and arrange submodule;
Described first arranges submodule, and for when described message is the operational order of manipulator, arranging described first variable is non-NULL;
Described second arranges submodule, and for when described message is the operational order of wafer alignment device, arranging described second variable is non-NULL.
A kind of semiconductor equipment, for realizing the parallel control to manipulator and wafer alignment device, comprises the processes control system of described semiconductor equipment.
The processes control method of semiconductor equipment of the present invention and system, the operation of manipulator and wafer alignment device is controlled respectively by two different control units, achieve the parallel work-flow of manipulator and wafer alignment device, improve the utilance of manipulator and wafer alignment device in technical process, decrease the standby time of equipment, be conducive to the raising of production efficiency.
Semiconductor equipment of the present invention, adopts the processes control system of above-mentioned semiconductor equipment, has higher utilization rate of equipment and installations, can significantly improve operating efficiency.
Accompanying drawing explanation
Fig. 1 is the flow chart of processes control method one embodiment of the present invention;
Fig. 2 is the workflow of common share communication passage one embodiment in processing control method of the present invention;
Fig. 3 is the module map of Executive Module one embodiment in control system for processing of the present invention.
Embodiment
Below in conjunction with Figure of description, the embodiment of the processes control method in the embodiment of the present invention is described.
The invention provides a kind of processes control method of semiconductor equipment, this processes control method, respectively manipulator and wafer alignment device are controlled by two different driving node, achieve the parallel work-flow of manipulator and wafer alignment device, decrease the time loss that technical process is unnecessary, improve production efficiency.
Composition graphs 1, processes control method of the present invention comprises the following steps:
S100: build the second driving node controlling manual first driving node of machinery and control the operation of wafer alignment device in input and output configuration file.
As a kind of embodiment, input and output configuration file is IO_config.xml file.In IO_config.xml file, increase corresponding statement, build two different driving node, control manipulator respectively and perform the action picking and placeing wafer, and wafer alignment device performs the calibration actions of wafer.
S200: build the first object of corresponding first driving node and the second object of corresponding second driving node in drive arrangements file;
As a kind of embodiment, drive arrangements file is Driver_config.xml file.The first object and the second object is built in Driver_config.xml file.Wherein, corresponding first driving node of the first object, under the control of the first driving node, driving device hand operates; Corresponding second driving node of second object, drives wafer alignment device to operate under the control of the second driving node.
S300: the first object and the second object are according to the message received the independently operation of driving device hand and the operation of wafer alignment device.
In S300, the first object and the second object are by a common share communication channel reception message.Common share communication passage is responsible for communicating with wafer alignment device with manipulator, comprises and sends message and receipt message.Namely this common share communication passage can receive the information such as position and state from manipulator or wafer alignment device, and the information received is sent to the first object or the second object.
Preferably, as a kind of embodiment, S300 comprises the following steps:
S310, to by common share communication channel reception to message judge;
S320, if message is the message of manipulator, then sends to the first object, by the operation of the first object control manipulator;
S330, if message is the operational order of wafer alignment device, then sends to the second object, by the operation of the second object control wafer alignment device.
Because the first object and the second object belong to different driving node respectively, when it receives a message, the action picking and placeing wafer of manipulator and the calibration actions of wafer alignment device can be controlled simultaneously, realize the parallel work-flow of manipulator and wafer alignment device; Namely, while the first object control manipulator execution picks and places the action of wafer, the controlled combinations calibrator of the second object performs calibration actions, and the two does not interfere with each other, and reaches parallel work-flow truly.
In processes control method of the present invention, the first object comprises the first variable, and the second object comprises the second variable; When message is the operational order of manipulator, arranging the first variable is non-NULL; When message is the operational order of wafer alignment device, arranging the second variable is non-NULL.That is:
When the first object and the second object reception are to the message sent from common share communication passage, first judge whether the message received is empty in respective variable, if not empty, then resolve this message, control manipulator and/or wafer alignment device perform corresponding action; If it is empty, then message is next time waited for.
Because common share communication channel reception, transmission message are a real-time operation process, therefore, when common share communication passage is when carrying out the transmission of message, the time of receipt message can be postponed.Preferably, as a kind of embodiment, common share communication passage comprises two independently threads, one for receipt message, one for sending message.
See Fig. 2, it is the workflow diagram of common share communication passage.When receiving the message from manipulator and wafer alignment device, first this message being judged, if the message of manipulator, then this message being assigned to the first object corresponding to manipulator; If the message of wafer alignment device, then this message is assigned to the second object corresponding to wafer alignment device.
It should be noted that, in Fig. 2, what Robot.Result=returned results be meant to the first object reception to message non-NULL in Robot.Result, control the first object driving device hand and operate; What Aligner.Result=returned results be meant to the second object reception to message non-NULL in Aligner.Result, control the second object and drive wafer alignment device to operate.
In order to specific explanations processes control method of the present invention, describe in detail below by way of a specific embodiment.
Embodiment 1
In Driver_config.xml file,
In IO_config.xml file,
Can find out, above-mentioned Driver_config.xml file and IO_config.xml file are after configuration, generate two different driving node, and the object corresponding with two driving node: node is the TcpAligner object of 2, node is the TcpRobot object of 7.Wherein, driving node 2 controls the operation of manipulator, and driving node 7 controls the operation of wafer alignment device, realizes especially by following statement:
In Driver_config.xml file,
<setNodeNumtype=" method " >7</setNodeNum>// * arranges the driving node 7 of manipulator
<setNodeNumtype=" method " >2</setNodeNum>// * arranges the driving node 2 of calibrating installation
In IO_config.xml file, increase following statement, control driving node 7 and driving node 2:
<Bd>2</BdGreatT. GreaT.GT//* reads the file driving calibrating installation from node 2
<Bd>7</BdGreatT. GreaT.GT//* reads the file of driving device hand from node 7
The method and system of parallel work-flow manipulator of the present invention and calibrating installation, construct two each and every one driving node, make manipulator and wafer alignment device can parallel work-flow, improve the production efficiency of equipment.
Based on same inventive concept, the embodiment of the present invention provides a kind of processes control system of semiconductor equipment, and the principle of dealing with problems due to this system is similar to a kind of aforementioned method, therefore, the enforcement of this system can realize according to the concrete steps of preceding method, repeats part and repeats no more.
The processes control system of semiconductor equipment of the present invention comprises input and output configuration file, drive arrangements file and Executive Module.
Wherein, the second driving node controlling manual first driving node of machinery and control the operation of wafer alignment device is configured with in input and output configuration file; The first object of corresponding first driving node and the second object of corresponding second driving node is configured with in drive arrangements file; Executive Module, independently controls the operation of manipulator and the operation of wafer alignment device for utilizing the first object and the second object according to the message received.
The processes control system of semiconductor equipment of the present invention also comprises common share communication module; First object and the second object are by the common share communication channel reception message in common share communication module.
See Fig. 3, as a kind of embodiment, above-mentioned Executive Module comprises and judges submodule 112, first implementation sub-module 114 and the second implementation sub-module 116.Wherein: judge submodule 112, for by common share communication channel reception to message judge; First implementation sub-module 114, for being the operational order of manipulator when message, sends to the first object, by the operation of the first object control manipulator; Second implementation sub-module 116, for being the operational order of wafer alignment device when message, sends to the second object, by the operation of the second object control wafer alignment device.
In the processes control system of semiconductor equipment of the present invention, the first object comprises the first variable, and the second object comprises the second variable.
Continue see Fig. 3, above-mentioned Executive Module also comprises first and arranges submodule 117 and second and arrange submodule 118.Wherein, first arranges submodule 117, and for when message is the operational order of manipulator, arranging the first variable is non-NULL; Second arranges submodule 118, and for when message is the operational order of wafer alignment device, arranging the second variable is non-NULL.
The processes control system of this semiconductor equipment controls the operation of manipulator and wafer alignment device respectively by two different driving node, achieve the parallel work-flow of manipulator and wafer alignment device, improve the utilance of manipulator and wafer alignment device, decrease the standby time of equipment, be conducive to the raising of production efficiency.
In addition, present invention also offers a kind of semiconductor equipment, for realizing the parallel control to manipulator and wafer alignment device.This semiconductor equipment comprises the processes control system of above-mentioned semiconductor equipment, has higher utilization rate of equipment and installations, can significantly improve operating efficiency.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a processes control method for semiconductor equipment, is characterized in that, comprise the following steps:
The second driving node controlling manual first driving node of machinery and control the operation of wafer alignment device is built in input and output configuration file;
Corresponding first object of described first driving node and the second object of described second driving node of correspondence is built in drive arrangements file;
Described first object and described second object independently control the operation of described manipulator and the operation of wafer alignment device according to the message received.
2. the processes control method of semiconductor equipment according to claim 1, is characterized in that,
Described drive arrangements file is Driver_config.xml file;
Described input and output configuration file is IO_config.xml file.
3. the processes control method of semiconductor equipment according to claim 1, is characterized in that, described first object and described second object are by message described in a common share communication channel reception.
4. the processes control method of semiconductor equipment according to claim 3, it is characterized in that, described first object and described second object independently control the operation of described manipulator and the operation of wafer alignment device according to the message received, and comprise the following steps:
To by described common share communication channel reception to described message judge;
If described message is the operational order of manipulator, then send to described first object, by the operation of manipulator described in described first object control;
If described message is the operational order of wafer alignment device, then send to described second object, by the operation of wafer alignment device described in described second object control.
5. the processes control method of semiconductor equipment according to claim 4, is characterized in that, described first object comprises the first variable, and described second object comprises the second variable;
When described message is the operational order of manipulator, arranging described first variable is non-NULL;
When described message is the operational order of wafer alignment device, arranging described second variable is non-NULL.
6. a processes control system for semiconductor equipment, is characterized in that, comprises input and output configuration file, drive arrangements file and Executive Module;
The second driving node controlling manual first driving node of machinery and control the operation of wafer alignment device is configured with in described input and output configuration file;
Corresponding first object of described first driving node and the second object of described second driving node of correspondence is configured with in described drive arrangements file;
Described Executive Module, independently controls the operation of described manipulator and the operation of wafer alignment device for utilizing described first object and described second object according to the message received.
7. the processes control system of semiconductor equipment according to claim 6, is characterized in that, also comprises common share communication module;
Described first object and described second object are by message described in the common share communication channel reception in described common share communication module.
8. the processes control system of semiconductor equipment according to claim 7, is characterized in that, described Executive Module comprises and judges submodule, the first implementation sub-module and the second implementation sub-module, wherein:
Described judgement submodule, for by described common share communication channel reception to described message judge;
Described first implementation sub-module, for when described message is the operational order of manipulator, sends to described first object, by the operation of manipulator described in described first object control;
Described second implementation sub-module, for when described message is the operational order of wafer alignment device, sends to described second object, by the operation of wafer alignment device described in described second object control.
9. the processes control system of semiconductor equipment according to claim 8, is characterized in that, described first object comprises the first variable, and described second object comprises the second variable;
Described Executive Module also comprises first and arranges submodule and second and arrange submodule;
Described first arranges submodule, and for when described message is the operational order of manipulator, arranging described first variable is non-NULL;
Described second arranges submodule, and for when described message is the operational order of wafer alignment device, arranging described second variable is non-NULL.
10. a semiconductor equipment, for realizing the parallel control to manipulator and wafer alignment device, is characterized in that, comprising the processes control system of the semiconductor equipment described in claim 6-9 any one.
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| CN101740441A (en) * | 2008-11-04 | 2010-06-16 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and device for dispatching mechanical hand and plasma processing equipment |
| US20130108400A1 (en) * | 2011-11-02 | 2013-05-02 | Hitachi High-Technologies Corporation | Vacuum processing device and method of transporting process subject member |
| CN103399543A (en) * | 2013-07-23 | 2013-11-20 | 清华大学 | Method and system for scheduling multiple robot equipment cooperated for transferring wafers |
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| CN1416403A (en) * | 2000-04-12 | 2003-05-07 | 阿西斯特技术公司 | Modular sorter |
| CN101615025A (en) * | 2008-06-26 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of maintenance control method and system that is used for semiconductor processing equipment |
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