CN100399800C - Solid state image pickup device and its manufacturing method - Google Patents
Solid state image pickup device and its manufacturing method Download PDFInfo
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- CN100399800C CN100399800C CNB2005100747133A CN200510074713A CN100399800C CN 100399800 C CN100399800 C CN 100399800C CN B2005100747133 A CNB2005100747133 A CN B2005100747133A CN 200510074713 A CN200510074713 A CN 200510074713A CN 100399800 C CN100399800 C CN 100399800C
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Abstract
A structure member is used wherein a circuit board is connected to a solid-state image pickup element and placed between a portion of the structure member to which the solid-state image pickup element is attached, and another portion to which a light-transmitting member is attached, and the circuit board is sealed integrally into the structure member. The solid-state image pickup element is attached to a through-opening portion 1 C, and a light-transmitting member is attached so as to cover the through-opening portion 1 C with being separated from the solid-state image pickup element by a predetermined distance. In a process of molding the structure member, the circuit board is integrally molded, whereby the manpower can be reduced, and the structures of the attaching portions can be simplified to miniaturize the device.
Description
The application is that denomination of invention is that " solid state image pickup device and preparation method thereof ", application number are 02151570.0, the applying date is on November 30th, 2002, the application people divides an application for the application for a patent for invention of Panasonic Electric Equipment Industrial Co.,Ltd.
Technical field
The present invention relates to solid state image pickup device and preparation method thereof, relate in particular to have solid-state image pickup device such as small-sized imaging device of surveillance camera, medical video camera or vehicle-mounted vidicon and preparation method thereof.
Background technology
This imaging device receives image and exports this image with electrical signal form by the optical system as lens.In recent years, along with miniaturization and the raising of performance and the reducing day by day of image pickup device size of this imaging device, imaging device is used to various fields and the image entering apparatus is arrived in its market expansion.
In the traditional imaging device that uses solid-state image pickup device, such as lens, solid-state image pickup device and each parts that the LSI of the drive circuit that is used for this element and signal processing circuit is installed all have the shape of housing or structure member, and each parts makes up mutually.Usually, the mounting structure based on this combination is formed by the installation elements that is installed to planar printed circuit board.
For further dwindling this device, among the open 2001-245186 of Japan Patent a kind of three dimensional printed circuit boards 201 has as shown in figure 11 been proposed.Printed circuit board (PCB) 201 is formed from a resin, wherein, installed part by the shank 201A with rectangle platform shape, be formed on the main part 201B on this shank and be formed on shank 201A and main part 201B between the throughhole portions 201C of intersection constitute.Printed circuit pattern 205 is formed on the three dimensional printed circuit boards on the side of shank 201A rear surface.Lens arrangement is on the inner periphery of main part 201B.With the axle 217 of lens when being the center, below filter 203 is positioned on the throughhole portions 201C, solid-state image pickup device 204 and chip part 208 are set at throughhole portions 201C.Shown in the cutaway view of Figure 12, utilize scolder 214 printed circuit board (PCB) to be connected to the mainboard 213 that installs such as mobile phone or personal computer etc. by the printed circuit pattern 205 that is formed on the shank 201A.Form many parts 219 on mainboard 213, parts 219 comprise the chip parts such as signal processing circuit, transistor and electric capacity such as the output signal that is used to handle solid-state imaging element.By ball grid array (BGA) 221 mainboard 213 is connected to the connection that flexible PCB (FPC) 220 is set up between the parts.Figure 13 is the view of the major part of this connection of expression.By being formed on image pick-up element 204 lip-deep protruding 206 solid-state imaging element 204 is connected to the printed circuit pattern 205 that is formed on the shank 201A, then, seals to finish and being connected of three dimensional printed circuit boards 201 with sealing resin 207.
Identical part is represented with identical label.
As we know from the figure, a lot of parts must be mounted, then interconnect again.Therefore, the existing problem of conventional apparatus is that many connections must be finished in the process that each parts is installed, so device size is big and installation process needs the long time cycle.
In installation process, shown in Figure 14 A-14C, the method below having adopted: in the molded back of three dimensional printed circuit boards (Figure 14 A), solid-state image pickup device 204 is installed to this circuit board (Figure 14 B), filter 203 (Figure 14 C) then is installed.
In the heating steps in the process that solid-state image pickup device 204 is installed to three dimensional printed circuit boards 201, three dimensional printed circuit boards 201 bigger distortion and the coupling part between solid-state image pickup device 204 and three dimensional printed circuit boards 201 occur and produces great stress, fails because of cracking takes place so often connect.
In general, this three dimensional printed circuit boards is made through injection molding.But its problem is, from the molded precision and the angle in injection molding life-span, the filler that is generally used for reducing the resin material coefficient of expansion can not be to add greater than a certain given amount.
The thermoplastic resin that is generally used for injection molding has straight-chain molecular structure, so it demonstrates at linear expansion coefficient little on the molecule bonding position on perpendicular to the molecule bonding position the anisotropic characteristic of big linear expansion coefficient.In this resin, filler is along mold pressing flow path direction orientation, so demonstrate the anisotropic characteristic of the big coefficient of expansion on perpendicular to the mold pressing flow path direction.
As mentioned above, traditional solid state image pickup device constitutes by the various functional parts in its outside installation such as signal processing circuit, so, there are these installation process needs long time cycle and the also bigger problem of size of devices.In addition, the coupling part of connection failure between solid-state image pickup device and treatment circuit parts takes place, and this has also reduced reliability.
In the heating steps in the process that solid-state image pickup device is installed to three dimensional printed circuit boards, three dimensional printed circuit boards bigger distortion and the coupling part between solid-state image pickup device and three dimensional printed circuit boards occur and produces great stress, fails because of cracking so often connect.
Usually, this coupling part between solid-state image pickup device and three dimensional printed circuit boards constitutes by being arranged on the pad on the solid-state image pickup device and the terminal of three dimensional printed circuit boards.Connection between them is realized by connected modes such as adopting electrically conducting adhesive such as elargol, ultrasonic bonding, hot pressing welding.
In the whole bag of tricks, since the thermal deformation of three dimensional printed circuit boards, the bonding very easily cracking of solid-state image pickup device, and this will cause output to descend.
When printed circuit board (PCB) is made three-dimensional structure, can make its miniaturization but its thermal deformation usually greater than the situation of two-dimensional structure, so exist the distortion that is caused because of coefficient of expansion difference to hinder the serious problems that output improves.
Therefore, wish to propose a kind ofly can easily to be connected to outer treatment circuit, can further to reduce the solid state image pickup device of size again.
Summary of the invention
The present invention makes under said circumstances.The purpose of this invention is to provide a solid state image pickup device, wherein, do not need peripheral connecting circuit, and the manufacture method of this solid state image pickup device is simple, size is little, reliability is high.
Another object of the present invention is the thermal deformation that suppresses such as the structural member of three dimensional printed circuit boards, with the connection of guaranteeing solid state image pickup device and the welding quality of improving this solid state image pickup device.
The invention provides a kind of solid state image pickup device, comprising:
Structural member is constituted and is had a throughhole portions by insulating resin;
Solid-state image pickup device, it is installed to described structural member;
Transmission element is installed to described structural member, covers this throughhole portions, and separates preset distance with described solid-state image pickup device;
Fixture integrally is sealed in the described structural member, between the part of the described transmission element of installation of the part of the described image pick-up element of installation of described structural member and described structural member;
Described solid state image pickup device also comprises:
Flexible substrates, it is bonded to this fixture;
Circuit part, it is formed on the surface of described flexible substrates, and wherein the required function element is installed on the described circuit part;
Wherein, described flexible substrates and described circuit part integrally are sealed in the described structural member and are set at described structural member and the part and the described structural member of described solid-state image pickup device are installed are installed between the part of described transmission element,
Wherein, the thermal deformation coefficient of described fixture is less than the thermal deformation coefficient of this insulating resin.
According to the present invention, a structural member that integrally is packaged with circuit board is used, this circuit board is connected to solid-state image pickup device and is set at the part that structural member connects solid-state image pickup device and is connected between another part of transmission element with structural member, solid-state image pickup device is installed to throughhole portions, and the installation of transmission element can cover throughhole portions and separate with preset distance and solid-state image pickup device.In the step of molded structure spare, therefore circuit board can be reduced the labour by integrally molded, and the structure of mounting portion can be simplified, thereby realizes miniaturization of devices.
According to the present invention, solid state image pickup device comprises: structural member, and it is made of insulating resin and has a throughhole portions; Solid-state image pickup device, it is installed to this structural member, in order to cover throughhole portions; Transmission element, it is installed to this structural member, separates in order to the covering throughhole portions and with preset distance and solid-state image pickup device; And circuit board, it is installed to this solid-state image pickup device and integrally is sealed in the structural member, and the part that this circuit board is set at structural member connection solid-state image pickup device is connected between another part of transmission element with structural member.
According to the present invention, the thickness of the optical interval between the part of utilization installation solid-state image pickup device and the part of installation transmission element will produce the circuit board sealing (in peripheral part) of little thermal deformation.So, can significantly reduce the quantity of peripheral components, device Miniaturizable.Because circuit board and structural parts whole ground are molded,, therefore significantly reduced the connection fault when solid-state image pickup device is installed so the thermal deformation of the structural member that produces reduces significantly.
Preferably, circuit board is the Multi-layer Interconnection Board with the conductive pattern that exposes from the mounting portion of solid-state image pickup device, and solid-state image pickup device directly faces down and is connected to the conductive pattern of circuit board.
In this structure, outside number of connection reduces, and connects by facing down to make the devices get smaller attenuation.
Preferably, circuit board comprises the signal processing circuit of the output signal that is used to handle solid-state image pickup device.
In this structure, circuit board need not be provided with external circuit because of having signal processing circuit, so the circuit board Miniaturizable.In addition, signal processing circuit forms near solid-state image pickup device, so can shorten the processing time and reduce noise level.
Preferably, signal processing circuit is a chip part that is connected to the circuit board first surface, and first surface is positioned at the side that transmission element is installed.
In this structure, because signal processing circuit is installed into the chip part that is positioned on the Multi-layer Interconnection Board, so Miniaturizable.In addition, signal processing circuit forms near solid-state image pickup device, so can shorten the processing time and reduce noise level.
Preferably, circuit board constitutes and comprises through hole so that have the part that extend into this throughhole portions and transmission element is installed by having annular element with the throughhole portions counterpart, and transmission element is fixed on the circuit board in order to the part of transmission element to be installed.
In this structure, owing to transmission element is installed on the little circuit board of thermal deformation, so thermal deformation can further be suppressed.
Preferably, circuit board is made of Multi-layer Interconnection Board, and conductive pattern also exposes in surface one side that solid-state image pickup device is installed, and solid-state image pickup device is directly connected to this conductive pattern.
In this structure of this device, connection is simplified and installs the attenuation that further diminishes.
Preferably, structural member has shank and is positioned at the cylinder body portion of shank, and throughhole portions is between this main part and shank.
When this structure was used for conventional apparatus, total can be dwindled, but the distortion of the coupling part that its problem is thermal deformation to be caused easily makes connection break down.Otherwise solid-state image pickup device of the present invention can be installed after by Unitarily molded the installation less than insulating resin and the circuit board that produces less thermal deformation at thermal coefficient of expansion again.Therefore, the thermal deformation of the structure of being made by insulating resin can be suppressed, and the connection reliability of solid-state image pickup device increases.
Preferably, Multi-layer Interconnection Board is electrically connected to the conductive pattern that is formed on the shank surface portion.
In this structure, device can easily be connected to external device (ED), also can further dwindle.
Preferably, Multi-layer Interconnection Board is made of the material of thermal coefficient of expansion less than insulating resin.
In this structure, because the thermal coefficient of expansion of Multi-layer Interconnection Board is less than the thermal coefficient of expansion that constitutes structural member, so so install during the solid-state image pickup device because of distortion that heat produced is reduced and to improve reliability.
Preferably, transmission element is to constitute by the dielectric film that forms sandwich construction on the quartz glass surface.
In this structure because the thermal coefficient of expansion of quartz glass is than the little order of magnitude of thermal coefficient of expansion of the resin that constitutes this structural member, so the distortion that heat produced of installing during the solid-state image pickup device can reduce, so reliability improves.
Preferably, transmission element is made of thermosetting resin.
In this structure owing to constitute transmission element with thermosetting resin, so the distortion that heat produced of installing during the solid-state image pickup device can reduce, so reliability improves.
Preferably, transmission element is a filter.
The installation site of this filter is determined solid-state image pickup device and is installed in distance between the lens of external position, so this installation site is a key factor.In this structure, because transmission element is through Unitarily molded and fixing and be made of little thermal coefficient of expansion parts, so the distortion of this structural member around transmission element is suppressed.Therefore, the thermal deformation of structural member around the solid-state image pickup device can be suppressed, then the stability of the distance between solid-state image pickup device and the filter improve, thereby pickup image better.
Preferably, circuit board partly constitutes by being formed on the lip-deep annular multilayer interconnection of light-transparent substrate, and one is positioned at the light-transparent substrate center and forms filter from the zone that multilayer interconnection partly exposes.
In this structure, the center of light-transparent substrate constitutes filter, and multilayer interconnection partly is formed on the excircle district of substrate, and circuit board and filter are made of same substrate.Therefore, number of components further reduces, the device attenuation that can diminish.In addition, the installation steps number further reduces, and the operability of installation process is enhanced.
In addition, according to the present invention, by integrally being sealed the structural member that forms with fixture, circuit part is used, circuit part is connected to solid-state image pickup device and is formed on the flexible substrates so that be arranged on the part of the structural member that solid-state image pickup device is installed and install between the other parts of transmission element, solid-state image pickup device is installed to throughhole portions, and transmission element is mounted so that cover the throughhole portions of separating with preset distance and solid-state image pickup device.In the process of molded structure spare, the circuit part that is formed on the flexible substrates is molded with fixture, can simplify so can save the structure of manpower, mounting portion, so can realize miniaturization of devices, and can easily device be connected to external device (ED).
Device in the solid state image pickup device of the present invention comprises: structural member, and it is made of insulating resin and has a throughhole portions; Solid-state image pickup device, it is installed to this throughhole portions; And transmission element, it is provided so that the throughhole portions that covering separates with preset distance and solid-state image pickup device; And fixture, its thermal coefficient of expansion is less than the thermal coefficient of expansion of resin; Flexible substrates, it is connected to this fixture; Circuit part, it is formed on the surface of flexible substrates, on the circuit part, required function element is seated in by integral sealing that structural member is installed the part of this solid-state image pickup device and structural member is installed between another part of transmission element.
In this structure, the optical space between the part of utilization installation solid-state image pickup device and the installation transmission element part, the circuit part that will be formed on the flexible substrates that is connected on the fixture that produces little thermal deformation seal (it is interior to arrive peripheral part).Therefore, can reduce the quantity of external components widely, device can be reduced.Owing to comprise that the fixture of circuit part is molded with structural member,, thereby greatly reduced the connection fault so the thermal deformation of structural member generation can obviously reduce when solid-state image pickup device is installed.
Preferably, circuit part has and is provided with the multi-layer wiring structure that connects the conductive pattern of the part that the part of this solid-state image pickup device exposes from structural member, so solid-state image pickup device is directly faced down is connected to the conductive pattern of this circuit part.
In this structure, the outside quantity that connects is reduced, and connects by facing down to make devices get smaller, attenuation.
Preferably, circuit part comprises the signal processing circuit of the output signal that is used to handle solid-state image pickup device.
In this structure,,, therefore can realize miniaturization so do not need to be provided with external circuit because circuit part comprises signal processing circuit.In addition, signal processing circuit forms near solid-state image pickup device, so the processing time can shorten, sound level can reduce.
Preferably, this fixture is the ring-shaped pottery substrate with the aperture in the corresponding district with throughhole portions, and signal processing circuit is the chip part that is connected to circuit part.
In this structure, because ceramic bases is used as fixture, signal processing circuit is mounted to the chip part on the circuit part, so can realize miniaturization.In addition, signal processing circuit forms near solid-state image pickup device, so the processing time can shorten, sound level can reduce.
Preferably, the chip that constitutes signal processing circuit partly is connected to the first surface of circuit part, and this first surface is arranged in the connected side of transmission element and is connected to this circuit part by the through hole that is formed on ceramic bases.
In this structure, can realize easily that high reliability connects, signal processing circuit can form near solid-state image pickup device, so the processing time can shorten, sound level can reduce.
Preferably, circuit part is made of multi-layer wiring structure spare, and conductive pattern exposes on the face side that solid-state image pickup device is installed, and solid-state image pickup device is directly connected to this conductive pattern.
In the device of this structure, be easy to connect, and device can further diminish, attenuation.
Preferably, structural member have on it the shank that forms the wiring part, the cylinder body portion on this shank and be formed on main part and shank between through-hole section.
When this structure applications during in traditional devices, total can be dwindled, but it can produce the connection fault that distortion caused of the coupling part that causes because of thermal deformation.Otherwise in the present invention, solid-state image pickup device can be installed after by Unitarily molded the installation less than insulating resin and the circuit board that produces less thermal deformation at thermal coefficient of expansion again.Therefore, the thermal deformation of the structural member of being made by insulating resin can be suppressed, and the connection reliability of solid-state image pickup device can increase.
Preferably, multi-layer wiring structure spare is electrically connected to the conductive pattern that is formed on the shank surface portion.
In this structure, device can easily be connected to external device (ED), also can further dwindle.
Preferably, transmission element is a filter.
The installation site of this filter is determined solid-state image pickup device and is installed in distance between the lens of external position, so this installation site is a key factor.In this structure, because transmission element is through Unitarily molded and fixing and be made of little thermal coefficient of expansion parts, so the distortion of this structural member around transmission element is suppressed.Therefore, the thermal deformation of structural member around the solid-state image pickup device can be suppressed, so the stability of distance improves between solid-state image pickup device and the filter, thus pickup image better.
Preferably, flexible substrates has the elongated portion that is provided with to the outside conductor end sub pattern of extending of structural member, and the conductor end sub pattern constitutes the lead-out terminal of power supply and signal processing circuit.
In this structure, thin-film carrier can reach the outside of structural member and be connected to external component with the wiring pattern.Therefore, this device can be installed to devices such as fold type portable telephone, thereby, realize miniaturization to a great extent.
In the method for the invention, its method comprises: terminal block forms step, and preparation has the insulating barrier of the through hole in the center and forms the wiring layer so that form circuit board; The signal processing circuit chip is connected to the step of the first surface of this circuit board; The molded step of structural member covers with insulating resin and to be formed with the circuit part of signal processing circuit and to form throughhole portions and carry out encapsulation process in a district corresponding with through hole, thereby forms structural member; The installation steps of solid-state image pickup device are installed to the throughhole portions of the second surface of circuit board with covered structure spare with solid-state image pickup device; The installation steps of transmission element are installed to transmission element the first surface of circuit board.
In this structure because the circuit board of little thermal deformation is molded with structural member, so the thermal deformation of the structural member that when solid-state image pickup device is installed, produces obviously reduce, so greatly reduce the connection fault.The step that transmission element is installed is optional, so can improve production efficiency.In addition, this connection does not need margin.Therefore device can dwindle.
Preferably, the molded step of this structural member is the injection step that forms the structural member that is made of the thermoplastic insulating resin by injection molding.
When structural member is formed by thermoplastic resin by injection molding, in the cured process, easily produce specific distortion, and when being used for hot environment, device also can produce distortion, therefore, caused being connected to the easily problem generation of generation connection fault of part (three dimensional printed circuit boards) of this structural member at solid-state image pickup device.Otherwise in this structure, the thermal deformation of the structural member that is formed by insulating resin is suppressed by the circuit board of thermal coefficient of expansion less than insulating resin, so distortion is very little, therefore, the connection reliability of solid-state image pickup device is enhanced.
In addition, in the method for the invention, its step comprises: plate forms step, preparation in the center, have through hole flexible substrates, form the forming circuit part the wiring layer, and this flexible substrates is connected to fixture; In this circuit part, form the step of signal processing circuit; The molded step of structural member covers with insulating resin and to be formed with the circuit part of signal processing circuit and to form throughhole portions and carry out encapsulation process in a district corresponding with through hole, thereby forms structural member; The installation steps of solid-state image pickup device are electrically connected to solid-state image pickup device the throughhole portions of this circuit part and covered structure spare; The installation steps of transmission element are installed to transmission element the first surface of this circuit part.
In this structure, the fixture and these parts that are connected to the little thermal deformation that also is used as signal processing circuit and supporting part owing to the flexible substrates that is formed with circuit part are molded with structural member, so the thermal deformation of the structural member that is produced when solid-state image pickup device is installed obviously reduces, therefore connect fault and descend greatly.Because the step of installation chip etc. is optional, so production efficiency improves.In addition, this connection does not need margin.Therefore device can be reduced.
Preferably, the molded step of this structural member is the injection step that forms the structural member that is made of the thermoplastic insulating resin by injection molding.
When structural member is formed by thermoplastic resin by injection molding, in the cured process, easily produce specific distortion, and when being used for hot environment, device also can produce distortion, therefore, be connected to the easy connection fault that produces of part (three dimensional printed circuit boards) of this structural member at solid-state image pickup device.Otherwise in this structure, the thermal deformation of the structural member that is formed by insulating resin is suppressed by the circuit board of thermal coefficient of expansion less than insulating resin, so distortion is very little, therefore, the connection reliability of solid-state image pickup device is enhanced.
Description of drawings
Fig. 1 is the cutaway view of the solid state image pickup device of first embodiment of the invention;
Fig. 2 is the amplification view of main part of the solid state image pickup device of first embodiment of the invention;
Fig. 3 A-3D shows the method step of the solid state image pickup device of making first embodiment of the invention;
Fig. 4 is the cutaway view of the solid state image pickup device main part of second embodiment of the invention;
Fig. 5 shows the method step of the solid state image pickup device of making the present invention second and the 4th embodiment;
Fig. 6 is the cutaway view of the solid state image pickup device of third embodiment of the invention;
Fig. 7,8B-8D show the method step of the solid state image pickup device of making third embodiment of the invention;
Fig. 9 is the cutaway view of the solid state image pickup device of fourth embodiment of the invention;
Figure 10 is the plane graph of the solid state image pickup device main part of second embodiment of the invention;
Figure 11 is the perspective view of conventional solid-state imaging device;
Figure 12 is the cutaway view of conventional solid-state imaging device;
Figure 13 is the cutaway view of conventional solid-state imaging device main part;
Figure 14 A-14C shows in the conventional art example, the step of installation solid state image pickup device main part.
Embodiment
Below, will specifically describe the present invention in conjunction with the accompanying drawings.
(embodiment 1)
Fig. 1 and 2 is the view of the solid state image pickup device main part of first embodiment of the invention.
In this solid state image pickup device, be equipped with thereon in the molding process of structural member 1 of solid-state image pickup device, the signal processing circuit chip DSP 22 of Multi-layer Interconnection Board 2 on the first surface that is formed on Multi-layer Interconnection Board 2 is sealed in the structural member 1 that is made of the poly-adjacency pair benzene trimethamide resin of insulation.In addition, Multi-layer Interconnection Board is used as the Service Circuit plate of the ceramic bases that forms basic part, and the thermal coefficient of expansion of ceramic bases is significantly less than the thermal coefficient of expansion of the resin that constitutes this structural member.Structural member 1 has throughhole portions 1C.The panel-like member that constitutes filter 3 is installed to structural member 1 and in the face of throughhole portions 1C and be positioned at the top of the first surface of Multi-layer Interconnection Board 2, structural member 1 comprises treatment circuit chip DSP 22 wherein.Solid-state image pickup device 4 is installed to the second surface of Multi-layer Interconnection Board 2 in the mode of facing down.In this embodiment, filter 3 is made of quartzy deflecting plate, and the peripheral part of filter arrives structural member 1 with adhesive securement.
Solid state image pickup device comprises structural member 1 and solid-state image pickup device 4.Structural member 1 is made of the poly-adjacency pair benzene trimethamide resin of insulation and comprises: the shank 1A with rectangle platform shape; Be formed on the main part 1B on the shank 1A; And be formed on the throughhole portions 1C of intersection between shank 1A and the main part 1B.Structural member 1 also is included near the wiring part with Multi-layer Interconnection Board 2 of the part that filter 3 is installed, and this wiring part has terminal patterns 5 at the surface portion of shank 1A.In Multi-layer Interconnection Board 2, inward flange partly stretches out, also forms at least a hole along the direction of throughhole portions 1C.Solid-state image pickup device 4 is connected to the wiring part that is installed in throughhole portions 1C and 27 is electrically connected to terminal patterns 5 through the hole.
Below, will the manufacture method of the solid state image pickup device of first embodiment be described.
As shown in Figure 3A, at first, on first (front) of ceramic bases 20 and second (back side) surface, form the copper film, utilize photoetching technique on the copper film, to form wiring pattern 21 and after-applied polyimide resin film 24, and formation via hole 23.Then, after forming the copper film, utilize photoetching technique to form the processing of pattern, thereby form Multi-layer Interconnection Board 2 with required pattern so that form wiring pattern 21 repeatedly.In pattern formed step, resistance film was stacked and be sandwiched between the wiring pattern and form thin-film capacitor, and resistance film is arranged between the wiring pattern and forms film resistor, and connection-core chip part as required.
Then, shown in Fig. 3 B, signal processing circuit chip DSP 22 is directly connected to the protruding 21S on the wiring pattern 21 that is formed on the substrate front surface.
The Multi-layer Interconnection Board 2 of this formation is placed in the transfer mould.Shown in Fig. 3 C, will poly-adjacency pair phenyl-diformyl polyimide resin inject the cavity of transfer mould, cool off then and harden, thereby form by gathering the structural member 1 that adjacency pair phenyl-diformyl polyimide resin constitutes, this structural member comprises the shank 1A with rectangle platform shape; Be formed on the main part 1B on the shank 1A; And be formed on the throughhole portions 1C of intersection between shank 1A and the main part 1B.
On the other hand, the dielectric film evaporation that will have a sandwich construction of required refractive index forms the filter 3 that is made of the dielectric interference light filter to quartz plate surface.
Then, shown in Fig. 3 C, filter 3 is connected to the first surface of the Multi-layer Interconnection Board 2 that exposes from structural member 1 so that in the face of throughhole portions 1C.
Afterwards, by the electroplating technology or the thin-film technique of for example sputtering technology, will comprise that the wire connecting portion branch that is formed on the terminal patterns 5 on the shank 1A back side is formed in the fate of structural member 1.
Then, shown in Fig. 3 D, solid-state image pickup device (chip) 104 is installed on the surface of throughhole portions of structural member 1.Projection 6 is pre-formed on the contact terminal of solid-state image pickup device 4, and this terminal is connected to the end of the terminal patterns on the shank 1A that is formed on structural member 1 by the hot pressing connected mode.Afterwards, carry out resin-sealed processing so that cover the surface of solid-state image pickup device 4 with resin seal 7.
At last, cover lens 8, also lens 8 be connected to structural member 1 and form the solid state image pickup device shown in Fig. 1 and 2 with protective cover 9 with adhering resin 10.
In this solid state image pickup device that forms, be equipped with on it such as the chip part of DSP and Multi-layer Interconnection Board that film resistor and thin-film capacitor be installed on it and be sealed in the structural member that constitutes by insulating resin.Therefore, the volume of this device very little, be easy to make and the reliability height.
The Multi-layer Interconnection Board that the structural member 1 that is made of insulating resin is sealed in the structural member supports.So in the process that solid-state image pickup device is installed, thermal coefficient of expansion is used as fixture to suppress the thermal deformation of structural member, so can improve the connection reliability of solid-state image pickup device less than the Multi-layer Interconnection Board of this structural member.
In addition, do not need to carry out for example installation of signal processing circuit of peripheral circuit parts.This device is configured so-called mixing IC, and this part utilization is formed on the optical space between filter and the solid-state image pickup device and is provided with.Therefore, the about size of this device is reduced significantly.
Do not need to install the step of this device.So installation steps significantly reduce, operability improves.
This structural member is made by injection molding.Poly-adjacency pair phenyl-diformyl polyimide resin has straight-chain molecular structure, therefore demonstrates anisotropic characteristic, and promptly thermal coefficient of expansion is little on the molecule bonding position and big on perpendicular to the direction of molecule bonding position.So in first embodiment, annular Multi-layer Interconnection Board is sealed so that surround this throughhole portions.On the other hand, can be parallel to two Multi-layer Interconnection Boards of sealing on the injection molding direction of thermoplastic resin, and make this terminal block toward each other across throughhole portions.Another aspect is to suppress to stretch on perpendicular to the molecule bonding position.
In first embodiment, preferably, by the gas that for example when forming the hole that is communicated with throughhole portions around the embedding filter position so that discharging the installation solid-state image pickup device, is produced.
In the formation of Multi-layer Interconnection Board, can on substrate or insulation film, form this through hole by laser punching, then carry out operations such as sputter process, electroplating processes.
In the end electroplate on the whole surface to structural member in the step, and overlay coating can be connected to the earth terminal of Multi-layer Interconnection Board and form electromagnetic shielding.
(embodiment 2)
Fig. 4 is the view of the solid state image pickup device main part of second embodiment of the invention.
In first embodiment, filter 3 is installed to Multi-layer Interconnection Board.On the contrary, in a second embodiment, the ceramic bases that constitutes Multi-layer Interconnection Board is made by light-transmittance ceramics, and required film forms from the teeth outwards, as the many refractive materials 20S that is used as filter.The Multi-layer Interconnection Board that is sealed in the structural member constitutes in the following manner.Many refractive materials 20S is used as dielectric base, and forms multi-layer wiring structure spare 2M so that have annular in the peripheral region except the district corresponding with throughhole portions 1C.Multi-layer wiring structure spare 2M is placed in the transfer mould, then carries out injection molding so that use the center of the structural member sealing multi-layer wiring structure spare 2M that is made of poly-adjacency pair phenyl-diformyl polyimide resin.
Manufacture method according to this embodiment, in the structural member 1 that solid-state image pickup device 4 is installed molded, the panel-like member that is integrated with a lot of multi-layer wiring structure spare 2M is formed, a lot of structural members are integrally molded with this panel-like member, then, molded product can be cut into single solid state image pickup device.
In this embodiment, the internal gas that is produced when in order to be released in solid-state image pickup device being installed preferably forms the through hole that is communicated with throughhole portions 1C in being used as the center of filter.And form the other parts of this device in the same manner as in the first embodiment.
In this manufacture method, form the device of this embodiment in the mode similar to first embodiment.But in this embodiment, not only filter but also structural member be also by integrally molded, molded product finally along line of cut d1, d2 shown in Figure 5, d3 ..., c1, c2, c3 ... be cut, so obtain solid state image pickup device shown in Figure 4.
(embodiment 3)
Fig. 6 is the view of the solid state image pickup device main part of third embodiment of the invention.
In this solid state image pickup device, in the molding process of the structural member 101 that solid-state image pickup device 104 is installed, signal processing circuit chip (DSP) 122 with being formed on ceramic bases 102g first surface on of ceramic bases 102g and the circuit part 102 that is formed on the sandwich construction on the thin-film carrier 120F that is used as flexible substrates, the through hole (not shown) that is opened on ceramic bases 102g are sealed in the structural member 101 that is made of the poly-adjacency pair phenyl-diformyl polyimide resin that insulate.In addition, ceramic bases 102g is used as fixture, and the thermal coefficient of expansion of ceramic bases 102g is significantly less than the poly-adjacency pair phenyl-diformyl polyimide resin that constitutes structural member 101.Structural member 101 comprises throughhole portions 101C.The panel-like member that constitutes filter 103 is installed to the structural member 101 that comprises signal processing circuit chip (DSP) 122 in it, and circuit part 102 is fixed to the first surface of ceramic bases 102g, so that this panel-like member is in the face of throughhole portions 101C.Solid-state image pickup device 104 is installed to the second surface of ceramic bases in the mode of facing down.In this embodiment, filter 103 is made of quartzy deflecting plate, and the peripheral part of filter 103 arrives structural member 101 with adhesive securement.
The first surface (front) of the thin-film carrier 120F of the polyimide film by will having the center opening bonds to ceramic bases 102g and goes up the plural layers that form copper wiring pattern 121 and polyimide resin film 124 and forming circuit part 102 at second surface (back side).Copper wiring pattern in each layer interconnects through being formed on the through hole 123 on the polyimide resin film 124.Other element such as thin-film capacitor 125 and film resistor 126 also is formed on circuit part 102.
Below, the manufacture method of solid state image pickup device is described.
As shown in Figure 7, the copper film is formed on second (back of the body) surface of the thin-film carrier 120F of polyimide film, thereby on the copper film, forms pattern formation wiring pattern 121 with photoetching technique, and after-applied polyimide resin film 124 and form through hole 123.Form the copper film repeatedly, form the processing of pattern with photoetching technique to form the step of wiring pattern 121, so that form the circuit part 102 of multi-layer wiring structure with required pattern.In pattern formed step, resistance film was by stacked and be clamped between the wiring pattern forming film capacitor, and resistance film is set between the wiring pattern to form film resistor, and connection-core chip part as required.
Then, shown in Fig. 8 B, formed through hole is formed in the wiring pattern 121 of substrate surface, and the ceramic bases 102g that has the wiring pattern and be positioned at lip-deep protruding 121S is by bonding, and signal processing circuit chip (DSP) 122 is directly connected to the protruding 121S on the ceramic bases.Signal processing circuit chip (DSP) 122 is by being formed on through hole in the thin-film carrier, being connected to this circuit part from the face side of ceramic bases 102g.
The circuit part 102 of Xing Chenging is placed in the transfer mould with the ceramic bases 102g as fixture like this.Shown in Fig. 8 C, will poly-adjacency pair phenyl-diformyl polyimide resin inject the cavity of transfer mould, cool off then and harden, thereby form by gathering the structural member 101 that adjacency pair phenyl-diformyl polyimide resin constitutes, this structural member comprises the shank 101A with rectangle platform shape; Be formed on the main part 101B on the shank 101A; And be formed on the throughhole portions 101C of the intersection between shank 101A and the main part 101B.
On the other hand, the dielectric film evaporation that will have a sandwich construction of required refractive index forms the filter 103 that is made of the dielectric interference light filter to quartz plate surface.
Then, filter 103 is connected to the first surface of the circuit part 102 that exposes from structural member 101 so that in the face of throughhole portions 101C.
Afterwards, by the electroplating technology or the thin-film technique of for example sputtering technology, will comprise that the wire connecting portion branch that is formed on the terminal patterns 105 on the shank 101A back side is formed in the fate of structural member.
Then, shown in Fig. 8 D, solid-state image pickup device (chip) 4 is installed to the surface of the throughhole portions 101C of structure member 101.Projection 106 is pre-formed on the contact terminal of solid-state image pickup device 104, and this terminal is connected to the end that is formed on the terminal patterns on the structural member 101A by hot pressing.Afterwards, carry out resin-sealed processing so that cover the surface of solid-state image pickup device 104 with resin seal 7.
At last, cover lens 108, also lens 108 be connected to structural member 101 and form solid state image pickup device shown in Figure 6 with protective cover 109 with adhering resin 110.
In this solid state image pickup device that forms, the Multi-layer Interconnection Board that chip part such as DSP also is equipped with film resistor and thin-film capacitor is installed on it is sealed in the structural member that constitutes by insulating resin.Therefore, the volume of this device very little, be easy to make and the reliability height.
The ceramic bases 2g that the structural member that is made of insulating resin is sealed in the structural member supports.So in the process that solid-state image pickup device is installed, thermal coefficient of expansion is used as fixture to suppress the thermal deformation of structural member, so can improve the connection reliability of solid-state image pickup device less than the ceramic bases of this structural member.
Because on the thin-film carrier that for example peripheral circuit of signal processing circuit is formed on ceramic bases is connected, so this device is configured so-called mixing IC, this parts utilization is formed on the optical space between filter and the solid-state image pickup device and is provided with.Therefore, this size of devices is reduced significantly.
Do not need to install the step of this device.So installation steps significantly reduce, operability improves.
This structural member is made by injection molding.Poly-adjacency pair phenyl-diformyl polyimide resin has straight-chain molecular structure, therefore demonstrates anisotropic characteristic, and promptly thermal coefficient of expansion is little on the molecule bonding position and big on perpendicular to the direction of molecule bonding position.So in the 3rd embodiment, annular Multi-layer Interconnection Board is sealed so that surround this throughhole portions.On the other hand, two ceramic bases can and be connected to thin-film carrier along the injection molding direction formation that is parallel to thermoplastic resin, and make ceramic bases and thin carrier across throughhole portions toward each other.Another aspect is to suppress to stretch on perpendicular to the molecule bonding position.
In the 3rd embodiment, preferably, by the gas that for example when forming the hole that is communicated with throughhole portions around the embedding filter position so that discharging the installation solid-state image pickup device, is produced.
In the formation of ceramic bases and circuit part, can on substrate or insulation film, form this through hole by laser punching, then carry out operations such as sputter process, electroplating processes.
In the end electroplate on the whole surface to structural member in the step, and overlay coating can be connected to the earth terminal of Multi-layer Interconnection Board and form electromagnetic shielding.
(embodiment 4)
Fig. 9 and 10 is views of the solid state image pickup device main body of fourth embodiment of the invention.
In the 3rd embodiment, be used for the outside terminal that connects and realize by the terminal patterns on the shank 101A that is formed on structural member 101.And in the 4th embodiment, thereby thin-film carrier 120F is connected to external component with the outside that the wiring pattern is extended structural member.
In this structure, in fact this device can be connected to equipment such as fold type portable telephone, so can realize miniaturization to a great extent.
When making, only need prolong this thin-film carrier simply.The device of present embodiment can use the mode similar to the 3rd embodiment shown in Fig. 7-8D to make.
In the above-described embodiments, filter 103 is installed to structural member 101.In addition, as described in the second embodiment of the present invention, the ceramic bases 102g that constitutes fixture can be made by light-transmittance ceramics, and required film is formed on the surface as many refractive materials 20S of filter.
In the present embodiment, the gas that is produced when solid-state image pickup device being installed in order to discharge, the through hole that is communicated with throughhole portions 1C preferably is formed on the center that is used as filter.Other parts form in the mode identical with the 3rd embodiment.
In this was made, not only filter but also structural member be also by integrally molded, molded product finally along line of cut d1, d2 shown in Figure 5, d3 ..., c1, c2, c3 ... be cut, so obtain solid state image pickup device shown in Figure 6.
Though filter is used as transmission element in the first and the 4th embodiment, transmission element is not limited to filter.Printing opacity seal, lens etc. also can be used as transmission element fully.
For the resin that constitutes structural member, can be used for replacing thermoplastic resin such as poly-adjacency pair phenyl-diformyl polyimide resin or PPS resin such as the thermosetting resin of epoxy resin.
The application of solid state image pickup device of the present invention is not only limited to image pickup device used in the optical communication field, and this solid state image pickup device also can be set in the various Optical devices such as reading device, medical equipment and call gate such as CD or DVD.
As mentioned above, according to the present invention, utilize the thickness of the optical space of part between the part that transmission element is installed that solid-state image pickup device is installed, the fixture that thermal deformation is little to be sealed to peripheral part with the circuit part that is formed on the flexible substrates.So, can reduce the quantity of external component significantly.So the present invention can provide undersized solid state image pickup device.
Because circuit part is molded with this structural member, so the thermal deformation that this structural member is produced when solid-state image pickup device is installed can reduce widely.Therefore, the invention provides the method that connects the obvious making solid state image pickup device that reduces of fault that makes.
Claims (10)
1. solid state image pickup device comprises:
Structural member is constituted and is had a throughhole portions by insulating resin;
Solid-state image pickup device, it is installed to described structural member;
Transmission element is installed to described structural member, covers this throughhole portions, and separates preset distance with described solid-state image pickup device;
Fixture integrally is sealed in the described structural member, between the part of the described transmission element of installation of the part of the described image pick-up element of installation of described structural member and described structural member;
Described solid state image pickup device also comprises:
Flexible substrates, it is bonded to this fixture;
Circuit part, it is formed on the surface of described flexible substrates, and wherein the required function element is installed on the described circuit part;
Wherein, described flexible substrates and described circuit part integrally are sealed in the described structural member and are set at described structural member and the part and the described structural member of described solid-state image pickup device are installed are installed between the part of described transmission element,
Wherein, the thermal deformation coefficient of described fixture is less than the thermal deformation coefficient of this insulating resin.
2. solid state image pickup device as claimed in claim 1, wherein,
Described circuit part is the multi-layer wiring structure with conductive pattern, and the part that the part of this circuit part is installed described solid-state image pickup device from described structural member is exposed,
The described conductive pattern that described solid-state image pickup device faces down and is provided with and is directly connected to this circuit part.
3. solid state image pickup device as claimed in claim 1, described required function element comprise the signal processing circuit of the output signal that is used to handle described solid-state image pickup device.
4. solid state image pickup device as claimed in claim 3, wherein,
Described fixture is the ring-shaped pottery substrate, has opening in the district corresponding with described throughhole portions;
Described signal processing circuit is the chip part that is connected to described circuit part.
5. solid state image pickup device as claimed in claim 4, wherein, first surface and the through hole through being formed on the described fixture that described signal processing circuit is connected to described circuit part are connected to described circuit part, and this first surface is positioned at the side that described transmission element is installed.
6. solid state image pickup device as claimed in claim 1, wherein,
Described circuit part is made of multi-layer wiring structure spare;
Conductive pattern exposes in a side on the surface that described solid-state image pickup device is installed;
Described solid-state image pickup device directly is connected to described conductive pattern.
7. solid state image pickup device as claimed in claim 6, wherein, described structural member has: shank forms the wiring part on it; Cylinder part, it is arranged on the described shank, and described throughhole portions is formed between described cylinder part and the described shank.
8. solid state image pickup device as claimed in claim 6, wherein, this multi-layer wiring structure spare is electrically connected to the conductive pattern that is formed on this shank surface portion.
9. solid state image pickup device as claimed in claim 1, wherein, described flexible substrates has elongated portion, and this elongated portion has the conductor end sub pattern that stretches to the outside of described structural member, and this conductor end sub pattern constitutes power supply and is used for the lead-out terminal of signal processing circuit.
10. method of making solid state image pickup device, its step comprises:
Preparation has the flexible substrates of through hole in the center;
On described flexible substrates, form the wiring layer so that the forming circuit part;
This flexible substrates is bonded to a fixture;
Setting is connected to the signal processing circuit of the first surface of this circuit part;
Form structural member by this circuit part and this signal processing circuit being sealed, thereby a throughhole portions of described structural member is set in the zone corresponding with this through hole with insulating resin;
Solid-state image pickup device is electrically connected to the second surface of this circuit part, covers the throughhole portions of this structural member;
Transmission element is installed to the described first surface of described circuit part, covers described throughhole portions, and with described solid-state image pickup device preset distance at interval;
Wherein, the step of described this structural member of formation comprises molded this structural member with the thermoplastic insulating resin; The thermal coefficient of expansion of described fixture is less than the thermal coefficient of expansion of described insulating resin.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001366981A JP3787765B2 (en) | 2001-11-30 | 2001-11-30 | Solid-state imaging device and manufacturing method thereof |
| JP366981/01 | 2001-11-30 | ||
| JP377018/01 | 2001-12-11 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021515700A Division CN1331345C (en) | 2001-11-30 | 2002-11-30 | Solid-state image-forming device and making method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1694509A CN1694509A (en) | 2005-11-09 |
| CN100399800C true CN100399800C (en) | 2008-07-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100747133A Expired - Fee Related CN100399800C (en) | 2001-11-30 | 2002-11-30 | Solid state image pickup device and its manufacturing method |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP3787765B2 (en) |
| CN (1) | CN100399800C (en) |
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| CN103956370A (en) * | 2014-05-20 | 2014-07-30 | 苏州晶方半导体科技股份有限公司 | Image sensor module and forming method thereof |
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| KR100568223B1 (en) * | 2003-06-18 | 2006-04-07 | 삼성전자주식회사 | Solid-State Imaging Apparatus |
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| JP4494746B2 (en) | 2003-09-25 | 2010-06-30 | 浜松ホトニクス株式会社 | Semiconductor device |
| DE10344760A1 (en) * | 2003-09-26 | 2005-05-04 | Siemens Ag | Optical module and optical system |
| JP2005116628A (en) * | 2003-10-03 | 2005-04-28 | Matsushita Electric Ind Co Ltd | Solid-state imaging device and manufacturing method thereof |
| JP4554962B2 (en) * | 2004-03-15 | 2010-09-29 | Ｈｏｙａ株式会社 | Substrate fixing structure for imaging device of electronic endoscope |
| JP4233536B2 (en) * | 2005-03-31 | 2009-03-04 | シャープ株式会社 | Module for optical equipment |
| JP2012009547A (en) * | 2010-06-23 | 2012-01-12 | Sony Corp | Solid imaging device and electronic apparatus |
| TWI445474B (en) * | 2011-11-18 | 2014-07-11 | Chuan Ling Hu | Manufacturing method of plastic metallized three - dimensional line |
| JP6146976B2 (en) * | 2012-09-24 | 2017-06-14 | オリンパス株式会社 | Imaging device and endoscope provided with the imaging device |
| CN103956371A (en) * | 2014-05-20 | 2014-07-30 | 苏州晶方半导体科技股份有限公司 | Image sensor module and forming method thereof |
| CN103972256B (en) * | 2014-05-20 | 2017-03-29 | 苏州晶方半导体科技股份有限公司 | Method for packing and encapsulating structure |
| CN103985723B (en) * | 2014-05-20 | 2017-06-20 | 苏州晶方半导体科技股份有限公司 | Method for packing and encapsulating structure |
| CN108933151B (en) * | 2018-07-26 | 2024-02-13 | 苏州晶方半导体科技股份有限公司 | Packaging structure and packaging method of image sensing chip |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN1694509A (en) | 2005-11-09 |
| JP2003168792A (en) | 2003-06-13 |
| JP3787765B2 (en) | 2006-06-21 |
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