CN100399232C - 气流产生装置和电子设备 - Google Patents

气流产生装置和电子设备 Download PDF

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Publication number
CN100399232C
CN100399232C CNB2006100777203A CN200610077720A CN100399232C CN 100399232 C CN100399232 C CN 100399232C CN B2006100777203 A CNB2006100777203 A CN B2006100777203A CN 200610077720 A CN200610077720 A CN 200610077720A CN 100399232 C CN100399232 C CN 100399232C
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China
Prior art keywords
air
flow
opening
chamber
room
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Expired - Fee Related
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CNB2006100777203A
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English (en)
Chinese (zh)
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CN1854981A (zh
Inventor
武笠智治
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Sony Corp
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Sony Corp
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Application filed by Sony Corp filed Critical Sony Corp
Publication of CN1854981A publication Critical patent/CN1854981A/zh
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Publication of CN100399232C publication Critical patent/CN100399232C/zh
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Air-Conditioning For Vehicles (AREA)
  • Jet Pumps And Other Pumps (AREA)
CNB2006100777203A 2005-04-28 2006-04-24 气流产生装置和电子设备 Expired - Fee Related CN100399232C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP131875/05 2005-04-28
JP2005131875A JP2006310586A (ja) 2005-04-28 2005-04-28 気流発生装置及び電子機器

Publications (2)

Publication Number Publication Date
CN1854981A CN1854981A (zh) 2006-11-01
CN100399232C true CN100399232C (zh) 2008-07-02

Family

ID=36677088

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100777203A Expired - Fee Related CN100399232C (zh) 2005-04-28 2006-04-24 气流产生装置和电子设备

Country Status (6)

Country Link
US (1) US7861767B2 (enExample)
EP (1) EP1718141A3 (enExample)
JP (1) JP2006310586A (enExample)
KR (1) KR20060113467A (enExample)
CN (1) CN100399232C (enExample)
TW (1) TW200641318A (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5088526B2 (ja) * 2005-04-18 2012-12-05 ソニー株式会社 噴流発生装置及び電子機器
JP2010511142A (ja) * 2006-11-30 2010-04-08 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 脈動冷却システム
US20080137289A1 (en) * 2006-12-08 2008-06-12 General Electric Company Thermal management system for embedded environment and method for making same
US8218318B2 (en) * 2007-12-07 2012-07-10 Koninklijke Philips Electronics N.V. Low noise cooling device
KR20110073582A (ko) * 2008-10-17 2011-06-29 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 냉각 장치
KR101414640B1 (ko) 2009-09-23 2014-07-03 엘지전자 주식회사 방열 장치
US8559173B2 (en) 2010-03-15 2013-10-15 Panasonic Corporation Electronic apparatus provided with cooling structure
GB201009338D0 (en) * 2010-06-04 2010-07-21 Rolls Royce Plc Fluid transfer arrangement
EP2544518A1 (en) * 2011-07-07 2013-01-09 ABB Research Ltd. Cooling apparatus for cooling a power electronic device
TWI475180B (zh) 2012-05-31 2015-03-01 Ind Tech Res Inst 合成噴流裝置
CN103987234B (zh) * 2013-02-08 2017-08-29 台达电子工业股份有限公司 散热装置
CN104735955B (zh) * 2013-12-24 2017-08-25 台达电子工业股份有限公司 散热装置及电子装置
TWI539267B (zh) * 2013-12-24 2016-06-21 台達電子工業股份有限公司 散熱裝置及電子裝置
US9891677B2 (en) * 2014-09-11 2018-02-13 Dell Products L.P. Skin based system cooling using internal system fan
CN104501646B (zh) * 2014-12-26 2016-08-31 李达 射流散热机构及射流散热器
EP3079034B1 (en) 2015-04-07 2020-09-30 Vestel Elektronik Sanayi ve Ticaret A.S. Double-acting synthetic jet module for cooling of electronic devices
US10529911B2 (en) * 2016-01-29 2020-01-07 Microjet Technology Co., Ltd. Piezoelectric actuator
CN111867325B (zh) * 2020-07-01 2021-04-20 南京航空航天大学 基于电磁振动与蒸发冷却的电子元件散热系统与方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02213200A (ja) * 1989-02-14 1990-08-24 Victor Co Of Japan Ltd 熱交換器
JPH03116961A (ja) * 1989-09-29 1991-05-17 Victor Co Of Japan Ltd 放熱装置

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55101800A (en) 1979-01-25 1980-08-04 Pioneer Electronic Corp Air pump
JPH03168373A (ja) * 1989-11-24 1991-07-22 Nippon Keiki Seisakusho:Kk 圧電ポンプ制御装置
JPH03222878A (ja) * 1990-01-26 1991-10-01 Mitsubishi Kasei Corp 圧電振動子ポンプ
JP3168373B2 (ja) * 1994-03-25 2001-05-21 株式会社イナックス 排水栓におけるキックレバーと押引ロッドの連結構造
JP3222878B2 (ja) * 1994-06-14 2001-10-29 シャープ株式会社 液晶表示装置
DE59510549D1 (de) * 1995-03-14 2003-03-13 Sulzer Markets & Technology Ag Verfahren zum aktiven Dämpfen globaler Strömungsoszillationen in abgelösten instabilen Strömungen und Vorrichtung zur Anwendung des Verfahrens
US5758823A (en) * 1995-06-12 1998-06-02 Georgia Tech Research Corporation Synthetic jet actuator and applications thereof
US6123145A (en) * 1995-06-12 2000-09-26 Georgia Tech Research Corporation Synthetic jet actuators for cooling heated bodies and environments
JP2000114760A (ja) 1998-10-06 2000-04-21 Toshiba Corp 電子機器の冷却構造
KR20000050679A (ko) 1999-01-13 2000-08-05 윤종용 전자기기용 방열장치
US6353295B1 (en) * 1999-01-20 2002-03-05 Philips Electronics North America Corporation Lamp electronic ballast with a piezoelectric cooling fan
JP2002134975A (ja) 2000-10-23 2002-05-10 Nippon Keiki Works Ltd 冷却ファン
EP1415342B1 (de) 2001-07-30 2006-06-07 BISTEKOS, Michael-Georg Einrichtung zur kühlung von gehausen, raumen, bauteilen, medien u. dgl
US6588497B1 (en) * 2002-04-19 2003-07-08 Georgia Tech Research Corporation System and method for thermal management by synthetic jet ejector channel cooling techniques
JP2004146547A (ja) 2002-10-24 2004-05-20 Hitachi Ltd 電子機器の冷却装置
US6937472B2 (en) * 2003-05-09 2005-08-30 Intel Corporation Apparatus for cooling heat generating components within a computer system enclosure
AU2004258530A1 (en) 2003-07-07 2005-01-27 Georgia Tech Research Corporation System and method for thermal management using distributed synthetic jet actuators
JP4677744B2 (ja) 2003-11-04 2011-04-27 ソニー株式会社 噴流発生装置、電子機器及び噴流発生方法
JP4887652B2 (ja) 2005-04-21 2012-02-29 ソニー株式会社 噴流発生装置及び電子機器
JP4747657B2 (ja) 2005-04-21 2011-08-17 ソニー株式会社 噴流発生装置及び電子機器

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02213200A (ja) * 1989-02-14 1990-08-24 Victor Co Of Japan Ltd 熱交換器
JPH03116961A (ja) * 1989-09-29 1991-05-17 Victor Co Of Japan Ltd 放熱装置

Also Published As

Publication number Publication date
CN1854981A (zh) 2006-11-01
KR20060113467A (ko) 2006-11-02
EP1718141A2 (en) 2006-11-02
US7861767B2 (en) 2011-01-04
TW200641318A (en) 2006-12-01
EP1718141A3 (en) 2008-07-30
TWI307764B (enExample) 2009-03-21
US20060245163A1 (en) 2006-11-02
JP2006310586A (ja) 2006-11-09

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Granted publication date: 20080702

Termination date: 20120424